CN211019730U

CN211019730U - PTN equipment

Info

Publication number: CN211019730U
Application number: CN201921473711.5U
Authority: CN
Inventors: 唐旭锟; 张凯翔; 王建平; 梅永洪
Original assignee: Hangzhou Chenxiao Technology Co ltd
Current assignee: Hangzhou Chenxiao Technology Co ltd
Priority date: 2019-09-05
Filing date: 2019-09-05
Publication date: 2020-07-14
Anticipated expiration: 2029-09-05

Abstract

The utility model provides a PTN equipment, including the frame that has the heat-sinking capability and set up the circuit board in the frame, still be provided with the radiator in the frame, the radiator includes the heat transfer body, and one side and the frame contact of heat transfer body, the opposite side and the circuit board contact of heat transfer body. According to the scheme, the heat conductor is used for conducting heat conduction, the machine frame is used for transferring heat energy to the outside, specifically, the heat energy generated by the circuit board is transferred to the machine frame through the heat conductor and then transferred to the outside through the machine frame, so that the heat dissipation of the PTN equipment is realized, a heat dissipation fan is not required to be arranged in the machine frame, the size of the PTN equipment is reduced, and the application range of the PTN equipment is widened.

Description

PTN equipment

Technical Field

The disclosure relates to the technical field of communication, in particular to a PTN device.

Background

The PTN (Packet Transport Network) equipment is a communication equipment, is used for an access layer and a convergence layer to replace an optical transmission equipment of an SDH (Synchronous Digital Hierarchy), has the function of transmitting voice service and data service in a fixed Network and a mobile return, and has the biggest characteristic of making up the rigidity defect of an SDH time slot circuit by realizing a statistical multiplexing function.

The PTN equipment in the prior art mainly carries out forced heat dissipation through a cooling fan so as to improve the heat dissipation capacity of the PTN equipment and prolong the service life of the PTN equipment. However, the PTN device is excessively large in size due to the additional arrangement of the heat dissipation fan in the PTN device, and is limited in application scenarios.

SUMMERY OF THE UTILITY MODEL

The present disclosure is directed to overcoming the drawbacks of the prior art and providing a PTN device for reducing the size and widening the range of applications of the PTN device.

The utility model provides a PTN equipment, includes the frame that has the heat-sinking capability and sets up the circuit board in the frame, the circuit board include the mother board and with the daughter board of mother board communication, the mother board with connect through the connector that has data transmission ability between the daughter board still be provided with in the frame with the heat energy conduction that the circuit board produced extremely the radiator of frame, the radiator includes heat conductor, one side of heat conductor with the circuit board contact, heat conductor's opposite side with the frame contact the frame is kept away from one side of heat conductor still is provided with the improvement the heat radiation structure of frame radiating efficiency.

Preferably, the heat radiation structure is arranged on the machine frame to increase the contact area between the machine frame and air.

The setting of pit has increased the area of contact of frame with the air, and then has improved the radiating efficiency of frame.

Preferably, heat radiation structure is including offering in increase on the frame with air area of contact's pit with set up in increase on the frame with air area of contact's bump, the bump with frame formula structure as an organic whole.

The contact area of frame and air has further been increased in the setting of bump to, the setting of bump has still improved the intensity of frame, has optimized the performance of PTN equipment.

Preferably, the shape of the convex point is a hemisphere, and a recess for increasing the contact area between the convex point and the air is arranged on the convex point.

The heat dispersion of frame has further been optimized to sunken setting, and then optimizes the performance of PTN equipment.

Preferably, the heat transfer body include with the base member of frame contact and with the branch structure of the even contact of circuit board, the base member with branch structure formula as an organic whole, and, be provided with the increase on the branch structure and circuit board area of contact's contact, the contact with branch structure formula as an organic whole.

The branch structure enables the heat conductor to be uniformly contacted with the circuit board, the heat conduction performance of the heat conductor is optimized, the local over-high temperature of the circuit board is avoided, and the stability of the PTN equipment is improved.

Preferably, a heat dissipation fin is arranged on the contact body, the heat dissipation fin is positioned on one side, far away from the circuit board, of the contact body, and the heat dissipation fin and the contact body are of an integrated structure.

The heat can be dissipated to other parts by the arrangement of the radiating fins, the damage of the circuit board due to overhigh temperature is prevented, and the service life of the PTN equipment is prolonged.

Preferably, the connector is fixed on the motherboard, the motherboard is fixed on the frame through screws, and at least three screws are arranged on the motherboard around the connector.

At least three screws are arranged around the connector, the daughter board and the motherboard are convenient to assemble or disassemble, and the assembling performance of the PTN device is optimized.

Preferably, L ED lamps and a power supply are further arranged on the motherboard, and the L ED lamps, the motherboard and the daughter board are all powered by the power supply.

The L ED lamp mainly serves an indicating function, optimizing the performance of the PTN device.

Preferably, the circuit board is further provided with a data interface, and the machine frame is provided with a connecting port which enables the data interface to be communicated with the outside.

The data interface is arranged, so that the PTN equipment can exchange data with other equipment conveniently, and the performance of the PTN equipment is optimized.

Preferably, be provided with the dust ring that has elastic deformation ability in the connector, the dust ring is located data interface with between the connector, and, the dust ring bond in on the frame.

The dust ring can be prevented from entering the PTN equipment, the working environment of the mother board and the daughter board is optimized, and the service life of the PTN equipment is prolonged.

The beneficial effect of this disclosure relative prior art:

1. the heat conductor and the machine frame are utilized to carry out physical heat dissipation on the circuit board, a heat dissipation fan does not need to be arranged in the machine frame, the size of the PTN equipment is reduced, and the application environment of the PTN equipment is widened.

2. The heat conductor and the machine frame are adopted for heat dissipation, the radiator does not need to be overhauled, and the PTN equipment is easy to maintain.

3. The heat radiation structure improves the heat radiation efficiency of the machine frame and optimizes the heat radiation performance of the machine frame.

Drawings

The following figures list only a few possible embodiments, not all of the figures of the present disclosure, and other figures may be derived by those skilled in the art from the technical solutions of the present disclosure.

Fig. 1 is a schematic diagram of a PTN device.

Fig. 2 is a cross-sectional view of one configuration of the PTN device.

FIG. 3 is a schematic diagram of a heat conductor structure.

Fig. 4 is a schematic structural diagram of a bump.

Detailed Description

The present disclosure is further described below in conjunction with the appended figures.

As shown in fig. 1 and 2, a PTN equipment, including frame 1 that has the heat-sinking capability and the circuit board 2 that sets up in frame 1, circuit board 2 include mother board 3 and with the daughter board 4 of mother board 3 communication, mother board 3 with connect through connector 5 that has data transmission ability between the daughter board 4 still be provided with in frame 1 with the heat energy conduction that circuit board 2 produced extremely the radiator of frame 1, the radiator includes heat conductor 6, one side of heat conductor 6 with circuit board 2 contacts, the opposite side of heat conductor 6 with frame 1 contacts frame 1 keeps away from frame 1 one side of heat conductor 6 still is provided with the improvement frame 1 radiating efficiency's heat radiation structure 7.

According to the technical scheme, the heat conductor 6 and the machine frame 1 are utilized to dissipate heat of the PTN equipment, a heat dissipation fan does not need to be arranged inside the equipment, the size of the PTN equipment is reduced, and the application range of the PTN equipment is widened.

Moreover, the machine frame 1 and the heat conductor 6 do not comprise movable parts, namely, the machine frame 1 and the heat conductor 6 realize heat dissipation by utilizing the structure and the shape of the machine frame 1 and the heat conductor 6, so that the machine frame 1 and the heat conductor 6 do not need to be overhauled in the actual working process, and the PTN equipment is easy to maintain.

For example, the heat generated by the circuit board 2 is absorbed by the thermal conductor 6, and after the heat is absorbed by the thermal conductor 6, the thermal conductor 6 transfers the heat to the frame 1, and the frame 1 transfers the heat to the outside, for example, the frame 1 transfers the heat to the air, so as to dissipate the heat of the circuit board 2.

This scheme has the advantage that stability is good, need not maintain heat conductor 6 and frame 1 in the heat dissipation process, has optimized the performance of PTN equipment greatly.

In some possible embodiments, the heat dissipation structure 7 is a pit opened on the frame 1 to increase the contact area between the frame 1 and air.

The shape of the pit is not limited, and can be freely selected by a person skilled in the art, and the main function of the pit is to increase the contact area between the machine frame 1 and air, so that good heat dissipation performance is achieved.

The depth of the pit should not affect the strength of the frame 1, and optionally, the depth of the pit should not be greater than 1/3 of the thickness of the frame 1, so as to avoid greatly reducing the strength of the frame 1 due to the pit.

As shown in fig. 1 and 2, in some possible embodiments, the heat dissipation structure 7 includes a pit arranged on the frame 1 to increase the contact area between the frame 1 and air and a bump 8 arranged on the frame 1 to increase the contact area between the frame 1 and air, the bump 8 and the frame 1 being of an integral structure.

The provision of the raised points 8 on the frame 1 improves the strength of the frame 1, while the depth of the pits should not be greater than 1/3 of the thickness of the frame 1 to avoid breakage or other damage to the frame 1.

As shown in fig. 4, in some preferred embodiments of the present invention, the shape of the bump 8 is a hemisphere, and a recess 9 for increasing the contact area between the bump 8 and the air is provided in the bump 8.

The depth and shape of the recess 9 are not particularly limited and can be freely selected by those skilled in the art. The arrangement of the recess 9 is to increase the contact area of the frame 1 and the air so as to improve the heat dissipation efficiency of the frame 1.

As shown in fig. 3, in some possible embodiments, the heat conductor 6 includes a base 10 contacting the frame 1 and a branch structure 11 uniformly contacting the circuit board 2, the base 10 is integrated with the branch structure 11, and the branch structure 11 is provided with a contact 12 for increasing a contact area between the branch structure 11 and the circuit board 2, and the contact 12 is integrated with the branch structure 11.

The branch structure 11 is a structure that is divided from the base 10, and the cross-sectional area of the branch structure 11 has no size relationship with the cross-sectional area of the base 10, and the branch structure 11 may be curved, so that the branch structure 11 may uniformly contact the circuit board 2, that is, the branch structure 11 should uniformly contact the motherboard 3 and the daughter board 4, so as to implement a conductive function, and avoid an excessive local temperature of the motherboard 3 or/and the daughter board 4.

In order to optimize the heat transfer capability of the heat conductor 6, the branch structure 11 and the base body 10 are preferably of a one-piece construction, and it is obvious that the branch structure 11 and the base body 10 can also be arranged by welding.

As shown in fig. 3, in some possible embodiments, a heat dissipation fin 13 is disposed on the contact 12, the heat dissipation fin 13 is located on a side of the contact 12 away from the circuit board 2, and the heat dissipation fin 13 and the contact 12 are of a unitary structure. The heat dissipation fins 13 are mainly used to improve the heat dissipation efficiency, so that the heat generated on the circuit board 2 is dissipated in time, and the heat is prevented from being concentrated on a certain area on the circuit board 2, thereby preventing the circuit board 2 from being damaged.

In some possible embodiments, the connector 5 is fixed to the motherboard 3, the motherboard 3 is fixed to the frame 1 by screws, and at least three screws are provided on the motherboard 3 around the connector 5.

The connector 5 is of conventional construction in the prior art and is commercially available and will not be described in detail. At least three screws are arranged around the connector 5, and the connector 5 and the motherboard 3 are stressed uniformly in the process of assembling or disassembling the daughter board 4 and the motherboard 3, so that the service life of the motherboard 3 is prolonged.

In some possible embodiments, L ED lights and power supplies are also provided on the motherboard 3, and the L ED lights, motherboard 3 and daughter board 4 are all powered by the power supplies.

As shown in fig. 1, the circuit board 2 is further provided with a data interface 14, and the machine frame 1 is provided with a connection port for connecting the data interface 14 to the outside.

Be provided with the dust ring 15 that has elastic deformation ability in the connector, dust ring 15 is located data interface 14 with between the connector, and, dust ring 15 bond in on the frame 1.

The dust ring 15 may be made of rubber material. The data interface 14 and power supply are conventional in the art and are readily available commercially and will not be described in detail herein.

The inclusion in the present disclosure means that the PTN device may contain other features in addition to the above, exemplary: the PNT device also comprises at least two RJ45 interfaces, wherein one RJ45 interface is connected to the motherboard 3FPGA chip through a PYH chip and is used for management and debugging.

And another RJ45 interface for connecting an external clock to the motherboard 3.

The PTN device may further include an SFP interface, the RJ45 interface is used for two paths of E1 signals and two paths of GE electrical signals, the SFP interface is used for one path of GE optical signals, the circuit board 2 includes a L IU chip, and the E1 signals are interacted with the switching chip through one path of Serdes signals after being subjected to signal processing by a L IU chip.

The GE electric signal passes through an SGMII channel and passes through an PYH chip to realize interaction with a switching chip; the GE optical signal, after passing through the connector 5, interacts directly with the switch chip through a route of Serdes.

The power supply system can adopt AC and DC power supply modes, when DC power supply is carried out, a 36-60V power supply is input, and after a series of protection measures such as lightning protection, filtering and buffering, the DC-DC circuit is converted into a 12V low-voltage power supply to be supplied to equipment for use.

When AC power is supplied, an AC-DC power supply module is directly adopted, AC power is input to the module and is directly converted into 12V DC power through the module to be supplied to equipment for use.

The related chips and interfaces are conventional structures in the prior art, and can be conveniently obtained by purchase, and are not described in detail herein.

While several embodiments of the disclosed technology have been illustrated and described, it will be apparent that the embodiments described above are merely some, and not all, of the disclosed technology and that other embodiments, which can be derived from the disclosed technology by those skilled in the art without inventive step, fall within the scope of the present disclosure.

Claims

1. A PTN device characterized by: including frame (1) that has heat-sinking capability and circuit board (2) that sets up in frame (1), circuit board (2) including mother board (3) and with daughter board (4) of mother board (3) communication, mother board (3) with connect through connector (5) that have data transmission ability between daughter board (4) still be provided with in frame (1) with the heat energy conduction that circuit board (2) produced extremely the radiator of frame (1), the radiator includes heat conductor (6), one side of heat conductor (6) with circuit board (2) contact, the opposite side of heat conductor (6) with frame (1) contact frame (1) is kept away from frame (1) one side of heat conductor (6) still is provided with the improvement frame (1) radiating efficiency's heat radiation structure (7).

2. PTN device according to claim 1, characterized in that: the heat dissipation structure (7) is arranged on the machine frame (1) and increases the pits between the machine frame (1) and the air contact area.

3. PTN device according to claim 1, characterized in that: heat radiation structure (7) are including offering in increase on frame (1) and air area of contact's pit with set up in increase on frame (1) and air area of contact's bump (8), bump (8) with frame (1) formula structure as an organic whole.

4. PTN device according to claim 3, characterized in that: the shape of the salient point (8) is hemispherical, and a recess (9) for increasing the contact area of the salient point (8) and air is arranged on the salient point (8).

5. PTN device according to claim 1, characterized in that: heat transmission body (6) include with base member (10) of frame (1) contact and with branch structure (11) of circuit board (2) even contact, base member (10) with branch structure (11) formula as an organic whole, and, be provided with the increase on branch structure (11) and circuit board (2) area of contact's contact (12), contact (12) with branch structure (11) formula structure as an organic whole.

6. PTN device according to claim 5, characterized in that: be provided with radiating fin (13) on contact (12), radiating fin (13) are located keep away from on contact (12) one side of circuit board (2), radiating fin (13) with contact (12) formula structure as an organic whole.

7. PTN device according to claim 1, characterized in that: connector (5) are fixed in on motherboard (3), motherboard (3) are fixed in through the screw on frame (1), on motherboard (3) be provided with three screw around connector (5) at least.

8. PTN device according to claim 1, characterised in that L ED lights and a power supply are further provided on said motherboard (3), said L ED lights, motherboard (3) and daughterboard (4) being powered by said power supply.

9. PTN device according to claim 1, characterized in that: the circuit board (2) is also provided with a data interface (14), and the machine frame (1) is provided with a connecting port which enables the data interface (14) to be communicated with the outside.

10. PTN device according to claim 9, characterized in that: be provided with dust ring (15) that have elastic deformation ability in the connector, dust ring (15) are located data interface (14) with between the connector, and, dust ring (15) bond in on frame (1).