CN109318136A - A kind of flexible polishing device - Google Patents
A kind of flexible polishing device Download PDFInfo
- Publication number
- CN109318136A CN109318136A CN201811448281.1A CN201811448281A CN109318136A CN 109318136 A CN109318136 A CN 109318136A CN 201811448281 A CN201811448281 A CN 201811448281A CN 109318136 A CN109318136 A CN 109318136A
- Authority
- CN
- China
- Prior art keywords
- poliss
- polishing device
- flexible polishing
- polishing
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 42
- 239000003082 abrasive agent Substances 0.000 claims abstract description 17
- 239000011159 matrix material Substances 0.000 claims abstract description 17
- 238000007517 polishing process Methods 0.000 claims abstract description 12
- 239000007767 bonding agent Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 238000005299 abrasion Methods 0.000 claims description 7
- BVPWJMCABCPUQY-UHFFFAOYSA-N 4-amino-5-chloro-2-methoxy-N-[1-(phenylmethyl)-4-piperidinyl]benzamide Chemical compound COC1=CC(N)=C(Cl)C=C1C(=O)NC1CCN(CC=2C=CC=CC=2)CC1 BVPWJMCABCPUQY-UHFFFAOYSA-N 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 235000010413 sodium alginate Nutrition 0.000 claims description 4
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 229920002521 macromolecule Polymers 0.000 claims description 3
- 239000000661 sodium alginate Substances 0.000 claims description 3
- 229940005550 sodium alginate Drugs 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- 229910052810 boron oxide Inorganic materials 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 239000004575 stone Substances 0.000 claims description 2
- 229910021529 ammonia Inorganic materials 0.000 claims 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 1
- -1 poly- ammonia Ester Chemical class 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- 239000006061 abrasive grain Substances 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 238000007596 consolidation process Methods 0.000 description 2
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D99/00—Subject matter not provided for in other groups of this subclass
- B24D99/005—Segments of abrasive wheels
Abstract
The invention discloses a kind of flexible polishing devices, including a bottom plate and multiple poliss.The present invention provides a kind of flexible polishing device of high intensity, the wearability not only having had aiming at the problem that abrasive material in three kinds of polishing modes in the prior art is held with appeared in tool life, but also has certain flexibility.While guaranteeing processing quality, it is greatly improved the service life of burnishing device.Since matrix and bonding agent have elasticity in flexible polishing device of the invention, during the polishing process, abrasive grain has certain deformability, can effectively reduce scratch and the damage of polished surface, has better polishing effect.The shape of poliss of the invention is symmetrical L shape in polishing, can be reduced the contact length when abrasive material to fall off and broken workpiece debris and friction of workpiece, reduces workpiece surface scratch.
Description
Technical field
The invention belongs to polishing tool technical fields, and in particular to a kind of flexible polishing device.
Background technique
This century, more and more fragile materials were applied with the rapid development of science and technology, were especially partly leading
The fields such as body, ceramic bottom board and stone material.This kind of material has hardness height, the big feature of brittleness.To fill material rationally
Divide ground to show its excellent characteristics and be applied, it is necessary to by means of mature material processing and processing method.And add general
During work, grinding and polishing process directly determines the final surface accuracy and surface quality of workpieces processing.
At present according to the consolidation style of abrasive material, polishing can be divided into concretion abrasive polishing, free abrasive polishing and semi-consolidated mill
Material polishing.Traditional concretion abrasive polishing is difficult to keep the consistent of abrasive material height of protrusion, is easy to cause workpiece on scuffing and surface
Damage.The abrasive material motion profile of free abrasive polishing is uncontrollable, and abrasive material is easy to reunite, and polishing efficiency is low.Semi-consolidated abrasive polishing
It is to be held on abrasive grain using some bonding agents flexible, abrasive grain has deformability during the polishing process, is effectively reduced table
The scratch in face and damage, but removal efficiency is still lower.
In addition, for the tool used in the three of the above polishing method: consolidation polish used in tool, when surface
Grain Falling Off loses working ability；Free abrasive polishing uses polishing slurries, has no idea back in most cases
It receives and recycles, cause a large amount of wastes of abrasive material；Polishing tool used in semi-consolidated polishing does not have generally mechanical strong well
Degree, very easy breakage, service life are short.
Summary of the invention
It is an object of the invention to overcome prior art defect, a kind of flexible polishing device is provided.
Technical scheme is as follows:
A kind of flexible polishing device, including
One bottom plate, for circle；
With multiple poliss, cross-sectional shape is symmetrical L shape, including an elastic base made of wear-resistant macromolecule material
Body and the hard abrasive material being uniformly attached to by bonding agent on the elastic matrix；
Above-mentioned multiple poliss are in several concentric ring-shaped array distributions in the surface of above-mentioned bottom plate, the cross of each poliss
The bisector in section is the tangent line of annulus where the poliss, and the quantity of the poliss is in equal differences from interior annular to outer toroid
Column；Have gap the clast generated in polishing process is discharged between adjacent poliss；During the polishing process, poliss generates mill
The hard abrasive abrasion of damage, outer layer falls off, and the hard abrasive of internal layer is gradually exposed, and poliss is made to have self-sharpening.
Preparation method includes the following steps:
(1) the hard abrasive material is mixed evenly with the bonding agent, is then coated uniformly on the elastic matrix
On, the symmetrical L-shaped poliss is being cut into after solidification；
(2) poliss is bonded on the bottom plate,.
In a preferred embodiment of the invention, the diameter of the bottom plate is 300-400mm.
In a preferred embodiment of the invention, the partial size of the hard abrasive material is W3-W40.
In a preferred embodiment of the invention, the material of the hard abrasive material is diamond, silicon carbide, cube carbon
Change at least one of boron and aluminium oxide.
In a preferred embodiment of the invention, the bonding agent is epoxy resin, organic siliconresin, photocuring tree
Rouge or sodium alginate.
In a preferred embodiment of the invention, the material of the elastic matrix includes polyurethane sponge and macromolecule
Fiber mat.
In a preferred embodiment of the invention, the poliss with a thickness of 1-3mm, it is described symmetrical L-shaped
The width on every one side is 4-6mm, length 16-18mm.
In a preferred embodiment of the invention, the spacing of adjacent two annulus is 24~26mm.
The beneficial effects of the present invention are:
1, the present invention held for abrasive material in three kinds of polishing modes in the prior art and appeared in tool life
Problem provides a kind of flexible polishing device of high intensity, the wearability not only having had, but also has certain flexibility.Guaranteeing
While processing quality, it is greatly improved the service life of burnishing device.
2, since matrix and bonding agent have elasticity in flexible polishing device of the invention, during the polishing process, abrasive grain has
Certain deformability can effectively reduce scratch and the damage of polished surface, have better polishing effect.
3, the shape of poliss of the invention is symmetrical L shape in polishing, can be reduced the abrasive material to fall off and broken work
Contact length when part clast and friction of workpiece reduces workpiece surface scratch.
Detailed description of the invention
Fig. 1 is the schematic perspective view of flexible polishing tool produced by the present invention.
Fig. 2 is the top view of flexible polishing tool produced by the present invention.
Fig. 3 is the structural schematic diagram of poliss of the invention.
Specific embodiment
Technical solution of the present invention is further explained and described below by way of specific embodiment.
Embodiment 1
As illustrated in fig. 1 and 2, a kind of flexible polishing device, including a bottom plate 1 and multiple poliss 2.
Bottom plate 1 is the circular discoid of diameter 300mm, and is irony, to facilitate installation for magnetic-type occasion；
Multiple poliss 2, cross-sectional shape are symmetrical L shape, including an elastic matrix 20 made of polyurethane sponge
The diamond 22 that the partial size on the elastic matrix 20 is 40 μm is uniformly attached to by epoxy resin 21；
Above-mentioned multiple poliss 2 are in several concentric ring-shaped array distributions in the surface of above-mentioned bottom plate 1, each poliss 2
Cross section bisector 23 be the 2 place annulus 10 of poliss tangent line, and the quantity of the poliss 2 is from interior annular to outer circle
Ring is in arithmetic progression, and in the present embodiment, the quantity of poliss 2 is followed successively by 20,25,30,35, adjacent two from interior annular to outer toroid
The spacing of the annulus 10 is 25mm (as shown in Figure 2)；Between adjacent poliss 2 there is gap to generate to be discharged in polishing process
Clast；During the polishing process, poliss 2 generates abrasion, and the abrasion of diamond 22 of outer layer falls off, and the diamond 22 of internal layer is gradually
Expose, makes poliss 2 that there is self-sharpening.
Preparation method includes the following steps:
(1) epoxy resin 21 that the parts by weight of diamond 22 and 60 of 10 parts by weight are in a liquid state is mixed using blender
5min is stirred evenly, then adds the epoxy curing agent of 30 parts by weight, continues to stir 5min, is then coated uniformly on the bullet
Property matrix 20 (paving in mold) on and be impregnated with elastic matrix 20 completely, then rely on gravity levelling, it is then solid under room temperature
Change 48h, be removed from the molds after solidification, is laser-cut into the symmetrical L-shaped poliss 2 (as shown in figure 3, with a thickness of 1-
The width of 3mm, described symmetrical L-shaped every one side are 5mm, and length 17mm, the angle on both sides is 90 °)；
(2) poliss 2 is bonded on the bottom plate 1 with double-sided adhesive,.
Embodiment 1
As illustrated in fig. 1 and 2, a kind of flexible polishing device, including a bottom plate 1 and multiple poliss 2.
Bottom plate 1 is the circular discoid of diameter 40mm, and is irony, to facilitate installation for magnetic-type occasion；
Multiple poliss 2, cross-sectional shape are symmetrical L shape, the elastic matrix including macromolecular fibre mat material matter
20 and to be uniformly attached to the partial size on the elastic matrix 20 by sodium alginate 21 ' be 3 μm of alumina particulate 22 '；
Above-mentioned multiple poliss 2 are in several concentric ring-shaped array distributions in the surface of above-mentioned bottom plate 1, each poliss 2
Cross section bisector 23 be the 2 place annulus 10 of poliss tangent line, and the quantity of the poliss 2 is from interior annular to outer circle
Ring is in arithmetic progression, and in the present embodiment, the quantity of poliss 2 is followed successively by 20,25,30,35,40 from interior annular to outer toroid, phase
The spacing of adjacent two annulus 10 is 25mm (as shown in Figure 2)；Have gap to be discharged in polishing process between adjacent poliss 2
The clast of generation；During the polishing process, poliss 2 generates abrasion, and the abrasion of alumina particulate 22 ' of outer layer falls off, the oxygen of internal layer
Change aluminium particle 22 ' to be gradually exposed, makes poliss 2 that there is self-sharpening.
Preparation method includes the following steps:
(1) alumina powder of 3 parts by weight, 91 parts by weight of deionized water and 6 parts by weight sodium alginates 21 ' are used
5h is mixed evenly in blender, is then coated uniformly on the elastic matrix 20 (paving in mold) and is impregnated with bullet completely
Then property matrix 20 is placed in 2% calcium chloride solution under room temperature using scraper flattening surface and is solidified 2h, then ventilation
Dry 48h, be then removed from the molds, be cut into the symmetrical L-shaped poliss 2 (as shown in figure 3, with a thickness of 1-3mm,
The width on described symmetrical L-shaped every one side is 5mm, and length 17mm, the angle on both sides is 90 °)；
(2) poliss 2 being bonded on the bottom plate 1 with glue, ventilation solidifies 2h,.
The foregoing is only a preferred embodiment of the present invention, the range that the present invention that therefore, it cannot be limited according to is implemented, i.e.,
Equivalent changes and modifications made in accordance with the scope of the invention and the contents of the specification should still be within the scope of the present invention.
Claims (8)
1. a kind of flexible polishing device, it is characterised in that: including
One bottom plate, for circle；
With multiple poliss, cross-sectional shape be symmetrical L shape, including an elastic matrix made of wear-resistant macromolecule material and
The hard abrasive material being uniformly attached to by bonding agent on the elastic matrix；
Above-mentioned multiple poliss are in several concentric ring-shaped array distributions in the surface of above-mentioned bottom plate, the cross section of each poliss
Bisector be the poliss where annulus tangent line, and the quantity of the poliss from interior annular to outer toroid be in arithmetic progression；
Have gap the clast generated in polishing process is discharged between adjacent poliss；During the polishing process, poliss generates abrasion,
The hard abrasive abrasion of outer layer falls off, and the hard abrasive of internal layer is gradually exposed, and poliss is made to have self-sharpening.
Preparation method includes the following steps:
(1) the hard abrasive material is mixed evenly with the bonding agent, is then coated uniformly on the elastic matrix, Gu
The symmetrical L-shaped poliss is being cut into after change；
(2) poliss is bonded on the bottom plate,.
2. a kind of flexible polishing device as described in claim 1, it is characterised in that: the diameter of the bottom plate is 300-400mm.
3. a kind of flexible polishing device as described in claim 1, it is characterised in that: the partial size of the hard abrasive material is W3-
W40。
4. a kind of flexible polishing device as described in claim 1, it is characterised in that: the material of the hard abrasive material is Buddha's warrior attendant
At least one of stone, silicon carbide, cubic boron and aluminium oxide.
5. a kind of flexible polishing device as described in claim 1, it is characterised in that: the bonding agent is epoxy resin, organic
Silicone resin, light-cured resin or sodium alginate.
6. a kind of flexible polishing device as described in claim 1, it is characterised in that: the material of the elastic matrix includes poly- ammonia
Ester sponge and macromolecular fibre pad.
7. a kind of flexible polishing device as described in claim 1, it is characterised in that: the poliss with a thickness of 1-3mm, institute
The width for stating symmetrical L-shaped every one side is 4-6mm, length 16-18mm.
8. a kind of flexible polishing device as described in claim 1, it is characterised in that: the spacing of adjacent two annulus is 24~
26mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811448281.1A CN109318136B (en) | 2018-11-29 | 2018-11-29 | Flexible polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811448281.1A CN109318136B (en) | 2018-11-29 | 2018-11-29 | Flexible polishing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109318136A true CN109318136A (en) | 2019-02-12 |
| CN109318136B CN109318136B (en) | 2024-02-27 |
Family
ID=65257674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811448281.1A Active CN109318136B (en) | 2018-11-29 | 2018-11-29 | Flexible polishing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109318136B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110076704A (en) * | 2019-05-29 | 2019-08-02 | 华侨大学 | A kind of flexible polishing disk for stone polishing |
| CN110539235A (en) * | 2019-07-31 | 2019-12-06 | 方国亮 | Novel double-sided lathe capable of preventing stones from being scratched in numerical control polishing process |
| CN113478404A (en) * | 2021-07-12 | 2021-10-08 | 苏州赛尔特新材料有限公司 | Large-size green flexible polishing pad and preparation method and application thereof |
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|---|---|---|---|---|
| WO2002043921A1 (en) * | 2000-12-01 | 2002-06-06 | Toyo Boseki Kabushiki Kaisha | Polishing pad, method of manufacturing the polishing pad, and cushion layer for polishing pad |
| CN2866001Y (en) * | 2006-01-24 | 2007-02-07 | 镇江锋芒磨具有限公司 | Circular grinding disc |
| CN202780810U (en) * | 2012-05-24 | 2013-03-13 | 周宝泉 | Flexible diamond grinding head |
| JP2013136146A (en) * | 2011-11-30 | 2013-07-11 | Aion Kk | Polishing tool |
| CN203542401U (en) * | 2013-09-27 | 2014-04-16 | 泉州众志新材料科技有限公司 | Novel resin grinding disc |
| CN204487304U (en) * | 2015-02-26 | 2015-07-22 | 白明正 | The grinding and polishing group of slurry trowel ray machine and floor-cleaning machine clapped by concrete |
| CN104802099A (en) * | 2015-05-04 | 2015-07-29 | 华侨大学 | Abrasion block with large chip containing cavities, and preparation method and application thereof |
| CN209207277U (en) * | 2018-11-29 | 2019-08-06 | 华侨大学 | Flexible polishing device |
-
2018
- 2018-11-29 CN CN201811448281.1A patent/CN109318136B/en active Active
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| WO2002043921A1 (en) * | 2000-12-01 | 2002-06-06 | Toyo Boseki Kabushiki Kaisha | Polishing pad, method of manufacturing the polishing pad, and cushion layer for polishing pad |
| CN2866001Y (en) * | 2006-01-24 | 2007-02-07 | 镇江锋芒磨具有限公司 | Circular grinding disc |
| JP2013136146A (en) * | 2011-11-30 | 2013-07-11 | Aion Kk | Polishing tool |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110076704A (en) * | 2019-05-29 | 2019-08-02 | 华侨大学 | A kind of flexible polishing disk for stone polishing |
| CN110076704B (en) * | 2019-05-29 | 2021-04-30 | 华侨大学 | Flexible polishing disk for polishing stone |
| CN110539235A (en) * | 2019-07-31 | 2019-12-06 | 方国亮 | Novel double-sided lathe capable of preventing stones from being scratched in numerical control polishing process |
| CN110539235B (en) * | 2019-07-31 | 2020-09-01 | 诸暨易联众创企业管理服务有限公司 | Double-sided lathe capable of preventing stones from being scratched in numerical control polishing |
| CN113478404A (en) * | 2021-07-12 | 2021-10-08 | 苏州赛尔特新材料有限公司 | Large-size green flexible polishing pad and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109318136B (en) | 2024-02-27 |
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