CN211240598U

CN211240598U - Display screen controller

Info

Publication number: CN211240598U
Application number: CN201922230892.5U
Authority: CN
Inventors: 刘钊; 韦桂锋
Original assignee: Xian Novastar Electronic Technology Co Ltd
Current assignee: Xian Novastar Electronic Technology Co Ltd
Priority date: 2019-12-12
Filing date: 2019-12-12
Publication date: 2020-08-11
Anticipated expiration: 2029-12-12

Abstract

The embodiment of the utility model provides a display screen controller is related to, for example include: a heat-dissipating substrate; the system control card comprises a first circuit board, a main processing chip and a first connector, wherein the main processing chip is arranged on the first circuit board, and the first connector is arranged at one end of the first circuit board and is electrically connected with the main processing chip; and the display control card comprises a second circuit board, an image processing chip, a second connector and an image signal output interface, wherein the second connector is electrically connected with the image processing chip, and the second connector is arranged at one end of the second circuit board. The system control card and the display control card are fixedly inserted into the second connector through the first connector and electrically connected, and the first circuit board and the second circuit board are fixed on one side of the heat dissipation substrate side by side. The embodiment provides a new heat dissipation mode and can reduce the overall height of the display screen controller.

Description

Display screen controller

Technical Field

The utility model relates to a show technical field, especially relate to a display screen controller.

Background

As a new display technology, the LED (Light Emitting Diode) display technology has been gradually accepted by the market due to its advantages of energy saving, environmental protection, high brightness, etc., and thus is widely used in various fields such as urban media and urban traffic. In recent years, with the development of LED display technology and the demand of the market, large-screen LED conference screens have been gradually put into the market.

At present, most of display screen controllers in LED conference screens are cooled by air through a fan or a cooling fin. However, the fan can cause noise, and the addition of the fan or heat sink increases the overall height of the display screen controller.

SUMMERY OF THE UTILITY MODEL

Therefore, to overcome at least some of the disadvantages and drawbacks of the prior art, an embodiment of the present invention provides a display screen controller.

On the one hand, the embodiment of the utility model provides a display screen controller, include: a heat-dissipating substrate; the system control card comprises a first circuit board, a main processing chip for installing an embedded operating system and a first connector, wherein the main processing chip is arranged on the first circuit board, and the first connector is arranged at one end of the first circuit board and is electrically connected with the main processing chip; and the display control card comprises a second circuit board, an image processing chip, a second connector and at least one image signal output interface, wherein the image processing chip is arranged on the second circuit board, the second connector is arranged at one end of the second circuit board and is electrically connected with the image processing chip, and the at least one image signal output interface is arranged on the second circuit board and is electrically connected with the image processing chip. The system control card and the display control card are fixedly inserted and connected through the first connector and the second connector to form electric connection, and the first circuit board and the second circuit board are fixed on one side of the heat dissipation substrate side by side.

The display screen controller of this embodiment adopts the integral type heat dissipation design, will the first circuit board of system control card with the second circuit board of display control card is fixed side by side on the heat dissipation base plate in order to utilize the heat dissipation base plate dispels the heat to system control card and display control card, consequently can not need to install fan or fin additional and dispel the heat to can reduce the whole height of display screen controller.

In an embodiment of the present invention, the main processing chip is located at a position where the first circuit board is adjacent to one side of the heat dissipation substrate and thermally connected to the heat dissipation substrate, and the image processing chip is located at a position where the second circuit board is adjacent to one side of the heat dissipation substrate and thermally connected to the heat dissipation substrate.

In an embodiment of the present invention, the heat dissipation substrate is an elongated aluminum plate, and the first circuit board and the second circuit board are fixed side by side along a length direction of the elongated aluminum plate in a threaded coupling manner on one side of the heat dissipation substrate.

In an embodiment of the present invention, the system control card further includes a plurality of video input interfaces and at least one communication interface disposed on the first circuit board, the plurality of video input interfaces and the at least one communication interface are electrically connected to the main processing chip respectively, and the at least one communication interface is selected from one or more of a USB interface and an ethernet interface.

In an embodiment of the present invention, the at least one communication interface includes the ethernet interface, the system control card further includes a local area network switching chip disposed on the first circuit board, and the local area network switching chip is electrically connected between the main processing chip and the ethernet interface; the display control card further comprises a microcontroller and an Ethernet PHY chip which are arranged on the second circuit board, the microcontroller is electrically connected with the image processing chip, and the microcontroller is further electrically connected with the local area network switching chip through the Ethernet PHY chip, the second connector and the first connector in sequence.

In an embodiment of the present invention, the system control card further includes at least one daughter board interface disposed on the first circuit board, and the at least one daughter board interface is selected from one or more of a key and remote control daughter board interface, a relay daughter board interface, and a USB daughter board interface.

In an embodiment of the present invention, the system control card further includes a power module disposed on the first circuit board, the power module is electrically connected to the main processing chip and electrically connected to the image processing chip and the power signal pin of each of the image signal output interfaces through the first connector and the second connector; and each image signal output interface is electrically connected with the image processing chip through a SerDes bus, and the SerDes bus comprises data transmission differential signal lines arranged in pairs and data reception differential signal lines arranged in pairs.

In an embodiment of the present invention, the image processing chip is a programmable logic device, the display control card further includes a microcontroller disposed on the second circuit board, and the microcontroller is electrically connected to the programmable logic device and further electrically connected to each of the image signal output interfaces through a multi-line serial communication bus.

In an embodiment of the present invention, each of the image signal output interfaces is a microssb 3.0 interface.

In an embodiment of the present invention, the multi-line serial communication bus is an MDIO bus, the display control card further includes a USB interface disposed on the second circuit board and electrically connected to the microcontroller.

In view of the above, the above technical features of the present invention can have one or more of the following advantages: the display screen controller of the embodiment adopts an integrated heat dissipation design, and the first circuit board of the system control card and the second circuit board of the display control card are fixed on the heat dissipation substrate side by side so as to dissipate heat of the system control card and the display control card by using the heat dissipation substrate, so that a fan or a heat dissipation fin does not need to be additionally arranged for heat dissipation, the overall height of the display screen controller can be reduced, and the overall rigidity can be improved; furthermore, the primary heat generating devices such as the main processing chip and the image processing chip are designed on the back side to form a thermal connection with the heat dissipating substrate, which is beneficial to improving the efficiency of heat conduction to the external environment.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a display screen controller according to an embodiment of the present invention.

Fig. 2 is a schematic circuit diagram of a system control card and a display control card of the display screen controller shown in fig. 1.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

[ first embodiment ] A method for manufacturing a semiconductor device

Referring to fig. 1 and fig. 2, a display screen controller 10 according to an embodiment of the present invention includes: heat dissipation substrate 11, system control card 13 and display control card 15.

The system control card 13 includes a first circuit board 130, a main processing chip 131 for installing an embedded operating system, and a first connector CON 1. The main processing chip 131 is disposed on the first circuit board 130, and the first connector CON1 is disposed at one end of the first circuit board 130 and electrically connected to the main processing chip 131. The embedded os is, for example, an Android os and is, for example, pre-installed in the main processing chip 131, and the main processing chip 131 is, for example, a tv chip MSD6a938 of a tv chip manufacturer Mstar, a tv chip S905 of Amlogic corporation, or a tv chip manufactured by another tv manufacturer, which has an audio/video decoding function and is capable of installing the embedded os.

The display control card 15 includes a second circuit board 150, an image processing chip 151, a second connector CON2, and at least one (two are shown in fig. 1 and 2 as examples) image signal output interface 154. The image processing chip 151 is disposed on the second circuit board 150, the second connector CON2 is disposed at one end of the second circuit board 150 and electrically connected to the image processing chip 151, and the at least one image signal output interface 154 is disposed on the second circuit board 150 and electrically connected to the image processing chip 151. The image signal output interface 154 is, for example, a microssb 3.0 interface including a plurality of pairs of differential signal pins electrically connected to the image processing chip 151 via a SerDes bus, which includes, for example, data transmission differential signal lines arranged in pairs and data reception differential signal lines arranged in pairs.

In the above, the system control card 13 and the display control card 15 are inserted and fixed to and electrically connected to the second connector CON2 through the first connector CON1, and the first circuit board 130 and the second circuit board 150 are fixed to one side of the heat dissipation substrate 11 side by side. In this embodiment, the first connector CON1 is, for example, a male connector, and the second connector CON2 is, for example, a female connector, which together constitute the connector assembly CON shown in FIG. 2; and vice versa.

As can be seen from the above, the display screen controller 10 of this embodiment adopts an integrated heat dissipation design, and the first circuit board 130 of the system control card 13 and the second circuit board 150 of the display control card 15 are fixed side by side on the heat dissipation substrate 11 to dissipate heat of the system control card 13 and the display control card 15 by using the heat dissipation substrate 11, so that a fan or a heat sink does not need to be additionally installed to dissipate heat, and the overall height of the display screen controller 10 can be reduced and the overall rigidity can be improved. It should be noted here that the number of the image signal output interfaces 154 on the display control card 15 is not limited to two shown in fig. 1 and 2, and may be more than two, and certainly is not excluded from being one.

Referring to fig. 1 and fig. 2 again, the heat dissipation substrate 11 is, for example, an elongated aluminum plate, and the first circuit board 130 and the second circuit board 150 are fixed side by side on one side of the elongated aluminum plate along the length direction of the elongated aluminum plate in a threaded coupling manner; the arrangement of the strip-shaped aluminum plate is beneficial to increasing the whole heat dissipation area. In addition, as a preferred embodiment, the main processing chip 131 is located on one side of the first circuit board 130 adjacent to the elongated aluminum plate and is thermally connected to the elongated aluminum plate, for example, by a thermal paste or a thermal pad; the image processing chip 151 is located on one side of the second circuit board 150 adjacent to the elongated aluminum plate and is thermally connected to the elongated aluminum plate, for example, by a thermal paste or a thermal pad. In the present embodiment, the main heat generating devices such as the main processing chip 131 and the image processing chip 151 are designed on the back surface to form thermal connection with the heat dissipating substrate 11, which is beneficial to improve the efficiency of heat conduction to the external environment.

As shown in fig. 2, the system control card 13 further includes, for example, a plurality of video input interfaces 132 and at least one communication interface disposed on the first circuit board 130, the plurality of video input interfaces 132 and the at least one communication interface are respectively electrically connected to the main processing chip 131, and the at least one communication interface is selected from one or more of a USB interface 133 and an ethernet interface 134. For example, the video input interfaces 132 are HDMI1.4 video interfaces, the USB interface 133 is a USB2.0 or USB3.0 interface, and the ethernet interface 134 is a gigabit ethernet interface. The arrangement of the plurality of video input interfaces 132 of the present embodiment is beneficial to providing a plurality of video sources to the system control card 13, and the arrangement of the at least one communication interface is convenient for data interaction between external devices and the main processing chip 131.

Furthermore, the system control card 13 further includes, for example, a local area network switching chip 138 disposed on the first circuit board 130, and the local area network switching chip 138 is electrically connected between the main processing chip 131 and the ethernet interface 134; the display control card 15 further comprises, for example, a microcontroller 152, an ethernet PHY chip 153 and a USB interface 155, which are disposed on the second circuit board 150, wherein the microcontroller 152 is electrically connected to the image processing chip 151 and the USB interface 155, and the microcontroller 152 is further electrically connected to the local area network switching chip 138 sequentially through the ethernet PHY chip 153, the second connector CON2 and the first connector CON 1. For example, the LAN switch chip 138 employs a TS3L110 chip, the microcontroller 152 employs an STM32 series MCU chip, such as an STM32H750 chip, of the semiconductor corporation, the image processing chip 151 employs a kinetx-7 series FPGA chip, such as an XC7K325T chip, of the Xilinx corporation, and the ethernet PHY chip 153 employs a LAN8720 chip, for example, and the ethernet PHY chip 153 communicates with the LAN switch chip 138 using an MDI (Media Dependent Interface) bus, for example. In this embodiment, due to the configuration of the Local Area Network (LAN) switch chip 138, the single ethernet interface 134 may be used for the wired network connection of the embedded os installed in the main processing chip 131, or the microcontroller 152 of the display control card 15 may be connected to the upper computer software (e.g., NovaLCT software).

In addition, the system control card 13 further includes at least one daughter board interface disposed on the first circuit board 130, and the at least one daughter board interface is selected from one or more of a key and remote control daughter board interface 135, a relay daughter board interface 136, and a USB daughter board interface 137. The key and remote daughter board interface 135 may be used to connect the key and remote daughter board through a cable to implement operations such as volume adjustment, brightness adjustment, power switching, power on and power off. The relay daughter board interface 136 may be used to connect relay daughter boards including multi-relays through cables to facilitate power management. The USB daughter board interface 137 may be used to connect a USB daughter board including a plurality of USB interfaces through a cable, so that a plurality of USB ports may be expanded to facilitate the layout of the USB ports.

In addition, as shown in fig. 2, the display control card 15 further includes a microcontroller 152 disposed on the second circuit board 150, for example, and the microcontroller 152 is electrically connected to the image processing chip 151. Each of the image signal Output interfaces 154 is electrically connected to the microcontroller 152 via a multi-line serial communication bus, for example, an MDIO (Management Data Input/Output) bus. The system control card 13 further comprises, for example, a power module 139 disposed on the first circuit board 130 and electrically connected to the main processing chip 131 and the image processing chip 151 and the at least one image signal output interface 154 via the connector assembly CON (composed of the first connector CON1 and the second connector CON2) to provide a power voltage to power signal pins of the main processing chip 131, the image processing chip 151 and the at least one image signal output interface 154.

It should be understood that the foregoing embodiments are merely exemplary illustrations of the present invention, and the technical solutions of the embodiments can be arbitrarily combined and collocated for use without conflict between technical features and structural contradictions. In addition, it should be noted that the image signal output interface 154 of the foregoing embodiment is not limited to a high-speed data interface including a plurality of pairs of differential signal pins and power signal pins, such as a microssb 3.0 interface, and the image processing chip 151 may be electrically connected to the interface via an RJ45 network port and then via a network transformer and an ethernet PHY chip. Furthermore, the main processing chip 131 may be typically provided with other peripheral circuits such as a volatile memory such as DDR shown in fig. 2 and a non-volatile memory such as EMMC, and the microcontroller 152 may be typically provided with other peripheral circuits such as LED indicator, temperature sensor TEMP and SPI flash memory shown in fig. 2.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. A display screen controller (10), comprising:

a heat dissipation substrate (11);

a system control card (13) comprising a first circuit board (130), a main processing chip (131) for installing an embedded operating system and a first connector (CON1), wherein the main processing chip (131) is arranged on the first circuit board (130), and the first connector (CON1) is arranged at one end of the first circuit board (130) and is electrically connected with the main processing chip (131); and

a display control card (15) comprising a second circuit board (150), an image processing chip (151), a second connector (CON2) and at least one image signal output interface (154), wherein the image processing chip (151) is disposed on the second circuit board (150), the second connector (CON2) is disposed at one end of the second circuit board (150) and electrically connected to the image processing chip (151), and the at least one image signal output interface (154) is disposed on the second circuit board (150) and electrically connected to the image processing chip (151);

the system control card (13) and the display control card (15) are fixedly connected with the second connector (CON2) through the first connector (CON1) in an inserting mode to form electric connection, and the first circuit board (130) and the second circuit board (150) are fixed on one side of the heat dissipation substrate (11) in parallel.

2. The display screen controller (10) of claim 1, wherein the main processing chip (131) is located on a side of the first circuit board (130) adjacent to the heat dissipating substrate (11) and is thermally connected to the heat dissipating substrate (11), and the image processing chip (151) is located on a side of the second circuit board (150) adjacent to the heat dissipating substrate (11) and is thermally connected to the heat dissipating substrate (11).

3. The display screen controller (10) of claim 1, wherein the heat dissipation substrate (11) is an elongated aluminum plate, and the first circuit board (130) and the second circuit board (150) are fastened side by side on one side of the heat dissipation substrate (11) along a length direction of the elongated aluminum plate in a threaded coupling manner.

4. A display screen controller (10) according to any one of claims 1 to 3, wherein the system control card (13) further comprises a plurality of video input interfaces (132) and at least one communication interface disposed on the first circuit board (130), the plurality of video input interfaces (132) and the at least one communication interface are respectively electrically connected to the main processing chip (131), and the at least one communication interface is selected from one or more of a USB interface (133) and an ethernet interface (134).

5. The display screen controller (10) of claim 4, wherein the at least one communication interface comprises the Ethernet interface (134), the system control card (13) further comprises a local area network switch chip (138) disposed on the first circuit board (130), and the local area network switch chip (138) is electrically connected between the main processing chip (131) and the Ethernet interface (134); the display control card (15) further comprises a microcontroller (152) and an Ethernet PHY chip (153) which are arranged on the second circuit board (150), the microcontroller (152) is electrically connected with the image processing chip (151), and the microcontroller (152) is further electrically connected with the local area network switching chip (138) through the Ethernet PHY chip (153), the second connector (CON2) and the first connector (CON1) in sequence.

6. A display screen controller (10) according to any of claims 1 to 3, wherein the system control card (13) further comprises at least one daughter board interface disposed on the first circuit board (130), and the at least one daughter board interface is selected from one or more of a push button and remote control daughter board interface (135), a relay daughter board interface (136) and a USB daughter board interface (137).

7. The display screen controller (10) according to any one of claims 1 to 3, wherein the system control card (13) further comprises a power supply module (139) disposed on the first circuit board (130), the power supply module (139) being electrically connected to the main processing chip (131) and to the image processing chip (151) and the power supply signal pin of each of the image signal output interfaces (154) through the first connector (CON1) and the second connector (CON2) in sequence; and each of the image signal output interfaces (154) is electrically connected to the image processing chip (151) through a SerDes bus, and the SerDes bus includes data transmission differential signal lines arranged in pairs and data reception differential signal lines arranged in pairs.

8. The display screen controller (10) of claim 7, wherein the image processing chip (151) is a programmable logic device, the display control card (15) further comprises a microcontroller (152) disposed on the second circuit board (150), and the microcontroller (152) is electrically connected to the programmable logic device and is also electrically connected to each of the image signal output interfaces (154) via a multi-wire serial communication bus.

9. The display screen controller (10) of claim 7, wherein each of the image signal output interfaces (154) is a microssb 3.0 interface.

10. The display screen controller (10) of claim 8, wherein the multi-wire serial communication bus is an MDIO bus, the display control card (15) further comprising a USB interface (155) disposed on the second circuit board (150) and electrically connected to the microcontroller (152).