CN203819301U - Silicon wafer transfer trolley - Google Patents
Silicon wafer transfer trolley Download PDFInfo
- Publication number
- CN203819301U CN203819301U CN201420225867.2U CN201420225867U CN203819301U CN 203819301 U CN203819301 U CN 203819301U CN 201420225867 U CN201420225867 U CN 201420225867U CN 203819301 U CN203819301 U CN 203819301U
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- Prior art keywords
- mortar
- vehicle frame
- slide glass
- silicon chip
- buggy
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Abstract
The utility model provides a silicon wafer transfer trolley which comprises a trolley frame and a wafer carrying trolley plate arranged on the trolley frame. The trolley frame comprises an upper-layer trolley frame body and a lower-layer trolley frame body which are arranged vertically, and the wafer carrying trolley plate is arranged on the upper-layer trolley frame body. A plurality of leaking holes penetrating through the wafer carrying trolley plate in the thickness direction are formed in the wafer carrying trolley plate, and a mortar collection device is detachably installed on the lower-layer trolley frame body. The silicon wafer transfer trolley comprises the upper layer and the lower layer, the upper-layer trolley frame body is the wafer carrying trolley plate for containing silicon wafers, and silicon wafers are transferred through the wafer carrying trolley plate. The leaking holes are formed in the wafer carrying trolley plate and arranged in the thickness direction of the wafer carrying trolley plate. When the silicon wafers are transferred and after mortar adhering to the surfaces of the silicon wafers falls to the wafer carrying trolley plate, the mortar can flow out through the leaking holes; the mortar collection device for collecting the mortar is arranged on the lower-layer trolley frame body, the leaked mortar is collected, the situation that the mortar flows out from the edges of the transfer trolley is avoided, therefore, pollution to the ground of a workshop is avoided, recycling of the mortar is achieved, and resources are saved.
Description
Technical field
The utility model relates to silicon chip preparing technical field, more particularly, relates to a kind of silicon chip transfer car(buggy).
Background technology
Silicon chip is through the cut object that forms the sheet with certain technical requirements thickness after monocrystalline pull-rod, polycrystalline cast ingot.
First the silicon chip cutting at workshop back warp scroll saw will be put on slide glass waggon, then by employee, shifts next process onto and carries out prerinse.Just from the lower silicon chip of wire saw machine tool unloading residual a large amount of mortar utilizing when the cutting silicon rod also, residual mortar can flow on the carrying surface of slide glass dolly and converge along silicon chip, within general two hours, forms and precipitates later.
Limited amount due to workshop slide glass dolly, too much increase slide glass dolly also can be too much account for space, workshop, in cycle of operations of a slide glass dolly, generally to transport 3-4 times, so can deposit a large amount of mortars, excessive mortar can overflow from the edge of dolly, stream, on the ground in workshop, has not only affected the environmental health in workshop but also sometimes also safety misadventure can occur, and makes people's tumble injury of slipping.
The mortar depositing on dolly carrying surface also can hold the pallet of bonding crystal bar, prewashed time, employee is difficult for pallet to carry down, affect production efficiency and even also can damage silicon chip, employee is also difficult for the mortar on carrying surface to rinse out in the cleaning dolly of relieving, not only wasted water resource, also cause mortar to be flushed away and cause supplies consumption, increase cost waste, being too much flushed in environment of mortar also damages environment.
Therefore, how solving the mortar spill-over problem that silicon chip transhipment causes, is current those skilled in the art's problem demanding prompt solution.
Utility model content
In view of this, the utility model provides a kind of silicon chip transfer car(buggy), to realize the mortar spill-over problem that silicon chip transhipment causes that solves.
In order to achieve the above object, the utility model provides following technical scheme:
A silicon chip transfer car(buggy), comprises vehicle frame and is arranged at the slide glass sweep on described vehicle frame, described vehicle frame comprises upper strata vehicle frame and the lower floor's vehicle frame of arranging up and down, and described slide glass sweep is arranged on the vehicle frame of described upper strata;
On described slide glass sweep, be provided with a plurality of a plurality of leak holes that run through on its thickness direction, on described lower floor vehicle frame, detouchable is provided with mortar gathering-device.
Preferably, in above-mentioned silicon chip transfer car(buggy), a plurality of described leak holes are distributed on described slide glass sweep uniformly.
Preferably, in above-mentioned silicon chip transfer car(buggy), the below of described slide glass sweep is provided with the mortar deflecting plate setting firmly thereon, the edge of described mortar deflecting plate and described slide glass sweep is affixed, and along the edge of described slide glass sweep to its downward-sloping layout in middle part, on described mortar deflecting plate, offer mortar export mouth.
Preferably, in above-mentioned silicon chip transfer car(buggy), described mortar export mouth is arranged at the middle part of described mortar deflecting plate, and described mortar deflecting plate detouchable is installed on the bottom of described slide glass sweep.
Preferably, in above-mentioned silicon chip transfer car(buggy), on described vehicle frame, be also provided with vehicle frame handrail.
Preferably, in above-mentioned silicon chip transfer car(buggy), the side that described vehicle frame is positioned at described vehicle frame handrail is furnished with the Ariticle-storing barrel of placing recording device.
Preferably, in above-mentioned silicon chip transfer car(buggy), the wheel that described bottom of frame is arranged comprises the solid wheel flutter to taking turns and be positioned at vehicle frame front portion near described vehicle frame handrail side.
Preferably, in above-mentioned silicon chip transfer car(buggy), the bottom of described slide glass sweep is provided with and is fixedly arranged on a plurality of strut bars that on described vehicle frame, described slide glass sweep supported.
Preferably, in above-mentioned silicon chip transfer car(buggy), described strut bar comprises that intersection is fixedly arranged on transverse supporting rod and the vertical supporting rod on described vehicle frame.
Preferably, in above-mentioned silicon chip transfer car(buggy), on the support end face of described slide glass sweep, be provided with the back-up block protruding from described slide glass sweep.
The silicon chip transfer car(buggy) that the utility model provides, comprises vehicle frame and is arranged at the slide glass sweep on vehicle frame, vehicle frame comprises upper strata vehicle frame and the lower floor's vehicle frame of arranging up and down, and slide glass sweep is arranged on the vehicle frame of upper strata.On slide glass sweep, be provided with a plurality of a plurality of leak holes that run through on its thickness direction, on lower floor's vehicle frame, detouchable is provided with mortar gathering-device.Silicon chip transfer car(buggy) comprises two-layer up and down, and upper deck sets up and is set to the slide glass sweep of placing silicon chip, by slide glass sweep, silicon chip is transported.A plurality of leak holes are set on slide glass sweep, leak holes is along the thickness direction setting of slide glass sweep, when silicon chip is transported, the mortar of silicon chip surface adhesion can flow out by leak holes after falling on slide glass sweep, and by the mortar gathering-device of collecting mortar is set on lower floor's vehicle frame, the mortar of revealing is collected, avoided mortar to be flowed out by the edge of silicon chip transfer car(buggy), thereby avoided the pollution to opposite, workshop, and realized the recycling of mortar, saved resource.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The construction profile front view of the silicon chip transfer car(buggy) that Fig. 1 provides for the utility model;
Fig. 2 is the birds-eye view of Fig. 1;
Fig. 3 is the left view of Fig. 1;
The structural representation of the silicon chip transfer car(buggy) that Fig. 4 provides for the utility model.
The specific embodiment
The utility model discloses a kind of silicon chip transfer car(buggy), solved the mortar spill-over problem that silicon chip transhipment causes.
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out to clear, complete description, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Based on embodiment of the present utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
The construction profile front view of the silicon chip transfer car(buggy) that as shown in Figure 1, Fig. 1 provides for the utility model; Fig. 2 is the birds-eye view of Fig. 1; Fig. 3 is the left view of Fig. 1; The structural representation of the silicon chip transfer car(buggy) that Fig. 4 provides for the utility model.
The utility model provides a kind of silicon chip transfer car(buggy), comprises vehicle frame 1 and is arranged at the slide glass sweep 11 on vehicle frame 1, and vehicle frame 1 comprises the upper strata vehicle frame 12He lower floor vehicle frame 13 of arranging up and down, and slide glass sweep 11 is arranged on upper strata vehicle frame 12.On slide glass sweep 11, be provided with a plurality of a plurality of leak holes 4 that run through on its thickness direction, on lower floor's vehicle frame 13, detouchable is provided with mortar gathering-device.Silicon chip transfer car(buggy) comprises two-layer up and down, and upper strata vehicle frame 12 is set to place the slide glass sweep 11 of silicon chip, by 11 pairs of silicon chips of slide glass sweep, is transported.A plurality of leak holes 4 are set on slide glass sweep 11, leak holes 4 is along the thickness direction setting of slide glass sweep 11, when silicon chip is transported, after the mortar of silicon chip surface adhesion is fallen on slide glass sweep 11, can flow out by leak holes 4, and by the mortar gathering-device of collecting mortar is set on lower floor's vehicle frame 13, the mortar of revealing is collected, avoided mortar to be flowed out by the edge of silicon chip transfer car(buggy), thereby avoided the pollution to opposite, workshop, and realized the recycling of mortar, saved resource.
The upper strata vehicle frame 12He lower floor vehicle frame 13 of vehicle frame 1 is all set to rectangle frame, with the transhipment requirement of accommodate silicon chip architecture.Upper strata vehicle frame 12He lower floor vehicle frame 13 supports by supporting leg 14, and supporting leg 14 is arranged at four corners of rectangle frame, thereby the space between the release upper strata vehicle frame 12He lower floor vehicle frame 13 of trying one's best meets the placement requirement of mortar gathering-device.
In the utility model one specific embodiment, a plurality of leak holes 4 are distributed on slide glass sweep 11 uniformly.Leak holes 4 is evenly distributed on the whole plate face of slide glass sweep 11, and the mortar of being convenient to flow to diverse location on slide glass sweep 11 flow in mortar gathering-device.Leak holes 4 spreads all over the whole plate face of slide glass sweep, and the edge ring winding of slide glass sweep 11 is set to baffle plate, blocks in slide glass sweep, through the leak holes collection of having flowed in mortar flow process through baffle plate.
In the utility model one specific embodiment, the below of slide glass sweep 11 is provided with the mortar deflecting plate 2 setting firmly thereon, mortar deflecting plate 2 is affixed with the edge of slide glass sweep 11, and along the edge of slide glass sweep 11 to its downward-sloping layout in middle part, on mortar deflecting plate 2, offer mortar export mouth 21.The leak holes 4 of mortar on slide glass sweep 11 drops onto in mortar gathering-device, in order further to avoid mortar drippage in promoting transfer car(buggy) process to be splashed on ground, mortar deflecting plate 2 is set below slide glass sweep 11, mortar deflecting plate 2 is the rectangular configuration of corresponding slide glass sweep, the edge of its edge and slide glass sweep is affixed, on mortar deflecting plate 2, offer mortar export mouth 21, and mortar deflecting plate 2 is tilted to lower layout from its edge to mortar export mouth 21 plate constructions, mortar is fallen on mortar deflecting plate after the leak holes drippage on slide glass sweep, and concentrate on mortar export mouth 21 and derive, thereby the random drippage of effectively avoiding mortar is splashed to the situation of mill floor.
In the utility model one specific embodiment, mortar export mouth 21 is arranged at the middle part of mortar deflecting plate 2, and mortar deflecting plate 2 detouchables are installed on the bottom of slide glass sweep 11.Mortar export mouth 21 is arranged on the middle part of mortar deflecting plate 2, makes mortar deflecting plate funnel structure, is beneficial to the collection of mortar and water conservancy diversion.Meanwhile, mortar deflecting plate 2 detouchables are arranged on the bottom of slide glass sweep 11, can after silicon chip transfer car(buggy) uses a period of time, the dismounting of mortar deflecting plate be cleared up, and by the cleaning to mortar deflecting plate and slide glass sweep, guarantee the spatter property of silicon chip transfer car(buggy).
In the utility model one specific embodiment, on vehicle frame, be also provided with vehicle frame handrail 3.By vehicle frame handrail 3, promote silicon chip transfer car(buggy)s, easy to operate, be beneficial to the carrying out of silicon chip transport.
In the utility model one specific embodiment, the side that vehicle frame 2 is positioned at vehicle frame handrail 3 is furnished with the Ariticle-storing barrel 5 of placing recording device.The Ariticle-storing barrel 5 of placing recording device is set on vehicle frame 2, thus can place easily in some transfer car(buggy) transportations, use as instruments such as writing charts, increase the convenience in transfer car(buggy) use procedure.
In the utility model one specific embodiment, the wheel that vehicle frame 2 bottoms are arranged comprises the solid wheel flutter to taking turns and be positioned at vehicle frame 2 front portions near vehicle frame handrail 3 sides.Vehicle frame 2 bottoms arrange wheel, and wheel comprises solid to wheel and wheel flutter, thereby further improve the convenience of transfer car(buggy) operation.
In the utility model one specific embodiment, the bottom of slide glass sweep 11 is provided with and is fixedly arranged on a plurality of strut bars that on vehicle frame, slide glass sweep supported.Strut bar comprises that intersection is fixedly arranged on transverse supporting rod 6 and the vertical supporting rod 7 on vehicle frame 2.Slide glass sweep directly carries silicon chip it is transported, and for guaranteeing the support strength of slide glass sweep, transverse supporting rod 6 and the vertical supporting rod 7 of arranged crosswise is set in the bottom of slide glass sweep, and the two erects slide glass sweep again, improves support strength.
In the utility model one specific embodiment, on the support end face of slide glass sweep 11, be provided with the back-up block protruding from slide glass sweep.Silicon chip is placed on the support end face of slide glass sweep in transportation, by on the support end face at slide glass sweep, some back-up blocks being set, by back-up block, silicon chip is erected, making silicon chip and slide glass sweep is not directly to contact, avoid the shutoff to leak holes, guaranteed the smooth leakage work of mortar.
In this specification sheets, each embodiment adopts the mode of going forward one by one to describe, and each embodiment stresses is the difference with other embodiment, between each embodiment identical similar part mutually referring to.
Above-mentioned explanation to the disclosed embodiments, makes professional and technical personnel in the field can realize or use the utility model.To the multiple modification of these embodiment, will be apparent for those skilled in the art, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. a silicon chip transfer car(buggy), is characterized in that, comprises vehicle frame and is arranged at the slide glass sweep on described vehicle frame, and described vehicle frame comprises upper strata vehicle frame and the lower floor's vehicle frame of arranging up and down, and described slide glass sweep is arranged on the vehicle frame of described upper strata;
On described slide glass sweep, be provided with a plurality of a plurality of leak holes that run through on its thickness direction, on described lower floor vehicle frame, detouchable is provided with mortar gathering-device.
2. silicon chip transfer car(buggy) according to claim 1, is characterized in that, a plurality of described leak holes are distributed on described slide glass sweep uniformly.
3. silicon chip transfer car(buggy) according to claim 1, it is characterized in that, the below of described slide glass sweep is provided with the mortar deflecting plate setting firmly thereon, the edge of described mortar deflecting plate and described slide glass sweep is affixed, and along the edge of described slide glass sweep to its downward-sloping layout in middle part, on described mortar deflecting plate, offer mortar export mouth.
4. silicon chip transfer car(buggy) according to claim 3, is characterized in that, described mortar export mouth is arranged at the middle part of described mortar deflecting plate, and described mortar deflecting plate detouchable is installed on the bottom of described slide glass sweep.
5. silicon chip transfer car(buggy) according to claim 1, is characterized in that, is also provided with vehicle frame handrail on described vehicle frame.
6. silicon chip transfer car(buggy) according to claim 5, is characterized in that, the side that described vehicle frame is positioned at described vehicle frame handrail is furnished with the Ariticle-storing barrel of placing recording device.
7. silicon chip transfer car(buggy) according to claim 6, is characterized in that, the wheel that described bottom of frame is arranged comprises the solid wheel flutter to taking turns and be positioned at vehicle frame front portion near described vehicle frame handrail side.
8. silicon chip transfer car(buggy) according to claim 1, is characterized in that, the bottom of described slide glass sweep is provided with and is fixedly arranged on a plurality of strut bars that on described vehicle frame, described slide glass sweep supported.
9. silicon chip transfer car(buggy) according to claim 8, is characterized in that, described strut bar comprises that intersection is fixedly arranged on transverse supporting rod and the vertical supporting rod on described vehicle frame.
10. silicon chip transfer car(buggy) according to claim 1, is characterized in that, is provided with the back-up block protruding from described slide glass sweep on the support end face of described slide glass sweep.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420225867.2U CN203819301U (en) | 2014-05-05 | 2014-05-05 | Silicon wafer transfer trolley |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420225867.2U CN203819301U (en) | 2014-05-05 | 2014-05-05 | Silicon wafer transfer trolley |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203819301U true CN203819301U (en) | 2014-09-10 |
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ID=51474828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420225867.2U Expired - Fee Related CN203819301U (en) | 2014-05-05 | 2014-05-05 | Silicon wafer transfer trolley |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203819301U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110282047A (en) * | 2019-06-06 | 2019-09-27 | 广汽丰田发动机有限公司 | A kind of laser navigation handling device |
-
2014
- 2014-05-05 CN CN201420225867.2U patent/CN203819301U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110282047A (en) * | 2019-06-06 | 2019-09-27 | 广汽丰田发动机有限公司 | A kind of laser navigation handling device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140910 Termination date: 20190505 |