CN203092379U - Pyramid grinding disc - Google Patents

Pyramid grinding disc Download PDF

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Publication number
CN203092379U
CN203092379U CN 201220679451 CN201220679451U CN203092379U CN 203092379 U CN203092379 U CN 203092379U CN 201220679451 CN201220679451 CN 201220679451 CN 201220679451 U CN201220679451 U CN 201220679451U CN 203092379 U CN203092379 U CN 203092379U
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CN
China
Prior art keywords
grinding
sword
abrasive disk
pyramid
matrix
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Expired - Fee Related
Application number
CN 201220679451
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Chinese (zh)
Inventor
李卫中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN RUNMING ELECTRONICS TECH Co Ltd
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DONGGUAN RUNMING ELECTRONICS TECH Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN 201220679451 priority Critical patent/CN203092379U/en
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Publication of CN203092379U publication Critical patent/CN203092379U/en
Anticipated expiration legal-status Critical
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Abstract

The utility model relates to the technical field of grinding equipment, in particular to a pyramid grinding disc. The pyramid grinding disc comprises a cylindrical base body, and at least one bottom surface of the base body is connected with a grinding layer comprising a grinding bottom layer and a plurality of grinding blades. The grinding bottom layer and the grinding blades are formed integrally. The grinding bottom layer is positioned between the base body and the grinding blades. The grinding blades are annular protrusions taking the circle center of the base body as the center. The grinding blades are connected with the grinding bottom layer through roots. The gaps between adjacent grinding blades are the same. During processing, new ends of the grinding blades are formed on exposed portions after the ends of the grinding blades are abraded so as to grind workpieces, and the ends of the grinding blades are allowed to keep certain roughness to continue grinding. Therefore, the pyramid grinding disc can perform grinding at a high cutting rate for a long time, an operator applies almost the same pressure condition in the whole grinding process to process stably and continuously, processing is facilitated, and a good, uniform and accurate grinding effect is easy to achieve.

Description

The pyramid abrasive disk
Technical field
The utility model relates to the milling apparatus technical field, particularly relates to a kind of pyramid abrasive disk that can finish grind crystalline materials such as jewel, silicon chip, wafers.
Background technology
In industry, often need handle the surface of workpiece, make it reach certain flatness, especially for crystalline materials such as sapphire, silicon chip, wafer, substrate slices, its surface-treated requires higher.Therefore, need be equipped with lapping liquid by abrasive disk grinding is carried out on the surface of workpiece.
From microcosmic, the surface of general solid-state material has certain roughness and porosity characteristic, and for abrasive disk, its surface has small, sharp lug boss, during relative motion, these sharp lug bosses can carry out grinding to the surface of workpiece to abrasive disk on workpiece.In the prior art usually with granular material compression molding, form discoid abrasive disk, its working face is a plane, can strengthen the work area of grinding like this, but after its work a period of time, the chip that workpiece and abrasive disk are worn is filled in the surface of abrasive disk, reduced its surperficial roughness, make the stock removal rate of abrasive disk descend rapidly, force the operator to apply bigger pressure, this can increase operator's labour intensity and increase the excessively danger of cutting.
Summary of the invention
The purpose of this utility model is at the deficiencies in the prior art, and a kind of pyramid abrasive disk that can finish grind crystalline materials such as jewel, silicon chip, wafers is provided, and its scientific structure is simple, process of lapping steadily, continuously, grinding effect is good.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of pyramid abrasive disk, it comprises columniform matrix, at least one bottom surface of described matrix is connected with grinding layer, described grinding layer comprise grind bottom, several grind sword, described grinding bottom and described grinding sword are one-body molded, described grinding bottom is between described matrix, grinding sword, described grinding sword is the annular protrusion at center for the center of circle with matrix, described grinding sword is connected with described grinding bottom by root, and the spacing of described adjacent grinding sword equates.
Wherein, the spacing of described adjacent grinding sword is 1~3mm, and the height of described grinding sword is 0.1~0.3mm.
Preferably.The spacing of described adjacent grinding sword is 2mm, and the height of described grinding sword is 0.2mm.
Wherein, the thickness of described grinding bottom is 8~10mm.
Preferably, the cross sectional shape of described grinding sword is a triangle, and this leg-of-mutton base is for grinding the root of sword.
Perhaps, the cross sectional shape of described grinding sword is trapezoidal, and this trapezoidal bottom is for grinding the root of sword.
Wherein, the middle part of described matrix is provided with the connecting hole of perforation.
Further, described matrix is the copper dish.
Further, described matrix also comprises iron pan or aluminium dish, and described iron pan or aluminium dish be and concentric cylindrical of described copper dish, and a bottom surface of described copper dish is connected with grinding layer, and another bottom surface is connected with described iron pan or aluminium dish.
Described iron pan or aluminium sheet and described copper dish are connected by bonding, welding or bolted one or more.
The beneficial effects of the utility model are: a kind of pyramid abrasive disk, its grinding layer comprises the grinding bottom, several grind sword, described grinding bottom and described grinding sword are one-body molded, described grinding sword is the annular protrusion at center for the center of circle with matrix, the spacing of described adjacent grinding sword equates, add man-hour, after grinding the end wear of sword, the part of exposing forms new end, can grind workpiece, thereby make the end of grinding sword keep certain roughness, can proceed to grind, therefore, pyramid abrasive disk of the present utility model can grind and keeps the long period with high stock removal rate, and the operator applies pressure condition much at one in the overall process of grinding, can carry out stably, continuous processing, made things convenient for processing, and the correct grinding effect of the unanimity that obtains easily.
Description of drawings
Fig. 1 is the structural representation of pyramid abrasive disk of the present utility model.
Fig. 2 is the structural representation of grinding sword of the present utility model.
Fig. 3 is the partial cutaway schematic of grinding sword of the present utility model, grinding bottom.
Fig. 4 is the partial cutaway schematic of the another kind of embodiment of grinding sword of the present utility model, grinding bottom.
Fig. 5 is the partial cutaway schematic of another embodiment of grinding sword of the present utility model, grinding bottom.
Description of reference numerals:
1---matrix 11---connecting hole
12---copper dish 13---iron pan
2---grinding bottom 3---are ground sword.
The specific embodiment
Below in conjunction with the drawings and specific embodiments the utility model being described in further detail, is not that practical range of the present utility model is limited to this.
As shown in Figure 1, the pyramid abrasive disk of present embodiment, it comprises columniform matrix 1, at least one bottom surface of described matrix 1 is connected with grinding layer, during use, matrix 1 is connected with milling apparatus, grinding layer is towards workpiece to be processed, milling apparatus drives matrix 1 and rotates, thereby by grinding layer workpiece is ground, and is holistic disk with respect to the pyramid abrasive disk of prior art, the utility model is with pyramid abrasive disk separated into two parts matrix 1, grinding layer two parts, after using a period of time, the grinding layer after the wearing and tearing can be replaced, and matrix 1 can reuse.And, described grinding layer comprises grinding bottom 2, several grind sword 3, described grinding bottom 2 and described grinding sword 3 are one-body molded, described grinding bottom 2 is positioned at described matrix 1, grind between the sword 3, it is identical with the material that grinds sword 3 to grind bottom 2, but its shape difference, grinding bottom 2 is writing board shape, mainly play a supportive role, mainly play abrasive actions and grind sword 3, described grinding sword 3 is the annular protrusion at center for the center of circle with matrix 1, described grinding sword 3 is connected with described grinding bottom 2 by root, the spacing of described adjacent grinding sword 3 equates, grinding the cross-sectional width of sword 3 from root to the end diminishes gradually, during use, after grinding the end wear of sword 3, the part of exposing forms new end, can grind workpiece, the chip of grinding sword 3 and workpiece falls into the groove between the adjacent grinding sword 3, and then discharge with lapping liquid, thereby make the end of grinding sword 3 keep certain roughness, can proceed to grind, therefore, pyramid abrasive disk of the present utility model can grind and keeps the long period with high stock removal rate, and the operator applies pressure condition much at one in the overall process of grinding, can carry out stably, continuous processing, made things convenient for processing, and the correct grinding effect of the unanimity that obtains easily.
For the utility model, the spacing a of described adjacent grinding sword 3 is 1~3mm, and the height b of described grinding sword 3 is 0.1~0.3mm, and preferred, the spacing of described adjacent grinding sword 3 is 2mm, and the height of described grinding sword 3 is 0.2mm.The thickness c of described grinding bottom 2 is 8~10mm.
For the utility model, the cross sectional shape of described grinding sword 3 can adopt numerous embodiments, is preferably triangle, and as shown in Figure 3, this leg-of-mutton base is for grinding the root of sword 3.
As shown in Figure 4, the cross sectional shape of described grinding sword 3 can also be for trapezoidal, and this trapezoidal bottom is for grinding the root of sword 3.As shown in Figure 5, the cross sectional shape of described grinding sword 3 can also be similar leg-of-mutton shape, and this leg-of-mutton upward drift angle is a fillet.
For the utility model, the middle part of described matrix 1 is provided with the connecting hole 11 of perforation, and milling apparatus is by contiguous block 11 fixing bases 1.
Because the effect of matrix 1 is to play a supportive role, so matrix 1 can select on-deformable metal for use, and requires this metal to be easy to be connected with grinding layer, and preferably, described matrix 1 is a copper dish 12.
Because the price of copper is higher, the one side that matrix 1 does not contact with grinding layer can also adopt other metals, as iron, aluminium and alloy thereof, preferably, as shown in Figure 1, described matrix 1 also comprises iron pan 13, and described iron pan 13 is and concentric cylindrical of described copper dish 12, a bottom surface of described copper dish 12 is connected with grinding layer, and another bottom surface is connected with described iron pan 13.
Described iron pan 13 or aluminium sheet and described copper dish 12 are connected by bonding, welding or bolted one or more.
Should be noted that at last; above embodiment is only in order to the explanation the technical solution of the utility model; but not to the restriction of the utility model protection domain; although the utility model has been done to explain with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement the technical solution of the utility model, and not break away from the essence and the scope of technical solutions of the utility model.

Claims (10)

1. pyramid abrasive disk, it is characterized in that: comprise columniform matrix, at least one bottom surface of described matrix is connected with grinding layer, described grinding layer comprise grind bottom, several grind sword, described grinding bottom and described grinding sword are one-body molded, and described grinding bottom is between described matrix, grinding sword, and described grinding sword is the annular protrusion at center for the center of circle with matrix, described grinding sword is connected with described grinding bottom by root, and the spacing of described adjacent grinding sword equates.
2. pyramid abrasive disk according to claim 2 is characterized in that: the spacing of described adjacent grinding sword is 1~3mm, and the height of described grinding sword is 0.1~0.3mm.
3. pyramid abrasive disk according to claim 2 is characterized in that: the spacing of described adjacent grinding sword is 2mm, and the height of described grinding sword is 0.2mm.
4. pyramid abrasive disk according to claim 1 is characterized in that: the thickness of described grinding bottom is 8~10mm.
5. pyramid abrasive disk according to claim 1 is characterized in that: the cross sectional shape of described grinding sword is a triangle, and this leg-of-mutton base is for grinding the root of sword.
6. pyramid abrasive disk according to claim 1 is characterized in that: the cross sectional shape of described grinding sword is trapezoidal, and this trapezoidal bottom is for grinding the root of sword.
7. pyramid abrasive disk according to claim 1 is characterized in that: the middle part of described matrix is provided with the connecting hole of perforation.
8. pyramid abrasive disk according to claim 1 is characterized in that: described matrix is the copper dish.
9. pyramid abrasive disk according to claim 8, it is characterized in that: described matrix also comprises iron pan or aluminium dish, described iron pan or aluminium dish be and concentric cylindrical of described copper dish, and a bottom surface of described copper dish is connected with grinding layer, and another bottom surface is connected with described iron pan or aluminium dish.
10. pyramid abrasive disk according to claim 9 is characterized in that: described iron pan or aluminium sheet and described copper dish are connected by bonding, welding or bolted one or more.
CN 201220679451 2012-12-11 2012-12-11 Pyramid grinding disc Expired - Fee Related CN203092379U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220679451 CN203092379U (en) 2012-12-11 2012-12-11 Pyramid grinding disc

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Application Number Priority Date Filing Date Title
CN 201220679451 CN203092379U (en) 2012-12-11 2012-12-11 Pyramid grinding disc

Publications (1)

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CN203092379U true CN203092379U (en) 2013-07-31

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103009237A (en) * 2012-12-11 2013-04-03 东莞润明电子科技有限公司 Pyramid grinding plate
CN106914816A (en) * 2017-03-21 2017-07-04 江苏吉星新材料有限公司 A kind of sapphire wafer polishing fast disassembly type resin copper dish

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103009237A (en) * 2012-12-11 2013-04-03 东莞润明电子科技有限公司 Pyramid grinding plate
CN103009237B (en) * 2012-12-11 2018-04-06 东莞润明电子科技有限公司 Pyramid grinding plate
CN106914816A (en) * 2017-03-21 2017-07-04 江苏吉星新材料有限公司 A kind of sapphire wafer polishing fast disassembly type resin copper dish

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130731

Termination date: 20201211

CF01 Termination of patent right due to non-payment of annual fee