CN211104426U - Punching device - Google Patents

Abstract

The utility model relates to a punching device, include: a machine base; the punching module is arranged on the base and comprises a punching mechanism and a material handling mechanism, the material handling mechanism is used for obtaining materials obtained after being punched by the punching mechanism at the material taking position 11, and the material handling mechanism is also used for driving the materials to move to the transfer position 15; and the blanking module is arranged on the base and comprises a blanking mechanism and a bearing mechanism, the bearing mechanism is used for bearing a tray, the blanking mechanism is used for obtaining materials on the material handling mechanism positioned at the transfer position 15 at the material receiving position 16, and the blanking mechanism is also used for driving the materials to move to the blanking position 17 and placing the materials on the tray at the blanking position 17. The punching device punches the flip chip film coil material by the punching mechanism, and the obtained flip chip film can be placed on the tray under the combined action of the material handling mechanism and the blanking mechanism, so that automatic operation is completed, manual handling is not needed, and the production cost is saved.

Description

Punching device

Technical Field

The utility model relates to a flip chip film production technical field especially relates to a die-cut device.

Background

An automatic punching device for flip-chip film coil is a device for punching and cutting the flip-chip film coil into flip-chip films. In some production application scenarios, the flip chip is punched and then stored in a tray before being used in the next process. At present, the punched flip chip film is transported to the tray in a manual transportation mode, which wastes manpower and has high production cost.

SUMMERY OF THE UTILITY MODEL

Therefore, there is a need for a die-cutting device capable of automatically transferring die-cut flip-chip films to a tray without manual handling, thereby saving production cost.

The technical scheme is as follows:

a die cutting device comprising: a machine base; the punching module is arranged on the base and comprises a punching mechanism and a material handling mechanism, the material handling mechanism is used for obtaining materials obtained after punching by the punching mechanism at a material taking position, and the material handling mechanism is also used for driving the materials to move to a transfer position; and the blanking module is arranged on the base and comprises a blanking mechanism and a bearing mechanism, the bearing mechanism is used for bearing a tray, the blanking mechanism is used for acquiring a material receiving position and is located at the material transmitting position on the material carrying mechanism, the blanking mechanism is further used for driving the material to move to the blanking position and place the material on the tray.

In the punching device, after the punching mechanism punches the roll of the flip chip on film into the flip chip on film, the material handling mechanism obtains the flip chip on film at the material taking position, then moves to the transfer position, and waits for transferring the flip chip on film to the blanking mechanism; when the material carrying mechanism carries the chip on film to move to the transfer position, the blanking mechanism receives the chip on film on the material carrying mechanism at the material receiving position and then moves to the blanking position to place the chip on film on the tray of the bearing mechanism. The punching device punches the flip chip film coil material by the punching mechanism, and the obtained flip chip film can be placed on the tray under the combined action of the material handling mechanism and the blanking mechanism, so that automatic operation is completed, manual handling is not needed, and the production cost is saved.

The technical solution is further explained below:

in one embodiment, the die-cutting module further comprises a cleaning mechanism, the material handling mechanism comprises a first handling assembly and a second handling assembly, the first handling assembly is movably arranged on the base and can move to and fro between the material taking position and the cleaning position, the second handling assembly is movably arranged on the base and can move to and fro between the cleaning material receiving position and the cleaning position, the second handling assembly is used for obtaining the material on the first handling assembly located at the cleaning position, and the cleaning mechanism is used for cleaning the material on the second handling assembly located at the cleaning position.

In one embodiment, the first handling assembly comprises a first suction device for sucking the material, and a first driving member in driving connection with the first suction device, wherein the first driving member is used for driving the first suction device to move so as to enable the first suction device to reciprocate between the material taking position and the cleaning transfer position.

In one embodiment, the second carrying assembly comprises a second adsorption piece for adsorbing the material, and a second driving piece in driving connection with the second adsorption piece, and the second driving piece is used for driving the second adsorption piece to move so that the second adsorption piece sequentially moves from the cleaning material receiving position to the cleaning position and the transfer position or sequentially moves from the transfer position to the cleaning position and the cleaning material receiving position.

In one embodiment, the cleaning mechanism includes a roller brush and a rotary driving member in driving connection with the roller brush, and the roller brush is disposed opposite to the second absorbing member located at the cleaning position.

In one embodiment, the blanking mechanism comprises a third adsorption part and a third driving part in driving connection with the third adsorption part, and the third driving part is used for driving the third adsorption part to move to and fro between the material receiving position and the blanking position.

In one embodiment, the bearing mechanism includes a first bearing component and a tray carrying component, the first bearing component includes a first bearing part for bearing the tray and a first lifting driving part in driving connection with the first bearing part, the first lifting driving part is used for driving the first bearing part to move so that the tray on the first bearing part moves to a tray transfer position, the tray carrying mechanism is used for obtaining the tray located at the tray transfer position and moving the tray to a tray receiving position, and the blanking mechanism is used for placing the material on the tray located at the tray receiving position.

In one embodiment, the pallet handling assembly comprises a first pallet handling assembly and an adaptor platform, the first tray carrying assembly comprises a fourth adsorption piece and a fourth driving piece in driving connection with the fourth adsorption piece, the fourth adsorption part is arranged opposite to the first supporting part, the fourth driving part is used for driving the fourth adsorption part to be close to or far away from the first supporting part, the switching platform comprises a bearing platform and a bearing platform driving piece which is in driving connection with the bearing platform, the bearing platform driving piece is used for driving the bearing platform to move from a position opposite to the fourth adsorption piece to a position opposite to the blanking mechanism at the blanking position, or the plummer driving piece is used for driving the plummer from with be located the material level down the relative position of unloading mechanism move to with the fourth adsorbs the relative position of piece.

In one embodiment, the carrying mechanism further comprises a second carrying assembly, the second carrying assembly is juxtaposed with the first carrying assembly, and the tray handling mechanism is further configured to move the tray located at the tray receiving position onto the second carrying assembly.

In one embodiment, the second bearing assembly comprises a second bearing part and a second lifting driving part in driving connection with the second bearing part, the tray carrying mechanism also comprises a second tray carrying assembly, the second tray carrying assembly comprises a fifth adsorption piece arranged opposite to the second bearing piece and a fifth driving piece in driving connection with the fifth adsorption piece, the fifth driving element is used for driving the fifth adsorption element to be close to or far away from the second supporting element, the bearing platform driving part is also used for driving the bearing platform to move from a position opposite to the blanking mechanism at the blanking position to a position opposite to the fifth adsorption part, or the plummer driving piece is also used for driving the plummer to move from the position opposite to the fifth adsorption piece to the position opposite to the blanking mechanism at the blanking position.

Drawings

Fig. 1 is a schematic structural view of a punching device according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a punching module according to an embodiment of the present invention;

fig. 3 is a schematic partial structural view of a punching mechanism according to an embodiment of the present invention;

FIG. 4 is an enlarged view of a portion of the die cutting module shown in FIG. 2 at A;

fig. 5 is a schematic partial structural view of a punching device according to an embodiment of the present invention;

fig. 6 is a schematic view of a partial structure of a blanking module according to an embodiment of the present invention;

fig. 7 is a schematic structural view of a blanking mechanism in an embodiment of the present invention;

fig. 8 is a schematic structural diagram of a first carrier assembly according to an embodiment of the present invention.

Description of reference numerals:

10. a punching device 11, a material taking position, 12, a cleaning transfer position, 13, a cleaning receiving position, 14, a cleaning position, 15, a transfer position, 16, a material receiving position, 17, a blanking position, 18, a tray transfer position, 19, a tray receiving position, 20, a tray, 100, a base, 200, a punching module, 210, a punching mechanism, 211, a punching gold type, 212, a punching driving member, 213, a ratchet, 214, a ratchet driving member, 220, a material handling mechanism, 221, a first handling component, 2211, a first suction member, 2212, a first driving member, 222, a second handling component, 2221, a second suction member, 2222, a second driving member, 22221, a first X-axis driving member, 22222, a first Z-axis driving member, 230, a cleaning mechanism, 231, a roller brush, 232, a rotary driving member, 300, a blanking module, 310, a blanking mechanism, 311, a third suction member, 312, a third driving member, 3121, a second X-axis driving member, 3122. second Z axle driving piece, 3123, steering driving piece, 320, bearing mechanism, 321, first bearing component, 3211, first bearing piece, 3212, first lifting driving piece, 322, first tray carrying component, 323, switching platform, 3231, bearing table, 3232, bearing table driving piece, 324, second bearing component, 325, second tray carrying component, 3251, fifth adsorption piece, 3252 and fifth driving piece.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the following detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In the present invention, the terms "first" and "second" do not denote any particular quantity or order, but are merely used to distinguish names.

As shown in fig. 1, an embodiment of a punching device 10 includes a base 100, a punching module 200, and a blanking module 300.

Specifically, the die-cutting module 200 is disposed on the base 100, the die-cutting module 200 includes a die-cutting mechanism 210 and a material-handling mechanism 220, the die-cutting mechanism 210 is configured to die-cut a roll of the flip chip on film into the flip chip on film, the material-handling mechanism 220 is configured to obtain the flip chip on film obtained by die-cutting by the die-cutting mechanism 210 at the material-taking position 11, and the material-handling mechanism 220 is further configured to carry the flip chip on film to move to the transfer position 15; the blanking module 300 is disposed on the base 100, the blanking module 300 includes a blanking mechanism 310 and a carrying mechanism 320, the carrying mechanism 320 is used for carrying the tray 20, the blanking mechanism 310 is used for obtaining the material on the material handling mechanism 220 located at the transfer position 15 at the material receiving position 16, and the blanking mechanism 310 is further used for moving the cover film to the blanking position 17 and placing the material on the tray 20 at the blanking position 17.

In the above-mentioned punching apparatus 10, after the punching mechanism 210 punches the roll of the flip chip on film into the flip chip on film, the material handling mechanism 220 obtains the flip chip on film at the material taking position 11, and then moves to the transfer position 15 to wait for transferring the flip chip on film to the blanking mechanism 310; after the material handling mechanism 220 carries the flip chip on the carrier to the transfer position 15, the unloading mechanism 310 receives the flip chip on the material handling mechanism 220 at the receiving position 16, and then moves to the unloading position 17 to place the flip chip on the tray 20 of the carrying mechanism 320. After the punching mechanism 210 punches the roll of the flip chip, the punching device 10 can put the obtained flip chip on the tray 20 under the combined action of the material handling mechanism 220 and the blanking mechanism 310, so as to complete the automatic operation, without manual handling, and save the production cost.

As shown in fig. 2 and 3, in one embodiment, the punching mechanism 210 includes a die-cut gold 211, a die-cut driving member 212 for driving the die-cut gold 211, ratchet wheels 213 disposed on two sides of the die-cut gold 211, and a ratchet wheel driving member 214 for driving the die-cut gold 211 to rotate, the flip-chip film roll is used for being mounted on the ratchet wheels 213 disposed on two sides of the die-cut gold 211, and the ratchet wheels 213 can drive the flip-chip film roll to move when rotating. When the die-cut gold type 211 is die-cut into a piece of flip-chip on film from the flip-chip on film roll under the action of the die-cut driving member 212, the flip-chip on film falls to the lower side due to gravity.

Alternatively, the punching driving member 212 is a linear driving module such as an air cylinder or an electric screw rod, and is used for driving the punching mechanism 210 to move along the Z-axis.

Furthermore, a vision camera is further disposed below the die-cut gold 211, the vision camera is used for detecting whether the position of the flip-chip film roll material is accurate, and after the position of the flip-chip film roll material is deviated, the ratchet 213 can adjust the position of the flip-chip film roll material, so that the die-cut flip-chip film can achieve the required precision.

As shown in fig. 2 and 4, in one embodiment, the die-cutting module 200 further includes a cleaning mechanism 230, the material handling mechanism 220 includes a first handling assembly 221 and a second handling assembly 222, the first handling assembly 221 is movably disposed on the base and can move between the material taking position 11 and the cleaning transfer position 12, the second handling assembly 222 is movably disposed on the base and can move between the cleaning receiving position 13 and the cleaning position 14, the second handling assembly 222 is used for obtaining the flip chips on the first handling assembly 221 located at the cleaning transfer position 12 at the cleaning receiving position 13, and the cleaning mechanism 230 is used for cleaning the flip chips on the second handling assembly 222 located at the cleaning position 14.

As shown in fig. 2 and 4, the first handling assembly 221 further includes a first suction member 2211 for sucking the material, and a first driving member 2212 in driving connection with the first suction member 2211, wherein the first driving member 2212 is used for driving the first suction member 2211 to move so as to move the first suction member 2211 to and from the material taking position 11 and the cleaning transfer position 12.

Specifically, the first driving member 2212 is configured to drive the first suction member 2211 to move along the Y-axis direction, when the first suction member 2211 is located at the material taking position 11, the first suction member 2211 is located just below the punching mechanism 210, after the punching mechanism 210 punches the flip-chip film roll into the flip-chip film, the flip-chip film can be sucked by the first suction member 2211, and when the first suction member 2211 sucks the flip-chip film, the first driving member 2212 can drive the first suction member 2211 to move along the Y-axis direction, so that the first suction member 2211 reaches the clean transfer position 12.

Alternatively, the first driving member 2212 may be a linear driving mechanism such as a cylinder, an electric screw, a conveyor belt mechanism or a linear motor module, and the first suction member 2211 may be a suction cup or a suction nozzle.

As shown in fig. 2, the second handling assembly 222 further includes a second suction member 2221 for sucking the material, and a second driving member 2222 in driving connection with the second suction member 2221, wherein the second driving member 2222 is used for driving the second suction member 2221 to move, so that the second suction member 2221 sequentially moves from the cleaning position 13 to the cleaning position 14 and the transfer position 15 or sequentially moves from the transfer position 15 to the cleaning position 14 and the cleaning position 13.

Specifically, the second driving member 2222 includes a first X-axis driving member 22221 and a first Z-axis driving member 22222, the first Z-axis driving member 22222 is drivingly connected to the first X-axis driving member 22221, and the first suction member 2211 is drivingly connected to the first Z-axis driving member 22222. The first X-axis driving member 22221 is used to drive the first Z-axis driving member 22222 to move along the X direction, so as to drive the first suction member 2211 on the first Z-axis driving member 22222 to move along the X direction, and the first Z-axis driving member 22222 is used to drive the first suction member 2211 to move along the Z direction. When the first suction member 2211 moves to the cleaning handover position 12, the second suction member 2221 is opposite to the first suction member 2211, the first Z-axis driving member 22222 can drive the second suction member 2221 to move toward the first suction member 2211 and make the second driving member 2222 contact with the chip on film, and when the first suction member 2211 removes the suction force from the chip on film, the second suction member 2221 can suck the chip on film on the first suction member 2211; then, the first Z-axis driving member 22222 drives the second absorbing member 2221 to move away from the first absorbing member 2211, so that the second absorbing member 2221 is separated from the first absorbing member 2211 by a certain distance; the first X-axis drive 22221 then drives the first suction fitting 2211 to move to the cleaning position 14. When the second suction member 2221 moves to the cleaning position 14, the flip chip on the second suction member 2221 is just opposite to the cleaning mechanism 230, and the cleaning mechanism 230 can clean the debris on the edge of the flip chip. After the cleaning of the flip chip is completed, the first X-axis driving element 22221 drives the second absorbing element 2221 to move along the X-axis direction, so that the second absorbing element 2221 reaches the transfer position 15.

Alternatively, the first X-axis driving member 22221 and the first Y-axis driving member may be linear driving mechanisms such as an air cylinder, an electric screw, a conveyor belt mechanism or a linear motor module, and the second adsorbing member 2221 may be a suction cup or a suction nozzle.

As shown in fig. 2, in one embodiment, the cleaning mechanism 230 includes a roller brush 231 and a rotary driving member 232 in driving connection with the roller brush 231, and the roller brush 231 is disposed opposite to the second adsorbing member 2221 at the cleaning position 14. The rotation driving member 232 is used for driving the roller brush 231 to rotate along the axis of the roller brush 231, and when the second adsorbing member 2221 is located at the cleaning position 14, the second adsorbing member 2221 can clean the chips on the edge of the chip on film adsorbed by the rotating roller brush 231.

Alternatively, the rotary drive 232 may be a motor or a rotary cylinder, or the like.

As shown in fig. 5 to 7, in one embodiment, the blanking mechanism 310 includes a third suction member 311 and a third driving member 312 in driving connection with the third suction member 311, and the third driving member 312 is used for driving the third suction member 311 to move to and from the material receiving position 16 and the blanking position 17.

As shown in fig. 7, in detail, the third driving member 312 includes a second X-axis driving member 3121, a second Z-axis driving member 3122 and a steering driving member 3123, the second Z-axis driving member 3122 is in driving connection with the second X-axis driving member 3121, the steering driving member 3123 is in driving connection with the second Z-axis driving member 3122, and the third suction member 311 is in driving connection with the steering driving member 3123. The second X-axis driving member 3121 is configured to drive the second Z-axis driving member 3122 to move along the X direction, so as to drive the steering driving member 3123 and the third absorbing member 311 on the second Z-axis driving member 3122 to move along the X direction; the second Z-axis driving member 3122 is used for driving the steering driving member 3123 and the third suction member 311 to move along the Z-axis direction; the steering driving member 3123 is used to drive the third suction member 311 to change direction, so that the third suction member 311 faces the carrying mechanism located at the transfer position 15 or the tray 20 on the carrying mechanism 320.

As shown in fig. 5 to 7, more specifically, after the second suction member 2221 is moved to the transfer position 15, the second X-axis driving member 3121 drives the third suction member 311 to move below the second suction member 2221; then, the steering driving member 3123 drives the third suction member 311 toward the second suction member 2221, such that the third suction member 311 is opposite to the second suction member 2221; then, the second Z-axis driving member 3122 may drive the third absorbing member 311 to move toward the second absorbing member 2221, so that the third absorbing member 311 contacts the flip chip on the second absorbing member 2221, and the third absorbing member 311 absorbs the flip chip on the second absorbing member 2221; then, the second X-axis driving member 3121 may further drive the second suction member 2221 to move above the tray 20, and the steering driving member 3123 further drives the second suction member 2221 toward the tray 20; finally, the second suction member 2221 is driven by the second Z-axis driving member 3122 to move toward the tray 20, so that the second suction member 2221 is placed on the tray 20. The working sequence of the second X-axis driving element 3121, the second Z-axis driving element 3122 and the steering driving element 3123 can be changed as required as long as the third absorbing element 311 can move to and from the material receiving position 16 and the material discharging position 17.

Alternatively, the second X-axis driving member 3121 and the second Y-axis driving member may be linear driving mechanisms such as an air cylinder, an electric screw, a conveyor belt mechanism or a linear motor module, the third suction member 311 may be a suction cup or a suction nozzle, and the steering driving member 3123 may be a motor or a rotary air cylinder.

As shown in fig. 5, 6 and 8, in one embodiment, the carrying mechanism 320 includes a first carrying assembly 321 and a tray carrying assembly, the first carrying assembly 321 includes a first supporting member 3211 for carrying the tray 20 and a first lifting driving member 3212 in driving connection with the first supporting member 3211, the first lifting driving member 3212 is used for driving the first supporting member 3211 to move so as to move the tray 20 on the first supporting member 3211 to the tray transfer position 18, the tray 20 carrying mechanism is used for taking the tray 20 located at the tray transfer position 18 and moving the tray 20 to the tray receiving position 19, and the discharging mechanism 310 is used for placing the liquid crystal film on the tray 20 located at the tray receiving position 19 at the discharging position 17. The first supporting member 3211 is configured to support an empty pallet stack 20, and after the pallet 20 located at the pallet transfer position 18 is transferred to the pallet receiving position 19 by the pallet transferring module, the first lifting driving member 3212 can drive the next empty pallet stack 20 to move to the pallet transfer position 18, so that the pallet 20 transferring module can again obtain the pallet stack 20 located at the pallet transfer position 18.

As shown in fig. 5 and 6, specifically, the tray transporting assembly includes a first tray transporting assembly 322 and an adapting platform 323, the first tray transporting assembly 322 includes a fourth absorbing member and a fourth driving member in driving connection with the fourth absorbing member, the fourth absorbing member is disposed opposite to the first supporting member 3211, the fourth driving member is configured to drive the fourth absorbing member to approach or depart from the first supporting member 3211, the adapting platform 323 includes a loading platform 3231 and a loading platform driving member 3232 in driving connection with the loading platform 3231, and the loading platform driving member 3232 is configured to drive the loading platform 3231 to move to and fro between a position opposite to the fourth absorbing member and a position opposite to the blanking mechanism 310 at the blanking position 17.

More specifically, the carrier driving element 3232 is used for driving the carrier 3231 to move along the Y-axis direction, and the blanking mechanism 310 and the first tray transporting assembly 322 are arranged at intervals along the Y-axis; the first carrying assembly 321 is disposed below the first tray carrying assembly 322, the first lifting driving element 3212 is configured to drive the first carrying element 3211 to move along the Z-axis direction, and the fourth driving element is configured to drive the fourth absorbing element to move along the Z-axis direction. When the tray 20 moves to the tray transfer position 18, the fourth driving part drives the fourth suction part to move toward the first supporting part 3211, so that the fourth suction part contacts the tray 20 located at the tray transfer position 18, so that the fourth suction part sucks the tray 20; then, the fourth driving element drives the fourth absorbing element to move away from the first supporting element 3211, the carrier table 3231 moves to a position opposite to the fourth absorbing element under the driving of the carrier table driving element 3232, the fourth absorbing element transfers the tray 20 to the carrier table 3231, and then the carrier table 3231 moves to a position opposite to the unloading mechanism 310 at the unloading position 17, so that the unloading mechanism 310 can place the flip chip film on the tray 20.

Optionally, the first lifting driving element 3212, the fourth driving element and the plummer driving element 3232 may be linear driving mechanisms such as an air cylinder, an electric screw, a conveyor belt mechanism or a linear motor module, the fourth adsorbing element may be a suction cup or a suction nozzle, and the first supporting element 3211 may be a supporting platform.

Further, the carrying mechanism 320 further includes a second carrying assembly 324, the second carrying assembly 324 is juxtaposed with the first carrying assembly 321, and the tray 20 carrying mechanism is further configured to move the tray 20 located at the tray receiving position 19 onto the second carrying assembly 324. The second carrying assembly 324 is used for carrying the tray 20 filled with the material, and when the tray 20 located at the tray receiving position 19 is filled with the flip chip, the tray 20 handling mechanism can move the tray 20 onto the second carrying assembly 324, so that a new tray 20 can be moved to the tray receiving position 19 for further receiving the material.

Specifically, the second bearing assembly 324 includes a second bearing member, and a second lifting driving member in driving connection with the second bearing member, the tray 20 carrying mechanism further includes a second tray carrying assembly 325, the second tray carrying assembly 325 includes a fifth suction member 3251 arranged opposite to the second bearing member, and a fifth driving member 3252 in driving connection with the fifth suction member 3251, the fifth driving member 3252 is used for driving the fifth suction member 3251 to approach or leave the second bearing member, and the bearing table driving member 3232 is further used for driving the bearing table 3231 to move to and fro between a position opposite to the blanking mechanism 310 located at the blanking position 17 and a position opposite to the fifth suction member 3251.

More specifically, the first carrying assembly 321 and the second carrying assembly 324 are arranged in parallel along the Y-axis direction, the second carrying assembly 324 is arranged below the second tray handling assembly 325, the second lifting driving element is used for driving the second carrying element to move along the Z-axis direction, and the fifth driving element 3252 is used for driving the fifth suction element 3251 to move along the Z-axis direction. When the tray 20 at the tray receiving position 19 is filled with the flip chip, the stage driving member 3232 drives the stage 3231 to move from a position opposite to the feeding mechanism 310 at the feeding position 17 to a position opposite to the fifth suction member 3251; then, the fifth driving member 3252 drives the fifth suction member 3251 to move in a direction approaching the carrier stage 3231, so that the fifth suction member 3251 contacts the tray 20, and the fifth suction member 3251 sucks the tray 20; then, the carrier table driving unit 3232 drives the carrier table 3231 to move from the position opposite to the fifth suction unit 3251 to the position opposite to the fourth suction unit, and waits for the carrier table 3231 to receive a new tray 20, at this time, the fifth driving unit 3252 may drive the fifth suction unit 3251 to move toward the second support unit, and place the full tray 20 on the second support unit.

Optionally, the second lifting driving element and the fifth driving element 3252 may be linear driving mechanisms such as an air cylinder, an electric screw, a conveyor belt mechanism or a linear motor module, the fifth absorbing element 3251 may be a suction cup or a suction nozzle, and the second supporting element may be a supporting platform.

Specifically, in the present embodiment, the structures of the first carrier assembly and the second carrier assembly are the same, and one of the structures of the first tray handling assembly and the second tray handling assembly is the same.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. A die cutting device, comprising:

a machine base;

the punching module is arranged on the base and comprises a punching mechanism and a material handling mechanism, the material handling mechanism is used for obtaining materials obtained after punching by the punching mechanism at a material taking position, and the material handling mechanism is also used for driving the materials to move to a transfer position; and

the unloading module, set up in on the frame, the unloading module includes unloading mechanism and bearing mechanism, bearing mechanism is used for bearing the tray, unloading mechanism is used for receiving the material position and gains to be located the handing-over position material in the material handling mechanism, just unloading mechanism still is used for taking the material removes unloading position and is in the unloading position the material will be placed on the tray.

2. The apparatus of claim 1, wherein the die cutting module further comprises a cleaning mechanism, the material handling mechanism comprises a first handling assembly and a second handling assembly, the first handling assembly is movably disposed on the base and can move to and from the material taking position and the cleaning transfer position, the second handling assembly is movably disposed on the base and can move to and from the cleaning material receiving position and the cleaning position, the second handling assembly is configured to take the material on the first handling assembly located in the cleaning transfer position at the cleaning material receiving position, and the cleaning mechanism is configured to clean the material on the second handling assembly located in the cleaning position.

3. The die-cutting device according to claim 2, wherein the first handling assembly comprises a first suction attachment for sucking the material, and a first driving member in driving connection with the first suction attachment, the first driving member being configured to drive the first suction attachment to move to and from the pick-up position and the clean hand-over position.

4. The die-cutting device according to claim 2 or 3, wherein the second carrying assembly includes a second adsorption member for adsorbing the material, and a second driving member in driving connection with the second adsorption member, and the second driving member is configured to drive the second adsorption member to move so that the second adsorption member sequentially moves from the clean material receiving position to the clean position and the transfer position or sequentially moves from the transfer position to the clean position and the clean material receiving position.

5. The trimming apparatus according to claim 4, wherein the cleaning mechanism includes a roller brush and a rotary driving member drivingly connected to the roller brush, the roller brush being disposed opposite the second suction member in the cleaning position.

6. The punching device according to claim 1, wherein the blanking mechanism includes a third suction member and a third driving member drivingly connected to the third suction member, and the third driving member is configured to drive the third suction member to move to and from the receiving position and the blanking position.

7. The die-cutting device according to claim 1, wherein the carrying mechanism comprises a first carrying assembly and a tray handling assembly, the first carrying assembly comprises a first carrying member for carrying the tray and a first lifting driving member in driving connection with the first carrying member, the first lifting driving member is used for driving the first carrying member to move so that the tray on the first carrying member moves to a tray transfer position, the tray handling mechanism is used for taking the tray at the tray transfer position and moving the tray to a tray receiving position, and the blanking mechanism is used for placing the material on the tray at the tray receiving position.

8. The die-cut device of claim 7, wherein the tray handling assembly comprises a first tray handling assembly and a transfer platform, the first tray handling assembly comprises a fourth adsorption member and a fourth driving member in driving connection with the fourth adsorption member, the fourth adsorption member is arranged opposite to the first supporting member, the fourth driving member is used for driving the fourth adsorption member to approach or keep away from the first supporting member, the transfer platform comprises a bearing table and a bearing table driving member in driving connection with the bearing table, the bearing table driving member is used for driving the bearing table to move from a position opposite to the fourth adsorption member to a position opposite to the blanking mechanism located at the blanking position, or the bearing table driving member is used for driving the bearing table to move from a position opposite to the blanking mechanism located at the blanking position to a position opposite to the fourth adsorption member Relative position.

9. The apparatus of claim 8, wherein the carrier mechanism further includes a second carrier assembly juxtaposed with the first carrier assembly, the tray handling mechanism further being adapted to move the tray at the tray receiving location onto the second carrier assembly.

10. The apparatus of claim 9, wherein the second carrier assembly includes a second support member and a second lift drive member drivingly connected to the second support member, the tray carrying mechanism also comprises a second tray carrying assembly, the second tray carrying assembly comprises a fifth adsorption piece arranged opposite to the second bearing piece and a fifth driving piece in driving connection with the fifth adsorption piece, the fifth driving element is used for driving the fifth adsorption element to be close to or far away from the second supporting element, the bearing platform driving part is also used for driving the bearing platform to move from a position opposite to the blanking mechanism at the blanking position to a position opposite to the fifth adsorption part, or the plummer driving piece is also used for driving the plummer to move from the position opposite to the fifth adsorption piece to the position opposite to the blanking mechanism at the blanking position.

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