CN210866130U - Large-pressure flip-chip bonding machine for bonding chip substrate after pre-welding - Google Patents
Large-pressure flip-chip bonding machine for bonding chip substrate after pre-welding Download PDFInfo
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- CN210866130U CN210866130U CN201922287078.7U CN201922287078U CN210866130U CN 210866130 U CN210866130 U CN 210866130U CN 201922287078 U CN201922287078 U CN 201922287078U CN 210866130 U CN210866130 U CN 210866130U
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Abstract
The utility model discloses a big pressure flip-chip bonding machine that is used for bonding after the chip base plate prewelds has solved the technical problem of jumbo size chip high quality bonding. A working table plate (101) is fixedly arranged on the table surface of a pressing table base (301) between the four guide posts (303), a cylindrical platform adjusting base (201) is fixedly arranged on the working table plate right below the servo press (314), a hemispherical floating platform adjusting platform (203) is movably arranged in the hemispherical groove (202), a lower pressing plate jig (115) is arranged on the hemispherical floating platform adjusting platform (203), a chip and a substrate (324) which are welded together in advance are arranged on the lower pressing plate jig (115), a parallel transfer guide rail (102) is arranged on the working table plate on one side of the cylindrical platform adjusting base (201), and a door-shaped transfer frame is arranged between the two transfer sliders; the positioning is accurate, the bonding is carried out in stages, and the realization process is easy.
Description
Technical Field
The invention relates to flip bonding equipment, in particular to flip bonding equipment for bonding a pre-welded chip and a substrate under high pressure.
Background
The flip-chip bonding technology is characterized in that a bare chip is directly connected to a substrate through a solder ball, so that the lead connection between the chip and the substrate is omitted, the shortest connecting path is formed between the chip and the substrate, good electrical performance and high packaging speed can be obtained, the packaging density is high, the frequency characteristic after packaging is good, and the production efficiency is improved; with the continuous increase of the size specification of the chip, when the flip bonding is carried out, the reliable connection between the chip and the substrate can be realized only by needing larger bonding pressure, and the traditional flip bonding equipment can not meet the bonding requirement of the chip with larger specification and size; at present, for the flip bonding of a large-size chip, each manufacturer generally adopts a step-by-step bonding process scheme of 'low-pressure flip alignment prewelding + high-pressure bonding', namely: and (3) carrying out alignment pre-welding on the bare chip and the substrate by adopting conventional flip-chip welding equipment, and then completing a bonding task by adopting high-pressure bonding equipment.
The method comprises the following steps that an adjusting platform is arranged on a bonding station of high-pressure bonding equipment, a lower pressing plate jig is accurately positioned and placed on the adjusting platform, a chip and a substrate which are pre-welded are accurately positioned and placed on the lower pressing plate jig, an upper pressing plate jig which is accurately positioned is arranged on the chip and the substrate which are pre-welded together, a lower pressing plate of a high-pressure bonding press is pressed downwards onto the upper pressing plate jig, and the high-pressure bonding press controls the lower pressing plate to press downwards at a certain pressure (generally 10 tons), so that a high-pressure bonding process of the chip and the substrate is completed; in the bonding process, whether the upper pressing plate jig and the lower pressing plate jig can be accurately positioned or not is directly related to the quality of the completion of the high-pressure bonding process; an actuating mechanism such as a press is configured right above a bonding station of the high-pressure bonding equipment, so that the space above the bonding station is narrow, if an upper pressure plate jig and a lower pressure plate jig are directly placed on the bonding station in advance for positioning, the difficulty of limited operation space exists, the positioning precision cannot be improved, and in the subsequent high-pressure bonding process, the upper pressure plate jig and the lower pressure plate jig are easy to generate lateral torque which can cause bonding dislocation between a bonded chip and a substrate; in addition, when the chips with different specifications are bonded with the substrate, different upper and lower pressing plate fixtures need to be replaced, so that how to conveniently replace the chips and the substrate, and the accurate positioning of the upper and lower pressing plate fixtures is realized, which becomes a technical problem to be solved on site.
The method comprises the following steps that an adjusting platform is arranged on a bonding station of high-pressure bonding equipment, a lower pressure plate jig is accurately positioned on the adjusting platform, a chip and a substrate which are pre-welded are accurately positioned on the lower pressure plate jig, an upper pressure plate jig which is accurately positioned is arranged on the chip and the substrate which are pre-welded together, a lower pressure plate is operated by a high-pressure bonding press to press downwards onto the upper pressure plate jig, the downward pressure for operating the lower pressure plate is very large (generally 10 tons), and the chip and the substrate are firmly bonded together; in the bonding and pressing process, the upper and lower pressing plate jigs are required to be tightly attached to the chip and the substrate which are subjected to pre-welding, so that the bonding quality under high pressure can be ensured; in the large-pressure bonding, the pressing is carried out in two stages, in the first stage, the large-pressure bonding machine operates the pressing plate to press down with smaller pressure, so that the whole processes of adaptation, alignment and bonding are completed among the upper pressing plate jig, the chip and the substrate, and after the alignment and bonding are determined to be completed among the upper pressing plate jig, the chip and the substrate, the large-pressure bonding in the second stage is carried out, and the chip and the substrate which are pre-welded together are firmly pressed together; how to make the upper pressure plate tool, the lower pressure plate tool and the chip substrate which is welded in advance, the alignment and the fitting among the upper pressure plate tool, the lower pressure plate tool and the chip substrate which is welded in advance are well completed, and the locking of the position of the pressure table after the alignment and the fitting is completed, so as to ensure that the high-quality large-pressure bonding is completed, and the technical problem which needs to be solved urgently on site is formed.
The large-pressure bonding and pressing is carried out in two stages, in the first stage, the large-pressure bonding machine operates the lower pressing plate to press with smaller pressure, generally the pressure is dozens of kilograms, so that the whole processes of adaptation, alignment and bonding are completed among the upper pressing plate jig, the lower pressing plate jig, the chip and the substrate, and after the alignment and bonding are determined to be completed among the upper pressing plate jig, the lower pressing plate jig, the chip and the substrate, the large-pressure bonding in the second stage is carried out; when the pressurizing mechanism is used for carrying out large-pressure bonding at the final stage, the maximum pressure can finally reach 10 tons, and how to realize flexible pressurization of the pressure in the large-pressure initial stage process can prevent the chip and the substrate which are accurately positioned and prewelded together from dislocation at the initial stage of pressurization, and meanwhile, the chip and the substrate can be well adapted to each other, which is a problem faced by the pressurizing mechanism; in addition, in the process of applying large pressure, how to monitor the pressurizing process is also a problem to be solved on site.
Disclosure of Invention
The invention provides a high-pressure flip chip bonder for bonding after pre-welding a chip substrate, which solves the technical problem of high-quality bonding of large-size chips.
The invention solves the technical problems by the following technical scheme:
a high-pressure flip-chip bonding machine for bonding chip substrates after pre-welding comprises a lower frame of the bonding machine, a pressing table base is fixedly arranged on the lower frame of the bonding machine, a box-shaped frame is fixedly arranged on the pressing table base, a servo press is fixedly arranged on a top plate of the box-shaped frame, four guide posts are arranged between the top plate of the box-shaped frame and the pressing table base, movable cross beams are movably penetrated on the four guide posts, a working table plate is fixedly arranged on a table surface of the pressing table base between the four guide posts, a cylindrical adjusting platform base is fixedly arranged on the working table plate right below the servo press, a hemispherical groove is arranged on the top surface of the cylindrical adjusting platform base, a hemispherical floating adjusting platform is movably arranged in the hemispherical groove, a lower pressing plate jig is arranged on the hemispherical floating adjusting platform, and a chip and a substrate which are pre-welded together are arranged on the lower pressing plate jig, a lower connecting plate is fixedly arranged at the center of the lower bottom surface of the movable cross beam, an upper jig sucking disc is arranged on the lower bottom surface of the lower connecting plate, and an upper pressing plate jig is adsorbed on the upper jig sucking disc; the parallel transfer guide rails are arranged on the working table plate on one side of the cylindrical transfer platform base, the door-shaped transfer frame is arranged between the two transfer sliding blocks, a lower pressing plate jig positioning table is fixedly arranged on the working table plate on the right end between the two parallel transfer guide rails, lower pressing plate jig positioning pin columns are arranged on the lower pressing plate jig positioning table, an upper pressing plate jig positioning table is arranged on a door-shaped transfer frame top plate of the door-shaped transfer frame, and upper pressing plate jig positioning pin columns are arranged on the upper pressing plate jig positioning table.
A starting end positioning column is fixedly arranged on the right side of the parallel transfer guide rail, a terminal positioning column is fixedly arranged on the left side of the parallel transfer guide rail, a starting end positioning sucker and a starting end positioning jackscrew are respectively arranged on the starting end positioning column, a terminal positioning sucker and a terminal positioning jackscrew are respectively arranged on the terminal positioning column, a right end positioning disk of the transfer frame is arranged at the right end of the door-shaped transfer frame, and a left end positioning disk of the transfer frame is arranged at the left end of the door-shaped transfer frame; and a lifting claw for conveying the lower pressing plate jig is arranged on the lower bottom surface of the top plate of the door-shaped transfer frame.
Transfer platform to float at the hemisphere and be provided with holding down plate tool adsorption area, it has positive pressure compressed air suction nozzle and negative pressure vacuum suction nozzle to transfer to be provided with respectively on the platform base at cylindric, positive pressure compressed air suction nozzle and negative pressure vacuum suction nozzle all communicate together with the hemisphere recess, it has the primary location cantilever frame to outwards encorbelment at equidistant 120 degrees on the top excircle of platform is transferred to the hemisphere float, it is provided with the counter weight lead screw to float the radial of the top circle of transferring the platform along the hemisphere in the primary location cantilever frame, the spiro union has the counter weight screw on the counter weight lead screw, it floats the primary location support cylinder who transfers the platform to be provided with the hemisphere on the work platen in the cylindric platform base outside of transferring, the upwards projecting shaft setting of primary location support cylinder is under the primary location cantilever frame.
The upper top surface of the movable cross beam is provided with a cylindrical concave groove, the bottom of the cylindrical concave groove is provided with a pressure sensor, the upper top surface of the pressure sensor is provided with a threaded hole in the middle of the top end of the pressure sensor, a stepped stud is screwed in the threaded hole in the middle of the top end of the pressure sensor, a stack spring is arranged on an annular step of the stepped stud, a pressure conduction sleeve is sleeved on the stepped stud on the stack spring, the top end of the cylindrical concave groove is provided with a top cover with a central hole groove, and the shaft end of a downward pressing output shaft of a servo press is abutted with the top end surface of the pressure conduction sleeve after penetrating through the central hole of the top cover with.
A high-pressure flip-chip bonding method for bonding after pre-welding of a chip substrate comprises the following steps:
firstly, moving a door-shaped transfer frame to a starting end, accurately positioning the door-shaped transfer frame through the matching of a positioning disc at the starting end of the transfer frame, a positioning sucker at the starting end and a positioning jackscrew at the starting end, then positioning a lower pressing plate jig on a positioning table of the lower pressing plate jig, positioning an upper pressing plate jig on the positioning table of the upper pressing plate jig, and positioning a chip and a substrate which are prewelded together on the lower pressing plate jig;
secondly, lifting the lower pressing plate jig by lifting claws which are arranged on the lower bottom surface of a top plate of the door-shaped transfer frame and used for conveying the lower pressing plate jig, operating the door-shaped transfer frame to move to the position above the hemispherical floating leveling platform, placing the lower pressing plate jig, the chip and the substrate which are welded together in advance on the lower pressing plate jig on an adsorption area of the lower pressing plate jig arranged on the hemispherical floating leveling platform, and adsorbing the upper pressing plate jig on an upper jig sucking disc arranged on the lower bottom surface of a lower connecting plate by operating a servo press;
thirdly, introducing positive pressure compressed air into the hemispherical groove through a positive pressure compressed air inlet nozzle, and controlling output shafts of the three primary positioning supporting cylinders to retract downwards to enable the hemispherical floating adjusting platform to be in a suspension state, wherein the suspension height is 12-15 microns;
fourthly, controlling a press lower pressing plate on the high-pressure bonding machine to press the hemispherical floating adjusting platform under the pressure of 50-80 kilograms, so that the suspension height between the hemispherical floating adjusting platform and the hemispherical groove is reduced to 8 microns;
fifthly, controlling a proportional control valve on the negative pressure vacuum gas path to vacuumize the hemispherical groove through a negative pressure vacuum suction nozzle, starting the proportional control valve on the positive pressure compressed air gas path when the proportional control valve on the negative pressure vacuum gas path is opened to the maximum, and gradually reducing the compressed air introduced into the hemispherical groove until the proportional control valve is closed; finishing self-leveling and position locking of the hemispherical floating adjusting platform;
sixthly, adjusting the pressing resolution of the press to lay a foundation for the small-pressure pressing of the first stage of the press, wherein the specific process is as follows: after the movable cross beam is lowered to a bonding station, the servo press is pressed down with the pressure of 50-80 kilograms, the pressure is pressed on the pressure sensor through the pressure conduction sleeve, the laminated spring and the stud with the step in sequence, the pressure sensed by the pressure sensor is observed through a display of the pressure sensor, then the pressure sensed by the pressure sensor is changed by adjusting the extending lengths of output shafts of four prepressing suspension cylinders, and the pressure sensed by the pressure sensor reaches a designed specified value;
seventhly, placing the upper pressure plate jig, the lower pressure plate jig and the chip and the substrate which are welded together in advance on a bonding station, operating the servo press to press down under small pressure in the first stage according to the adjusted pressure value, and completing the self-adaption and the attachment of the upper pressure plate jig, the lower pressure plate jig and the chip and the substrate which are welded together in advance;
and eighthly, operating the servo press to perform the second stage of high-pressure bonding.
The invention realizes the high-precision bonding of the pre-welded large-size chip and the substrate, has accurate positioning, is performed in stages and has easy realization process.
Drawings
FIG. 1 is a schematic diagram of the general structure of the present invention;
FIG. 2 is a schematic view of the present invention in a front view;
fig. 3 is a schematic structural view of the transfer mechanism of the present invention;
fig. 4 is a schematic structural view of the transfer mechanism of the present invention in a rear view direction;
FIG. 5 is a schematic structural diagram of an adjustment platform of the present invention;
FIG. 6 is a schematic view of the pressing mechanism of the present invention;
FIG. 7 is a schematic cross-sectional view of the pressing mechanism of the present invention;
fig. 8 is a partially enlarged view at I in fig. 6.
Detailed Description
The invention is described in detail below with reference to the accompanying drawings:
a high-pressure flip-chip bonding machine for bonding a chip substrate after pre-welding comprises a lower frame 323 of the bonding machine, a pressing table base 301 is fixedly arranged on the lower frame 323 of the bonding machine, a box-shaped frame 302 is fixedly arranged on the pressing table base 301, a servo press 314 is fixedly arranged on a top plate of the box-shaped frame 302, four guide posts 303 are arranged between the top plate of the box-shaped frame 302 and the pressing table base 301, movable cross beams 304 are movably penetrated on the four guide posts 303, a working table plate 101 is fixedly arranged on a table surface of the pressing table base 301 between the four guide posts 303, a cylindrical adjusting platform base 201 is fixedly arranged on the working table plate 101 right below the servo press 314, a hemispherical groove 202 is arranged on the top surface of the cylindrical adjusting platform base 201, a hemispherical floating adjusting platform 203 is movably arranged in the hemispherical groove 202, a lower pressing plate 115 is arranged on the hemispherical floating adjusting platform 203, the lower pressure plate jig 115 is provided with a chip and a base plate 324 which are welded together in advance, the center of the lower bottom surface of the movable beam 304 is fixedly provided with a lower connecting plate 305, the lower bottom surface of the lower connecting plate 305 is provided with an upper jig sucking disc 306, and the upper jig sucking disc 306 is sucked with an upper pressure plate jig 119; parallel transfer guide rails 102 are provided on the table plate 101 on one side of the cylindrical leveling base 201, a portal transfer frame 104 is provided between the two transfer sliders 103, a lower platen jig positioning table 113 is fixedly provided on the table plate 101 on the right end between the two parallel transfer guide rails 102, lower platen jig positioning pins 114 are provided on the lower platen jig positioning table 113, an upper platen jig positioning table 117 is provided on the portal transfer frame top plate 116 of the portal transfer frame 104, and upper platen jig positioning pins 118 are provided on the upper platen jig positioning table 117.
A pressing plate jig accurate positioning and transferring mechanism of a large-pressure inverted bonding machine comprises a working table plate 101, a parallel transferring guide rail 102 is arranged on the working table plate 101 along the left-right horizontal direction, transferring sliders 103 are movably arranged on the parallel transferring guide rail 102, a door-shaped transferring frame 104 is arranged between the two transferring sliders 103, a starting end positioning column 105 is fixedly arranged on the right side of the parallel transferring guide rail 102, a terminal positioning column 106 is fixedly arranged on the left side of the parallel transferring guide rail 102, a starting end positioning suction cup 107 and a starting end positioning jackscrew 109 are respectively arranged on the starting end positioning column 105, a terminal positioning suction cup 108 and a terminal positioning jackscrew 110 are respectively arranged on the terminal positioning column 106, a transferring frame right end positioning disc 111 is arranged at the right side end of the door-shaped transferring frame 104, and a transferring frame left end positioning disc 112 is arranged at the left side end of the door-shaped transferring frame 104; a lower pressing plate jig positioning table 113 is fixedly arranged on the right working table plate 101 between the two parallel transfer guide rails 102, a lower pressing plate jig positioning pin 114 is arranged on the lower pressing plate jig positioning table 113, a lower pressing plate jig 115 is positioned on the lower pressing plate jig positioning table 113, an upper pressing plate jig positioning table 117 is arranged on a portal transfer frame top plate 116 of the portal transfer frame 104, an upper pressing plate jig positioning pin 118 is arranged on the upper pressing plate jig positioning table 117, and an upper pressing plate jig 119 is arranged on the upper pressing plate jig positioning table 117; a lifting claw 120 for transferring the lower platen jig is provided on the lower bottom surface of the gate-shaped transfer frame top plate 116.
A chip substrate high-pressure flip-chip bonding adjusting platform with self-leveling and locking functions comprises a working platform plate 101, a cylindrical adjusting platform base 201 is arranged on the working platform plate 101, a hemispherical groove 202 is arranged on the top surface of the cylindrical adjusting platform base 201, a hemispherical floating adjusting platform 203 is movably arranged in the hemispherical groove 202, a lower pressing plate jig adsorption area 204 is arranged on the hemispherical floating adjusting platform 203, a positive pressure compressed air inlet nozzle 205 and a negative pressure vacuum nozzle 206 are respectively arranged on the cylindrical adjusting platform base 201, the positive pressure compressed air inlet nozzle 205 and the negative pressure vacuum nozzle 206 are both communicated with the hemispherical groove 202, a primary positioning cantilever frame 207 is overhung outwards at equal interval of 120 degrees on the top excircle of the hemispherical floating adjusting platform 203, a counterweight lead screw 210 is arranged in the primary positioning cantilever frame 207 along the radial direction of the top circle of the hemispherical floating adjusting platform, a counterweight screw nut 211 is screwed on the counterweight screw rod 210, a primary positioning support cylinder 208 of the hemispherical floating adjusting platform 203 is arranged on the working platform plate 101 outside the cylindrical adjusting platform base 201, and an upward extending shaft 209 of the primary positioning support cylinder 208 is arranged right below the primary positioning cantilever frame 207.
A chip substrate high-pressure flip-chip bonding flexible pressurizing mechanism comprises a pressing table base 301, a box-shaped frame 302 is fixedly arranged on the pressing table base 301, a servo press 314 is fixedly arranged on a top plate of the box-shaped frame 302, four guide columns 303 are arranged between the top plate of the box-shaped frame 302 and the pressing table base 301, a movable cross beam 304 is movably connected onto the four guide columns 303 in a penetrating manner, a lower connecting plate 305 is fixedly arranged at the center of the lower bottom surface of the movable cross beam 304, an upper jig suction cup 306 is arranged on the lower bottom surface of the lower connecting plate 305, a cylindrical concave groove 307 is arranged on the upper top surface of the movable cross beam 304, a pressure sensor 308 is arranged at the bottom of the cylindrical concave groove 307, a pressure sensor top end middle threaded hole 309 is arranged on the upper top surface of the pressure sensor 308, a step-equipped stud 310 is screwed in the pressure sensor top end middle threaded hole, a stack spring 311 is arranged on the annular step of the stepped stud 310, a pressure conduction sleeve 312 is sleeved on the stepped stud 310 on the stack spring 311, a top cover 317 with a central hole groove is arranged at the top end of the cylindrical concave groove 307, and the shaft end of the lower pressure output shaft 313 of the servo press penetrates through the central hole of the top cover 317 with the central hole groove and then is abutted with the top end surface of the pressure conduction sleeve 312.
Four pre-pressing suspension cylinders 315 are arranged on the top plate of the box-shaped frame 302 at intervals outside the servo press 314, a movable joint 316 is fixedly arranged on the upper top surface of the movable cross beam 304, and the shaft ends of output shafts, extending downwards, of the pre-pressing suspension cylinders 315 are connected with the movable joint 316.
A guide groove 321 is formed in the outer cylindrical surface of the top cap 317 with the central hole groove in the vertical direction, a pair of needle roller bearings 322 is symmetrically arranged on the outer cylindrical surface of the top cap 317 with the central hole groove on two sides of the guide groove 321, an anti-rotation clamping table 318 is arranged on the pressing output shaft 313 of the servo press, an anti-rotation clamping frame 319 is clamped on the anti-rotation clamping table 318, an anti-rotation cantilever 320 is connected to the anti-rotation clamping frame 319, the lower end of the anti-rotation cantilever 320 is embedded in the guide groove 321, and the lower end of the anti-rotation cantilever 320 is clamped between the pair of needle roller bearings 322.
A high-pressure flip-chip bonding method for bonding after pre-welding of a chip substrate comprises the following steps:
firstly, moving a door-shaped transfer frame 104 to the initial end, accurately positioning the door-shaped transfer frame 104 through the matching of a positioning disc at the initial end of the transfer frame, an initial end positioning suction disc 107 and an initial end positioning jackscrew 109, positioning a lower pressure plate jig 115 on a lower pressure plate jig positioning table 113, positioning an upper pressure plate jig 119 on an upper pressure plate jig positioning table 117, and positioning a chip and a substrate 324 which are pre-welded together on the lower pressure plate jig 115;
secondly, lifting the lower pressing plate jig 115 by a lifting claw 120 which is arranged on the lower bottom surface of the top plate 116 of the door-shaped transfer frame and used for conveying the lower pressing plate jig, operating the door-shaped transfer frame 104 to move to the upper part of the hemispherical floating adjusting platform 203, placing the lower pressing plate jig 115, the chips and the substrate 324 which are welded together in advance on the lower pressing plate jig adsorption area 204 arranged on the hemispherical floating adjusting platform 203, and adsorbing the upper pressing plate jig 119 on an upper jig sucking disc 306 arranged on the lower bottom surface of the lower connecting plate 305 by operating the servo press 314;
thirdly, introducing positive pressure compressed air into the hemispherical groove 202 through a positive pressure compressed air inlet nozzle 205, and controlling the output shafts of the three primary positioning support cylinders 208 to retract downwards to enable the hemispherical floating adjusting platform 203 to be in a suspension state, wherein the suspension height is 12-15 microns;
fourthly, controlling a press lower pressing plate on the high-pressure bonding machine to press the hemispherical floating adjusting platform 203 under the pressure of 50-80 kilograms, so that the suspension height between the hemispherical floating adjusting platform 203 and the hemispherical groove 202 is reduced to 8 microns;
fifthly, controlling a proportional control valve on the negative pressure vacuum gas path to vacuumize the hemispherical groove 202 through the negative pressure vacuum suction nozzle 206, starting the proportional control valve on the positive pressure compressed air gas path when the proportional control valve on the negative pressure vacuum gas path is opened to the maximum, and gradually reducing the compressed air introduced into the hemispherical groove 202 until the proportional control valve is closed; finishing self-leveling and position locking of the hemispherical floating adjusting platform;
sixthly, adjusting the pressing resolution of the press to lay a foundation for the small-pressure pressing of the first stage of the press, wherein the specific process is as follows: after the movable cross beam 304 is lowered to a bonding station, the servo press 314 is pressed down with the pressure of 50-80 kilograms, the pressure is pressed on the pressure sensor 308 through the pressure conduction sleeve 312, the laminated spring 311 and the stud with the step 310 in sequence, the pressure sensed by the pressure sensor 308 is observed through the display of the pressure sensor, and then the pressure sensed by the pressure sensor 308 is changed by adjusting the extending length of the output shaft of the four prepressing suspension cylinders 315, so that the pressure sensed by the pressure sensor 308 reaches the designed specified value;
seventhly, placing the upper pressure plate jig, the lower pressure plate jig and the chip and the substrate which are welded together in advance on a bonding station, operating the servo press 314 to press down under small pressure in the first stage according to the adjusted pressure value, and completing the self-adaption and the bonding of the upper pressure plate jig, the lower pressure plate jig and the chip and the substrate which are welded together in advance;
eighth, operating the servo press 314 to perform the second stage of high pressure bonding; in the pressurizing process, the full closed-loop control of the pressurizing process is realized through the feedback of the pressure sensor 308, and the pressurizing precision is ensured; meanwhile, in the second stage of pressing process, the deformation of the pressed product can be measured by four precise length meters arranged on the upper pressing surface, so that the pressed deformation state of the detection device is realized.
Claims (4)
1. A high-pressure flip-chip bonding machine for bonding a chip substrate after pre-welding comprises a lower frame (323) of the bonding machine, a pressing table base (301) is fixedly arranged on the lower frame (323) of the bonding machine, a box-shaped frame (302) is fixedly arranged on the pressing table base (301), a servo press (314) is fixedly arranged on a top plate of the box-shaped frame (302), four guide columns (303) are arranged between the top plate of the box-shaped frame (302) and the pressing table base (301), movable cross beams (304) are movably connected on the four guide columns (303) in a penetrating manner, and the high-pressure flip-chip bonding machine is characterized in that a working table plate (101) is fixedly arranged on a table top of the pressing table base (301) between the four guide columns (303), a cylindrical platform adjusting base (201) is fixedly arranged on the working table plate (101) right below the servo press (314), and a hemispherical groove (202) is arranged on the top surface of the cylindrical platform adjusting base, a hemispherical floating leveling platform (203) is movably arranged in the hemispherical groove (202), a lower pressing plate jig (115) is arranged on the hemispherical floating leveling platform (203), a chip and a substrate (324) which are welded together in advance are arranged on the lower pressing plate jig (115), a lower connecting plate (305) is fixedly arranged at the center of the lower bottom surface of the movable cross beam (304), an upper jig sucking disc (306) is arranged on the lower bottom surface of the lower connecting plate (305), and the upper pressing plate jig (119) is adsorbed on the upper jig sucking disc (306); the parallel transfer guide rail (102) is arranged on the working table plate (101) on one side of the cylindrical transfer platform base (201), the door-shaped transfer frame (104) is arranged between the two transfer sliders (103), a lower press plate jig positioning table (113) is fixedly arranged on the working table plate (101) on the right end between the two parallel transfer guide rails (102), lower press plate jig positioning pins (114) are arranged on the lower press plate jig positioning table (113), an upper press plate jig positioning table (117) is arranged on a door-shaped transfer frame top plate (116) of the door-shaped transfer frame (104), and upper press plate jig positioning pins (118) are arranged on the upper press plate jig positioning table (117).
2. The high-pressure flip chip bonder used for bonding after pre-welding of chip substrates as claimed in claim 1, wherein a start-end positioning column (105) is fixedly arranged on the right side of the parallel transfer guide rail (102), a terminal positioning column (106) is fixedly arranged on the left side of the parallel transfer guide rail (102), a start-end positioning suction cup (107) and a start-end positioning jackscrew (109) are respectively arranged on the start-end positioning column (105), a terminal positioning suction cup (108) and a terminal positioning jackscrew (110) are respectively arranged on the terminal positioning column (106), a transfer frame right-end positioning plate (111) is arranged on the right side end of the door-shaped transfer frame (104), and a transfer frame left-end positioning plate (112) is arranged on the left side end of the door-shaped transfer frame (104); a lifting claw (120) for conveying the lower pressing plate jig is arranged on the lower bottom surface of the top plate (116) of the door-shaped transfer frame.
3. The high-pressure flip chip bonder for bonding after pre-welding of a chip substrate as claimed in claim 2, wherein a lower pressing plate fixture adsorption area (204) is arranged on the hemispherical floating leveling platform (203), a positive pressure compressed air intake nozzle (205) and a negative pressure vacuum suction nozzle (206) are respectively arranged on the cylindrical leveling platform base (201), the positive pressure compressed air intake nozzle (205) and the negative pressure vacuum suction nozzle (206) are both communicated with the hemispherical groove (202), a primary positioning cantilever frame (207) is cantilevered outwards at equal intervals of 120 degrees on the top excircle of the hemispherical floating leveling platform (203), a counterweight lead screw (210) is arranged in the primary positioning cantilever frame (207) along the radial direction of the top circle of the hemispherical floating leveling platform, a counterweight screw nut (211) is screwed on the counterweight lead screw (210), and a primary setting of the hemispherical floating leveling platform (203) is arranged on the working table plate (101) outside the cylindrical leveling platform base (201) And an upward extending shaft (209) of the primary positioning supporting cylinder (208) is arranged right below the primary positioning cantilever frame (207).
4. The high-pressure flip chip bonder for bonding after pre-welding of a chip substrate as claimed in claim 3, wherein a cylindrical concave groove (307) is arranged on the upper top surface of the movable beam (304), a pressure sensor (308) is arranged at the bottom of the cylindrical concave groove (307), a pressure sensor top end middle threaded hole (309) is arranged on the upper top surface of the pressure sensor (308), a stepped stud (310) is screwed in the pressure sensor top end middle threaded hole (309), a stack spring (311) is arranged on the annular step of the stepped stud (310), a pressure conduction sleeve (312) is sleeved on the stepped stud (310) on the stack spring (311), a recessed top cover (317) with a central hole is arranged at the top end of the cylindrical concave groove (307), and the shaft end of the pressing output shaft (313) of the servo press abuts against the top end surface of the pressure conduction sleeve (312) after penetrating through the central hole of the recessed top cover (317) with the central hole And (3) starting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922287078.7U CN210866130U (en) | 2019-12-19 | 2019-12-19 | Large-pressure flip-chip bonding machine for bonding chip substrate after pre-welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922287078.7U CN210866130U (en) | 2019-12-19 | 2019-12-19 | Large-pressure flip-chip bonding machine for bonding chip substrate after pre-welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210866130U true CN210866130U (en) | 2020-06-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922287078.7U Active CN210866130U (en) | 2019-12-19 | 2019-12-19 | Large-pressure flip-chip bonding machine for bonding chip substrate after pre-welding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210866130U (en) |
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2019
- 2019-12-19 CN CN201922287078.7U patent/CN210866130U/en active Active
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