CN203610368U - Ultrasonic cleaning device of diamond wire - Google Patents
Ultrasonic cleaning device of diamond wire Download PDFInfo
- Publication number
- CN203610368U CN203610368U CN201320736069.1U CN201320736069U CN203610368U CN 203610368 U CN203610368 U CN 203610368U CN 201320736069 U CN201320736069 U CN 201320736069U CN 203610368 U CN203610368 U CN 203610368U
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- diamond wire
- rinse bath
- ultrasonic
- ultrasonic cleaning
- cleaning equipment
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Abstract
The utility model relates to an ultrasonic cleaning device of a diamond wire. The ultrasonic cleaning device comprises a washing tank and an ultrasonic device, wherein the ultrasonic device comprises an ultrasonic generator, an ultrasonic transducer and at least one ultrasonic vibration plate; the ultrasonic vibration plates are disposed inside the washing tank, the middle part of the washing tank is provided with a diamond wire inlet and a diamond outlet, a diamond wire unreeling device is disposed at the inlet of the washing tank while a diamond wire winding device at the outlet of the washing tank, and a cleaning fluid supplement device is disposed on the washing tank. The ultrasonic cleaning device of the diamond wire is simple in structure, novel in design, high in efficiency and excellent in effect; and with adoption of the ultrasonic cleaning device, continuous ultrasonic washing of the diamond wire can be realized, on-line washing of the diamond wire can be further realized, and the diamond wire can be washed immediately after being used for cutting a silicon wafer, when remnant silicon particles can be easily removed, thereby bringing convenience for following utilization of the diamond wire, raising the using ratio of the diamond wire, reducing the using cost of the diamond wire, and bringing convenience for popularization of diamond wire cutting.
Description
Technical field
The present invention relates to diamond wire cleaning device, especially a kind of diamond wire ultrasonic cleaning equipment.
Background technology
Diamond wire saw machine, for solar power silicon material cutting industry, is revolutionary progress.Diamond wire saw machine cutting technique, in the universal use of Japan 90% above user, uses American-European 20% above user.Diamond wire saw owner on domestic market will be monopolized by offshore company, on the incisory diamond wire saw machine of solar power silicon material market, made in China is still in space state, compare with mortar cutting mode with traditional steel wire, diamond wire saw facility have plurality of advantages: can realize high-speed cutting, environmental protection is produced, with low cost etc., and there is obvious superiority of effectiveness compared with foreign same type product.High-speed cutting is for traditional mortar cutting mode, and speed is 2-3 times of this traditional handicraft cutting, can make user reduce buying equipment cost, also can make user can accept larger size of order simultaneously.It is also for traditional mortar cutting mode that environmental protection is produced, traditional handicraft cutting environment is severe, not environmental protection, and a large amount of mortars needs recycling, consume a large amount of manpower and financial resources costs, and the technique of diamond wire saw machine need not mortar, only need water or water base cooling cleaning solution just passable, really realize environmental protection and produced and manufacture.It is very obvious that diamond cutting secant contrasts traditional steel wire advantage, adopts electroplated diamond wire cutting polycrystalline silicon ingot with same equipment, greatly shortens than adopting mortar to cut the time used, brought into play to greatest extent equipment effectiveness; Equipment applied environment is effectively improved, and improves service life of equipment; The actual use of equipment power reduction.Diamond wire needs to clean completing after primary line cutting, removes the silicon material on diamond wire surface, so that follow-up continuation is used, common cleaning method and cleaning equipment are difficult to remove the silicon material sticking on diamond wire, have affected the utilization again of diamond wire.
Summary of the invention
The technical problem to be solved in the present invention is: overcome diamond wire in prior art be difficult to clean, affect the technical problem of follow-up use, a kind of diamond wire ultrasonic cleaning equipment is provided, by Ultrasonic Cleaning diamond wire, can realize serialization and produce, effective, efficiency is high.
The technical solution adopted for the present invention to solve the technical problems is: a kind of diamond wire ultrasonic cleaning equipment, comprise rinse bath and ultrasonic unit, described ultrasonic unit comprises supersonic generator, ultrasonic transducer and at least one ultrasonic vibration plate, described ultrasonic vibration plate is arranged in rinse bath, the middle part of described rinse bath offers import and the outlet of diamond wire, and described rinse bath is provided with cleaning fluid supplementary device.Diamond wire is directly worn and is incident upon outlet from the import of rinse bath after completing cutting, make the cleaning fluid in rinse bath act on diamond wire surface by ultrasonic vibration plate, ultrasonic wave drives the remaining silicon grain on diamond wire to vibrate together, and come off thereupon, can carry out immediately the cutting of new silicon chip from outlet clean diamond wire out, the on-line continuousization that completes diamond wire is cleaned.
Further, also concentrate and clean for ease of off-line, the import department of described rinse bath is provided with diamond wire unwinding device, and the exit of rinse bath is provided with the wrap-up of diamond wire,
As preferably, the quantity of described ultrasonic vibration plate is two, and two described ultrasonic vibration plate holders are located at rinse bath import and the upper and lower both sides of outlet.Be that diamond wire is penetrated and mistake from wearing between two ultrasonic vibration plates, the whole surface of diamond wire is cleaned thoroughly.
Further, described rinse bath comprises upper groove body and lower groove, and described upper groove body and lower groove directly removably connect., be convenient to diamond wire and pass, turning connection between described upper groove body and lower groove through rinse bath for ease of diamond wire.
Further, for ease of controlling the liquid level in rinse bath, described upper groove body is provided with liquid level gauge.
Further, for guaranteeing the cleaning fluid submergence diamond wire in rinse bath, the inlet and outlet of the cell body of described rinse bath is respectively equipped with overflow launder.
Further, described overflow launder is to be centered around the circumferential loop configuration of rinse bath.
Concrete, described cleaning fluid supplementary device comprises a liquid-accumulating trough, and described liquid-accumulating trough is respectively by pipeline and overflow launder and rinse bath formation closed circuit, and the pipeline between liquid-accumulating trough and rinse bath is provided with the pump housing and switch valve.
Further, for removing the silicon material in cleaning fluid, the pipeline between described liquid-accumulating trough and overflow launder and rinse bath is provided with filter.
Further, the pipeline between described liquid-accumulating trough and rinse bath is provided with Pressure gauge.
The invention has the beneficial effects as follows, diamond wire ultrasonic cleaning equipment of the present invention, simple in structure, novel, can realize the serialization ultrasonic cleaning of diamond wire, efficiency is high, effective, more can realize the on-line cleaning of diamond wire, after cutting silicon wafer, clean immediately, now cleaning silicon material is also more easily removed, so that the later use of diamond wire, improve the utilization rate of diamond wire, reduce the use cost of diamond wire, be convenient to the popularization of diamond wire saw, when on-line cleaning, ultrasonic wave makes diamond wire produce microseismic activity, can make the cut surface of cut object smooth, bright and clean, reduce the mill of postorder, throw operation or workload, and can make the life-span of golden steel wire lengthen.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is the structural representation of first embodiment of diamond wire ultrasonic cleaning equipment of the present invention.
Fig. 2 is the structural representation of second embodiment of diamond wire ultrasonic cleaning equipment of the present invention.
Fig. 3 is the structural representation of the 3rd embodiment of diamond wire ultrasonic cleaning equipment of the present invention.
In figure: 1. rinse bath, 11. imports, 12. outlets, 2. ultrasonic vibration plate, 3. unwinding device, 4. wrap-up, 5. liquid level gauge, 6. overflow launder, 7. liquid-accumulating trough, 8. filter.
The specific embodiment
In conjunction with the accompanying drawings, the present invention is further detailed explanation.These accompanying drawings are the schematic diagram of simplification, and basic structure of the present invention is only described in a schematic way, and therefore it only shows the formation relevant with the present invention.
As shown in Figure 1, first embodiment of a kind of diamond wire ultrasonic cleaning equipment of the present invention, comprise rinse bath 1 and ultrasonic unit, described ultrasonic unit comprises supersonic generator, ultrasonic transducer and at least one ultrasonic vibration plate 2, described ultrasonic vibration plate 2 is arranged in rinse bath 1, the middle part of described rinse bath 1 offers import 11 and the outlet 12 of diamond wire, and described rinse bath 1 is provided with cleaning fluid supplementary device.Diamond wire is worn and is incident upon outlet 12 from the import 11 of rinse bath 1, make the cleaning fluid in rinse bath 1 act on diamond wire surface by ultrasonic vibration plate 2, ultrasonic wave drives the remaining silicon grain on diamond wire to vibrate together, and come off thereupon, this diamond wire ultrasonic cleaning equipment section is directly installed on silicon chip slicer, and the on-line continuousization that completes diamond wire is cleaned.When on-line cleaning, ultrasonic wave makes diamond wire produce microseismic activity, can make the cut surface of cut object smooth, bright and clean, reduces mill, throwing operation or the workload of postorder, and can make the life-span of golden steel wire lengthen.
Further, for guaranteeing the cleaning fluid submergence diamond wire in rinse bath 1, the import 11 of the cell body of described rinse bath 1 and outlet 12 places are respectively equipped with overflow launder 6.
Further, described overflow launder 6 is for being centered around the circumferential loop configuration of rinse bath 1.
Concrete, described cleaning fluid supplementary device comprises a liquid-accumulating trough 7, and described liquid-accumulating trough 7 forms closed circuit by pipeline and overflow launder 6 and rinse bath 1 respectively, and the pipeline between liquid-accumulating trough 7 and rinse bath 1 is provided with the pump housing and switch valve.
As shown in Figure 2, second embodiment of a kind of diamond wire ultrasonic cleaning equipment of the present invention, be with the difference of first embodiment: import 11 places of described rinse bath 1 are provided with diamond wire unwinding device 3, and outlet 12 places of rinse bath 1 are provided with the wrap-up 4 of diamond wire.Diamond wire completes after cutting, can rolling get up, and then concentrates and clean rear rolling, in order to using next time.
As preferably, the quantity of described ultrasonic vibration plate 2 is two, and two described ultrasonic vibration plates 2 are folded in rinse bath 1 import 11 and outlet, and Shang Xia 12 both sides.Be that diamond wire is penetrated and mistake from wearing between two ultrasonic vibration plates 2, the whole surface of diamond wire is cleaned thoroughly.
Further, described rinse bath 1 comprises upper groove body and lower groove, and described upper groove body and lower groove directly removably connect.Pass rinse bath 1 for ease of diamond wire.
Further, be convenient to diamond wire and pass, turning connection between described upper groove body and lower groove.
Further, for ease of controlling the liquid level in rinse bath 1, described upper groove body 1 is provided with liquid level gauge 5.
As shown in Figure 3, the 3rd embodiment of the present invention, is with the difference of second embodiment: further, for removing the silicon material in cleaning fluid, the pipeline between described liquid-accumulating trough 7 and overflow launder 6 and rinse bath 1 is provided with filter 8.
Further, the pipeline between described liquid-accumulating trough 7 and rinse bath 1 is provided with Pressure gauge.
Take above-mentioned foundation desirable embodiment of the present invention as enlightenment, by above-mentioned description, relevant staff can, not departing from the scope of this invention technological thought, carry out various change and modification completely.The technical scope of this invention is not limited to the content on description, must determine its technical scope according to claim scope.
Claims (10)
1. a diamond wire ultrasonic cleaning equipment, it is characterized in that: comprise rinse bath and ultrasonic unit, described ultrasonic unit comprises supersonic generator, ultrasonic transducer and at least one ultrasonic vibration plate, described ultrasonic vibration plate is arranged in rinse bath, the middle part of described rinse bath offers import and the outlet of diamond wire, and described rinse bath is provided with cleaning fluid supplementary device.
2. diamond wire ultrasonic cleaning equipment as claimed in claim 1, is characterized in that: the import department of described rinse bath is provided with diamond wire unwinding device, the exit of rinse bath is provided with the wrap-up of diamond wire.
3. diamond wire ultrasonic cleaning equipment as claimed in claim 1 or 2, is characterized in that: the quantity of described ultrasonic vibration plate is two, and two described ultrasonic vibration plate holders are located at rinse bath import and the upper and lower both sides of outlet.
4. diamond wire ultrasonic cleaning equipment as claimed in claim 1, is characterized in that: described rinse bath comprises upper groove body and lower groove, described upper groove body and lower groove directly removably connect, turning connection between described upper groove body and lower groove.
5. diamond wire ultrasonic cleaning equipment as claimed in claim 4, is characterized in that: described upper groove body is provided with liquid level gauge.
6. diamond wire ultrasonic cleaning equipment as claimed in claim 1, is characterized in that: the inlet and outlet of the cell body of described rinse bath is respectively equipped with overflow launder.
7. diamond wire ultrasonic cleaning equipment as claimed in claim 6, is characterized in that: described overflow launder is to be centered around the circumferential loop configuration of rinse bath.
8. diamond wire ultrasonic cleaning equipment as claimed in claim 1, it is characterized in that: described cleaning fluid supplementary device comprises a liquid-accumulating trough, described liquid-accumulating trough is respectively by pipeline and overflow launder and rinse bath formation closed circuit, and the pipeline between liquid-accumulating trough and rinse bath is provided with the pump housing and switch valve.
9. diamond wire ultrasonic cleaning equipment as claimed in claim 8, is characterized in that: the pipeline between described liquid-accumulating trough and overflow launder and rinse bath is provided with filter.
10. diamond wire ultrasonic cleaning equipment as claimed in claim 8, is characterized in that: the pipeline between described liquid-accumulating trough and rinse bath is provided with Pressure gauge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320736069.1U CN203610368U (en) | 2013-11-19 | 2013-11-19 | Ultrasonic cleaning device of diamond wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320736069.1U CN203610368U (en) | 2013-11-19 | 2013-11-19 | Ultrasonic cleaning device of diamond wire |
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| Publication Number | Publication Date |
|---|---|
| CN203610368U true CN203610368U (en) | 2014-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320736069.1U Expired - Fee Related CN203610368U (en) | 2013-11-19 | 2013-11-19 | Ultrasonic cleaning device of diamond wire |
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| CN (1) | CN203610368U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103611705A (en) * | 2013-11-19 | 2014-03-05 | 张家港市超声电气有限公司 | Ultrasonic cleaning device for diamond wires |
-
2013
- 2013-11-19 CN CN201320736069.1U patent/CN203610368U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103611705A (en) * | 2013-11-19 | 2014-03-05 | 张家港市超声电气有限公司 | Ultrasonic cleaning device for diamond wires |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20161119 |
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| CF01 | Termination of patent right due to non-payment of annual fee |