CN211128389U - High-frequency transmission type communication circuit board - Google Patents
High-frequency transmission type communication circuit board Download PDFInfo
- Publication number
- CN211128389U CN211128389U CN201922227291.9U CN201922227291U CN211128389U CN 211128389 U CN211128389 U CN 211128389U CN 201922227291 U CN201922227291 U CN 201922227291U CN 211128389 U CN211128389 U CN 211128389U
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- China
- Prior art keywords
- circuit board
- transmission type
- type communication
- frequency material
- frequency
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- Expired - Fee Related
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 47
- 229910000679 solder Inorganic materials 0.000 claims abstract description 16
- 230000017525 heat dissipation Effects 0.000 claims description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000000741 silica gel Substances 0.000 claims description 16
- 229910002027 silica gel Inorganic materials 0.000 claims description 16
- 238000009413 insulation Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a high frequency transmission type communication line board, including insulating basic unit, first circuit board and second circuit board are installed on insulating basic unit's top, and open the bottom of first circuit board has first high frequency material groove, and open on the top of second circuit board has second high frequency material groove, and the internally mounted of first high frequency material groove has the high frequency material post, and the bottom of first circuit board is provided with the insulating film. The high-frequency material column is arranged on the side faces of the first circuit board and the second circuit board, and the surface area of the circuit board occupied by the high-frequency material column is reduced. And the first circuit board and the second circuit board are matched through the convex blocks and the grooves, so that the circuit board is simple and quick. The connecting rod inserts the louvre, and fastening post and metallic shield layer joint, the solder mask on second circuit board top is more firm, is difficult for droing.
Description
Technical Field
The utility model relates to a communication line way board technical field specifically is high frequency transmission type communication line way board.
Background
With the development of domestic and foreign communication, the market of high-frequency communication equipment will inevitably expand. The high-frequency communication needs a high-frequency communication circuit board, so that the high-frequency communication circuit board has low cost and excellent performance, and has a long-term huge market share. And with the change of communication technology, the high-frequency communication circuit board can be widely applied in the communication industry.
Chinese patent publication No. CN207340283U in 2018, 5, 8, discloses a high-frequency multilayer printed wiring board for communications, which is characterized in that: including the insulating basic unit, first circuit board and the second circuit board that set gradually, first circuit board with all be provided with the pore on the second circuit board, be equipped with the high frequency material in the pore, the upper surface of first circuit board is equipped with the convex part, be equipped with a plurality of perforation on the convex part, the lower surface of second circuit board be equipped with the corresponding concave part of convex part, be equipped with on the concave part with perforate corresponding through-hole, insulating basic unit with be equipped with aluminium oxide heat dissipation coating between the first circuit board, be equipped with a plurality of louvres on the second circuit board, its simple structure can realize more complicated function and application, has strengthened the practicality and the richness of terminal product greatly, and radio signal is more stable, and the interference killing feature strengthens greatly, and transmission distance is showing the extension.
The existing high-frequency transmission type communication circuit board is more stable in wireless signal and greatly enhanced in anti-interference capability. However, the used area of the circuit board surface is small, and it is inconvenient when the first circuit board and the second circuit board are matched. The solder mask on the top end of the circuit board is easy to fall off and has no reinforcing structure.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high frequency transmission type communication line board to solve the area of use on circuit board surface less, and inconvenient problem when first circuit board and second circuit board are in phase with each other.
In order to achieve the above object, the utility model provides a following technical scheme: high frequency transmission type communication circuit board, including insulating basic unit, first circuit board and second circuit board are installed to insulating basic unit's top, open the bottom of first circuit board has first high frequency material groove, open the top of second circuit board has second high frequency material groove, the internally mounted in first high frequency material groove has the high frequency material post, the bottom of first circuit board is provided with the insulating film.
Preferably, the top of first circuit board is provided with the lug, the top of second circuit board is provided with the recess, open the top of second circuit board has the louvre, the inside of louvre is pasted with the metal shielding layer, the top of second circuit board is provided with the solder mask.
Preferably, a connecting rod is fixed at the bottom end of the solder mask layer, a fastening column is connected to the surface of the connecting rod, and the fastening column is inserted into the heat dissipation hole.
Preferably, the top of insulating basic unit is fixed with the baffle, the side of baffle is provided with first heat dissipation layer, the silica gel layer is installed on the top of insulating basic unit, the top on silica gel layer is provided with the arch, the second heat dissipation layer is installed on the top on silica gel layer, open the bottom of insulating basic unit has the connecting hole.
Preferably, the first high-frequency material groove and the second high-frequency material groove are both arc-shaped grooves, and the first high-frequency material groove and the second high-frequency material groove are aligned up and down.
Preferably, the projection and the groove are both arc-shaped structures, and the projection is inserted into the groove.
Preferably, the connecting rod is perpendicular to the solder mask layer, the fastening column is obliquely connected with the connecting rod, and the fastening column is made of a silica gel material.
Preferably, the baffle is perpendicular to the insulation base layer, the protrusion is of a hemispherical structure, and the connecting hole is a threaded hole.
Compared with the prior art, the beneficial effects of the utility model are that: 1. the high-frequency material column is arranged on the side faces of the first circuit board and the second circuit board, and the surface area of the circuit board occupied by the high-frequency material column is reduced. And the first circuit board and the second circuit board are matched through the convex blocks and the grooves, so that the circuit board is simple and quick.
2. The connecting rod inserts the louvre, and fastening post and metallic shield layer joint, the solder mask on second circuit board top is more firm, is difficult for droing.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is an enlarged view of fig. 1 at a according to the present invention;
fig. 3 is a schematic structural diagram of a part of the high-frequency material column of fig. 1 according to the present invention;
fig. 4 is a schematic structural diagram of a portion of the first circuit board of fig. 1 according to the present invention.
In the figure: 1. an insulating base layer; 2. a silica gel layer; 3. a protrusion; 4. a second heat dissipation layer; 5. connecting holes; 6. a first circuit board; 7. an insulating film; 8. a high frequency material column; 9. a first high-frequency material tank; 10. a second high-frequency material tank; 11. a first heat dissipation layer; 12. a baffle plate; 13. a solder resist layer; 14. a bump; 15. a groove; 16. a second circuit board; 17. heat dissipation holes; 18. a metal shielding layer; 19. a connecting rod; 20. and (5) fastening the column.
Detailed Description
Referring to fig. 1 and fig. 3, the present invention provides a technical solution: the high-frequency transmission type communication circuit board comprises an insulating base layer 1, wherein a first circuit board 6 and a second circuit board 16 are mounted at the top end of the insulating base layer 1, and the first circuit board 6 is parallel to the second circuit board 16.
Referring to fig. 1 and 3, a first high-frequency material groove 9 is formed in the bottom end of the first circuit board 6, the first high-frequency material groove 9 is located on the side surface of the first circuit board 6, a second high-frequency material groove 10 is formed in the top end of the second circuit board 16, the second high-frequency material groove 10 is located on the side surface of the second circuit board 16, the first high-frequency material groove 9 and the second high-frequency material groove 10 are both arc-shaped grooves, and the first high-frequency material groove 9 and the second high-frequency material groove 10 are aligned up and down.
Referring to fig. 1, 3 and 4, the high-frequency material pillar 8 is installed between the first high-frequency material groove 9 and the second high-frequency material groove 10, so as to satisfy the requirement of high-frequency signal transmission and reduce the surface area occupied by the second circuit board 16. The insulating film 7 is disposed between the first wiring board 6 and the second wiring board 16.
Referring to fig. 1 and 4, a bump 14 is disposed on the top of the first circuit board 6, a groove 15 is disposed on the top of the second circuit board 16, and the bump 14 and the groove 15 are both arc-shaped structures, which is not only beneficial for the bump 14 to be inserted into the groove 15, but also can increase the surface area of the first circuit board 6.
Referring to fig. 1 and 4, a heat dissipation hole 17 is formed at the top end of the second circuit board 16, and a metal shielding layer 18 is adhered inside the heat dissipation hole 17.
Referring to fig. 1 and 2, a solder mask layer 13 is disposed on the top of the second circuit board 16, a connecting rod 19 is fixed on the bottom of the solder mask layer 13, the connecting rod 19 is perpendicular to the solder mask layer 13, and the connecting rod 19 is inserted into the heat dissipation hole 17. The surface of connecting rod 19 is connected with fastening post 20, and fastening post 20 is connected with the slope of connecting rod 19, and fastening post 20 is the shape of falling the splayed, and fastening post 20 adopts the silica gel material, and fastening post 20 inserts louvre 17, increases the frictional resistance between fastening post 20 and the metallic shield 18, consolidates solder mask 13.
Referring to fig. 1, a barrier 12 is fixed on the top of the insulation base layer 1, the barrier 12 is perpendicular to the insulation base layer 1, a first heat dissipation layer 11 is disposed on the side of the barrier 12, and the side of the first heat dissipation layer 11 contacts with the side of the high-frequency material pillar 8.
Referring to fig. 1, a silica gel layer 2 is mounted on the top end of an insulation base layer 1, a protrusion 3 is disposed on the top end of the silica gel layer 2, the protrusion 3 is of a hemispherical structure, and the contact area between the silica gel layer 2 and a second heat dissipation layer 4 is increased to accelerate heat dissipation. The second heat dissipation layer 4 is installed on the top of silica gel layer 2, and second heat dissipation layer 4 is located the bottom of first circuit board 6.
Referring to fig. 1, the bottom end of the insulation base layer 1 is provided with a connection hole 5, and the connection hole 5 is a threaded hole for mounting the insulation base layer 1.
The utility model discloses when concrete implementation: the insulating film 7 is disposed between the first wiring board 6 and the second wiring board 16, the first wiring board 6 is placed on top of the second wiring board 16, and the bumps 14 are inserted inside the grooves 15.
The first high-frequency material groove 9 and the second high-frequency material groove 10 are aligned up and down, and the high-frequency material column 8 is installed inside.
The solder mask layer 13 is installed on the top end of the second circuit board 16, the connecting rod 19 and the fastening column 20 are inserted into the heat dissipation hole 17, and the fastening column 20 is clamped with the metal shielding layer 18 to reinforce the solder mask layer 13.
The first heat dissipation layer 11 is in contact with the side of the first wiring board 6 and is mounted on the side of the dam 12, and the dam 12 is fixed on the top of the insulation base layer 1. Silica gel layer 2 is installed on the top of insulating basic unit 1, and second heat dissipation layer 4 is installed on the top of silica gel layer 2, and second heat dissipation layer 4 is installed in the bottom of first circuit board 6, dispels the heat to first circuit board 6.
Claims (8)
1. High frequency transmission type communication line board, including insulating basic unit (1), its characterized in that: first circuit board (6) and second circuit board (16) are installed on the top of insulating basic unit (1), open the bottom of first circuit board (6) has first high frequency material groove (9), open the top of second circuit board (16) has second high frequency material groove (10), the internally mounted of first high frequency material groove (9) has high frequency material post (8), the bottom of first circuit board (6) is provided with insulating film (7).
2. The high-frequency transmission type communication wiring board according to claim 1, characterized in that: the top of first circuit board (6) is provided with lug (14), the top of second circuit board (16) is provided with recess (15), open on the top of second circuit board (16) has louvre (17), metal shielding layer (18) have been pasted to the inside of louvre (17), the top of second circuit board (16) is provided with solder mask (13).
3. The high-frequency transmission type communication wiring board according to claim 2, characterized in that: the bottom end of the solder mask layer (13) is fixed with a connecting rod (19), the surface of the connecting rod (19) is connected with a fastening column (20), and the fastening column (20) is inserted into the heat dissipation hole (17).
4. The high-frequency transmission type communication wiring board according to claim 1, characterized in that: the top of insulating basic unit (1) is fixed with baffle (12), the side of baffle (12) is provided with first heat dissipation layer (11), silica gel layer (2) are installed on the top of insulating basic unit (1), the top on silica gel layer (2) is provided with arch (3), second heat dissipation layer (4) are installed on the top on silica gel layer (2), connecting hole (5) have been opened to the bottom of insulating basic unit (1).
5. The high-frequency transmission type communication wiring board according to claim 1, characterized in that: the first high-frequency material groove (9) and the second high-frequency material groove (10) are both arc-shaped grooves, and the first high-frequency material groove (9) and the second high-frequency material groove (10) are aligned up and down.
6. The high-frequency transmission type communication wiring board according to claim 2, characterized in that: the convex block (14) and the groove (15) are both arc-shaped structures, and the convex block (14) is inserted into the groove (15).
7. The high-frequency transmission type communication wiring board according to claim 3, characterized in that: connecting rod (19) and solder mask (13) are perpendicular, fastening post (20) and connecting rod (19) slope are connected, fastening post (20) adopt the silica gel material.
8. The high-frequency transmission type communication wiring board according to claim 4, wherein: the baffle (12) is perpendicular to the insulation base layer (1), the protrusions (3) are of hemispherical structures, and the connecting holes (5) are threaded holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922227291.9U CN211128389U (en) | 2019-12-12 | 2019-12-12 | High-frequency transmission type communication circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922227291.9U CN211128389U (en) | 2019-12-12 | 2019-12-12 | High-frequency transmission type communication circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211128389U true CN211128389U (en) | 2020-07-28 |
Family
ID=71705489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922227291.9U Expired - Fee Related CN211128389U (en) | 2019-12-12 | 2019-12-12 | High-frequency transmission type communication circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211128389U (en) |
-
2019
- 2019-12-12 CN CN201922227291.9U patent/CN211128389U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200728 |