CN102875011B - Lump melting device for quartz wafers - Google Patents
Lump melting device for quartz wafers Download PDFInfo
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- CN102875011B CN102875011B CN201210361637.4A CN201210361637A CN102875011B CN 102875011 B CN102875011 B CN 102875011B CN 201210361637 A CN201210361637 A CN 201210361637A CN 102875011 B CN102875011 B CN 102875011B
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- wafer
- mounting groove
- stone roller
- lump
- ceiling
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Abstract
The invention relates to a lump melting device for quartz wafers. According to the lump melting device, a plurality of mounting tanks for placing wafer lumps are formed in the upper end of the device, and the length and width of each mounting tank are matched with those of each wafer lump, so that protective strips at the peripheries of the wafer lumps are vertically placed in the mounting tanks; and a through hole from which the wafers drop is formed in the area of the middle wafer of each wafer lump at the bottom of each mounting tank. When the wafer lumps are molten, the wafers drop into collecting boxes automatically, the protective strips are left on the device, and the wafers are not in contact with the protective strips, so that scratch marks, chips and bright spots are avoided, and the yield of products is improved. In addition, the process for selecting the protective strips is saved, and the work efficiency is improved.
Description
Technical field
The present invention relates to a kind of quartz wafer weight device.
Background technology
Need multiple square piece tackiness agent to be bonded together in quartz wafer manufacturing processed and form brilliant stone roller and carry out again cutting and waste time, grind and waste time.And after process finishing, needs is wasted time, the crystalline substance by well cutting is wasted time and is put into container, pours chemical reagent into, places after 2 to 3 hours, and under the effect of chemical reagent, the hot melt adhesive on wafer comes off, and wafer scatters naturally.In order to protect wafer; four limits that crystalline substance is wasted time all are stained with the ceiling made with glass, need to choose ceiling in a reservoir after changing stone roller, and now wafer is easy to protected bar and encounters; then can form cut in wafer surface, or encounter the corner of wafer and produce and collapse the defect such as limit, bright spot.
Summary of the invention
The object of the invention is for the deficiencies in the prior art, a kind of quartz wafer weight device is provided, ceiling damage wafers can be prevented, wafer process quality can be improved, improve conforming product rate.
Present invention employs following technical scheme: device upper end has several mounting groove placing brilliant stone roller, the length and width that length and width and the crystalline substance of each mounting groove are cut or polish jade with an emery wheel coordinate, and make brilliant stone roller surrounding ceiling be placed perpendicularly in mounting groove; Have in the middle wafer region of crystalline substance stone roller the through hole fallen for wafer bottom each mounting groove.Crystalline substance stone roller is placed in the mounting groove of this device; device is put into container; when changing stone roller; wafer falls into the wafer receiving tank of below by the through hole bottom mounting groove; and the ceiling of surrounding is being trapped in mounting groove; wafer is separated automatically with ceiling, thus wafer can be protected not damage by it.
Mounting groove is distributed on device by linescan method, can arrange more mounting groove, and each crystalline substance stone roller quantity of placing is more, can improve the efficiency of device.
The edge that mounting groove is used for supporting the long ceiling in brilliant stone roller both sides is inclined to set, and when changing stone roller, wafer can landing automatically, and wafer can be prevented mutually bonding.Its angle of inclination is to be not more than 15 ° as well, and angle of inclination is crossed conference and made to be arranged in the wafer receiving tank that high-end short ceiling rollover falls into below.
The present invention falls in disposable box automatically due to wafer when changing stone roller, and ceiling is stayed on device, and wafer does not contact with ceiling, avoids cut, collapses limit, the generation of bright spot, improves conforming product rate.And eliminate the operation of choosing ceiling, improve working efficiency.
Accompanying drawing explanation
Fig. 1 is vertical view of the present invention.
Fig. 2 is along A-A line sectional view in Fig. 1.
Fig. 3 is brilliant stone roller structural representation.
Embodiment
Shown in Fig. 1 and Fig. 2, apparatus of the present invention 1 upper end has several by linescan method distribution, the mounting groove 2 being used for placing brilliant stone roller 4, and this example is provided with three row three to arrange for nine mounting grooves.The length and width that length and width and the crystalline substance of each mounting groove 2 cut or polish jade with an emery wheel 4 coordinate, and make brilliant stone roller 4 surrounding ceilings 42,43,44,45 be placed perpendicularly in mounting groove 2; Have in middle wafer 41 region of crystalline substance stone roller 4 through hole 3 fallen for wafer 41 bottom each mounting groove 2.
Crystalline substance stone roller 4 is placed in the mounting groove 2 of this device 1; device 1 is put into container; when changing stone roller; wafer 41 falls into the wafer receiving tank of below by the through hole 3 bottom mounting groove 2; and the ceiling 42,43,44,45 of surrounding is being trapped in mounting groove 2; wafer 41 is separated automatically with ceiling 42,43,44,45, thus wafer can be protected not damage by it.
Conveniently wafer 41 glides; the edge 21 that mounting groove 2 is used for supporting the long ceiling 42,44 in brilliant stone roller both sides is inclined to set; this angle of inclination, edge 21 is not more than 15 °, angle of inclination cross conference make to be arranged in high-end 22 sides of mounting groove 2 short ceiling 45 rollover fall into below wafer receiving tank.
Claims (4)
1. quartz wafer weight device, it is characterized in that: device (1) upper end has several mounting groove (2) placing brilliant stone roller (4), the length and width that length and width and the crystalline substance of each mounting groove (2) cut or polish jade with an emery wheel (4) coordinate, and make brilliant stone roller (4) surrounding ceiling (42,43,44,45) be placed perpendicularly in mounting groove (2); Each mounting groove (2) bottom has the through hole (3) fallen for wafer (41) in the middle wafer region of crystalline substance stone roller (4).
2. quartz wafer weight device according to claim 1, is characterized in that: mounting groove (2) is distributed on device (1) by linescan method.
3. quartz wafer weight device according to claim 1, is characterized in that: the edge (21) that mounting groove (2) is used for supporting the brilliant stone roller long ceiling in (4) both sides (42,44) is inclined to set.
4. quartz wafer weight device according to claim 3, is characterized in that: mounting groove (2) is used for supporting brilliant angle of inclination of cutting or polish jade with an emery wheel the edge (21) of the long ceiling in (4) both sides (42,44) and is not more than 15 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210361637.4A CN102875011B (en) | 2012-09-25 | 2012-09-25 | Lump melting device for quartz wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210361637.4A CN102875011B (en) | 2012-09-25 | 2012-09-25 | Lump melting device for quartz wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102875011A CN102875011A (en) | 2013-01-16 |
| CN102875011B true CN102875011B (en) | 2015-05-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210361637.4A Active CN102875011B (en) | 2012-09-25 | 2012-09-25 | Lump melting device for quartz wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102875011B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107186901A (en) * | 2017-05-11 | 2017-09-22 | 济源石晶光电频率技术有限公司 | Quartz wafer processing method |
| CN107171652B (en) * | 2017-05-24 | 2020-04-21 | 广东惠伦晶体科技股份有限公司 | Lump melting process for quartz wafer |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201395649Y (en) * | 2009-01-21 | 2010-02-03 | 深圳泰美克晶体技术有限公司 | Quartz wafer glue melting machine |
| CN102152204A (en) * | 2011-01-17 | 2011-08-17 | 常州松晶电子有限公司 | Crystal weight degumming device |
| CN102170273A (en) * | 2010-12-31 | 2011-08-31 | 苏州普锐晶科技有限公司 | Application of sulfuric acid stripping in frequency sheet lump melting engineering |
| CN102185575A (en) * | 2010-12-31 | 2011-09-14 | 苏州普锐晶科技有限公司 | Method for removing frequency chip protective glass |
| CN102307040A (en) * | 2011-05-03 | 2012-01-04 | 铜陵市三科电子有限责任公司 | Preparation method for quartz wafer crystal block of surface mounted device (SMD) |
| CN202829811U (en) * | 2012-09-25 | 2013-03-27 | 铜陵晶越电子有限公司 | Quartz-wafer block melting device |
-
2012
- 2012-09-25 CN CN201210361637.4A patent/CN102875011B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201395649Y (en) * | 2009-01-21 | 2010-02-03 | 深圳泰美克晶体技术有限公司 | Quartz wafer glue melting machine |
| CN102170273A (en) * | 2010-12-31 | 2011-08-31 | 苏州普锐晶科技有限公司 | Application of sulfuric acid stripping in frequency sheet lump melting engineering |
| CN102185575A (en) * | 2010-12-31 | 2011-09-14 | 苏州普锐晶科技有限公司 | Method for removing frequency chip protective glass |
| CN102152204A (en) * | 2011-01-17 | 2011-08-17 | 常州松晶电子有限公司 | Crystal weight degumming device |
| CN102307040A (en) * | 2011-05-03 | 2012-01-04 | 铜陵市三科电子有限责任公司 | Preparation method for quartz wafer crystal block of surface mounted device (SMD) |
| CN202829811U (en) * | 2012-09-25 | 2013-03-27 | 铜陵晶越电子有限公司 | Quartz-wafer block melting device |
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| CN102875011A (en) | 2013-01-16 |
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Address after: 244000 No. 1258, Cuihu 2 Road, Tongling Economic and Technological Development Zone, Anhui Province Patentee after: Tongling Jingyue Electronics Co.,Ltd. Address before: 244000 No. 1258, Cuihu 2 Road, Tongling Economic and Technological Development Zone, Anhui Province Patentee before: TONGLING JINGYUE ELECTRONICS CO.,LTD. |
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