CN213702415U - Pressurizing mechanism for flip-chip bonding machine - Google Patents
Pressurizing mechanism for flip-chip bonding machine Download PDFInfo
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- CN213702415U CN213702415U CN202022196925.1U CN202022196925U CN213702415U CN 213702415 U CN213702415 U CN 213702415U CN 202022196925 U CN202022196925 U CN 202022196925U CN 213702415 U CN213702415 U CN 213702415U
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Abstract
The utility model belongs to the technical field of the flip-chip bonding, concretely relates to loading system for flip-chip bonding machine, this loading system for flip-chip bonding machine includes: a platen base; the supporting frame is positioned on the pressing table base; one end of each guide post is fixed on the pressing table base, and the other end of each guide post is fixed on the top plate of the support frame; the movable pressing block is movably connected among the four guide columns in a penetrating way; the pressing plate is fixedly connected to the lower bottom surface of the movable pressing block; the adsorption component is arranged on the lower bottom surface of the pressing plate and is used for adsorbing the chip; the driving assembly is fixed on the support frame and connected with the top surface of the movable pressing block and is used for pressing the movable pressing block downwards along the axial direction of each guide column so as to press the chip adsorbed by the adsorption assembly and the corresponding substrate placed in the pressing area on the pressing table base; the utility model discloses a put at activity briquetting four corners side and central point and all set up servo press, can make the even pressfitting of activity briquetting atress promptly chip and base plate, improve the bonding quality.
Description
Technical Field
The utility model belongs to the technical field of the flip-chip bonding, concretely relates to loading system for flip-chip bonding machine.
Background
The flip-chip bonding technology is characterized in that a bare chip is directly connected to a substrate through a solder ball, so that the lead connection between the chip and the substrate is omitted, the shortest connecting path is formed between the chip and the substrate, good electrical performance and high packaging speed can be obtained, the packaging density is high, the frequency characteristic after packaging is good, and the production efficiency is improved; with the continuous increase of the size specification of the chip, when the flip bonding is carried out, the reliable connection between the chip and the substrate can be realized only by needing larger bonding pressure, and the traditional flip bonding equipment can not meet the bonding requirement of the chip with larger specification and size; at present, for the flip bonding of a large-size chip, each manufacturer generally adopts a process scheme of step-by-step bonding of 'low-pressure flip alignment prewelding + high-pressure bonding', namely: and (3) carrying out alignment pre-welding on the bare chip and the substrate by adopting conventional flip-chip welding equipment, and then completing a bonding task by adopting high-pressure bonding equipment.
The method comprises the following steps that an adjusting platform is arranged on a bonding station of the high-pressure bonding equipment, a lower pressure plate jig is accurately positioned on the adjusting platform, a chip and a substrate which are pre-welded are accurately positioned on the lower pressure plate jig, an upper pressure plate jig which is accurately positioned is arranged on the chip and the substrate which are pre-welded together, and when the lower pressure plate of the high-pressure bonding press is pressed downwards onto the upper pressure plate jig, the high-pressure bonding press operates the lower pressure plate to press downwards at a certain pressure (generally 10 tons), so that the high-pressure bonding process of the chip and the substrate is completed; in the final bonding and pressing process, the upper and lower pressing plate jigs are required to be tightly attached to the pre-welded chip and the substrate, so that the bonding quality under high pressure can be ensured; the large-pressure bonding and pressing is carried out in two stages, in the first stage, the large-pressure bonding machine operates the lower pressing plate to press with smaller pressure, generally the pressure is dozens of kilograms, so that the whole processes of adaptation, alignment and bonding are completed among the upper pressing plate jig, the lower pressing plate jig, the chip and the substrate, and after the alignment and bonding are determined to be completed among the upper pressing plate jig, the lower pressing plate jig, the chip and the substrate, the large-pressure bonding in the second stage is carried out; when the pressurizing mechanism is used for carrying out large-pressure bonding at the final stage, the maximum pressure can finally reach 10 tons, and how to realize flexible pressurization of the pressure in the large-pressure initial stage process can prevent the chip and the substrate which are accurately positioned and prewelded together from dislocation at the initial stage of pressurization, and meanwhile, the chip and the substrate can be well adapted to each other, which is a problem faced by the pressurizing mechanism; in addition, in the process of applying large pressure, how to monitor the pressurizing process is also a problem to be solved on site.
But because the traditional bonder pressurizing device adopts a single servo press, the stress of the press plate is not uniform, and the bonding between the chip and the substrate is not firm.
Therefore, it is necessary to develop a new pressing mechanism for flip chip bonding machine to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a loading system for flip-chip bonding machine to solve the problem that how to realize chip and the even bonding of base plate.
In order to solve the technical problem, the utility model provides a loading system for flip-chip bonding machine, it includes: a platen base; the supporting frame is positioned on the pressing table base; one end of each guide post is fixed on the pressing table base, and the other end of each guide post is fixed on the top plate of the support frame; the movable pressing block is movably connected among the four guide columns in a penetrating way; the pressing plate is fixedly connected to the lower bottom surface of the movable pressing block; the adsorption component is arranged on the lower bottom surface of the pressing plate and is used for adsorbing the chip; and the driving assembly is fixed on the support frame and connected with the top surface of the movable pressing block and is used for pressing the movable pressing block downwards along the axial direction of each guide column so as to press the chip adsorbed by the adsorption assembly and the corresponding substrate placed in the pressing area on the pressing table base.
Further, the drive assembly includes: the device comprises a controller, a main servo press and four slave servo presses, wherein the main servo press and the four slave servo presses are fixed on a support frame and electrically connected with the controller; the pressing output shafts of the master servo press are connected with the center of the movable pressing block, the pressing output shafts of the four slave servo presses are respectively and correspondingly arranged on the sides of the four guide posts on the movable pressing block, namely, the controller is suitable for driving the master servo press and the four slave servo presses to press the movable pressing block.
Further, the controller synchronously drives the master servo press and the four slave servo presses.
Further, the adsorption assembly includes: the sucker is arranged on the lower bottom surface of the pressing plate; the sucking disc is suitable for adsorbing the chip.
Further, the drive assembly further comprises: the pressure sensor is electrically connected with the controller; the pressure sensor is arranged at the joint of the pressing output shaft of the main servo press and the movable pressing block, namely the pressure sensor is suitable for collecting the bearing pressure value of the movable pressing block, and the controller is suitable for adjusting the displacement of each servo press according to the bearing pressure value of the movable pressing block.
Further, a cylindrical concave groove is formed in the upper top surface of the movable pressing block, and the pressure sensor is located at the bottom of the cylindrical concave groove; the upper top surface of the pressure sensor is provided with a threaded hole in the middle of the top end of the pressure sensor, a stepped stud is screwed in the threaded hole in the middle of the top end of the pressure sensor, a stacked spring is arranged on an annular step of the stepped stud, a pressure conduction sleeve is sleeved on the stepped stud on the stacked spring, and a top cover with a central hole and a groove is arranged at the top end of the cylindrical concave groove; and the shaft end of a pressing output shaft of the main servo press penetrates through a central hole of a top cover with a central hole groove and then is abutted with the top end surface of the pressure transmission sleeve.
Furthermore, the lower bottom surface of the pressing plate is provided with at least two distance sensors electrically connected with the controller, namely the controller is suitable for judging whether the movable pressing block deviates according to the distance between the pressing plate and the pressing table base acquired by the distance sensors.
The beneficial effects of the utility model are that, the utility model discloses an all set up servo press in activity briquetting four corners side and central point, can make activity briquetting atress evenly be the even pressfitting of chip and base plate, improve the bonding quality.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a view showing a structure of a pressing mechanism for a flip chip bonding machine according to the present invention;
FIG. 2 is a schematic block diagram of a pressing mechanism for a flip chip bonding machine according to the present invention;
fig. 3 is a mounting structure diagram of the pressure sensor of the present invention;
fig. 4 is a top view of the movable pressing block of the present invention.
In the figure:
the device comprises a pressing table base 1, a support frame 2, a guide post 3, a movable pressing block 4, a cylindrical concave groove 41, a stud with a step 42, a laminated spring 43, a pressure conduction sleeve 44, a pressing plate 5, an adsorption component 6, a driving component 7, a main servo press 71, a slave servo press 72, a distance sensor 8 and a pressure sensor 9.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
FIG. 1 is a view showing a structure of a pressing mechanism for a flip chip bonding machine according to the present invention;
fig. 4 is a top view of the movable pressing block of the present invention.
In the present embodiment, as shown in fig. 1 and 4, the present embodiment provides a pressing mechanism for a flip chip bonder, including: a platen base 1; the support frame 2 is positioned on the pressing table base 1; one end of each guide post 3 is fixed on the pressing table base 1, and the other end of each guide post 3 is fixed on a top plate of the support frame 2; the movable pressing block 4 is movably connected among the four guide posts 3 in a penetrating way; the pressing plate 5 is fixedly connected to the lower bottom surface of the movable pressing block 4; the adsorption component 6 is arranged on the lower bottom surface of the pressure plate 5 and is used for adsorbing the chip; and the driving assembly 7 is fixed on the support frame 2 and connected with the top surface of the movable pressing block 4 and is used for pressing the movable pressing block 4 downwards along the axial direction of each guide column 3 so as to press the chip adsorbed by the adsorption assembly 6 and the corresponding substrate placed in the pressing area on the pressing table base 1.
In this embodiment, the servo presses are disposed at the four corners and the center of the movable pressing block 4, so that the movable pressing block 4 is stressed uniformly, i.e., the chip and the substrate are pressed uniformly, and the bonding quality is improved.
Fig. 2 is a schematic block diagram of a pressing mechanism for a flip chip bonding machine according to the present invention.
In the present embodiment, as shown in fig. 2, the driving assembly 7 includes: the device comprises a controller, a main servo press 71 and four slave servo presses 72, wherein the main servo presses 71 and the four slave servo presses 72 are fixed on a support frame 2 and electrically connected with the controller; the pressing output shafts of the master servo press are connected with the center of the movable pressing block 4, the pressing output shafts of the four slave servo presses 72 are respectively and correspondingly arranged at the sides of the four guide posts 3 on the movable pressing block 4, namely, the controller is suitable for driving the master servo press 71 and the four slave servo presses 72 to press the movable pressing block 4.
In this embodiment, the controller may be, but is not limited to, an STM32 series single chip microcomputer.
In this embodiment, the controller drives the master servo press 71 and the four slave servo presses 72 synchronously.
In this embodiment, the movable pressing block 4 is uniformly applied with force from five directions, so that the stress on the chip and the substrate is more uniform, and the bonding effect is better.
In the present embodiment, the adsorption assembly 6 includes: a sucker arranged on the lower bottom surface of the pressing plate 5; the sucking disc is suitable for adsorbing the chip.
Fig. 3 is a mounting structure diagram of the pressure sensor of the present invention.
In this embodiment, as shown in fig. 3, the driving assembly 7 further includes: the pressure sensor 9 is electrically connected with the controller; the pressure sensor 9 is arranged at the joint of the lower pressure output shaft of the main servo press and the movable pressing block 4, namely, the pressure sensor 9 is suitable for collecting the bearing pressure value of the movable pressing block 4, and the controller is suitable for adjusting the displacement of each servo press according to the bearing pressure value of the movable pressing block 4.
In the present embodiment, the pressure sensor 9 can be, but is not limited to, FR07-YH501-B-1-40MPA-P-S-ZC pressure sensor 9.
In this embodiment, the pressure sensor 9 senses the output pressure, and the controller can control the corresponding servo pressure to adjust the output pressure in time, so as to achieve the bonding pressure required by the chip and the substrate.
In this embodiment, a cylindrical concave groove 41 is provided on the upper top surface of the movable pressing block 4, and the pressure sensor 9 is located at the bottom of the cylindrical concave groove 41; a threaded hole in the middle of the top end of the pressure sensor 9 is formed in the upper top surface of the pressure sensor 9, a stepped stud 42 is screwed in the threaded hole in the middle of the top end of the pressure sensor 9, a laminated spring 43 is arranged on an annular step of the stepped stud 42, a pressure conduction sleeve 44 is sleeved on the stepped stud 42 on the laminated spring 43, and a groove top cover with a central hole is arranged at the top end of the cylindrical concave groove 41; the shaft end of the pressing output shaft of the main servo press penetrates through the center hole of the top cover with the center hole groove and then is abutted with the top end surface of the pressure transmission sleeve 44.
In this embodiment, the lower bottom surface of the pressing plate 5 is provided with at least two distance sensors 8 electrically connected to the controller, that is, the controller is adapted to determine whether the movable pressing block 4 is deviated according to the distance between the pressing plate 5 and the pressing table base 1 acquired by the distance sensors 8.
In the present embodiment, the distance sensor 8 may employ, but is not limited to, the LS-92F distance sensor 8.
In this embodiment, when the movable pressing block 4 deviates or inclines, the movable pressing block can be adjusted or maintained in time, so that the normal operation of the pressurizing mechanism for the flip bonding machine is ensured, and the bonding effect is ensured.
To sum up, the utility model discloses an all set up servo press in activity briquetting four corners side and central point and put, can make the even pressfitting of activity briquetting atress promptly chip and base plate, improve the bonding quality.
The components selected for use in the present application (components not illustrated for specific structures) are all common standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experimentation. Moreover, the software programs referred to in the present application are all prior art, and the present application does not relate to any improvement of the software programs.
In the description of the embodiments of the present invention, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (7)
1. A pressure mechanism for a flip chip bonder is characterized by comprising:
a platen base;
the supporting frame is positioned on the pressing table base;
one end of each guide post is fixed on the pressing table base, and the other end of each guide post is fixed on the top plate of the support frame;
the movable pressing block is movably connected among the four guide columns in a penetrating way;
the pressing plate is fixedly connected to the lower bottom surface of the movable pressing block;
the adsorption component is arranged on the lower bottom surface of the pressing plate and is used for adsorbing the chip;
and the driving assembly is fixed on the support frame and connected with the top surface of the movable pressing block and is used for pressing the movable pressing block downwards along the axial direction of each guide column so as to press the chip adsorbed by the adsorption assembly and the corresponding substrate placed in the pressing area on the pressing table base.
2. The pressing mechanism for a flip chip bonder of claim 1,
the drive assembly includes: the device comprises a controller, a main servo press and four slave servo presses, wherein the main servo press and the four slave servo presses are fixed on a support frame and electrically connected with the controller;
the pressing output shaft of the main servo press is connected with the center of the movable pressing block, and the pressing output shafts of the four slave servo presses are respectively and correspondingly arranged at the sides of four guide posts on the movable pressing block, namely
The controller is suitable for driving the main servo press and the four slave servo presses to press down the movable pressing blocks.
3. The pressing mechanism for a flip chip bonder of claim 2,
the controller synchronously drives the master servo press and the four slave servo presses.
4. The pressing mechanism for a flip chip bonder of claim 1,
the adsorption assembly includes: the sucker is arranged on the lower bottom surface of the pressing plate;
the sucking disc is suitable for adsorbing the chip.
5. The pressing mechanism for a flip chip bonder of claim 2,
the drive assembly further includes: the pressure sensor is electrically connected with the controller;
the pressure sensor is arranged at the joint of the lower pressure output shaft of the main servo press and the movable pressing block, namely
The pressure sensor is suitable for collecting the bearing pressure value of the movable pressing block, and the controller is suitable for adjusting the displacement of each servo press according to the bearing pressure value of the movable pressing block.
6. The pressing mechanism for a flip chip bonder of claim 5,
a cylindrical concave groove is formed in the upper top surface of the movable pressing block, and the pressure sensor is located at the bottom of the cylindrical concave groove;
the upper top surface of the pressure sensor is provided with a threaded hole in the middle of the top end of the pressure sensor, a stepped stud is screwed in the threaded hole in the middle of the top end of the pressure sensor, a stacked spring is arranged on an annular step of the stepped stud, a pressure conduction sleeve is sleeved on the stepped stud on the stacked spring, and a top cover with a central hole and a groove is arranged at the top end of the cylindrical concave groove;
and the shaft end of a pressing output shaft of the main servo press penetrates through a central hole of a top cover with a central hole groove and then is abutted with the top end surface of the pressure transmission sleeve.
7. The pressing mechanism for a flip chip bonder of claim 2,
the lower bottom surface of the pressing plate is provided with at least two distance sensors electrically connected with the controller, namely
The controller is suitable for judging whether the movable pressing block deviates or not according to the distance between the pressing plate and the pressing table base, which is acquired by the distance sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022196925.1U CN213702415U (en) | 2020-09-29 | 2020-09-29 | Pressurizing mechanism for flip-chip bonding machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022196925.1U CN213702415U (en) | 2020-09-29 | 2020-09-29 | Pressurizing mechanism for flip-chip bonding machine |
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| CN213702415U true CN213702415U (en) | 2021-07-16 |
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| CN202022196925.1U Active CN213702415U (en) | 2020-09-29 | 2020-09-29 | Pressurizing mechanism for flip-chip bonding machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116960035A (en) * | 2023-09-20 | 2023-10-27 | 微纳动力(北京)科技有限责任公司 | Wafer bonding device and wafer bonding system |
-
2020
- 2020-09-29 CN CN202022196925.1U patent/CN213702415U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116960035A (en) * | 2023-09-20 | 2023-10-27 | 微纳动力(北京)科技有限责任公司 | Wafer bonding device and wafer bonding system |
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