CN210866126U - Chip substrate high-pressure flip-chip bonding flexible pressurizing mechanism - Google Patents
Chip substrate high-pressure flip-chip bonding flexible pressurizing mechanism Download PDFInfo
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- CN210866126U CN210866126U CN201922287080.4U CN201922287080U CN210866126U CN 210866126 U CN210866126 U CN 210866126U CN 201922287080 U CN201922287080 U CN 201922287080U CN 210866126 U CN210866126 U CN 210866126U
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Abstract
The utility model discloses a flexible loading system of chip substrate big pressure flip-chip bonding has solved how to carry out the flexible pressurization and to the problem of pressurization process implementation control in the pressurization initial stage. A cylindrical concave groove (307) is arranged on the upper top surface of a movable cross beam (304), a pressure sensor (308) is arranged at the bottom of the cylindrical concave groove, a stepped stud (310) is screwed in a threaded hole (309) in the middle of the top end of the pressure sensor, a stack spring (311) is arranged on an annular step of the stepped stud (310), a pressure conduction sleeve (312) is sleeved on the stepped stud (310) on the stack spring, a concave top cover (317) with a central hole is arranged at the top end of the cylindrical concave groove, and the shaft end of a pressing output shaft (313) of a servo press penetrates through the central hole of the concave top cover with the central hole and then abuts against the top end surface of the pressure conduction sleeve (312), so that the technological requirements of chip bonding of different specifications are met.
Description
Technical Field
The invention relates to flip bonding equipment, in particular to a flexible pressurizing mechanism on a high-pressure flip bonding machine when the high-pressure flip bonding is carried out on a chip substrate.
Background
The flip-chip bonding technology is characterized in that a bare chip is directly connected to a substrate through a solder ball, so that the lead connection between the chip and the substrate is omitted, the shortest connecting path is formed between the chip and the substrate, good electrical performance and high packaging speed can be obtained, the packaging density is high, the frequency characteristic after packaging is good, and the production efficiency is improved; with the continuous increase of the size specification of the chip, when the flip bonding is carried out, the reliable connection between the chip and the substrate can be realized only by needing larger bonding pressure, and the traditional flip bonding equipment can not meet the bonding requirement of the chip with larger specification and size; at present, for the flip bonding of a large-size chip, each manufacturer generally adopts a process scheme of step-by-step bonding of 'low-pressure flip alignment prewelding + high-pressure bonding', namely: and (3) carrying out alignment pre-welding on the bare chip and the substrate by adopting conventional flip-chip welding equipment, and then completing a bonding task by adopting high-pressure bonding equipment.
The method comprises the following steps that an adjusting platform is arranged on a bonding station of the high-pressure bonding equipment, a lower pressure plate jig is accurately positioned on the adjusting platform, a chip and a substrate which are pre-welded are accurately positioned on the lower pressure plate jig, an upper pressure plate jig which is accurately positioned is arranged on the chip and the substrate which are pre-welded together, and when the lower pressure plate of the high-pressure bonding press is pressed downwards onto the upper pressure plate jig, the high-pressure bonding press operates the lower pressure plate to press downwards at a certain pressure (generally 10 tons), so that the high-pressure bonding process of the chip and the substrate is completed; in the final bonding and pressing process, the upper and lower pressing plate jigs are required to be tightly attached to the pre-welded chip and the substrate, so that the bonding quality under high pressure can be ensured; the large-pressure bonding and pressing is carried out in two stages, in the first stage, the large-pressure bonding machine operates the lower pressing plate to press with smaller pressure, generally the pressure is dozens of kilograms, so that the whole processes of adaptation, alignment and bonding are completed among the upper pressing plate jig, the lower pressing plate jig, the chip and the substrate, and after the alignment and bonding are determined to be completed among the upper pressing plate jig, the lower pressing plate jig, the chip and the substrate, the large-pressure bonding in the second stage is carried out; when the pressurizing mechanism is used for carrying out large-pressure bonding at the final stage, the maximum pressure can finally reach 10 tons, and how to realize flexible pressurization of the pressure in the large-pressure initial stage process can prevent the chip and the substrate which are accurately positioned and prewelded together from dislocation at the initial stage of pressurization, and meanwhile, the chip and the substrate can be well adapted to each other, which is a problem faced by the pressurizing mechanism; in addition, in the process of applying large pressure, how to monitor the pressurizing process is also a problem to be solved on site.
Disclosure of Invention
The invention provides a chip substrate high-pressure flip-chip bonding flexible pressurizing mechanism, which solves the technical problems of how to carry out flexible pressurization at the initial stage of pressurization and monitoring the pressurization process.
The invention solves the technical problems by the following technical scheme:
a chip substrate high-pressure flip-chip bonding flexible pressurizing mechanism comprises a pressing table base, wherein a box-shaped frame is fixedly arranged on the pressing table base, a servo press is fixedly arranged on a top plate of the box-shaped frame, four guide posts are arranged between the top plate of the box-shaped frame and the pressing table base, a movable cross beam is movably connected onto the four guide posts in a penetrating manner, a lower connecting plate is fixedly arranged at the center of the lower bottom surface of the movable cross beam, an upper jig sucking disc is arranged on the lower bottom surface of the lower connecting plate, a cylindrical concave groove is arranged on the upper top surface of the movable cross beam, a pressure sensor is arranged at the bottom of the cylindrical concave groove, a threaded hole in the middle of the top end of the pressure sensor is arranged on the upper top surface of the pressure sensor, a stud with a step is screwed in the threaded hole in the middle of the top end of the pressure sensor, a stacked spring is arranged on an annular step, the top end of the cylindrical concave groove is provided with a groove top cover with a central hole, and the shaft end of the downward pressing output shaft of the servo press penetrates through the central hole of the groove top cover with the central hole and then is abutted with the top end face of the pressure transmission sleeve.
Four prepressing suspension cylinders are arranged on a top plate of the box-shaped frame at the outer side of the servo press at intervals, a movable joint is fixedly arranged on the upper top surface of the movable cross beam, and the shaft ends of output shafts extending downwards from the prepressing suspension cylinders are connected with the movable joint.
The cylindrical outer side surface of the top cover with the central hole groove is provided with a guide groove along the vertical direction, the cylindrical outer side surfaces of the top covers with the central hole groove on the two sides of the guide groove are symmetrically provided with a pair of needle roller bearings, an anti-rotation clamping table is arranged on a pressing output shaft of a servo press, an anti-rotation clamping frame is clamped on the anti-rotation clamping table, an anti-rotation cantilever is connected to the anti-rotation clamping frame, the lower end of the anti-rotation cantilever is embedded into the guide groove, and the lower end of the anti-rotation cantilever is clamped between the pair of needle roller bearings.
A chip substrate high-pressure flip-chip bonding flexible pressurization method comprises the steps that a cylindrical concave groove is formed in the upper top surface of a movable cross beam, a pressure sensor is arranged at the bottom of the cylindrical concave groove, a pressure sensor top end middle threaded hole is formed in the upper top surface of the pressure sensor, a stepped stud is screwed in the pressure sensor top end middle threaded hole, a stacked spring is arranged on an annular step of the stepped stud, a pressure conduction sleeve is sleeved on the stepped stud on the stacked spring, a top cover with a central hole is arranged at the top end of the cylindrical concave groove, and the shaft end of a pressing output shaft of a servo press penetrates through the central hole of the top cover with the central hole and then abuts against the top end face of the pressure conduction sleeve; the method is characterized by comprising the following steps:
firstly, the work of adjusting the pressing resolution of the press is carried out, the foundation is laid for the small-pressure pressing of the first stage of the press, and the specific process is as follows: after the movable cross beam is lowered to a bonding station, the servo press is pressed down with the pressure of 50-80 kilograms, the pressure is pressed on the pressure sensor through the pressure conduction sleeve, the laminated spring and the stud with the step in sequence, the pressure sensed by the pressure sensor is observed through a display of the pressure sensor, then the pressure sensed by the pressure sensor is changed by adjusting the extending lengths of output shafts of four prepressing suspension cylinders, and the pressure sensed by the pressure sensor reaches a designed specified value;
secondly, placing the upper pressing plate jig, the lower pressing plate jig and the chip and the substrate which are welded together in advance on a bonding station, operating the servo press to press down under small pressure in the first stage according to the adjusted pressure value, and completing the self-adaption and the bonding of the upper pressing plate jig, the lower pressing plate jig and the chip and the substrate which are welded together in advance;
finally, the servo press is operated to perform a second stage of high pressure bonding.
The maximum pressure of the pressurizing mechanism reaches 10 tons, the system is subjected to full closed-loop feedback, pressure mode feedback control can be realized, the device deformation feedback control can also be realized, and different process requirements are met; in the first stage of pressurization bonding, flexible pressure control and resolution ratio adjustability of the whole process of adaptation, alignment and lamination among the pressing plate jig, the lower pressing plate jig, the chip and the substrate are achieved, and bonding of chips with different specifications and sizes is achieved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view in cross section of the present invention;
fig. 3 is a partially enlarged view at I in fig. 1.
Detailed Description
The invention is described in detail below with reference to the accompanying drawings:
a chip substrate high-pressure flip-chip bonding flexible pressurizing mechanism comprises a pressing table base 301, a box-shaped frame 302 is fixedly arranged on the pressing table base 301, a servo press 314 is fixedly arranged on a top plate of the box-shaped frame 302, four guide columns 303 are arranged between the top plate of the box-shaped frame 302 and the pressing table base 301, a movable cross beam 304 is movably connected onto the four guide columns 303 in a penetrating manner, a lower connecting plate 305 is fixedly arranged at the center of the lower bottom surface of the movable cross beam 304, an upper jig suction cup 306 is arranged on the lower bottom surface of the lower connecting plate 305, a cylindrical concave groove 307 is arranged on the upper top surface of the movable cross beam 304, a pressure sensor 308 is arranged at the bottom of the cylindrical concave groove 307, a pressure sensor top end middle threaded hole 309 is arranged on the upper top surface of the pressure sensor 308, a step-equipped stud 310 is screwed in the pressure sensor top end middle threaded hole, a stack spring 311 is arranged on the annular step of the stepped stud 310, a pressure conduction sleeve 312 is sleeved on the stepped stud 310 on the stack spring 311, a top cover 317 with a central hole groove is arranged at the top end of the cylindrical concave groove 307, and the shaft end of the lower pressure output shaft 313 of the servo press penetrates through the central hole of the top cover 317 with the central hole groove and then is abutted with the top end surface of the pressure conduction sleeve 312.
Four pre-pressing suspension cylinders 315 are arranged on the top plate of the box-shaped frame 302 at intervals outside the servo press 314, a movable joint 316 is fixedly arranged on the upper top surface of the movable cross beam 304, and the shaft ends of output shafts, extending downwards, of the pre-pressing suspension cylinders 315 are connected with the movable joint 316.
A guide groove 321 is formed in the outer cylindrical surface of the top cap 317 with the central hole groove in the vertical direction, a pair of needle roller bearings 322 is symmetrically arranged on the outer cylindrical surface of the top cap 317 with the central hole groove on two sides of the guide groove 321, an anti-rotation clamping table 318 is arranged on the pressing output shaft 313 of the servo press, an anti-rotation clamping frame 319 is clamped on the anti-rotation clamping table 318, an anti-rotation cantilever 320 is connected to the anti-rotation clamping frame 319, the lower end of the anti-rotation cantilever 320 is embedded in the guide groove 321, and the lower end of the anti-rotation cantilever 320 is clamped between the pair of needle roller bearings 322.
A chip substrate high-pressure flip-chip bonding flexible pressurization method comprises the steps that a cylindrical concave groove 307 is formed in the upper top surface of a movable cross beam 304, a pressure sensor 308 is arranged at the bottom of the cylindrical concave groove 307, a pressure sensor top end middle threaded hole 309 is formed in the upper top surface of the pressure sensor 308, a stepped stud 310 is screwed in the pressure sensor top end middle threaded hole 309, a superposed spring 311 is arranged on an annular step of the stepped stud 310, a pressure conduction sleeve 312 is sleeved on the stepped stud 310 on the superposed spring 311, a central hole groove top cover 317 is arranged at the top end of the cylindrical concave groove 307, and the shaft end of a lower pressure output shaft 313 of a servo press penetrates through a central hole of the central hole groove top cover 317 and then abuts against the top end face of the pressure conduction sleeve 312; the method is characterized by comprising the following steps:
firstly, the work of adjusting the pressing resolution of the press is carried out, the foundation is laid for the small-pressure pressing of the first stage of the press, and the specific process is as follows: after the movable cross beam 304 is lowered to a bonding station, the servo press 314 is pressed down with the pressure of 50-80 kilograms, the pressure is pressed on the pressure sensor 308 through the pressure conduction sleeve 312, the laminated spring 311 and the stud with the step 310 in sequence, the pressure sensed by the pressure sensor 308 is observed through the display of the pressure sensor, and then the pressure sensed by the pressure sensor 308 is changed by adjusting the extending length of the output shaft of the four prepressing suspension cylinders 315, so that the pressure sensed by the pressure sensor 308 reaches the designed specified value;
secondly, placing the upper pressure plate jig, the lower pressure plate jig and the chip and the substrate which are welded together in advance on a bonding station, operating the servo press 314 to perform low-pressure pressing in the first stage at the adjusted pressure value, and completing the self-adaption and the bonding of the upper pressure plate jig, the lower pressure plate jig and the chip and the substrate which are welded together in advance;
finally, servo press 314 is operated to perform a second stage of high pressure bonding.
Claims (3)
1. A chip substrate high-pressure flip-chip bonding flexible pressurizing mechanism comprises a pressing table base (301), a box-shaped frame (302) is fixedly arranged on the pressing table base (301), a servo press (314) is fixedly arranged on a top plate of the box-shaped frame (302), four guide posts (303) are arranged between the top plate of the box-shaped frame (302) and the pressing table base (301), a movable cross beam (304) is movably connected onto the four guide posts (303) in a penetrating manner, the mechanism is characterized in that a lower connecting plate (305) is fixedly arranged at the center of the lower bottom surface of the movable cross beam (304), an upper jig suction cup (306) is arranged on the lower bottom surface of the lower connecting plate (305), a cylindrical concave groove (307) is arranged on the upper top surface of the movable cross beam (304), a pressure sensor (308) is arranged at the bottom of the cylindrical concave groove (307), a pressure sensor top middle threaded hole (309) is arranged on the upper top surface of the pressure sensor (308, a threaded hole (309) in the middle of the top end of the pressure sensor is in threaded connection with a stepped stud (310), an annular step of the stepped stud (310) is provided with a laminated spring (311), the stepped stud (310) on the laminated spring (311) is sleeved with a pressure conduction sleeve (312), the top end of a cylindrical concave groove (307) is provided with a concave top cover (317) with a central hole, and the shaft end of a downward pressing output shaft (313) of a servo press penetrates through the central hole of the concave top cover (317) with the central hole and then is abutted to the top end face of the pressure conduction sleeve (312).
2. The large-pressure flip-chip bonding flexible pressurizing mechanism for the chip substrate as claimed in claim 1, wherein four prepressing suspension cylinders (315) are arranged on the top plate of the box-shaped frame (302) at intervals outside the servo press (314), a movable joint (316) is fixedly arranged on the upper top surface of the movable cross beam (304), and the output shaft ends of the prepressing suspension cylinders (315) extending downwards are connected with the movable joint (316).
3. The large-pressure flip-chip bonding flexible pressurizing mechanism for the chip substrate according to claim 1, wherein a guide groove (321) is formed in the cylindrical outer side surface of the top cover (317) with the central hole groove in the vertical direction, a pair of needle roller bearings (322) are symmetrically arranged on the cylindrical outer side surface of the top cover (317) with the central hole groove on two sides of the guide groove (321), an anti-rotation clamping table (318) is arranged on a downward-pressing output shaft (313) of the servo press, an anti-rotation clamping frame (319) is clamped on the anti-rotation clamping table (318), an anti-rotation cantilever (320) is connected to the anti-rotation clamping frame (319), the lower end of the anti-rotation cantilever (320) is embedded in the guide groove (321), and the lower end of the anti-rotation cantilever (320) is clamped between the pair of needle roller bearings (322).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922287080.4U CN210866126U (en) | 2019-12-19 | 2019-12-19 | Chip substrate high-pressure flip-chip bonding flexible pressurizing mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922287080.4U CN210866126U (en) | 2019-12-19 | 2019-12-19 | Chip substrate high-pressure flip-chip bonding flexible pressurizing mechanism |
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| CN210866126U true CN210866126U (en) | 2020-06-26 |
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| CN201922287080.4U Active CN210866126U (en) | 2019-12-19 | 2019-12-19 | Chip substrate high-pressure flip-chip bonding flexible pressurizing mechanism |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110993520A (en) * | 2019-12-19 | 2020-04-10 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Chip substrate high-pressure flip-chip bonding flexible pressurizing mechanism |
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- 2019-12-19 CN CN201922287080.4U patent/CN210866126U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110993520A (en) * | 2019-12-19 | 2020-04-10 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Chip substrate high-pressure flip-chip bonding flexible pressurizing mechanism |
| CN110993520B (en) * | 2019-12-19 | 2024-08-06 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | High-pressure flip-chip bonding flexible pressurizing mechanism for chip substrate |
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