CN204278278U - Silicon chip cutting machine tool mortar backplate - Google Patents

Silicon chip cutting machine tool mortar backplate Download PDF

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Publication number
CN204278278U
CN204278278U CN201420658011.4U CN201420658011U CN204278278U CN 204278278 U CN204278278 U CN 204278278U CN 201420658011 U CN201420658011 U CN 201420658011U CN 204278278 U CN204278278 U CN 204278278U
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CN
China
Prior art keywords
backplate
mortar
silicon chip
machine tool
cutting machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420658011.4U
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Chinese (zh)
Inventor
刘彬国
何京辉
李立伟
张立涛
菅书勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xingtai Jinglong Electronic Material Co Ltd
Original Assignee
Xingtai Jinglong Electronic Material Co Ltd
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Priority to CN201420658011.4U priority Critical patent/CN204278278U/en
Application granted granted Critical
Publication of CN204278278U publication Critical patent/CN204278278U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of silicon chip cutting machine tool mortar backplate, relate to silicon chip cutting machine tool attachment technique field, described backplate is two pieces of rectangular slabs consistent with guide wheel width, middle part level be provided with the bending consistent with guide wheel cylindrical radian and bending angle down, backplate top down one side be provided with the friction tight horizontal draw-in groove with mortar spray pipe cylindrical.Utilize draw-in groove to be stuck on mortar spray pipe by backplate, backplate is covered on outside guide wheel up and down, the mortar in cutting process can be made to be back on gauze or mortar jar along backplate medial surface, make mortar fully participate in cutting.The utility model has the advantage that structure is simple, can effectively prevent mortar from splashing, loads and unloads, clears up convenient and swift, make mortar fully participate in cutting, avoids impurity and mud and comes off and drop on gauze, causality loss such as reduction wire jumper, broken string etc.

Description

Silicon chip cutting machine tool mortar backplate
Technical field
The utility model relates to silicon chip cutting machine tool attachment technique field.
Background technology
The silicon chip cutting process method many employings multi-wire saw technology used at present, principle is that machine guide wheel drives steel wire in running up, carried by the steel wire of high-speed cruising and with carborundum and suspension mixed mortar, silicon rod is cut, in the running up of steel wire, recur friction with the silicon rod be pressed on gauze complete cutting process.NTC WMW442 type lathe just belongs to a kind of conventional silicon wafer cutting equipment.
Along with the development of solar level monocrystalline silicon piece, 8 cun, 9 cun major diameter single crystal silicon chips have been trend of the times, when using 442 type lathes cutting major diameter single crystal silicon chip, steel wire outage increases, difficulty increases, following defect is there is: (1), in cutting process in cutting process, the mortar penetrated by mortar spray pipe in cutting chamber splashes, the participation that part mortar can not be real is caused to be cut, and mortar also can be deposited as mortar mud on lathe wall and workbench, the cleaning of mortar mud is not only wasted time and energy but also be not easy to clean out; (2), during cutting, workbench and the precipitation mortar mud of cutting chamber surrounding drop to gauze can cause to cutting and have a strong impact on, cause the accidents such as steel wire wire jumper, broken string, therefore the silicon chip surface quality problems such as silicon chip surface stria, cut caused, if the impurity particle entered is larger, the line-outage contingency caused can bring very big inconvenience to production, causes heavy losses to company.
Utility model content
Technical problem to be solved in the utility model is to provide the silicon chip cutting machine tool mortar backplate that a kind of structure is simple, easy to operate, can effectively prevent mortar from splashing.
For solving the problems of the technologies described above, technical solution adopted in the utility model is:
A kind of silicon chip cutting machine tool mortar backplate, be two pieces of rectangular slabs consistent with guide wheel width, in the middle part of described backplate, horizontal direction is provided with the bending consistent with guide wheel cylindrical radian, and down, described backplate top down one side is provided with the friction tight horizontal draw-in groove with mortar spray pipe cylindrical to described bending angle.
Preferably, projection is provided with outside described backplate top edge.
Preferably, the projection of described backplate and top edge thereof is one.
Preferably, described backplate lower outside face is provided with two handles.
Preferably, two sides, described backplate bottom, side, top one are provided with baffle plate.
Preferably, described backplate is corrosion resistant plate.
The beneficial effect adopting technique scheme to produce is: utilize the horizontal draw-in groove on backplate top to be stuck on mortar spray pipe, handling, clear up convenient and swift, horizontal bending in the middle part of backplate is consistent with guide wheel cylindrical radian makes backplate cover on up and down outside guide wheel, can to avoid in cutting process outside mortar splashes in, the mortar of splashing is made to be back on gauze or mortar jar along backplate medial surface, mortar is made fully to participate in cutting, projection outside backplate top edge and two sides, bottom, the baffle plate of side, top one can avoid foreign matter to drop on gauze, two handles on backplate lower outside face are in handling, handled easily during cleaning backplate, adopting stainless steel to make backplate can prevent backplate from using for a long time to get rusty and scrap.The utility model has the advantage that structure is simple, easy to operate, can effectively prevent mortar from splashing, and makes mortar fully participate in cutting, avoids impurity and mud and comes off and drop on gauze, reduce the causality loss such as wire jumper, broken string.
Accompanying drawing explanation
Fig. 1 is using state figure of the present utility model;
Fig. 2 is outside of the present utility model schematic diagram;
Fig. 3 is inboard front view of the present utility model;
In figure: 1-backplate, 2-steel wire, 3-guide wheel, 4-mortar spray pipe, 5-silicon rod, 6-bending, 7-draw-in groove, 8-is protruding, 9-handle, 10-baffle plate.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
A kind of silicon chip cutting machine tool mortar backplate as shown in Figure 1, 2, 3, be two pieces of rectangular slabs consistent with guide wheel 3 width, in the middle part of described backplate 1, horizontal direction is provided with the bending 6 consistent with guide wheel 3 cylindrical radian, described bending 6 angle down, backplate 1 through bending be able to well cover on outside guide wheel 3, described backplate 1 top down one side is provided with the friction tight horizontal draw-in groove 7 with mortar spray pipe 4 cylindrical, utilizes this plug type draw-in groove 7 backplate 1 tightly can be stuck on mortar spray pipe 4.
As a kind of preferred structure, be provided with protruding 8 outside described backplate 1 top edge, in order to simplify production process, the projection 8 of described backplate 1 and top edge thereof is one.Protruding 8 can avoid foreign matter to drop on gauze.
As a kind of preferred structure, described backplate 1 lower outside face is provided with two handles 9, the handled easily when handling, cleaning backplate.
Also for ease of and prevent foreign matter from dropping on gauze, can in two sides, backplate 1 bottom, side, top one is provided with baffle plate 10.
Use for a long time to prevent backplate 1 and get rusty, backplate 1 can be made of corrosion resistant plate.
During concrete use, first the draw-in groove 7 on two pieces of backplate 1 tops is utilized to be stuck on the mortar spray pipe of both sides, two handles 9 are utilized to assist convenient to operation, bending 6 in the middle part of backplate 1 is consistent with guide wheel 3 cylindrical radian makes backplate about 1 cover on outside guide wheel 3, the mortar in cutting process can be made to be back on gauze or mortar jar along backplate 1 medial surface, mortar is made fully to participate in cutting, projection 8 outside backplate 1 top edge and two sides, bottom, the baffle plate 10 of side, top one can avoid foreign matter to drop on gauze, adopting stainless steel to make backplate can prevent backplate from using for a long time to get rusty and scrap.
In sum, the utility model has the advantage that structure is simple, easy to operate, can effectively prevent mortar from splashing, mortar is made fully to participate in cutting, avoid impurity and mud to come off and drop on gauze, reduce the causality loss such as wire jumper, broken string, decrease the problem that silicon chip surface stria, cut etc. affect silicon chip surface quality, reduce percent defective, ensure that carrying out smoothly of production.

Claims (6)

1. a silicon chip cutting machine tool mortar backplate, it is characterized in that: be two pieces of rectangular slabs consistent with guide wheel (3) width, described backplate (1) middle part horizontal direction is provided with the bending (6) consistent with guide wheel (3) cylindrical radian, down, described backplate (1) top down one side is provided with the friction tight horizontal draw-in groove (7) with mortar spray pipe (4) cylindrical to described bending (6) angle.
2. silicon chip cutting machine tool mortar backplate according to claim 1, is characterized in that: be provided with projection (8) outside described backplate (1) top edge.
3. silicon chip cutting machine tool mortar backplate according to claim 2, is characterized in that: the projection (8) of described backplate (1) and top edge thereof is one.
4. silicon chip cutting machine tool mortar backplate according to claim 1, is characterized in that: described backplate (1) lower outside face is provided with two handles (9).
5. silicon chip cutting machine tool mortar backplate according to claim 1, is characterized in that: described backplate (1) two sides, bottom, side, top one are provided with baffle plate (10).
6. silicon chip cutting machine tool mortar backplate according to claim 1, is characterized in that: described backplate (1) is corrosion resistant plate.
CN201420658011.4U 2014-11-06 2014-11-06 Silicon chip cutting machine tool mortar backplate Expired - Fee Related CN204278278U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420658011.4U CN204278278U (en) 2014-11-06 2014-11-06 Silicon chip cutting machine tool mortar backplate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420658011.4U CN204278278U (en) 2014-11-06 2014-11-06 Silicon chip cutting machine tool mortar backplate

Publications (1)

Publication Number Publication Date
CN204278278U true CN204278278U (en) 2015-04-22

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420658011.4U Expired - Fee Related CN204278278U (en) 2014-11-06 2014-11-06 Silicon chip cutting machine tool mortar backplate

Country Status (1)

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CN (1) CN204278278U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106426585A (en) * 2016-10-09 2017-02-22 苏州协鑫光伏科技有限公司 Multi-wire sawing machine for silicon wafers
CN106976167A (en) * 2017-03-17 2017-07-25 浙江好亚能源股份有限公司 Diamond cutting line slicing machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106426585A (en) * 2016-10-09 2017-02-22 苏州协鑫光伏科技有限公司 Multi-wire sawing machine for silicon wafers
CN106976167A (en) * 2017-03-17 2017-07-25 浙江好亚能源股份有限公司 Diamond cutting line slicing machine

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150422

Termination date: 20181106