TWM467072U - High-frequency connector and optical mold block - Google Patents

Description

High frequency connector and optical module

The present invention provides a high-frequency connector and an optical module, in particular, a combination of a single high-frequency connector and a single photovoltaic module for data transmission, which can effectively save manufacturing costs and improve process yield.

Button, the connector refers to all connected components and their accessories on the electronic signal and power supply. It is a bridge for all signals. Its quality will affect the reliability of current and signal transmission, and also with electronics. System operation is closely related. In the trend of high-speed and miniaturization of electronic products, most of the signal connectors used today are high-speed interfaces, such as: Mini SAS HD, PCI Express, InfiniBand, SerialATA, Serial SCSI, DVI, HDMI, etc. Due to the large increase in communication requirements and data transmission volume, the traditional communication method using coaxial cable as the transmission medium has been insufficient, so the optical fiber has been adopted as the transmission medium, which has also caused the advent of the optical fiber transmission era, among which Mini SAS HD Specifications of the signal connector can be divided into copper connectors, AoC cable connectors (non-removable) and MPO cable connectors (detachable). For example, a signal connector of the conventional Mini SAS HD standard is used as an example. Referring to FIG. 1, an optical connector 10' is shown in the figure, which mainly has a first circuit board 101' and a second circuit. The first circuit board 101' and the second circuit board 102' are respectively provided with a first photoelectric module 1011' and a second photoelectric module 1021', and the first photoelectric module 1011' and The second optoelectronic module 1021' is respectively connected to a fiber optic line 11', 12' (the fiber optic line can be single or multi-core). Moreover, the first circuit board 101' and the second circuit board 102' are respectively formed with a first data transmission port 1012' and a second data transmission port 1022', and the first circuit board 101' and the second circuit board 102' are formed. The group is disposed in a connector 103' to form a complete optical connector 10'. Further, the user can insert the photoelectric connector 10' between the corresponding information transmission devices to transmit data. The first circuit board 101' and the second circuit board 102 of the optoelectronic connector 10' need to be respectively provided with a photoelectric module 1011', 1021'. However, the photovoltaic module and the optical fiber are the main components for transmitting data. Among the components of the optical connector 10', the manufacturing cost accounts for a large proportion, and the manufacturing cost of the entire optical connector 10' is relatively increased. In order to solve the above problems, the industry has developed another "optical connector", as shown in FIG. 2, an optoelectronic connector 10' as shown in the figure, which is mainly from the back end of the first circuit board 101' and The two circuit boards 102' rear end pull out two FPC flexible cables 13', 14' to a single photovoltaic module 1011' for data transmission. However, when the amount of data transmission increases significantly, the transmission speed of the FPC flexible cable 13', 14' is limited and cannot be applied to high-frequency transmission; in addition, since the FPC flexible cable 13', 14' must be soldered to the first circuit, respectively. The electrical connection between the first circuit board 101' and the second circuit board 102' must extend to the electrical contacts at the rear end of the board 101' and the second circuit board 102', so that the manufacturing cost is increased, and The yield of welding problems arises. Furthermore, the optical connector 10' shown in FIG. 1 and FIG. 2 can only transmit signals along the surface circuit of the first circuit board 101' and the second circuit board 102', so the first circuit board 101' and the The circuit design of the two circuit boards 102' is limited by space, and the application field is limited. Therefore, the assembly design of the prior art still has shortcomings, and it is waiting for further improvement by our generation to improve the assembly quality and performance.

In summary, the creator feels that the above problems can be improved. He is dedicated to research and cooperate with the application of theory, and finally proposes a creation that is reasonable in design and effective in improving the above-mentioned defects.

The main purpose of this creation is to provide a high frequency connector that is permeable. A single high-frequency connector is connected to the two boards, and a single optoelectronic module can be used for bidirectional data transmission.

In order to achieve the above object, the present invention provides an optical module for performing bidirectional transmission of data data with an output/input connector, the output/input connector including a first set of conductive terminals and a second set of conductive terminals The optical module includes: a connector having an accommodating space, wherein the two ends of the connector are respectively formed with an open end and a set of terminals; a first circuit board is disposed in the accommodating space, the first One end of a circuit board has a plurality of first electrical contacts adjacent to the open end, and the other end of the first circuit board is provided with a photoelectric module adjacent to the set end, the first electrical contact Electrically connected to the first group of conductive terminals; a second circuit board disposed in the accommodating space, the one end of the second circuit board having a plurality of second electrical contacts adjacent to the open end, The second electrical contacts are electrically connected to the second set of conductive terminals; a high frequency connector is disposed between the first circuit and the second circuit board, the high frequency connector includes an insulating base body, The insulating base has a surrounding side surface and one of the opposite sides An end surface and a second end surface respectively connected to the first end surface and the second end surface, wherein the first end surface and the second end surface are correspondingly provided with at least one terminal setting region, and the plurality of connecting terminals are disposed through Corresponding to the at least one terminal setting area; and an optical fiber line passing through the set end of the connecting head and electrically connected to the photoelectric module of the first circuit board.

The present invention also provides a high frequency connector for mounting between a first circuit board and a second circuit board of an optical module, the first circuit board group being provided with a photoelectric module, the high frequency connection The device includes: an insulating seat body having a surrounding side surface and a first end surface and a second end surface, the side surfaces respectively engaging the first end surface and the second end surface, the first The end surface and the second end surface are correspondingly provided with at least one terminal setting area; and a plurality of connecting terminals are disposed through the corresponding terminal setting area, and the photoelectric module is electrically connected to an optical fiber line.

This creation has at least the following advantages: This creation is to connect two boards through a high-frequency connector, which not only achieves the use of a photovoltaic module (light engine) to save manufacturing costs. It can solve the problem that the process yield control is not easy. In addition, the creation uses a method of connecting a high-frequency connector between the two circuit boards, so that the signal is transmitted not only along the surface circuit of the two circuit boards, but also along the inner circuit of the two circuit boards, and the two circuit boards are greatly increased. The wiring space that can be used, so the wiring can be flexibly adjusted according to actual needs, making the application field more extensive.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and explanation, and are not intended to limit the creation.

"Knowledge Technology"

10'‧‧‧Optoelectronic connector

11’‧‧‧Fiber optic cable

12’‧‧‧Fiber Optic Cable

13’‧‧‧FPC flexible cable

14’‧‧‧FPC flexible cable

101’‧‧‧First board

102’‧‧‧second circuit board

1011'‧‧‧First Photovoltaic Module

1021'‧‧‧Second Photovoltaic Module

1012’‧‧‧First Data Transfer埠

1022’‧‧‧Second data transmission埠

"This Creation"

100‧‧‧ optical module

1‧‧‧Connector

11‧‧‧Shell

2‧‧‧First board

21‧‧‧First electrical contact

22‧‧‧Optoelectronic module

23‧‧‧First line

24‧‧‧ third line

24a‧‧‧The third line of the surface

24b‧‧‧ inner third line

24c‧‧‧ bottom third line

25‧‧‧First hole

26‧‧‧Metal heat sink

27‧‧‧ Thermal pad

28‧‧‧First connection terminal

3‧‧‧Second circuit board

31‧‧‧Second electrical contact

32‧‧‧second line

32a‧‧‧The second line of the surface

32b‧‧‧ inner second line

32c‧‧‧ bottom second line

33‧‧‧Second hole

34‧‧‧Second connection terminal

4‧‧‧High frequency connector

41‧‧‧Insulated body

411‧‧‧ side surface

411a‧‧‧impedance groove

412‧‧‧ first end

413‧‧‧second end face

414‧‧‧ positioning port

415‧‧‧body body hole

42‧‧‧ Inner body

421‧‧‧ embedded card slot

422‧‧‧Inner body positioning port

43‧‧‧ Positioning module

431‧‧‧ module side surface

431a‧‧‧ Impedance groove

432‧‧‧ first module end face

433‧‧‧ second module end face

434‧‧‧ embedded card bumps

5‧‧‧Connecting terminal

51‧‧‧ Fixed Department

52‧‧‧ pins

521‧‧‧ Fisheye

6‧‧‧Fiber optic cable

7‧‧‧Electronic parts

200‧‧‧Output/Input Connector

201‧‧‧First set of conductive terminals

2011‧‧‧First conductive terminal

2011a‧‧‧First Contact

2011b‧‧‧First Body Department

2011c‧‧‧ first tail

202‧‧‧Second set of conductive terminals

2021‧‧‧Second conductive terminal

2021a‧‧ Second Contact

2021b‧‧‧Second body part

2021c‧‧‧second tail

S‧‧‧ accommodating space

F1‧‧‧ open end

F2‧‧‧Set

P‧‧‧Terminal setting area

B‧‧‧Terminal area not set

L3‧‧‧ Length of the first line

L4‧‧‧ Length of the second line

Length of L5‧‧‧ connection terminal

Length of L6‧‧‧ third line

Distance between W‧‧‧ inset slots

1 is a schematic structural view of a conventional optical module; FIG. 2 is a schematic structural view of another conventional optical module; FIG. 3 is a three-dimensional assembled view of an unbonded state of the created optical module; Figure 3 is a side elevational cross-sectional view showing the combined state of the optical module; Figure 6 is a side cross-sectional view showing the combined state of the optical module; Figure 7 is a perspective exploded view of the high frequency connector; 8 is a perspective exploded view of another embodiment of the high-frequency connector of the present invention; FIG. 9 is a perspective exploded view of still another embodiment of the high-frequency connector; FIG. 10 is a three-dimensional exploded view of the high-frequency connector Exploded view; and Figure 11 is a perspective exploded view of another embodiment having a plurality of high frequency connectors.

The embodiments described below are referred to by the number or the like, and the scope of application of the present invention should not be limited by the number or the like unless otherwise stated. The specific details disclosed herein are not to be construed as limiting, but rather should be the basis of the scope of the claimed application, and as a representative basis to teach the artist to make it, in fact, in any suitable manner. Use this creation in a variety of ways, including using it here The various features disclosed may be combined with those disclosed herein.

Referring first to FIG. 3, the present invention provides an optical module 100 for transmitting and receiving optical signals. The optical module 100 performs bidirectional transmission of data data with an output/input connector 200. The output/input connector 200 is mounted on a host device (not shown), which may be a server or an industrial computer having a large amount of data transmission/access requirements, but is not limited to the authoring application. The scope. The optical module 100 of the present invention can be used for transmitting and receiving optical signals of various data rates, including one billion bits per second, two billion bits per second, two billion bits per second, and four billion bits per second. , 8 billion bits per second, 10 billion bits per second, and even higher data rates, but not limited to this. In addition, the optical module 100 can be used for transmitting and receiving optical signals of various wavelengths, including 850 nm, 1310 nm, 1470 nm, 1490 nm, 1510 nm, 1530 nm, 1550 nm, 1570 nm, 1590. Nano or 1610 nm, but not limited to this. In addition, the optical module 100 can be used to support multiple transmission standards, including fast Ethernet, Gigabit Ethernet, tens of billions Ethernet, and 1x, 2x, 4x, and 10x Fibre Channel, but is not limited thereto.

Referring to FIG. 3 and FIG. 4, the optical module 100 of the present invention is mainly composed of a connector 1, a first circuit board 2, a second circuit board 3, a high frequency connector 4, and a fiber optic cable 6. The connector 1 is hollow, and has an accommodating space S therein for accommodating the first circuit board 2 and the second circuit board 3. The two ends of the accommodating space S are respectively formed with a set. The terminal F2 and the open end F1 are connected to the output/input connector 200, and the optical fiber 6 is electrically connected to the photoelectric module of the first circuit board 2 through the set terminal F2. 22, for signal transmission. As shown in FIG. 4, the first circuit board 2 can be a printed circuit board (PCB), and one end of the first circuit board 2 has a plurality of first electrical contacts 21 adjacent to the open end F1 ( That is, the edge connector, the edge connector), and the other end of the first circuit board 2 is provided with a photoelectric module 22 adjacent to the assembly end F2, the optoelectronic module 22 is connected to a fiber optic cable 6 (may be The single-core or multi-core optical fiber cable is connected, so that the optoelectronic module 22 can use the optical fiber line 6 for bidirectional data transmission; the second circuit board 3 can also be a printed circuit board (PCB), and one end of the second circuit board 3 has a plurality of second electrical contacts 31 (ie, edge connectors) adjacent to the open end F1, and The two circuit boards 3 and the first circuit board 2 are connected to each other only through a single high frequency connector 4.

In the optical module 100 of the present invention, the high frequency connector 4 has a function of transmitting signals between the first circuit board 2 and the second circuit board 3; more specifically, the high frequency connector 4 includes an insulating body. 41, the insulating base 41 has a surrounding side surface 411 and a first end surface 412 and a second end surface 413, and the side surface 411 is respectively engaged with the first end surface 412 and the second end surface 413; wherein, the first end surface 412 and the second end surface 413 are correspondingly provided with at least one terminal setting area P for allowing a plurality of connection terminals to pass through; therefore, the first circuit board 2 and the second circuit board 3 can be mutually generated through the connection terminals Information connection.

The output/input connector 200 includes a first set of conductive terminals 201 (as shown in FIG. 6) and a second set of conductive terminals 202 (FIG. 6), so that the optical module 100 and the output/input connector 200 of the present invention are electrically The first electrical contacts 21 of the first circuit board 2 are electrically connected to the first set of conductive terminals 201, and the second electrical contacts 31 of the second circuit board 3 are electrically connected to the second group. The conductive terminal 202, since the high frequency connector 4 has a function of transmitting signals between the first circuit board 2 and the second circuit board 3, the electrical signal from the output/input connector 200 or the optical fiber line 6 can be The optical signals can be photoelectrically converted through a single optoelectronic module 22 of the first circuit board 2, and then transmitted to the optical fiber line 6 or the output/input connector 200, respectively. Therefore, the optical module 100 of the present invention can transmit data through only a single photoelectric module 22, which can effectively reduce the manufacturing cost of the optical module 100 as a whole, and can solve the conventional soft cable 13', 14' (eg, Figure 2) The problem of insufficient transmission speed and difficult control of process solder yield. In addition, the creation system connects the high-frequency connector 4 up and down through the two circuit boards (the first circuit board 2 and the second circuit board 3), so that the electrical signal can be transmitted not only along the surface circuit of the two circuit boards, but also Along the inner circuit or the bottom circuit of the two circuit boards, the wiring space that can be used by the two circuit boards is greatly increased, so the wiring can be flexibly adjusted according to actual needs, so that the application field More broadly, how the electrical signal is transmitted in the surface circuit or the underlying circuit will be described in detail in Figure 5 and later.

The specific embodiment of the present invention will be described in detail below. Please refer to FIG. 3 and FIG. 4 , FIG. 3 is a three-dimensional combination diagram of the unbonded state of the created optical module, and FIG. 4 is a three-dimensional exploded view of the unbonded state of the created optical module. As shown in FIG. 3 and FIG. 4, the first circuit board 2 and the second circuit board 3 are connected through a single high frequency connector 4, and further assembled inside the connector 1, the The connector 1 completely covers the first circuit board 2 and the second circuit board 3, and effectively protects the related components of the first circuit board 2 and the second circuit board 3, and the first circuit board 2 is oppositely disposed on The upper surface of the second circuit board 3 (the lower circuit board 3) is opposite to the first circuit board 2 and the second circuit board 3, and after the first circuit board 2 and the second circuit board 3 are assembled to the connector 1 A plurality of first electrical contacts 21 and a plurality of second electrical contacts 31 are exposed at the open end F1 of the connector 1. In addition, the outer portion of the optical fiber 6 has a fiber optic cable outer cover (not labeled), and the outer end of the optical fiber wire is formed with a fixing member (not shown) for fixing to the assembled end F2 to make the optical fiber. The wire 6 can be stably assembled with the connector 1. It should be noted that, in this embodiment, since the terminal installation region P of the insulating base 41 is located on both sides of the insulating base 41, when the first circuit board 2 and the second circuit board 3 are coupled to the high frequency In the case of the connector 4, the force can be evenly distributed on both sides of the insulating base 41, so that the first circuit board 2, the second circuit board 3, and the high-frequency connector 4 can be stably assembled together, and it is not easy to loosen. , so that the signal is transmitted stably. Next, the circuit of the first circuit board 2, including the first line 23, the third line 24, and the second circuit board 3, including the second line 32 (pattern) corresponding to the insulating body 41 The area B of the terminal (i.e., the central area of the insulating base 41) is not provided. Therefore, the first circuit board 2 and the second circuit board 3 have a large area of wiring area, which can flexibly increase or decrease the number of wirings and change the wiring pattern.

Please refer to FIG. 4 to FIG. 6 together. FIG. 5 is a side enlarged cross-sectional view showing the combined state of the optical module, and FIG. 6 is a side cross-sectional view showing the combined state of the optical module; FIG. 4 and FIG. The first circuit board 2 and the second circuit board 3 can be multi-layered The circuit board, and the first circuit board 2 may have a plurality of first lines 23 stacked on each other and a plurality of third lines 24 stacked on each other, and the second circuit board 3 may have a plurality of second lines 32 stacked on each other. Therefore, as shown in FIG. 5 and FIG. 6 , when the optical module 100 is electrically coupled to the output/input connector 200 , the electrical signals from the first set of conductive terminals 201 may select different first electrics of the first circuit board 2 . The contact 21 enters one of the surface first line 23, the inner first line (not labeled) or the bottom first line (not labeled), and directly transmits the electrical signal to the optoelectronic module 22; likewise, from The electrical signals of the second set of conductive terminals 202 may select different second electrical contacts 31 of the second circuit board 3 to enter one of the surface second line 32a, the inner second line 32b or the bottom second line 32c. And transmitting the electrical signal to one end of one of the connection terminals 5 of the high frequency connector 4, and then selectively transmitting the electrical signal to the first circuit from the other end of the one of the connection terminals One of the surface third line 24a, the inner third line 24b or the bottom third line 24c of the board 2 transmits the electrical signal to the optoelectronic module 22. More specifically, the optical module 100 of the present invention can transmit the same signal to the same optoelectronic module 22 in the two layers of the circuit board (the first circuit board 2 and the second circuit board 3). According to actual needs, the two circuit boards are respectively counted corresponding to the number of lines and the lines are separated, the wiring space of the two boards is greatly increased, and the wiring design is more flexible, thereby making the application field of the present optical module 100 more extensive.

Referring to FIG. 4 and FIG. 6, the first and second sets of conductive terminals 201, 202 of the output/input connector 200 respectively include a plurality of first and second conductive terminals 2011, 2021. Each of the first and second conductive terminals 2011, 2021 has a first and second contact portions 2011a, 2021a, a first and second tail portions 2011c, 2021c, and an intermediate first and second body portions 2011b, 2021b. The first and second contact portions 2011a, 2021a and the first and second tail portions 2011c, 2021c are respectively bent from the two ends of the first and second body portions 2011b, 2021b, and the first and second contact portions are respectively formed. 2011a, 2021a are electrically connected to the first and second electrical contacts 21, 31, respectively. When the first electrical contact 21 and the second electrical contact 31 respectively receive the electrical signal, the first circuit board 2 can directly directly transmit the electrical signal. The signal is transmitted to the optoelectronic module 22, and the received data signal is converted into an optical signal, and the signal transmission is performed via the optical fiber line 6. The second circuit board 3 transmits the electrical signal to the first circuit board through the high frequency connector 4. 2, the optoelectronic module 22 of the first circuit board 2 is used to convert the received data signal into an optical signal, and the signal transmission is performed via the optical fiber line 6. Otherwise, the optical signal is transmitted by the optical fiber line 6, and the optical module 22 is also used. After the optical signal and the electrical signal are converted, the electrical signal is directly transmitted to the first electrical contact 21 of the first circuit board 2, or the electrical signal is transmitted to the second electrical circuit of the second circuit board 3 through the high frequency connector 4. The contact 31 is transmitted.

It should be noted that the first set of conductive terminals 201 of the output/input connector 200 has a longer length than the second set of conductive terminals 202, and the first line 23 has a longer length than the second line 32, so The length of the first line 23 is defined as L3, the length of the second line 32 is defined as L4, the length of the connection terminals is defined as L5, and the length of the third line 24 is defined as L6, and the length of the first set of conductive terminals 201 ( The length from the first tail portion 2011c to the first contact portion 2011a) + L3 = the length of the second group of conductive terminals 202 (the length from the second tail portion 2021c to the second contact portion 2021a) + L4 + L5 + L6; wherein, L1 >L2, L3>L4. Therefore, the optical module 100 of the present invention can transmit the distance from the output/input connector 200 to the optoelectronic module 22 via the first circuit board 2 and the electrical signal to the optoelectronic module via the second circuit board 3. The distances of 22 are the same, thereby solving the problem of the difference in line length between the first circuit board 2 and the second circuit board 3, so that the two-way signal transmission has no time difference.

Referring to FIG. 4 , the first circuit board 2 of the present optical module 100 may be further provided with at least one heat dissipation pad 27 adjacent to the photoelectric module 22; specifically, the first circuit board 2 is disposed adjacent to At least one metal heat sink 26 of the photovoltaic module 22, and the at least one heat sink 27 is correspondingly disposed on the metal heat sink 26. The heat dissipating pad 27 may be selected from the group consisting of a thermal conductive silicone, a resilient metal, and a non-metallic elastic material. In this embodiment, preferably, the heat dissipating pad 27 may have A thermal conductive silica gel having high compression properties and high thermal conductivity; wherein the thermally conductive silica gel can be further added with other electrically insulating materials having good heat conduction properties. Therefore, when this The thermal energy generated by the created light module 100 during operation can be quickly conducted to the housing 11 of the connector 1 by the heat dissipation pad 27 (thermal conductive silicone), and the thermal energy is quickly dissipated to the atmosphere by the connector 1 The heat dissipation performance is greatly improved, so that the temperature is lowered, the photoelectric transmission speed is improved, and the efficiency and service life of the optical module 100 are improved. The housing 11 can be made of a metal material.

Please refer to FIG. 5 and FIG. 7 together. FIG. 7 is a perspective exploded view of the high frequency connector. As shown in FIG. 5 and FIG. 7, the high frequency connector 4 is disposed on the first circuit board 2 and the second circuit board. Between the three, the insulating base 41 is integrally formed, and two rows of parallel connection terminals 5 which are juxtaposed and parallel to each other are embedded on both sides of the first end surface 412 and the second end surface 413 of the insulating base 41; Each of the connecting terminals 5 may include a fixing portion 51 and two legs 52. The fixing portion 51 is embedded in the insulating base 41, and the two pins 52 extend from both ends of the fixing portion 51 to be exposed to the insulating base 41. The first end surface 412 and the second end surface 413 are outside. As can be seen from the figure, the insulating base 41 defines a plurality of positioning openings 414 for positioning the connecting terminals 5 in the corresponding positioning openings 414. It should be noted that, as shown in FIG. 5, since the two pins 52 of each connection terminal 5 are respectively provided with a fisheye portion 521, when the first circuit board 2, the second circuit board 3, and the high frequency connector are to be assembled, At 4 o'clock, the two pins 52 of the connection terminals of the high-frequency connector 4 are directly inserted into a first connection hole 25 of the first circuit board 2 and a second connection hole of the second circuit board 3, respectively. 33, the assembly can be easily completed, so that the assembly time and labor cost are effectively saved; or the two pins 52 of each connection terminal can also be respectively soldered to a first connection hole 25 of the first circuit board 2 and the first A second through hole 33 of the two circuit boards 3 is used for assembly, but not limited thereto.

On the other hand, the side surface 411 of the insulating base 41 can be further provided with a plurality of impedance grooves 411a, such that the positions of the impedance grooves 411a are respectively staggered with the positions of the connecting terminals 5; for example, two An impedance groove 411a is disposed between the adjacent connecting terminals 5 (ie, a connecting terminal 5 is disposed between two adjacently disposed impedance grooves 411a); wherein the insulating seat 41 is made of a high temperature resistant engineering plastic Made. When the side surface of the insulating base 41 is not provided with an impedance groove, when the electrical signal passes through the high frequency When the connector 4 is used, it has the disadvantage that the capacitance is too high and the impedance is too low. When the impedance groove is formed on the side surface of the insulating base 41, the impedance can be effectively increased, thereby achieving the purpose of reducing the capacitance and increasing the inductance. Therefore, when the high frequency connector 4 of the present invention is provided with an impedance groove, the impedance value can be stably between 100 Ω ± 10% both in the transmission of the high frequency or low frequency signal. Therefore, the high-frequency connector 4 of the present invention can replace the engineering plastic with the air with the insulating property to achieve the purpose of adjusting the impedance stability. The engineering plastic used in the insulating base 41 may be poly-1,9-indenylene terephthalamide (PA9T) or nylon 46' liquid crystal polymer (LCP), but is not limited thereto. Engineering plastics with high temperature characteristics should be included in the examples of this creation. Thereby, the high frequency connector 4 of the present invention can be applied to high frequency signal transmission.

Please refer to FIG. 8. FIG. 8 is a perspective exploded view of another embodiment of the high frequency connector. The difference between the embodiment and the embodiment shown in FIG. 7 is that the high frequency connector 4 is a three-piece combination structure. . The insulating base 41 includes an inner base 42 and two positioning modules 43 . The two positioning modules 43 are embedded on opposite side surfaces of the inner base 42 . Each positioning module 43 has a surrounding module side surface 431 and a first module end surface 432 and a second module end surface 433, and the module side surface 431 is coupled to the first module end surface 432 and the second module end surface 433, respectively. Each of the positioning modules 43 is embedded with a plurality of connection terminals 5 arranged in a neat manner. The fixing portions 51 of the connection terminals 5 are embedded in the corresponding positioning module 43 , and the two pins 52 extend from both ends of the fixing portion 51 . The inner block body 42 is further provided with a plurality of inner seat positioning ports 422, so that the two pins 52 of the connecting terminals 5 are respectively It is located in the corresponding inner body positioning port 422.

It is to be noted that the opposite side surfaces of the inner seat body 42 are respectively provided with a card insertion slot 421 for the two positioning modules 43 to be disposed in the corresponding insertion slots 421. Therefore, when the first circuit board 2, the second circuit board 3, and the high frequency connector 4 are to be assembled, the two positioning modules 43 can be respectively disposed in the corresponding card slots 421 by using a card bump 434. The inner body 42 and the two positioning modules 43 are assembled to form a complete high frequency connector 4; wherein the card bump 434 has the function of guiding and limiting, and The positioning module 43 can be stably positioned and disposed in the corresponding embedded slot 421. In addition, the high-frequency connector 4 of the present embodiment is a combined design, wherein the inner seat body 42 can be an I-shaped structure, and the distance W between the two embedded card slots 421 can be correspondingly required according to actual needs. Increasing or shortening, in other words, when the demand changes, the high frequency connector 4 of the present invention only needs to replace the positioning module 43 of different sizes to be applicable to different application fields; for example, the number of the connection terminals of the positioning module 43 The spacing, length and length can be changed according to actual needs, so the manufacturing cost and maintenance cost can be greatly reduced, which is very economical and practical. Furthermore, the module side surface 431 of each positioning module 43 can be further provided with a plurality of impedance grooves 431a, and the positions of the impedance grooves 431a are respectively staggered with the positions of the connection terminals 5, so that the signal transmission is performed. The impedance value can be stably between 100 Ω ± 10%.

On the other hand, the circuit design of the two circuit boards (the first circuit board 2 and the second circuit board 3) may also vary correspondingly with the distance W between the two embedded card slots 421, for example, with the second embedded The distance W between the card slots 421 is shortened, and the connection terminals 5 of the two positioning modules 43 are close to each other. At this time, the terminal setting region P of the insulating base 41 is located in the central region of the insulating base 41, and the region B where the terminal is not provided The two circuit boards (the first circuit board 2 and the second circuit board 3) are designed to be disposed on opposite sides of the two circuit boards, so that they can be flexibly adjusted according to requirements. Board circuit.

Please refer to FIG. 9. FIG. 9 is a perspective exploded view of still another embodiment of the high frequency connector. The difference between the embodiment and the embodiment shown in FIG. 7 and FIG. 8 is that the insulating base 41 is integrally formed and opened. The plurality of connection terminals 415, and the plurality of connection terminals 5 include a plurality of first connection terminals 28 and a plurality of second connection terminals 34; wherein the first connection terminals 28 are disposed on the first circuit board 2 The second connection terminals 34 are disposed on the second circuit board 3 . When the first circuit board 2, the second circuit board 3, and the high frequency connector 4 are to be assembled, the first connection terminals 28 and the corresponding second connection terminals 34 are directly disposed to face each other. The seat holes 415 are in contact with each other, and the assembly can be easily performed, so that the assembly time and the manpower can be effectively saved. point. In addition, the opposite side surfaces 411 of the insulating base 41 are further provided with a plurality of impedance recesses 411a, such that the positions of the impedance recesses 411a and the positions of the first connecting terminals 28 and the second connecting terminals 34 are Interleaved settings, so that the impedance value can be stably between 100Ω ± 10%.

Please refer to FIG. 10 and FIG. 11. FIG. 10 is a perspective exploded view of the present invention having a plurality of high frequency connectors, and FIG. 11 is a perspective exploded view of another embodiment having a plurality of high frequency connectors; 10 and FIG. 11 , the optical module 100 of the present invention can have a plurality of high frequency connectors 4 stacked on top of each other, and the high frequency connectors 4 are disposed on the first circuit board 1 and the second circuit board 2 . between. Therefore, when the electronic component 7 having a larger volume and thickness is disposed on one or both of the first circuit board 1 and the second circuit board 2, the high frequency connector 4 stacked and stacked on each other can be added. Or reducing the distance between the first circuit board 1 and the second circuit board 2 to meet the actual needs of the customer, thereby expanding the application field of the optical module 100 of the present invention; wherein the number of stacked high frequency connectors is Not limited thereto, and variations of the high frequency connectors 4 may be one of the embodiments of FIG. 7, FIG. 8, or FIG. 9, and the high frequency connectors 4 are stacked on each other. Specifically, as shown in FIG. 10, in the present embodiment, the optical module 100 of the present invention can have three high-frequency connectors 4 stacked on top of each other, wherein the high-frequency connector 4 located in the middle can be FIG. In the embodiment, the upper and lower high frequency connectors 4 can be one of the implementation manners of FIG. 7 and FIG. 8 , and the first circuit board 1 and the second circuit of FIG. 7 and FIG. 8 are combined. The light module 100 of the present creation is completed by the board 2. In addition, as shown in FIG. 11, in the present embodiment, the optical module 100 of the present invention can also have three high-frequency connectors 4 stacked on top of each other, but the high-frequency connector 4 located in the middle can be changed to FIG. And one of the implementation aspects of FIG. 8, and the upper and lower high frequency connectors 4 can be changed to the embodiment of FIG. 9 together with the first circuit board 1 and the second circuit board 2 of FIG. The optical module 100 of the present creation is completed. In addition, it should be specifically noted here that the direction terms mentioned in this creation, such as: up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is used to illustrate and not to limit the Work.

Therefore, through this creation, it has the following features and functions:

1. The optical module of the present invention is connected to the two circuit boards through the high-frequency connector, which not only achieves the use of a photovoltaic module (light engine) to save manufacturing costs, but also solves the problem that the process yield control is not easy.

2. The optical module of the present invention can selectively transmit the electrical signal along the surface circuit of the two circuit boards or the inner circuit to the same optical module, thereby greatly increasing the wiring space available for the two circuit boards. The actual needs of flexible adjustment of wiring, so that the field of application of this creation is more extensive.

3. The optical module of the present invention uses a high frequency connector to connect the first circuit board and the second circuit board, so that the electrical signal is transmitted from the output/input connector to the same through the first circuit board and the second circuit board respectively. The distances of the photoelectric modules are the same, thereby solving the problem of the difference in the length of the pattern between the pattern of the first circuit board and the pattern of the second circuit board, so that the two-way signal transmission has no time difference.

Fourth, the high-frequency connector of the present invention is a combined design, so when the application requirements change, only need to replace different positioning modules, the number of the connecting terminals can be changed, and between the connecting terminals The distance and the purpose of connecting the lengths of the terminals can save manufacturing and maintenance costs and are extremely economical.

In summary, the creation has been in line with the requirements for the creation of patents, and the application is made according to law. However, the above disclosures are only preferred embodiments of the present invention, and the scope of rights of the present invention cannot be limited thereto. Therefore, the equal changes or modifications made according to the scope of the application of the present application are still covered by the present application.

100‧‧‧ optical module

1‧‧‧Connector

11‧‧‧Shell

2‧‧‧First board

21‧‧‧First electrical contact

22‧‧‧Optoelectronic module

23‧‧‧First line

24‧‧‧ third line

25‧‧‧First hole

26‧‧‧Metal heat sink

27‧‧‧ Thermal pad

3‧‧‧Second circuit board

31‧‧‧Second electrical contact

32‧‧‧second line

33‧‧‧Second hole

4‧‧‧High frequency connector

41‧‧‧Insulated body

411‧‧‧ side surface

412‧‧‧ first end

413‧‧‧second end face

5‧‧‧Connecting terminal

6‧‧‧Fiber optic cable

200‧‧‧Output/Input Connector

S‧‧‧ accommodating space

P‧‧‧Terminal setting area

B‧‧‧Terminal area not set

Claims (18)

An optical module for performing bidirectional transmission of data data with an output/input connector, the output/input connector comprising a first set of conductive terminals and a second set of conductive terminals, the optical module comprising: a connector One end of the connector is formed with an open end and a set of terminals; a first circuit board is disposed in the accommodating space, and one end of the first circuit board is adjacent to the a plurality of first electrical contacts of the open end, the other end of the first circuit board is provided with a photoelectric module adjacent to the set of terminals, and the first electrical contacts are electrically connected to the first set of conductive a second circuit board is disposed in the accommodating space, and one end of the second circuit board has a plurality of second electrical contacts adjacent to the open end, and the second electrical contacts are electrically connected The second set of conductive terminals; at least one high frequency connector disposed between the first circuit board and the second circuit board, the at least one high frequency connector comprising an insulating base body, the insulating base body having a side surface surrounding and a first end surface and a second end The side surface is respectively connected to the first end surface and the second end surface, and the first end surface and the second end surface are correspondingly provided with at least one terminal setting region, and the plurality of connecting terminals are disposed through the corresponding at least one terminal a setting area; and a fiber optic line passing through the set end of the connector and electrically connected to the optoelectronic module. The optical module of claim 1, wherein the first circuit board and the second circuit board are multi-layer circuit boards, and the first circuit pattern, the third circuit pattern, and the first circuit board The second circuit of the two circuit boards corresponds to an area where the insulating body is not provided with a terminal, and the first circuit extends from the first electrical contacts to the photoelectric module, and the second circuit is from the The second electrical contacts extend to one of the connection terminals, and the third circuit extends from one of the connection terminals to the optoelectronic module. The optical module of claim 2, wherein the length of the first set of conductive terminals is defined as L1, the length of the second set of conductive terminals is defined as L2, and the length of the first line is defined as L3, the second line The length is defined as L4, the length of the connection terminals is defined as L5, and the length of the third line is defined as L6, where L1>L2, L3>L4, L1+L3=L2+L4+L5+L6. The optical module of claim 1, wherein each of the connecting terminals comprises a fixing portion and two pins, the fixing portion is embedded in the insulating base, and the two legs are extended from both ends of the fixing portion to be exposed. And the first end surface and the second end surface. The optical module of claim 4, wherein the insulating base is provided with a plurality of positioning ports, wherein the connecting terminals are respectively positioned in the corresponding positioning openings, and the side surfaces are further provided with a plurality of impedance grooves, The positions of the impedance grooves are respectively staggered with the positions of the connection terminals. The optical module of claim 1, wherein the insulating base comprises an inner seat body and two positioning modules, wherein the two positioning modules are embedded on opposite side surfaces of the inner seat body, and each positioning module has a surrounding module. a side surface and a first end surface of the module and a second end surface of the module, wherein the side surface of the module is respectively connected to the end surface of the first module and the end surface of the second module, and each of the connecting terminals comprises a fixing portion and two pins The fixing portion is embedded in the corresponding positioning module, and the two legs extend from both ends of the fixing portion to be exposed on the end surface of the first module and the end surface of the second module. The optical module of claim 6, wherein the two positioning modules are respectively provided with a plurality of module positioning ports, wherein the opposite side surfaces of the inner seat body are respectively provided with a card insertion slot, and the two positioning modules respectively use an embedded card bump The two pins of the connecting terminals are respectively positioned in the corresponding positioning holes of the module, and the side surface of the module is further provided with a plurality of impedance grooves, and the impedance grooves are disposed in the corresponding card slots. The positional system is alternately arranged with the positions of the connecting terminals. The optical module of claim 4, wherein each of the two pins of the connecting terminal is respectively provided with a fisheye portion, and the two pins are respectively corresponding to one of the first circuit boards. a first connection hole and a second connection hole of the second circuit board, or two pins of each of the connection terminals directly corresponding to a first connection hole of the first circuit board and one of the second circuit board Second hole. The optical module of claim 1, wherein the connection terminals comprise a plurality of first connection terminals and a plurality of second connection terminals, the first connection terminals being disposed on the first circuit board, and the second connection terminals Provided on the second circuit board, the insulating base body is provided with a plurality of seat body holes, and the first connecting terminals and the corresponding second connecting terminals are disposed opposite to each other at the same body connecting holes . The optical module of claim 1, wherein the optical module comprises a plurality of high frequency connectors stacked one above another. The optical module of claim 1, wherein the first circuit board is further provided with at least one heat dissipation pad adjacent to the photoelectric module. A high frequency connector is mounted between a first circuit board and a second circuit board of an optical module, the first circuit board group is provided with a photoelectric module, and the high frequency connector comprises: An insulating base body having a surrounding side surface and a first end surface and a second end surface, wherein the side surface is respectively connected to the first end surface and the second end surface, the first end surface and the first end surface The two end faces are correspondingly provided with at least one terminal setting area; and a plurality of connecting terminals are disposed through the corresponding at least one terminal setting area, and the photoelectric module is electrically connected to a fiber optic line. The high-frequency connector of claim 12, wherein each of the connection terminals comprises a fixing portion and two pins, the fixing portion is embedded in the insulating base, and the two legs extend from both ends of the fixing portion. And exposed to the first end surface and the second end surface. The high-frequency connector of claim 13, wherein the insulating base is provided with a plurality of positioning ports, wherein the connecting terminals are respectively positioned in the corresponding positioning openings, and the side surfaces are further provided with a plurality of impedance grooves. The positions of the impedance grooves respectively correspond to the positions of the connection terminals. The high-frequency connector of claim 12, wherein the insulating base comprises an inner seat body and two positioning modules, the two positioning modules are embedded on opposite side surfaces of the inner seat body, and each positioning module has a surrounding a module side surface and a first module end surface and a second module end surface, the module side surface respectively engaging the first module end surface and the second module end surface, each of the connection terminals comprising a fixing portion and two The fixing portion is embedded in the corresponding positioning module, and the two legs extend from the two ends of the fixing portion to be exposed to the corresponding first module end surface and the second module end surface. The high-frequency connector of claim 15, wherein the inner seat body is further provided with a plurality of inner seat positioning ports, and the opposite side surfaces of the inner seat body are respectively provided with a card insertion slot, and the two positioning modules respectively utilize one The embedded card bumps are disposed in the corresponding card slot, and the two pins of the connecting terminals are respectively positioned in the corresponding inner body positioning ports, and the module side surface is further provided with a plurality of impedance grooves. The positions of the impedance grooves respectively correspond to the positions of the connection terminals. The high-frequency connector of claim 13 or 15, wherein the two pins of each of the connection terminals are respectively provided with a fisheye portion, and the two pins are respectively corresponding to a first hole embedded in the first circuit board and A second connection hole of the second circuit board or two pins of each of the connection terminals directly correspond to a first connection hole of the first circuit board and a second connection hole of the second circuit board. The high-frequency connector of claim 12, wherein the connection terminals comprise a plurality of first connection terminals and a plurality of second connection terminals, the first connection terminals being disposed on the first circuit board, and the second connection terminals The connecting terminal is disposed on the second circuit board, and the insulating base body is provided with a plurality of socket body holes, and the first connecting terminals and the corresponding second connecting terminals are disposed opposite to each other in the same body Hole.