CN103009273B - Pyramid grinding plate - Google Patents
Pyramid grinding plate Download PDFInfo
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- CN103009273B CN103009273B CN201210530738.XA CN201210530738A CN103009273B CN 103009273 B CN103009273 B CN 103009273B CN 201210530738 A CN201210530738 A CN 201210530738A CN 103009273 B CN103009273 B CN 103009273B
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- Prior art keywords
- grinding
- sword
- diadust
- diamond
- polishing material
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Abstract
The present invention relates to milling apparatus technical fields, more particularly to a kind of pyramid grinding plate, it includes 60%~80%(weight) diadust, surplus is non-diamond nanoscale polishing material, wherein, non-diamond nanoscale polishing material is aluminium oxide, cerium oxide, the mixture of one or more of silicon carbide and resin, the mesh number of diadust and non-diamond nanoscale polishing material is 600~5000 mesh, the present invention is uniformly distributed after abrasive mixed can be made to close, obtain stable stock-removing efficiency, longer service life, diadust and aluminium oxide, cerium oxide, silicon carbide can refine crystal, processed material will not be damaged, without fragmentation, without scuffing, stability, safety is more preferable, and due to diadust and aluminium oxide, cerium oxide, silicon carbide stable chemical performance, therefore originally The pyramid grinding plate of invention with have corrosive lapping liquid with the use of when do well.
Description
Technical field
The present invention relates to milling apparatus technical fields, can be to the crystal material such as jewel, silicon wafer, chip more particularly to one kind
Expect the pyramid grinding plate refined.
Background technique
In the industry, it is often necessary to the surface of workpiece is handled, certain flatness is reached, especially for
The requirement of the crystalline materials such as sapphire, silicon wafer, chip, substrate slice, surface treatment is higher.Therefore, it is necessary to be matched by abrasive disk
It is ground with surface of the lapping liquid to workpiece.The surface of abrasive disk is amplified, it can be seen that its surface has small, sharp
Lug boss, in relative motion on workpiece, these sharp lug bosses can be ground the surface of workpiece abrasive disk.
The material of abrasive disk is directly related to the service life and grinding effect of abrasive disk, and the material of existing abrasive disk is logical
It frequently with grey cast-iron, wears no resistance, service life is short.Application No. is 201110143354.8 Chinese invention patent Shens
In please " synthesizing copper dish abrasive disk ", which describe the abrasive disk that a kind of main component is copper, specific components are as follows: and copper powder 90~
95%, nickel powder 1~5%, cerium powder 3~10%, and add 10~50% epoxy resin of said components total amount and mixing for polyurethane adhesive
Close object.It is still remained and is worn no resistance using the abrasive disk of above-mentioned material, the short disadvantage of service life is not suitable for carrying out essence to crystal
Fine lapping also, when lapping liquid have corrosivity when, above-mentioned abrasive disk can shorten the working life.
Summary of the invention
In view of the above-mentioned deficiencies in the prior art, it is an object of the present invention to and one kind is provided can be to crystalline substances such as jewel, silicon wafer, chips
The pyramid grinding plate that body material is refined, wearability is good, long service life, is suitble to refine crystal.
The technical solution adopted by the present invention to solve the technical problems is: a kind of pyramid grinding plate comprising 60%~
80%(weight) diadust, surplus be non-diamond nanoscale polishing material, wherein non-diamond nanoscale polishing material
Material is the mixture of one or more of aluminium oxide, cerium oxide, silicon carbide and resin, diadust and non-diamond nanometer
The mesh number of grade polishing material is 600~5000 mesh.
Diadust preferably comprising 65%~75%(weight), surplus are non-diamond nanoscale polishing material.
Diadust preferably comprising 70%(weight), 30%(weight) non-diamond nanoscale polishing material.
Preferably, the purity of the diadust is 98% or more.
Preferably, the non-diamond nanoscale polishing material is aluminium oxide, and the purity of aluminium oxide is 98% or more.
Preferably, the non-diamond nanoscale polishing material is cerium oxide, and the purity of cerium oxide is 98% or more.
Preferably, the non-diamond nanoscale polishing material is silicon carbide, and the purity of silicon carbide is 98% or more.
The beneficial effects of the present invention are: a kind of pyramid grinding plate, is uniformly distributed after abrasive mixed can be made to close, obtain steady
Fixed stock-removing efficiency, longer service life, diadust and aluminium oxide, cerium oxide, silicon carbide can carry out essence to crystal
Mill, will not damage processed material, no fragmentation, without scuffing, and stability, safety are more preferable, and due to diadust and
Aluminium oxide, cerium oxide, silicon carbide stable chemical performance, thus pyramid grinding plate of the invention with have corrosive lapping liquid
With the use of when do well.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of abrasive disk of the invention.
Fig. 2 is the structural schematic diagram of grinding sword of the invention.
Fig. 3 is grinding sword of the invention, the partial cutaway schematic for grinding bottom.
Description of symbols:
1 --- matrix 11 --- connecting hole
12 --- copper dish 13 --- iron pans
2 --- grinding bottom 3 --- grinding swords.
Specific embodiment
The present invention is described in further detail in the following with reference to the drawings and specific embodiments, is not reality of the invention
Scope limitation is applied in this.
Embodiment one.
Pyramid grinding plate comprising 60%~80%(weight) diadust, surplus be non-diamond nanoscale throw
Luminescent material, wherein non-diamond nanoscale polishing material is one or more of aluminium oxide, cerium oxide, silicon carbide and resin
Mixture, the mesh number of diadust and non-diamond nanoscale polishing material is 600~5000 mesh, the golden word of the present embodiment
Tower abrasive disk is uniformly distributed after mixing abrasive material when processing, and can obtain stable stock-removing efficiency, longer service life, Buddha's warrior attendant
Stone micro mist and aluminium oxide, cerium oxide, silicon carbide can refine crystal, will not damage processed material, no fragmentation, nothing
It scratching, stability, safety are more preferable, and due to diadust and aluminium oxide, cerium oxide, silicon carbide stable chemical performance,
Therefore pyramid grinding plate of the invention with corrosive lapping liquid with the use of when do well.
Preferably, the purity of the diadust is 98% or more.
Preferably, the non-diamond nanoscale polishing material is aluminium oxide, and the purity of aluminium oxide is 98% or more.
For the present invention, to obtain better grinding effect, pyramid grinding plate of the invention has as shown in Figure 1, Figure 2, Fig. 3
Structure comprising at least one bottom surface of cylindrical matrix 1, described matrix 1 is connected with grinding layer, in use, matrix 1 with
Milling apparatus connection, grinding layer drive matrix 1 to rotate towards workpiece to be processed, milling apparatus, thus by grinding layer to work
Part is ground, and abrasive disk is divided into two parts matrix by the disk that abrasive disk compared with the existing technology is integral, the present invention
1, the grinding layer after abrasion can be replaced by grinding layer two parts after a period of use, and matrix 1 can repeat benefit
With.Also, the grinding layer includes grinding bottom 2, several grinding swords 3,3 one of the grinding bottom 2 and the grinding sword
Molding, the grinding bottom 2 are located between described matrix 1, grinding sword 3, and grinding bottom 2 is identical as the grinding material of sword 3, but its
Shape is different, and grinding bottom 2 is writing board shape, mainly plays a supportive role, and grinds sword 3 and mainly play abrasive action, the grinding
Sword 3 is the annular protrusion centered on the center of circle of matrix 1, and the grinding sword 3 is connect by root with the grinding bottom 2, institute
The spacing for stating neighboring abrasive sword 3 is equal, and grinding sword 3 gradually becomes smaller from the cross-sectional width of root end, in use, grinding sword 3
After end wear, the part of exposing forms new end, can grind to workpiece, and the clast for grinding sword 3 and workpiece is fallen into
It in groove between neighboring abrasive sword 3, and then is discharged with lapping liquid, so that the end of grinding sword 3 keeps centainly coarse
Degree, can continue to grind, and therefore, abrasive disk of the invention can be ground and be maintained for a long time with high stock removal rate,
Operator applies almost the same pressure condition in the overall process of grinding, can carry out stable, continuous processing, facilitate
Processing, and the consistent refining effect being easy to get.Grind cross-sectional width of the sword 3 from root to end gradually become smaller to
The shape of similar " pyramid " is formed, the section of grinding sword 3 is not necessarily limited to shape shown in Fig. 3.
The middle part of matrix 1 is provided with the connecting hole 11 of perforation, and milling apparatus passes through 11 fixing base 1 of link block.The base
Body 1 is preferably copper dish 12, and since the price of copper is higher, the one side that matrix 1 is not contacted with grinding layer can also use other metals,
Such as iron, aluminium and its alloy, it is preferred that as shown in Figure 1, described matrix 1 further includes iron pan 13.
Embodiment two.
The difference between this embodiment and the first embodiment lies in: the non-diamond nanoscale polishing material be cerium oxide rather than
Aluminium oxide, the purity of cerium oxide are 98% or more.The other technical characteristics of the present embodiment are the same as example 1, no longer superfluous herein
It states.
Embodiment three.
The difference between this embodiment and the first embodiment lies in: the non-diamond nanoscale polishing material be silicon carbide rather than
Aluminium oxide, the purity of silicon carbide are 98% or more.The other technical characteristics of the present embodiment are the same as example 1, no longer superfluous herein
It states.
Example IV.
For the pyramid grinding plate of the present embodiment comprising 65%~75%(weight) diadust, surplus be it is non-
Diamond nano grade polishing material, wherein non-diamond nanoscale polishing material is aluminium oxide, cerium oxide, one in silicon carbide
The mesh number of kind or several and resin mixture, diadust and non-diamond nanoscale polishing material is 600~5000 mesh,
The other technical characteristics of the present embodiment are the same as example 1, and details are not described herein.
Embodiment five.
The difference of the present embodiment and example IV is: it includes 70%(weight) diadust, 30%(weight)
Non-diamond nanoscale polishing material, wherein non-diamond nanoscale polishing material is aluminium oxide, in cerium oxide, silicon carbide
The mesh number of one or more of mixtures with resin, diadust and non-diamond nanoscale polishing material is 600~5000
The other technical characteristics of mesh, the present embodiment are identical as example IV, and details are not described herein.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than the present invention is protected
The limitation of range is protected, although explaining in detail referring to preferred embodiment to the present invention, those skilled in the art are answered
Work as understanding, it can be with modification or equivalent replacement of the technical solution of the present invention are made, without departing from the reality of technical solution of the present invention
Matter and range.
Claims (1)
1. pyramid grinding plate, it is characterised in that: it includes the non-Buddha's warrior attendant of the diadust of 70% (weight), 30% (weight)
Stone nanoscale polishing material, wherein non-diamond nanoscale polishing material is the mixed of aluminium oxide, cerium oxide, silicon carbide and resin
The mesh number of conjunction object, diadust and non-diamond nanoscale polishing material is 600~5000 mesh；The diadust it is pure
Degree is 98% or more；The purity of the aluminium oxide is 98% or more, and the purity of the cerium oxide is 98% or more, the silicon carbide
Purity be 98% or more；
Pyramid grinding plate includes cylindrical matrix (1), at least one bottom surface of described matrix (1) is connected with grinding layer, institute
Stating grinding layer includes grinding bottom (2), several grindings sword (3), the grinding bottom (2) and the grinding sword (3) integrally at
Type, the grinding bottom (2) are located between described matrix (1), grinding sword (3), and grinding bottom (2) is writing board shape, described to grind
Sharpening (3) is the annular protrusion centered on the center of circle of matrix (1), and the grinding sword (3) passes through root and the grinding bottom
(2) connect, the spacing of the neighboring abrasive sword (3) is equal, grind sword (3) cross-sectional width from root to end gradually become smaller from
And form the shape of similar " pyramid "；In use, the part of exposing forms new end after the end wear of grinding sword (3),
Workpiece can be ground, the clast for grinding sword (3) and workpiece is fallen into the groove between neighboring abrasive sword (3), Jin Ersui
Lapping liquid discharge can continue to grind so that the end of grinding sword (3) keeps certain roughness；Matrix (1)
Middle part is provided with the connecting hole (11) of perforation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210530738.XA CN103009273B (en) | 2012-12-11 | 2012-12-11 | Pyramid grinding plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210530738.XA CN103009273B (en) | 2012-12-11 | 2012-12-11 | Pyramid grinding plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103009273A CN103009273A (en) | 2013-04-03 |
| CN103009273B true CN103009273B (en) | 2019-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210530738.XA Expired - Fee Related CN103009273B (en) | 2012-12-11 | 2012-12-11 | Pyramid grinding plate |
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| CN (1) | CN103009273B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103465347B (en) * | 2013-09-24 | 2015-03-04 | 潍坊华美精细技术陶瓷有限公司 | Manufacturing method for silicon carbide grinding barrel in grinding equipment |
| CN103522217B (en) * | 2013-10-16 | 2015-12-02 | 柘城县华鑫超硬磨料磨具有限公司 | Gem and jade processing mill and production technology thereof |
| CN105538174B (en) * | 2015-12-03 | 2018-05-22 | 郑州磨料磨具磨削研究所有限公司 | A kind of emery wheel block and preparation method thereof, buffing wheel |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201483357U (en) * | 2009-09-02 | 2010-05-26 | 四川欧曼机械有限公司 | Mirror surface grinding disk |
| CN102699833A (en) * | 2012-05-16 | 2012-10-03 | 贵州荣清工具有限公司 | Method for manufacturing ceramic diamond composite grinding wheel |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08118240A (en) * | 1994-10-18 | 1996-05-14 | Yano Kazuya | Grinding wheel and its manufacture |
| KR100809623B1 (en) * | 2007-06-19 | 2008-03-05 | (주)디앤디 디스크산업 | Manufacturing mold for cutting wheel |
| CN201419362Y (en) * | 2009-06-16 | 2010-03-10 | 河南富耐克超硬材料有限公司 | Composite abrasive grinding disc |
| CN101745875A (en) * | 2009-12-29 | 2010-06-23 | 西安交通大学 | Grinding tool mixed by abrasives |
| CN102337084B (en) * | 2011-07-25 | 2014-04-09 | 郑州磨料磨具磨削研究所有限公司 | Grinding fluid for processing LED (light-emitting diode) substrate and preparation method thereof |
-
2012
- 2012-12-11 CN CN201210530738.XA patent/CN103009273B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201483357U (en) * | 2009-09-02 | 2010-05-26 | 四川欧曼机械有限公司 | Mirror surface grinding disk |
| CN102699833A (en) * | 2012-05-16 | 2012-10-03 | 贵州荣清工具有限公司 | Method for manufacturing ceramic diamond composite grinding wheel |
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| CN103009273A (en) | 2013-04-03 |
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