CN205071601U - Electronic device - Google Patents
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- Publication number
- CN205071601U CN205071601U CN201520904058.9U CN201520904058U CN205071601U CN 205071601 U CN205071601 U CN 205071601U CN 201520904058 U CN201520904058 U CN 201520904058U CN 205071601 U CN205071601 U CN 205071601U
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- CN
- China
- Prior art keywords
- circuit board
- chip
- heat
- heat pipe
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides an electronic device, including chip, circuit board and heat dissipation layer board, the bottom surface slant of chip is equipped with a plurality of terminals, be equipped with on the circuit board with the conducting strip of terminal contact, circuit board are installed on the heat dissipation layer board, and a fin is hugged closely to the upper surface of chip, and one side of circuit board is fixed with the heat pipe, and the upper end of heat pipe is supported and is leaned on one side of chip, the heat dissipation layer board is connected to the lower extreme of heat pipe. The utility model discloses a fin is hugged closely at the upper surface of chip in the aspect, and on the other hand reaches the thermo -contact relation between chip and the heat dissipation layer board through the heat pipe for the heat energy of chip is transmitted to circuit board and heat dissipation layer board by the heat pipe, through the great casing area of circuit board and heat dissipation layer board in order increasing effectual heat radiating area, thereby improve electronic device's whole radiating efficiency, the utility model discloses electronic device's cooling efficiency can be effectively improved, electronic device's system stability is guaranteed.
Description
Technical field
The utility model relates to electroporation field, and specifically, the utility model relates to a kind of electronic installation.
Background technology
The various electronic components producing heat are used in many electronic installations.In these electronic components, when environment for use temperature is higher than a specified temp, will there is various negative effect, the unsteadiness, reliability reduction etc. of such as normal running, this causes the hydraulic performance decline of electronic installation or manufacturing equipment self.
In recent years, with the improvement etc. in memory capacity increase, readwrite performance raising, portable terminal performance, the message transmission rate between electronic installation, storage card etc. increased further.Therefore, be concerned about, the increase of companion data transmission quantity, the heat that electronic component produces will become larger, and this causes described device fluctuation of service.For the problems referred to above, those skilled in the art need badly provides a kind of electronic installation with great heat radiation effect.
Summary of the invention
The technical problems to be solved in the utility model is: provide a kind of electronic installation with great heat radiation effect.
The utility model solves the technical scheme that its technical problem adopts: provide a kind of electronic installation, comprise: chip, circuit board and heat radiation supporting plate, the bottom surface of described chip is oblique is provided with some terminals, described circuit board is provided with the conducting strip with described termination contact, described circuit board is arranged on described heat radiation supporting plate, the upper surface of described chip is close to a fin, the side of described circuit board is fixed with heat pipe, the upper end of described heat pipe is against the side of described chip, and the lower end of described heat pipe connects heat radiation supporting plate.
Preferably, be connected by the first metal guide plume between described chip with described circuit board.
Preferably, in described circuit board, embed the second metal guide plume, and the position of the second metal guide plume is corresponding to the position of described first metal guide plume.
Preferably, be connected by the 3rd metal guide plume between described circuit board with heat radiation supporting plate, and the position of the 3rd metal guide plume is corresponding to the position of described second metal guide plume.
Preferably, described heat pipe is hollow tube, is filled with cooling fluid in described hollow tube.
The utility model provides a kind of electronic installation, a fin is close on the one hand at the upper surface of chip, on the other hand, the thermo-contact relation between chip and heat radiation supporting plate is reached by heat pipe, the heat energy of chip is made to be passed to circuit board and heat radiation supporting plate by heat pipe, by circuit board and the larger housing area of heat radiation supporting plate to increase effective area of dissipation, thus improve the integral heat sink efficiency of electronic installation, the utility model effectively can improve the heat dissipation of electronic installation, ensures the stability of a system of electronic installation.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of electronic installation preferred embodiment of the present utility model.
[in figure Reference numeral]:
10. chip, 11. terminals, 12. first metal guide plumes, 20. circuit boards, 21. conducting strips, 22. second metal guide plumes, 30. heat radiation supporting plates, 31. the 3rd metal guide plumes, 40. fin, 50. heat pipes.
Embodiment
For making content of the present utility model clearly understandable, below in conjunction with Figure of description, content of the present utility model is described further.Certain the utility model is not limited to this specific embodiment, and the general replacement known by those skilled in the art is also encompassed in protection range of the present utility model.Secondly, the utility model detailed statement that utilized schematic diagram to carry out, when describing the utility model example in detail, for convenience of explanation, schematic diagram, should in this, as to restriction of the present utility model not according to general ratio partial enlargement.
Above-mentioned and other technical characteristic and beneficial effect, will in conjunction with the embodiments and accompanying drawing 1 electronic installation of the present utility model is described in detail.As shown in Figure 1, Fig. 1 is the structural representation of electronic installation preferred embodiment of the present utility model.
As shown in Figure 1, the utility model provides a kind of electronic installation, comprise chip 10, circuit board 20 and heat radiation supporting plate 30, the bottom surface of chip 10 is oblique is provided with some terminals 11, and circuit board 20 is provided with the conducting strip 21 contacted with described terminal 11, and circuit board 20 is arranged on described heat radiation supporting plate 30, the upper surface of chip 10 is close to a fin 40, the side of circuit board 20 is fixed with heat pipe 50, and the upper end of heat pipe 50 is against the side of described chip 10, and the lower end of heat pipe 50 connects heat radiation supporting plate 30.
In order to optimize radiating effect further, be connected by the first metal guide plume 12 between chip 10 with circuit board 20; In addition, in circuit board 20, embed the second metal guide plume 22, and the position of the second metal guide plume 22 is corresponding to the position of the first metal guide plume 12; Further, be connected by the 3rd metal guide plume 31 between circuit board 20 with heat radiation supporting plate 30, and the position of the 3rd metal guide plume 31 is corresponding to the position of the second metal guide plume 22.
Concrete, in the present embodiment, heat pipe 50 is hollow tube, is filled with cooling fluid in hollow tube.
In sum, the utility model provides a kind of electronic installation, a fin 40 is close on the one hand at the upper surface of chip 10, on the other hand, the thermo-contact relation between chip 10 and heat radiation supporting plate 30 is reached by heat pipe 50, the heat energy of chip 10 is made to be passed to circuit board 20 and heat radiation supporting plate 30 by heat pipe 50, by circuit board 20 and the larger housing area of heat radiation supporting plate 30 to increase effective area of dissipation, thus improve the integral heat sink efficiency of electronic installation, the utility model effectively can improve the heat dissipation of electronic installation, ensure the stability of a system of electronic installation.
Although the utility model essentially describes above embodiment, just come as an example to be described, and the utility model is not limited to this.Such as, each parts that embodiment is shown in detail can be revised and run, to described modification with apply relevant difference and can think and be included in protection range of the present utility model that claims limit.
Embodiment involved in this specification, its implication is that specially feature, structure or the characteristic described in conjunction with this embodiment is included at least one embodiment of the present utility model.These terms come across in specification everywhere differ to establish a capital and relate to same embodiment.In addition, when describing special characteristic, structure or characteristic in conjunction with any embodiment, all think that it falls in the scope of these special characteristics, structure or the characteristic that those of ordinary skill in the art just can realize in conjunction with other embodiments.
Claims (5)
1. an electronic installation, it is characterized in that, comprise chip, circuit board and heat radiation supporting plate, the bottom surface of described chip is oblique is provided with some terminals, and described circuit board is provided with the conducting strip with described termination contact, and described circuit board is arranged on described heat radiation supporting plate, the upper surface of described chip is close to a fin, the side of described circuit board is fixed with heat pipe, and the upper end of described heat pipe is against the side of described chip, and the lower end of described heat pipe connects heat radiation supporting plate.
2. electronic installation as claimed in claim 1, be is characterized in that, be connected between described chip with described circuit board by the first metal guide plume.
3. electronic installation as claimed in claim 2, it is characterized in that, embed the second metal guide plume in described circuit board, and the position of the second metal guide plume is corresponding to the position of described first metal guide plume.
4. electronic installation as claimed in claim 3, is characterized in that, be connected, and the position of the 3rd metal guide plume is corresponding to the position of described second metal guide plume between described circuit board with heat radiation supporting plate by the 3rd metal guide plume.
5. electronic installation as claimed in claim 1, it is characterized in that, described heat pipe is hollow tube, is filled with cooling fluid in described hollow tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520904058.9U CN205071601U (en) | 2015-11-13 | 2015-11-13 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520904058.9U CN205071601U (en) | 2015-11-13 | 2015-11-13 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205071601U true CN205071601U (en) | 2016-03-02 |
Family
ID=55398096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520904058.9U Expired - Fee Related CN205071601U (en) | 2015-11-13 | 2015-11-13 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205071601U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109845424A (en) * | 2016-10-17 | 2019-06-04 | Zf 腓德烈斯哈芬股份公司 | For exporting the equipment and its manufacturing method of heat |
-
2015
- 2015-11-13 CN CN201520904058.9U patent/CN205071601U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109845424A (en) * | 2016-10-17 | 2019-06-04 | Zf 腓德烈斯哈芬股份公司 | For exporting the equipment and its manufacturing method of heat |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160302 Termination date: 20161113 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |