TW202328022A - Glass sheet manufacturing method - Google Patents
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- TW202328022A TW202328022A TW111146171A TW111146171A TW202328022A TW 202328022 A TW202328022 A TW 202328022A TW 111146171 A TW111146171 A TW 111146171A TW 111146171 A TW111146171 A TW 111146171A TW 202328022 A TW202328022 A TW 202328022A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
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- Organic Chemistry (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
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Abstract
Description
本揭示是有關於一種玻璃板的製造方法。The disclosure relates to a method for manufacturing a glass plate.
玻璃板的製造步驟中包含利用研削磨石對玻璃板的端面進行加工的研削步驟、以及利用研磨磨石對藉由研削磨石加工後的端面進行加工的研磨步驟的情況為慣例(參照專利文獻1)。於研削步驟中,對玻璃板的端面進行磨削來實施倒角加工,於研磨步驟中,進行使端面光滑的精加工。 [現有技術文獻] [專利文獻] It is common practice to include a grinding step of processing the end face of the glass plate with a grinding stone and a grinding step of processing the end face processed by the grinding stone with the grinding stone in the manufacturing steps of the glass plate (see Patent Document 1). In the grinding step, the end surface of the glass plate is ground and chamfered, and in the grinding step, finishing processing for smoothing the end surface is performed. [Prior art literature] [Patent Document]
[專利文獻1]日本專利特開2016-40073號公報[Patent Document 1] Japanese Patent Laid-Open No. 2016-40073
[發明所欲解決之課題] 玻璃板被用作以液晶顯示器、有機電致發光(Electroluminescence,EL)顯示器等為代表的顯示器用的基板。近年來,要求開發出更高精細的顯示器,為了應對該要求,需要進一步提高玻璃板的端面品質。具體而言,要求可進一步抑制玻璃粉的產生的低起塵性、或可防止由蝕刻液引起的腐蝕的耐藥液性、或可防止以端面為起點的破裂的高強度等。 [Problem to be Solved by the Invention] A glass plate is used as a substrate for displays represented by liquid crystal displays, organic electroluminescence (EL) displays, and the like. In recent years, the development of higher-definition displays has been demanded, and in order to meet this demand, it is necessary to further improve the quality of the end surface of the glass plate. Specifically, low dust generation that can further suppress the generation of glass powder, chemical resistance that can prevent corrosion caused by etching liquid, high strength that can prevent cracks starting from the end surface, and the like are required.
鑒於以上情況而應解決的技術課題在於,在製造玻璃板時提高該玻璃板的端面品質。 [解決課題之手段] The technical problem to be solved in view of the above situation is to improve the quality of the end surface of the glass plate at the time of manufacturing the glass plate. [Means to solve the problem]
用於解決所述課題的第一玻璃板的製造方法包括:研削步驟,利用研削磨石對玻璃板的端面進行加工;以及研磨步驟,利用研磨磨石對藉由研削磨石加工後的玻璃板的端面進行加工,所述方法的特徵在於:於研削步驟中以脆性模式進行加工,於研磨步驟中主要以延展性模式進行加工。A method of manufacturing a first glass plate for solving the above-mentioned problems includes: a grinding step of processing an end surface of a glass plate with a grinding stone; and a grinding step of grinding the glass plate processed by the grinding stone with a grinding stone The method is characterized in that the processing is performed in a brittle mode in the grinding step, and the processing is mainly performed in a ductile mode in the grinding step.
此處,所謂「主要以延展性模式進行加工」,是指以延展性模式對作為加工對象的端面的全長(沿著加工方向的全長)中的50%以上的長度進行加工(以下相同)。Here, "processing mainly in the ductile mode" means that 50% or more of the total length (full length along the machining direction) of the end surface to be processed is processed in the ductile mode (the same applies hereinafter).
於本方法中,於進行玻璃板的端面的精加工的步驟即研磨步驟中,主要以延展性模式對端面進行加工。根據延展性模式,可儘可能地避免於加工後的端面上殘存裂紋。藉此,對於研磨步驟後的端面,獲得可抑制玻璃粉的產生的低起塵性、可防止由蝕刻液引起的腐蝕的耐藥液性、及可防止以端面為起點的破裂的高強度。即,能夠提高玻璃板的端面品質。In this method, in the step of finishing the end surface of the glass plate, that is, the grinding step, the end surface is mainly processed in a ductile mode. According to the ductility mode, remaining cracks on the machined end face can be avoided as much as possible. Thereby, for the end face after the grinding step, low dust generation that suppresses the generation of glass powder, chemical resistance that prevents corrosion caused by etching liquid, and high strength that prevents cracks starting from the end face are obtained. That is, the end surface quality of a glass plate can be improved.
第二玻璃板的製造方法設為如下方式:於所述第一玻璃板的製造方法中,於研削步驟及研磨步驟中,分別向研削磨石及研磨磨石的圓周上的加工部供給冷卻介質,於研磨步驟中,相較於研削步驟而言減少冷卻介質的供給量。The manufacturing method of the 2nd glass plate is set as follows: In the manufacturing method of the said 1st glass plate, in a grinding process and a grinding process, a cooling medium is supplied to the grinding stone and the processing part on the circumference of a grinding stone, respectively. , in the grinding step, the supply amount of the cooling medium is reduced compared to the grinding step.
由發明者進行試行,結果判明,於向磨石的圓周上的加工部供給冷卻介質時,若於研磨步驟中相較於研削步驟而言減少供給量,則於研磨步驟中容易表現出延展性模式。因此,若如上所述般減少冷卻介質的供給量,則於研磨步驟中容易穩定地實施基於延展性模式的加工。As a result of the inventor's experiments, it has been found that when the cooling medium is supplied to the processing portion on the circumference of the grindstone, if the supply amount is reduced in the grinding step compared with the grinding step, ductility is easily expressed in the grinding step model. Therefore, if the supply amount of the cooling medium is reduced as described above, it is easy to stably perform processing in the ductility mode in the grinding step.
第三玻璃板的製造方法設為如下方式:於所述第二玻璃板的製造方法中,使用水作為冷卻介質。另外,第四玻璃板的製造方法設為如下方式:於第三玻璃板的製造方法中,於研削步驟及研磨步驟中,分別自研削步驟用噴嘴及研磨步驟用噴嘴供給水,於研削步驟中,將自研削步驟用噴嘴流出的水的流量設為15 L/min~25 L/min,於研磨步驟中,將自研磨步驟用噴嘴流出的水的流量設為0 L/min~15 L/min。The manufacturing method of the 3rd glass plate is set as the aspect which uses water as a cooling medium in the manufacturing method of the said 2nd glass plate. In addition, in the manufacturing method of the fourth glass plate, in the manufacturing method of the third glass plate, in the grinding step and the grinding step, water is supplied from the nozzle for the grinding step and the nozzle for the grinding step, respectively, and in the grinding step , set the flow rate of water flowing out from the nozzle in the grinding step to 15 L/min to 25 L/min, and in the grinding step, set the flow rate of water flowing out from the nozzle in the grinding step to 0 L/min to 15 L/min min.
根據所述第三玻璃板的製造方法,藉由使用水作為冷卻介質,可簡易且低成本地享有所述提高玻璃板的端面品質的效果。另外,根據所述第四玻璃板的製造方法,藉由將水的流量調節為所述流量,於研磨步驟中容易表現出延展性模式,於該方面更有利。According to the manufacturing method of the third glass plate, by using water as the cooling medium, the effect of improving the quality of the end surface of the glass plate can be enjoyed easily and at low cost. Moreover, according to the manufacturing method of the said 4th glass plate, by adjusting the flow rate of water to the said flow rate, it becomes easy to express a ductility mode in a grinding process, and it is more advantageous in this point.
第五玻璃板的製造方法設為如下方式:於所述第一玻璃板的製造方法~第四玻璃板的製造方法中的任一玻璃板的製造方法中,於研磨步驟中,將研磨磨石與玻璃板的端面的相對移動速度設為20 m/min以上。The manufacturing method of the 5th glass plate is set as follows: In the manufacturing method of any one glass plate in the manufacturing method of the said 1st glass plate - the manufacturing method of the 4th glass plate, in a grinding process, a grinding stone is used The relative moving speed with the end face of the glass plate is set to 20 m/min or more.
作為基於延展性模式的加工的難點,可列舉磨石與玻璃板的端面的相對移動速度(加工速度)容易成為低速這一點。然而,若如上所述般於研磨步驟中相較於研削步驟而言減少冷卻介質(水)的供給量,則可實現20 m/min以上的高速的相對移動速度下的基於延展性模式的加工。As a difficulty in the processing by the ductility mode, the relative moving speed (processing speed) of the grindstone and the end surface of the glass plate tends to be low. However, if the amount of cooling medium (water) supplied in the grinding step is reduced compared to the grinding step as described above, processing by the ductility mode at a high relative moving speed of 20 m/min or more can be realized .
第六玻璃板的製造方法設為如下方式:於所述第一玻璃板的製造方法~第五玻璃板的製造方法中的任一玻璃板的製造方法中,於研磨步驟中,使根據下述[數1]式算出的G的值小於0.1。 [數1] m:磨石中所含的研磨粒的種類的數量 n k:關於第k種研磨粒的研磨粒的數量(根據下述[數2]式算出) r k:關於第k種研磨粒的平均研磨粒半徑[mm] A k:關於第k種研磨粒的研磨粒種類係數 D:磨石的直徑[mm] B:關於用於磨石的黏合劑的黏合劑係數 此處,研磨粒種類係數A k的值根據研磨粒的種類設為如下般。 金剛石:8000 立方氮化硼:4700 碳化矽:2500 氧化鋁:2100 此處,黏合劑係數B的值根據黏合劑的種類設為如下般。 金屬:3000 樹脂:30 彈性體:1 [數2] c k:關於第k種研磨粒的研磨粒率[vol%] The manufacturing method of the 6th glass plate is set as follows: In the manufacturing method of any one glass plate in the manufacturing method of the said 1st glass plate - the manufacturing method of the 5th glass plate, in a grinding|polishing process, the following [Equation 1] The value of G calculated by the formula is less than 0.1. [number 1] m: the number of types of abrasive grains contained in the grindstone n k : the number of abrasive grains for the k-th type of abrasive grains (calculated from the following formula 2) r k : average for the k-th type of abrasive grains Abrasive grain radius [mm] A k : Abrasive grain type coefficient regarding the k-th type of abrasive grain D: Diameter of the grinding stone [mm] B: Binder coefficient regarding the binder used for the grinding stone Here, the abrasive grain type coefficient The value of A k is set as follows according to the type of abrasive grains. Diamond: 8000 Cubic boron nitride: 4700 Silicon carbide: 2500 Alumina: 2100 Here, the value of the binder coefficient B is set as follows according to the type of binder. Metal: 3000 Resin: 30 Elastomer: 1 [number 2] c k : Abrasive grain ratio of the kth abrasive grain [vol%]
若使根據所述[數1]式算出的G的值小於0.1,則能夠更適宜地享有所述提高玻璃板的端面品質的效果。If the value of G calculated from the above-mentioned [Expression 1] formula is less than 0.1, the above-mentioned effect of improving the quality of the end surface of the glass plate can be enjoyed more suitably.
此處,對所述[數1]式進行說明。G的值是用於表示磨石對玻璃板的端面進行磨削的能力的高低的指標。若展開所述[數1]式,則成為下述[數3]式。 [數3] Here, the above formula [1] will be described. The value of G is an index for showing the level of the ability of the grindstone to grind the end surface of the glass plate. When the above-mentioned [Expression 1] expression is expanded, it becomes the following [Expression 3] expression. [number 3]
關於所述[數3]式,作為分母的「n 1+n 2+···+n m」表示磨石中所含的全部研磨粒的數量。「n 1+n 2+···+n m」的值越大,接觸面積越增加,自各研磨粒對玻璃板的端面施加的力變小,因此磨石對端面進行磨削的能力變低。 Regarding the above formula [3], "n 1 +n 2 +···+n m " as a denominator represents the number of all abrasive grains contained in the grindstone. The larger the value of "n 1 +n 2 +...+n m ", the larger the contact area, and the smaller the force exerted by each abrasive grain on the end surface of the glass plate, the lower the ability of the grindstone to grind the end surface .
作為分子的「2/3」此係數是基於磨石中所含的研磨粒自黏合劑突出的量一般被稱為研磨粒的直徑的1/3而得。This coefficient of "2/3" as a numerator is based on the fact that the amount of the abrasive grains contained in the grindstone protruding from the binder is generally referred to as 1/3 of the diameter of the abrasive grains.
作為分子的「A k(k=1、2、···、m)」是基於用於磨石的研磨粒的努氏硬度而設定的係數。作為分子的「r kA k(k=1、2、···、m)」是考慮到如下情況的係數:研磨粒的粒徑越大,玻璃板的端面的去除量越增加,另外研磨粒越硬,越能夠不負於加工物(玻璃)地去除。 “A k (k=1, 2, . . . , m)” as a numerator is a coefficient set based on the Knoop hardness of abrasive grains used in a grindstone. "r k A k (k=1, 2, ..., m)" as a numerator is a coefficient that takes into account the fact that the larger the particle size of the abrasive grain, the greater the removal amount of the end surface of the glass plate. The harder the grains, the more they can be removed without damaging the workpiece (glass).
作為分子的「n k/n 1+n 2+···+n m(k=1、2、···、m)」表示磨石中所含的全部研磨粒中的第k種研磨粒的比例。 "n k /n 1 +n 2 +···+n m (k=1, 2,···,m)" as a numerator represents the k-th abrasive grain among all the abrasive grains contained in the grinding stone proportion.
作為分母的「√D」是考慮到磨石的直徑的影響的係數,直徑越大,研磨時的磨石與玻璃板的端面的接觸長度越長,同時碰觸端面的研磨粒的個數增加,因此磨石對端面進行磨削的能力變低。"√D" as the denominator is a coefficient that takes into account the influence of the diameter of the grindstone. The larger the diameter, the longer the length of contact between the grindstone and the end surface of the glass plate during grinding, and the number of abrasive grains that touch the end surface at the same time increases. , so the ability of the grindstone to grind the end face becomes low.
作為分子的「B」是對於用於磨石的黏合劑,考慮到黏合劑的彈性模數的影響的係數。「B」的值越小,研磨粒越下沈,各研磨粒自黏合劑的突出量越容易對齊,自各研磨粒對玻璃板的端面施加的力變小,因此磨石對端面進行磨削的能力變低。"B" which is a numerator is a coefficient which takes into account the influence of the elastic modulus of a binder with respect to the binder used for a grindstone. The smaller the value of "B", the lower the abrasive grains sink, and the easier the alignment of the protruding amount of each abrasive grain from the adhesive is, and the force exerted by each abrasive grain on the end surface of the glass plate becomes smaller, so the end surface is ground by the grindstone. Ability becomes lower.
第七玻璃板的製造方法設為如下方式:於所述第六玻璃板的製造方法中,於研磨步驟中,根據所述[數1]式算出的G的值與根據下述[數4]式算出的P的值之積滿足1.0×10 -9≦G×P≦1.0×10 -6的關係。 [數4] v:磨石與玻璃板的端面的相對移動速度(加工速度)[m/min] V:磨石的圓周速度[m/min] L:向磨石供給的水的流量[L/min] F:磨石擠壓玻璃板的端面的擠壓力[N] In the manufacturing method of the seventh glass plate, in the manufacturing method of the sixth glass plate, in the grinding step, the value of G calculated from the formula [1] and the value of G calculated from the following formula [4] The product of the values of P calculated by the formula satisfies the relationship of 1.0×10 -9 ≦G×P≦1.0×10 -6 . [number 4] v: Relative moving speed (processing speed) of the grinding stone and the end face of the glass plate [m/min] V: Peripheral speed of the grinding stone [m/min] L: Flow rate of water supplied to the grinding stone [L/min] F : Extrusion force of the grinding stone on the end face of the glass plate [N]
若所述G×P的值滿足所述關係,則更有利於在研磨步驟中容易表現出延展性模式,進而於提高玻璃板的端面品質方面更適宜。If the value of G×P satisfies the above relationship, it is more favorable for the ductility mode to be easily expressed in the polishing step, and it is more suitable for improving the quality of the end surface of the glass plate.
第八玻璃板的製造方法設為如下方式:於所述第一玻璃板的製造方法~第七玻璃板的製造方法中的任一玻璃板的製造方法中,使研磨步驟中的研磨點的溫度相較於研削步驟中的研削點的溫度而言為高溫。The manufacturing method of the eighth glass plate is set as follows: In the manufacturing method of any one glass plate in the manufacturing method of the said 1st glass plate - the manufacturing method of the 7th glass plate, the temperature of the grinding|polishing point in a grinding|polishing process is made It is high temperature compared with the temperature of the grinding point in a grinding process.
由發明者進行試行,結果判明,若使研磨步驟中的研磨點的溫度相較於研削步驟中的研削點的溫度而言為高溫,則於研磨步驟中容易表現出延展性模式。因此,若如上所述般使研磨點相較於研削點而言為高溫,則於研磨步驟中容易穩定地實施基於延展性模式的加工。As a result of experiments conducted by the inventors, it was found that if the temperature of the grinding point in the grinding step is made higher than the temperature of the grinding point in the grinding step, the ductility mode is likely to appear in the grinding step. Therefore, if the grinding point is made higher temperature than the grinding point as described above, it is easy to perform the processing by the ductility mode stably in the polishing step.
用於解決所述課題的第九玻璃板的製造方法包括:研削步驟,利用研削磨石對玻璃板的端面進行加工;以及研磨步驟,利用研磨磨石對藉由研削磨石加工後的玻璃板的端面進行加工,所述方法的特徵在於:於研削步驟及研磨步驟中,分別向研削磨石及研磨磨石的圓周上的加工部供給冷卻介質,於研磨步驟中,相較於研削步驟而言減少冷卻介質的供給量。A ninth method of manufacturing a glass plate for solving the above-mentioned problems includes: a grinding step of processing an end face of a glass plate with a grinding stone; and a grinding step of grinding the glass plate processed by the grinding stone with a grinding stone The method is characterized in that in the grinding step and the grinding step, a cooling medium is supplied to the grinding stone and the processing portion on the circumference of the grinding stone, respectively, and in the grinding step, compared with the grinding step Decrease the supply of cooling medium.
於本方法中,由於在向磨石的圓周上的加工部供給冷卻介質時,於研磨步驟中相較於研削步驟而言減少供給量,因此即使於研磨步驟中不降低加工效率(加工速度),亦容易表現出延展性模式。藉由延展性模式,可儘可能地避免於加工後的端面殘存裂紋。藉此,對於研磨步驟後的端面,獲得可抑制玻璃粉的產生的低起塵性、可防止由蝕刻液引起的腐蝕的耐藥液性、及可防止以端面為起點的破裂的高強度。即,能夠提高玻璃板的端面品質。 [發明的效果] In this method, since the cooling medium is supplied to the processing portion on the circumference of the grindstone, the supply amount is reduced in the grinding step compared to the grinding step, so that the processing efficiency (processing speed) is not lowered even in the grinding step. , are also prone to exhibit ductility patterns. With the ductility mode, it is possible to avoid residual cracks on the end face after processing as much as possible. Thereby, for the end face after the grinding step, low dust generation that suppresses the generation of glass powder, chemical resistance that prevents corrosion caused by an etching solution, and high strength that prevents cracks starting from the end face are obtained. That is, the end surface quality of a glass plate can be improved. [Effect of the invention]
藉由本揭示的玻璃板的製造方法,於製造玻璃板時,能夠提高該玻璃板的端面品質。By the manufacturing method of the glass plate of this disclosure, when manufacturing a glass plate, the quality of the end surface of this glass plate can be improved.
以下,參照隨附圖式對實施方式的玻璃板的製造方法進行說明。再者,實施方式的說明所參照的各圖式中所表示的X方向、Y方向、及Z方向是相互正交的方向。Hereinafter, the manufacturing method of the glass plate which concerns on embodiment is demonstrated with reference to accompanying drawing. In addition, the X direction, the Y direction, and the Z direction shown in each drawing referred to in description of embodiment are mutually orthogonal directions.
如圖1所示,本製造方法包括:研削步驟P1,利用研削磨石2對玻璃板1的端面1a進行加工;以及研磨步驟P2,利用研磨磨石3對藉由研削磨石2加工後的端面1a進行加工。於本製造方法中,於研削步驟P1中以脆性模式對端面1a進行加工,於研磨步驟P2中主要以延展性模式對端面1a進行加工。As shown in Figure 1, the manufacturing method includes: a grinding step P1, using a grinding
此處,對延展性模式及脆性模式進行說明。Here, the ductile mode and the brittle mode will be described.
當利用磨石對玻璃實施研削加工(研磨加工)時,加工面(於本實施方式中為端面1a)會變得透明或者不透明。於延展性模式下加工面變得透明,於脆性模式下加工面變得不透明。When grinding (polishing) is performed on glass with a grindstone, the processed surface (the end surface 1 a in this embodiment) becomes transparent or opaque. The processed surface becomes transparent in ductile mode, and opaque in brittle mode.
如圖2所示,於將磨石擠壓於玻璃的壓力足夠小的期間,玻璃沿磨石表面上滑。但是,若壓力變得足夠大,則玻璃被磨石研削(研磨)。於較該研削(研磨)開始的研削開始壓力大的壓力下實施加工的是延展性模式。As shown in FIG. 2 , during the period when the pressure of the grinding stone against the glass is sufficiently small, the glass slides up along the surface of the grinding stone. However, if the pressure becomes great enough, the glass is ground (ground) by the grindstone. It is the ductile mode that performs processing under a pressure higher than the grinding start pressure at the start of the grinding (grinding).
例如,可以如下方式判斷是脆性模式還是延展性模式。首先,對玻璃板1的端面的算術平均高度Sa進行測定。算術平均高度Sa例如可藉由基恩士(Keyence)公司製造的顯微鏡VHX-8000來測定。若Sa為0.20 μm以上,則為脆性模式,若Sa小於0.20 μm,則為延展性模式。For example, whether it is a brittle mode or a ductile mode can be judged as follows. First, the arithmetic mean height Sa of the end surface of the
於本實施方式中,對呈平放姿勢的矩形的玻璃板1的沿著X方向延伸的兩端面1a、1a執行研削步驟P1及研磨步驟P2。然而並不限定於此,作為本實施方式的變形例,成為執行兩步驟P1、P2的對象的玻璃板1的形狀亦可為矩形以外的形狀。In this embodiment, the grinding process P1 and the grinding|polishing process P2 are performed with respect to both end surfaces 1a, 1a extended along the X direction of the
玻璃板1利用浮式法、溢流下拉法、狹縫下拉法、再引曳法等成形方法成形後,被切成規定尺寸。玻璃板1的兩端面1a、1a均成為切斷面。玻璃板1的厚度例如為0.1 mm~10 mm。玻璃板1是成為液晶顯示器或有機EL顯示器等所代表的顯示器用的基板的玻璃。當然,玻璃板1除作為顯示器用的玻璃以外,例如亦可為太陽電池或各種照明等所採用的玻璃。The
於本實施方式中,為了對玻璃板1的兩端面1a、1a進行加工,研削磨石2及研磨磨石3分別配置成於Y方向上隔著玻璃板1而成對。成對的研削磨石2彼此及研磨磨石3彼此針對固定於壓盤(省略圖示)上的狀態的玻璃板1,一邊於與X方向平行的T方向上移動,一邊對兩端面1a、1a進行加工。然而並不限定於此,只要使兩磨石2、3與玻璃板1相對移動即可,因此亦可與本實施方式相反,設為將兩磨石2、3固定的狀態,並且使玻璃板1移動,藉此執行兩步驟P1、P2。另外,亦可一邊使兩磨石2、3與玻璃板1雙方移動,一邊執行兩步驟P1、P2。兩磨石2、3的旋轉方向自Z方向觀察時成為逆時針方向。當然,兩磨石2、3的旋轉方向亦可為順時針方向。In this embodiment, in order to process the both end surfaces 1a and 1a of the
研削磨石2是用於對玻璃板1的端面1a進行磨削來實施倒角加工的磨石。另一方面,研磨磨石3是用於進行使端面1a光滑的精加工的磨石,於以固定擠壓力壓抵於端面1a的狀態下對端面1a進行加工。再者,作為本實施方式的變形例,研削磨石2亦可於以固定擠壓力壓抵於端面1a的狀態下對端面1a進行加工。此處所言的「擠壓力」是與Y方向平行地作用,且單位以[N]表示的力。The grinding
於本實施方式中,採用根據所述[數1]式算出的G的值為0.1以上的磨石作為研削磨石2,並且採用G的值小於0.1的磨石作為研磨磨石3。但是,對於研磨磨石3,為了避免對玻璃板1的端面1a進行磨削的能力過度不足,G的值較佳為設為1.0×10
-5以上。
In the present embodiment, a grindstone having a G value of 0.1 or more calculated by the formula [1] is used as the grinding
研削磨石2較佳為採用金屬結合材料(金屬黏合劑)作為研磨粒的結合材料(黏合劑)的金屬黏合劑磨石。採用作結合材料的金屬較佳為自鐵、銅、鈷、鎳、鎢等中選擇一種或選擇兩種以上並加以混合而成者,尤佳為包含鐵的金屬。結合於研削磨石2的研磨粒較佳為金剛石研磨粒,粒度較佳為#200~#600。然而,關於研削磨石2中的結合劑的種類、研磨粒的種類、及研磨粒的粒度,只要於所述[數1]式中,G的值為0.1以上,則可為任意的結合劑、研磨粒、粒度。The grinding
研磨磨石3較佳為採用樹脂結合材料(樹脂黏合劑)作為研磨粒的結合材料(黏合劑)的樹脂黏合劑磨石。作為樹脂結合材料,較佳為熱硬化性樹脂。作為具體例,可採用酚系樹脂、環氧樹脂、聚醯亞胺樹脂、聚胺基甲酸酯樹脂等作為樹脂結合劑。作為結合於研磨磨石3的研磨粒,可使用自金剛石研磨粒、立方氮化硼研磨粒、碳化矽研磨粒、氧化鋁研磨粒中選擇一種或選擇兩種以上並加以混合而成者。研磨粒的粒度較佳為#320~#1000。然而,關於研磨磨石3中的結合劑的種類、研磨粒的種類、及研磨粒的粒度,只要於所述[數1]式中,G的值小於0.1,則可為任意的結合劑、研磨粒、粒度。另外,研磨磨石3可為與研削磨石2不同種類的磨石,亦可為相同種類的磨石。The grinding
圖3a表示研削步驟P1,圖3b表示研磨步驟P2。根據兩圖可以理解,研削步驟P1與研磨步驟P2於實施方式中存在共通點。以下,對研削步驟P1與研磨步驟P2的共通點進行說明。Figure 3a shows the grinding step P1 and Figure 3b shows the grinding step P2. According to the two figures, it can be understood that the grinding step P1 and the grinding step P2 have a common point in the embodiment. Hereinafter, common points between the grinding step P1 and the polishing step P2 will be described.
於研削步驟P1及研磨步驟P2中,分別向研削磨石2及研磨磨石3的圓周上的加工部2a、加工部3a供給作為冷卻介質的水4。於兩磨石2、3的加工部2a、加工部3a,形成有上下多段用於對玻璃板1的端面1a進行加工的槽(省略圖示)。藉由將所述多段槽中的一個壓抵於端面1a來對端面1a進行加工。再者,於本實施方式中,使用水4作為冷卻介質,此外,亦可使用空氣、微氣泡、奈米氣泡、冷卻劑等作為冷卻介質。In the grinding process P1 and the grinding process P2, the water 4 which is a cooling medium is supplied to the processing part 2a and the processing part 3a on the circumference of the grinding
水4分別自研削步驟用噴嘴5及研磨步驟用噴嘴6供給至研削磨石2的加工部2a及研磨磨石3的加工部3a(於圖1中省略兩噴嘴5、6的圖示)。研削步驟用噴嘴5及研磨步驟用噴嘴6分別包括第一噴嘴7、第一噴嘴8及第二噴嘴9、第二噴嘴10。再者,研削步驟用噴嘴5及研磨步驟用噴嘴6分別與研削磨石2及研磨磨石3的移動聯動地沿著X方向移動。Water 4 is supplied to processing portion 2 a of grinding
第一噴嘴7、第一噴嘴8配置成於上下方向(Z方向)上的位置與玻璃板1對齊,並且自兩磨石2、3的旋轉方向的後方側指向研削點2x、研磨點3x而供給水4。研削點2x是研削磨石2的加工部2a與玻璃板1的端面1a接觸而對端面1a進行加工的部位,研磨點3x是研磨磨石3的加工部3a與端面1a接觸而對端面1a進行加工的部位。再者,作為本實施方式的變形例,亦可自兩磨石2、3的旋轉方向的前方側供給水4。來自第一噴嘴7、第一噴嘴8的水4是出於降低兩磨石2、3與端面1a的摩擦,或者防止因摩擦而導致兩磨石2、3及端面1a過熱等的目的而供給。The first nozzle 7 and the first nozzle 8 are arranged to align with the
第二噴嘴9、第二噴嘴10配置成於Y方向上與研削磨石2、研磨磨石3相向。第二噴嘴9、第二噴嘴10自玻璃板1側朝向研削磨石2側、研磨磨石3側供給簇射狀的水4。來自第二噴嘴9、第二噴嘴10的水4是出於將在研削步驟P1、研磨步驟P2中產生的玻璃粉自玻璃板1、研削磨石2、及研磨磨石3中去除等的目的而供給。再者,研削步驟用噴嘴5及研磨步驟用噴嘴6並非必須包括第二噴嘴9、第二噴嘴10,亦可僅包括第一噴嘴7、第一噴嘴8。The second nozzle 9 and the second nozzle 10 are disposed so as to face the grinding
以下,對研削步驟P1與研磨步驟P2的不同點進行說明。Hereinafter, differences between the grinding step P1 and the polishing step P2 will be described.
於研磨步驟P2中,相較於研削步驟P1而言減少水4的供給量。即,使自研磨步驟用噴嘴6(第一噴嘴8及第二噴嘴10)流出的水4的流量(相當於所述[數4]式中的L)少於自研削步驟用噴嘴5(第一噴嘴7及第二噴嘴9)流出的水4的流量。詳細而言,使自第一噴嘴8流出的水4的流量少於第一噴嘴7,且使自第二噴嘴10流出的水4的流量少於第二噴嘴9。然而並不限定於此,只要自研磨步驟用噴嘴6流出的水4的流量少於自研削步驟用噴嘴5流出的水4的流量,第一噴嘴7與第一噴嘴8之間的流量的大小關係、及第二噴嘴9與第二噴嘴10之間的流量的大小關係可為任意。In the grinding step P2, the supply amount of the water 4 is reduced compared to the grinding step P1. That is, the flow rate of the water 4 flowing out from the nozzle 6 (the first nozzle 8 and the second nozzle 10) of the grinding step (corresponding to L in the formula [4]) is less than that of the nozzle 5 (the first nozzle 10) flowing out from the grinding step. The flow rate of the water 4 flowing out of the first nozzle 7 and the second nozzle 9). Specifically, the flow rate of the water 4 flowing out from the first nozzle 8 is made smaller than that of the first nozzle 7 , and the flow rate of the water 4 flowing out from the second nozzle 10 is made smaller than that of the second nozzle 9 . However, it is not limited to this, as long as the flow rate of the water 4 flowing out from the nozzle 6 in the grinding step is less than the flow rate of the water 4 flowing out from the nozzle 5 in the grinding step, the size of the flow rate between the first nozzle 7 and the first nozzle 8 The relation and the magnitude relation of the flow rate between the second nozzle 9 and the second nozzle 10 may be arbitrary.
此處,將自研削步驟用噴嘴5流出的水4的流量作為基準,自研磨步驟用噴嘴6流出的水4的流量較佳為設為75%以下的流量。再者,更佳為設為50%以下的流量,進而較佳為設為25%以下的流量。於本實施方式中,於研削步驟P1中,將自研削步驟用噴嘴5流出的水的流量設為15 L/min~25 L/min。另一方面,於研磨步驟P2中,將自研磨步驟用噴嘴6流出的水的流量設為0 L/min~15 L/min。即,於研磨步驟P2中,亦可未必向研磨磨石3的加工部3a供給水4。於在研磨步驟P2中不供給水4的情況下,亦可不設置研磨步驟用噴嘴6。Here, the flow rate of the water 4 flowing out from the nozzle 5 for the grinding step is taken as a reference, and the flow rate of the water 4 flowing out from the nozzle 6 for the grinding step is preferably 75% or less of the flow rate. Furthermore, it is more preferable to set it as a flow rate of 50% or less, and it is more preferable to set it as a flow rate of 25% or less. In this embodiment, in the grinding step P1, the flow rate of water flowing out from the nozzle 5 for the grinding step is set to 15 L/min to 25 L/min. On the other hand, in the polishing step P2, the flow rate of water flowing out from the nozzle 6 for the polishing step is 0 L/min to 15 L/min. That is, in the grinding|polishing process P2, the water 4 may not necessarily be supplied to the processing part 3a of the grinding
於本製造方法中,根據所述水4的流量關係,使研磨步驟P2中的研磨點3x的溫度相較於研削步驟P1中的研磨點2x的溫度而言為高溫。另外,根據所述水4的流量關係,於研磨步驟P2中容易表現出延展性模式,容易穩定地實施基於延展性模式的玻璃板1的端面1a的加工。再者,於本製造方法中,與於研削步驟P1與研磨步驟P2之間使水4的供給量同等的情況相比,即使將粒度粗的研磨粒用作研磨磨石3,亦容易表現出延展性模式。而且,由於可採用粗的研磨粒,因此亦能夠實現研磨磨石3的長壽命化、研磨不均的減少、加工速度的提高等。In this manufacturing method, the temperature of the polishing point 3x in the polishing step P2 is made higher than the temperature of the polishing point 2x in the grinding step P1 according to the flow rate relationship of the water 4 described above. In addition, due to the flow rate relationship of the water 4, the ductility mode is easily expressed in the polishing step P2, and the processing of the end surface 1a of the
以下,對已述的事項以外的研磨步驟P2的實施條件進行說明。Hereinafter, the implementation conditions of the polishing step P2 other than the above-mentioned matters will be described.
於研磨步驟P2中,將研磨磨石3與玻璃板1的端面1a的相對移動速度(加工速度)設為20 m/min以上。再者,相對移動速度較佳為25 m/min以上,進而佳為30 m/min以上。於本實施方式中,由於研磨磨石3一邊相對於固定狀態的玻璃板1移動一邊對端面1a進行加工,因此所述相對移動速度與圖3b所示的研磨磨石3的移動速度v相等。In the polishing step P2, the relative moving speed (processing speed) of the grinding
此外,於研磨步驟P2中,將研磨磨石3的圓周速度設為V,將向研磨磨石3供給的水4的流量(於本實施方式中,與自研磨步驟用噴嘴6流出的水4的流量相等)設為L,將研磨磨石3擠壓端面1a的擠壓力設為F,根據所述[數4]式算出P的值。而且,P的值與根據所述[數1]式算出的G的值之積(G×P)滿足1.0×10
-9≦G×P≦1.0×10
-6的關係。再者,G×P的值更佳為滿足5.0×10
-8≦G×P≦1.0×10
-6的關係,進而佳為滿足3.0×10
-7≦G×P≦1.0×10
-6的關係。
In addition, in the grinding step P2, the peripheral speed of the grinding
此處,對於所述實施方式,亦能夠應用如以下的變形例。於所述實施方式中,於研削步驟P1及研磨步驟P2中,分別僅使用一個研削磨石2及研磨磨石3,但亦可使用多個研削磨石2及研磨磨石3。於此情況下,利用各研削磨石2以脆性模式對玻璃板1的端面1a進行加工,利用各研磨磨石3主要以延展性模式對端面1a進行加工。此時,較佳為使向各研磨磨石3供給的水4的量相較於向各研削磨石2供給的水4的量而言減少。
[實施例]
Here, the following modified examples can also be applied to the above-mentioned embodiment. In the above embodiment, only one grinding
於作為研削步驟利用研削磨石以脆性模式對玻璃板的端面進行加工之後,作為研磨步驟利用研磨磨石以(a)脆性模式對端面進行加工的情況(比較例)與(b)主要以延展性模式對端面進行加工的情況(實施例)之間,對加工後的端面品質的良否進行比較。再者,於比較例中,於研削步驟中向磨石供給的水的流量與於研磨步驟中向磨石供給的水的流量相等,於實施例中,於研磨步驟中向磨石供給的水的流量設定為較於研削步驟中向磨石供給的水的流量少。After the end surface of the glass plate was processed in the brittle mode with the grinding stone as the grinding step, the case where (a) the brittle mode was processed with the grinding stone as the grinding step (comparative example) and (b) mainly with the ductility The quality of the end face after processing was compared between cases (Example) in which the end face was processed by the property model. Furthermore, in the comparative example, the flow rate of water supplied to the grindstone in the grinding step was equal to the flow rate of water supplied to the grindstone in the grinding step, and in the examples, the flow rate of water supplied to the grindstone in the grinding step The flow rate is set to be smaller than the flow rate of water supplied to the grindstone in the grinding step.
於比較例1及實施例1、實施例2中,共同使用下述列舉的條件的研磨磨石。研磨粒的種類:金剛石(研磨粒種類係數A 1=8000) 研磨粒的粒度:#1500(平均研磨粒半徑r 1=0.005[mm]) 研磨粒率c 1:25[vol%] 磨石的直徑D:200[mm] 黏合劑的種類:酚樹脂(樹脂黏合劑,黏合劑係數B=30) In Comparative Example 1, Example 1, and Example 2, the grinding stones of the conditions listed below were used in common. Type of abrasive grain: diamond (abrasive grain type coefficient A 1 =8000) grain size of abrasive grain: #1500 (average abrasive grain radius r 1 =0.005[mm]) abrasive grain rate c 1 : 25[vol%] of grinding stone Diameter D: 200[mm] Type of adhesive: phenolic resin (resin adhesive, adhesive coefficient B=30)
於比較例1及實施例1、實施例2中,分別將加工條件設為下述列舉的條件。 [比較例1] 磨石與玻璃板的端面的相對移動速度v(加工速度):30[m/min] 磨石的圓周速度V:2000[m/min] 磨石擠壓玻璃板的端面的擠壓力F:20[N] 向磨石供給的水的流量L:15[L/min] G×P的值:1.33×10 -6[實施例1] 磨石與玻璃板的端面的相對移動速度v(加工速度):10[m/min] 磨石的圓周速度V:2000[m/min] 磨石擠壓玻璃板的端面的擠壓力F:20[N] 向磨石供給的水的流量L:15[L/min] G×P的值:4.44×10 -7再者,向研削磨石供給的水的流量為25 L/min。 [實施例2] 磨石與玻璃板的端面的相對移動速度v(加工速度):30[m/min] 磨石的圓周速度V:2000[m/min] 磨石擠壓玻璃板的端面的擠壓力F:20[N] 向磨石供給的水的流量L:5[L/min] G×P的值:4.44×10 -7再者,向研削磨石供給的水的流量為25 L/min。 In Comparative Example 1, Example 1, and Example 2, the processing conditions were each set to the conditions listed below. [Comparative Example 1] Relative moving speed v (processing speed) of the grinding stone and the end face of the glass plate: 30 [m/min] Peripheral speed V of the grinding stone: 2000 [m/min] The speed at which the grinding stone presses the end face of the glass plate Pressing force F: 20 [N] Flow rate L of water supplied to the grindstone: 15 [L/min] Value of G×P: 1.33×10 −6 [Example 1] The relative distance between the grindstone and the end surface of the glass plate Moving speed v (processing speed): 10[m/min] Peripheral speed V of the grindstone: 2000[m/min] Pressing force F of the grindstone against the end face of the glass plate: 20[N] Flow rate L of water: 15 [L/min] Value of G×P: 4.44×10 −7 In addition, the flow rate of water supplied to the grinding stone is 25 L/min. [Example 2] The relative moving speed v (processing speed) of the grinding stone and the end surface of the glass plate: 30 [m/min] The peripheral speed V of the grinding stone: 2000 [m/min] The speed of the grinding stone pressing the end surface of the glass plate Squeeze force F: 20 [N] Flow rate L of water supplied to the grinding stone: 5 [L/min] G×P value: 4.44×10 -7 Furthermore, the flow rate of water supplied to the grinding stone is 25 L/min.
與比較例1不同,於實施例1、實施例2中獲得高的端面品質(低起塵性、耐藥液性、高強度)。另外,於實施例2中,儘管加工速度與比較例1相同,但亦能夠獲得高的端面品質。推測其原因在於,於實施例2中,除了於研磨步驟中向磨石供給的水的流量較於研削步驟中向磨石供給的水的流量少之外,相較於比較例1而言減少了水的流量L。Unlike Comparative Example 1, in Example 1 and Example 2, high end surface quality (low dust generation, chemical liquid resistance, high strength) was obtained. In addition, in Example 2, although the processing speed was the same as that of Comparative Example 1, high end surface quality was also obtained. The reason for this is presumed to be that, in Example 2, the flow rate of water supplied to the grindstone in the grinding step is less than that of the water supplied to the grindstone in the grinding step, compared to Comparative Example 1. The flow of water L.
於比較例2及實施例3、實施例4中,共同使用下述列舉的條件的研磨磨石。研磨粒的種類(第一種):金剛石(研磨粒種類係數A 1=8000) 研磨粒的粒度(第一種):#600(平均研磨粒半徑r 1=0.0125[mm]) 研磨粒率(第一種)c 1:15[vol%] 研磨粒的種類(第二種):碳化矽(研磨粒種類係數A 2=2500) 研磨粒的粒度(第二種):#400(平均研磨粒半徑r 2=0.01875[mm]) 研磨粒率(第二種)c 2:15[vol%] 磨石的直徑D:200[mm] 黏合劑的種類:胺基甲酸酯橡膠(彈性體、黏合劑係數B=1) In Comparative Example 2, Example 3, and Example 4, the grinding stones of the conditions listed below were used in common. Type of abrasive grain (first type): diamond (abrasive grain type coefficient A 1 =8000) abrasive grain size (first type): #600 (average abrasive grain radius r 1 =0.0125[mm]) abrasive grain rate ( Type 1) c 1 : 15[vol%] Type of abrasive grain (Type 2): silicon carbide (coefficient of type of abrasive grain A 2 =2500) Size of grain (Type 2): #400 (average abrasive grain Radius r 2 =0.01875[mm]) Abrasive grain ratio (second type) c 2 : 15[vol%] Diameter D of the grinding stone: 200[mm] Type of binder: urethane rubber (elastomer, Adhesive coefficient B=1)
於比較例2及實施例3、實施例4中,分別將加工條件設為下述列舉的條件。 [比較例2] 磨石與玻璃板的端面的相對移動速度v(加工速度):30[m/min] 磨石的圓周速度V:2000[m/min] 磨石擠壓玻璃板的端面的擠壓力F:30[N] 向磨石供給的水的流量L:15[L/min] G×P的值:1.31×10 -6[實施例3] 磨石與玻璃板的端面的相對移動速度v(加工速度):3[m/min] 磨石的圓周速度V:2000[m/min] 磨石擠壓玻璃板的端面的擠壓力F:30[N] 向磨石供給的水的流量L:15[L/min] G×P的值:1.31×10 -7再者,向研削磨石供給的水的流量為25 L/min。 [實施例4] 磨石與玻璃板的端面的相對移動速度v(加工速度):30[m/min] 磨石的圓周速度V:2000[m/min] 磨石擠壓玻璃板的端面的擠壓力F:30[N] 向磨石供給的水的流量L:2[L/min] G×P的值:1.74×10 -7再者,向研削磨石供給的水的流量為25 L/min。 In Comparative Example 2, Example 3, and Example 4, the processing conditions were set to the conditions listed below, respectively. [Comparative Example 2] Relative moving speed v (processing speed) of the grinding stone and the end face of the glass plate: 30 [m/min] Peripheral speed V of the grinding stone: 2000 [m/min] The speed at which the grinding stone presses the end face of the glass plate Pressing force F: 30 [N] Flow rate L of water supplied to the grindstone: 15 [L/min] Value of G×P: 1.31×10 −6 [Example 3] The relative distance between the grindstone and the end surface of the glass plate Moving speed v (processing speed): 3 [m/min] Peripheral speed V of the grindstone: 2000 [m/min] Pressing force F of the grindstone against the end face of the glass plate: 30 [N] Flow rate L of water: 15 [L/min] Value of G×P: 1.31×10 −7 In addition, the flow rate of water supplied to the grinding stone is 25 L/min. [Example 4] The relative moving speed v (processing speed) of the grinding stone and the end surface of the glass plate: 30 [m/min] The peripheral speed V of the grinding stone: 2000 [m/min] The speed of the grinding stone pressing the end surface of the glass plate Squeeze force F: 30 [N] Flow rate L of water supplied to the grinding stone: 2 [L/min] G×P value: 1.74×10 −7 Furthermore, the flow rate of water supplied to the grinding stone is 25 L/min.
與比較例2不同,於實施例3、實施例4中獲得高的端面品質。另外,於實施例4中,儘管加工速度與比較例2相同,但亦能夠獲得高的端面品質。推測其原因在於,於實施例4中,除了於研磨步驟中向磨石供給的水的流量較於研削步驟中向磨石供給的水的流量少之外,相較於比較例2而言減少了水的流量L。進而,根據實施例3及實施例4的結果可知,於水的流量L相對少的實施例4中,相較於水的流量L相對多的實施例3而言,可實現高速的加工。Unlike Comparative Example 2, high end surface quality was obtained in Examples 3 and 4. In addition, in Example 4, although the processing speed was the same as that of Comparative Example 2, high end surface quality was also obtained. The reason for this is presumed to be that, in Example 4, the flow rate of water supplied to the grindstone in the grinding step is less than that of water supplied to the grindstone in the grinding step. The flow of water L. Furthermore, from the results of Example 3 and Example 4, it can be seen that in Example 4 in which the flow rate L of water is relatively small, compared with Example 3 in which the flow rate L of water is relatively large, high-speed processing can be realized.
於比較例3及實施例5中,共同使用下述列舉的條件的研磨磨石。 研磨粒的種類:碳化矽(研磨粒種類係數A 1=2500) 研磨粒的粒度:#400(平均研磨粒半徑r 1=0.01875[mm]) 研磨粒率c 1:50[vol%] 磨石的直徑D:200[mm] 黏合劑的種類:彈性體(黏合劑係數B=1) In Comparative Example 3 and Example 5, the grinding stones of the conditions listed below were used together. Abrasive grain type: silicon carbide (abrasive grain type coefficient A 1 =2500) abrasive grain size: #400 (average abrasive grain radius r 1 =0.01875[mm]) abrasive grain ratio c 1 : 50[vol%] grinding stone Diameter D: 200[mm] Type of adhesive: elastomer (adhesive coefficient B=1)
於比較例3及實施例5中,分別將加工條件設為下述列舉的條件。 [比較例3] 磨石與玻璃板的端面的相對移動速度v(加工速度):30[m/min] 磨石的圓周速度V:2000[m/min] 磨石擠壓玻璃板的端面的擠壓力F:15[N] 向磨石供給的水的流量L:15[L/min] G×P的值:1.83×10 -6[實施例5] 磨石與玻璃板的端面的相對移動速度v(加工速度):30[m/min] 磨石的圓周速度V:2000[m/min] 磨石擠壓玻璃板的端面的擠壓力F:15[N] 向磨石供給的水的流量L:4[L/min] G×P的值:4.88×10 -7再者,向研削磨石供給的水的流量為25 L/min。 In Comparative Example 3 and Example 5, the processing conditions were respectively set to the conditions listed below. [Comparative Example 3] Relative moving speed v (processing speed) of the grinding stone and the end face of the glass plate: 30 [m/min] Peripheral speed V of the grinding stone: 2000 [m/min] The speed at which the grinding stone presses the end face of the glass plate Pressing force F: 15 [N] Flow rate L of water supplied to the grindstone: 15 [L/min] Value of G×P: 1.83×10 −6 [Example 5] The relative distance between the grindstone and the end surface of the glass plate Moving speed v (processing speed): 30 [m/min] Peripheral speed V of the grindstone: 2000 [m/min] Pressing force F of the grindstone against the end surface of the glass plate: 15 [N] Flow rate L of water: 4 [L/min] Value of G×P: 4.88×10 −7 In addition, the flow rate of water supplied to the grinding stone was 25 L/min.
與比較例3不同,於實施例5中獲得高的端面品質。此處,針對比較例3及實施例5,將對加工後的端面實施了蝕刻的狀態分別示於圖4及圖5。根據兩圖可知,實施例5相較於比較例3而言可防止端面的腐蝕。另外,於實施例5中,儘管加工速度與比較例3相同,但亦能夠獲得高的端面品質。推測其原因在於,於實施例5中,除了於研磨步驟中向磨石供給的水的流量較於研削步驟中向磨石供給的水的流量少之外,相較於比較例3而言減少了水的流量L。Unlike Comparative Example 3, high end surface quality was obtained in Example 5. Here, for Comparative Example 3 and Example 5, states in which the processed end faces were etched are shown in FIGS. 4 and 5 , respectively. According to the two figures, it can be seen that compared with Comparative Example 3, Example 5 can prevent the corrosion of the end surface. In addition, in Example 5, although the processing speed was the same as that of Comparative Example 3, high end surface quality was also obtained. The reason for this is presumed to be that, in Example 5, the flow rate of water supplied to the grindstone in the grinding step is less than that of the water supplied to the grindstone in the grinding step, compared to Comparative Example 3. The flow of water L.
1:玻璃板 1a:端面 2:研削磨石(磨石) 2a:加工部 2x:研削點 3:研磨磨石(磨石) 3a:加工部 3x:研磨點 4:水 5:研削步驟用噴嘴(噴嘴) 6:研磨步驟用噴嘴(噴嘴) 7、8:第一噴嘴 9、10:第二噴嘴 D:直徑 F:擠壓力 P1:研削步驟(步驟) P2:研磨步驟(步驟) T、X、Y、Z:方向 v:移動速度(相對移動速度) V:圓周速度 1: glass plate 1a: end face 2: Grinding grindstone (grindstone) 2a: Processing Department 2x: Grinding points 3: Grinding millstone (grindstone) 3a: Processing Department 3x: Grinding point 4: water 5: Nozzle for grinding step (nozzle) 6: Nozzle for grinding step (nozzle) 7, 8: the first nozzle 9, 10: Second nozzle D: diameter F: extrusion force P1: Grinding step (step) P2: Grinding step (step) T, X, Y, Z: direction v: moving speed (relative moving speed) V: peripheral speed
圖1是概略性地表示玻璃板的製造方法所包括的研削步驟及研磨步驟的平面圖。 圖2是用於對延展性模式及脆性模式進行說明的圖。 圖3a是表示玻璃板的製造方法所包括的研削步驟的平面圖。 圖3b是表示玻璃板的製造方法所包括的研磨步驟的平面圖。 圖4是表示在比較例3中對端面實施了蝕刻的狀態的圖。 圖5是表示在實施例5中對端面實施了蝕刻的狀態的圖。 FIG. 1 is a plan view schematically showing a grinding step and a polishing step included in a method of manufacturing a glass plate. FIG. 2 is a diagram for explaining a ductile mode and a brittle mode. Fig. 3a is a plan view showing a grinding step included in the method of manufacturing a glass plate. Fig. 3b is a plan view showing a grinding step included in the manufacturing method of the glass plate. FIG. 4 is a diagram showing a state in which an end face is etched in Comparative Example 3. FIG. FIG. 5 is a view showing a state in which end faces are etched in Example 5. FIG.
1:玻璃板 1: glass plate
1a:端面 1a: end face
3:研磨磨石(磨石) 3: grinding millstone (grindstone)
3a:加工部 3a: Processing Department
3x:研磨點 3x: Grinding point
4:水 4: water
6:研磨步驟用噴嘴(噴嘴) 6: Nozzle (nozzle) for grinding step
8:第一噴嘴 8: The first nozzle
10:第二噴嘴 10: Second nozzle
D:直徑 D: diameter
F:擠壓力 F: extrusion force
P2:研磨步驟(步驟) P2: Grinding step (step)
v:移動速度(相對移動速度) v: moving speed (relative moving speed)
V:圓周速度 V: peripheral speed
X、Y、Z:方向 X, Y, Z: direction
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JP2015006697A (en) * | 2011-10-31 | 2015-01-15 | 旭硝子株式会社 | Processing device and processing method of plate-like object |
KR102432658B1 (en) * | 2014-01-27 | 2022-08-16 | 코닝 인코포레이티드 | Edge chamfering by mechanically processing laser cut glass |
CN105415101B (en) * | 2015-11-26 | 2018-04-03 | 东北大学 | A kind of determination method of devitrified glass ceramics grinding surface roughness |
KR20190098768A (en) * | 2017-01-13 | 2019-08-22 | 코닝 인코포레이티드 | Method and apparatus for finishing glass sheets |
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2022
- 2022-11-30 WO PCT/JP2022/044285 patent/WO2023100957A1/en active Application Filing
- 2022-11-30 CN CN202280070382.8A patent/CN118139722A/en active Pending
- 2022-11-30 JP JP2023565070A patent/JPWO2023100957A1/ja active Pending
- 2022-12-01 TW TW111146171A patent/TW202328022A/en unknown
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JPWO2023100957A1 (en) | 2023-06-08 |
WO2023100957A1 (en) | 2023-06-08 |
CN118139722A (en) | 2024-06-04 |
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