CN210789570U - Direct welding device for power device - Google Patents
Direct welding device for power device Download PDFInfo
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- CN210789570U CN210789570U CN201920718308.8U CN201920718308U CN210789570U CN 210789570 U CN210789570 U CN 210789570U CN 201920718308 U CN201920718308 U CN 201920718308U CN 210789570 U CN210789570 U CN 210789570U
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- power device
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Abstract
The utility model provides a direct welding device for power devices; the power device direct welding device comprises a copper substrate, a DBC board, a chip, a silk-screen welding paste board, a metal clamp and a metal solder; the copper substrate, the DBC board and the chip form a power device together; the copper substrate is positioned at the bottom end of the whole power device; the DBC plate is welded on the copper substrate; the chip is welded on the DBC board; the metal clamp clamps the copper substrate; the surface of the silk-screen welding paste plate is provided with silk-screen patterns, and the metal solder is pre-coated on the silk-screen patterns of the silk-screen welding paste plate; the utility model discloses can realize the direct welding of power device and radiator, reduce welding voidage, solder waste and welding excessive tin flash simultaneously, be applicable to various packaging form, low cost.
Description
Technical Field
The utility model relates to a power electronics heat dissipation technical field especially relates to a power device direct welding device.
Background
The power device is divided into two main packaging forms, namely a discrete device and a power module. In a circuit system, the power devices in two types of packaging forms need reasonable heat dissipation design.
First, the heat dissipation design of discrete devices includes two types of approaches: 1) the device is directly assembled with a radiator, and the device is connected with the radiator through a heat conduction insulating gasket; 2) the aluminum base plate with the insulating layer is directly welded, and the welding material is metal solder, so that the heat conducting performance is relatively better. The direct welding adopts a reflow welding mode, and directly heats and melts the solder, so that the copper heat dissipation plate of the power device and the device radiator (plate) form metal solder interconnection. However, when the solder melts, the flux and the like generate volatile gases, and the volatile gases are difficult to discharge in a non-vacuum environment, and after the soldering is completed, the void ratio is often high.
Secondly, the heat dissipation design of the power module is more difficult, and the traditional welding mode of coating soldering paste can also generate a serious void ratio problem due to the large area of the copper substrate of the power module; another reason is that the conventional solder paste coating method requires the area of the applied solder paste to be equal to the area of the copper substrate of the power device, the solder waste is serious, and the phenomenon of the flash is serious.
Therefore, the heat dissipation design scheme of the power module is often reversed, and then, the heat conduction silicone grease with poor heat conductivity is used as a transition material of the contact surface of the module and the radiator to be directly assembled; however, the heat conduction silicone grease has the natural disadvantage that the heat conductivity is far lower than that of metal, and the optimal connection mode of the power module and the radiator is metal nondestructive interconnection.
In order to solve the problem, many well-known companies in the industry begin to develop integrated products of power modules and radiators, which meet the application requirements of certain specific fields to a certain extent; but the packaging form is special, can not be used universally in most application fields, and in addition, the price is high, which is not enough to meet the market demand at all.
SUMMERY OF THE UTILITY MODEL
In order to solve the defects of the prior art, the utility model aims to provide a power device direct welding device to solve the defects in the prior art.
In order to achieve the above object, the utility model provides a power device direct welding device, direct welding device includes copper base plate, DBC board, chip, silk screen printing welding cream board, metal fixture and metallic solder; the copper substrate, the DBC board and the chip form a power device together; the copper substrate is positioned at the bottom end of the whole power device; the DBC plate is welded on the copper substrate; the chip is welded on the DBC board; the metal clamp clamps the copper substrate; and the surface of the silk-screen welding paste plate is provided with silk-screen patterns, and the metal solder is pre-coated on the silk-screen patterns of the silk-screen welding paste plate.
Preferably, the solder coating density at the chip site is greater than the solder coating density at the DBC board site.
Preferably, the silk-screen patterns on the surface of the silk-screen soldering paste plate are composed of various simple patterns, a certain distance is formed between the patterns, and the distance is 1um-5 mm.
Preferably, the metal clamp is fixedly connected with the copper substrate through threads, and a threaded through hole is formed in the fixedly connected position, so that pressure of 50N-200N can be generated.
Preferably, the metal solder is coated on the silk-screen welding paste board at a low temperature, and the temperature of a welding reflux curve is 125-200 ℃.
The working principle of the utility model is as follows:
1) the metal solder is pre-coated on the surface of a copper substrate of the power device or directly coated on the surface of the silk-screen welding paste plate;
2) the power device is fixed by the metal clamp;
3) alignment marks are arranged on the metal clamp, the screen printing paste welding plate and the DBC plate, and the metal clamp, the screen printing paste welding plate and the DBC plate are aligned at the same time or in pairs; the alignment mark is designed for laser self-alignment; or designing an alignment pattern, an alignment clamping groove and the like to perform manual alignment to perform solder paste pre-coating;
4) after alignment, the silk-screen patterns on the silk-screen soldering paste plate can be accurately coated on the corresponding positions of the power device;
5) and taking away the silk-screen printing soldering paste plate after the coating is finished, wherein the silk-screen printing soldering paste plate can be repeatedly utilized.
Compared with the prior art, the beneficial effects of the utility model are embodied in:
1) the power device is directly welded, so that the device and the radiator are interconnected through the metal solder, and the heat dissipation efficiency of the product is greatly improved; the thermal conductivity of the contact interface reaches 250-300W/mk, which is much higher than that of the prior art thermal conductive silicone grease by 1-5W/mk.
2) And pre-coating a soldering paste technology, wherein the internal packaging layout of the power device, and the stress and deformation generated on the surface of the copper substrate are fully considered during the design of the silk-screen soldering paste plate.
3) The solder filling amount of a welding interface is reflected through reasonable change of the pattern density of the silk screen printing plate; through the design of the silk-screen welding paste plate, the power device copper substrate surface micro deformation can be fully filled.
4) The gaps of the silk screen plate patterns can release gas in a contact interface in the process of applying pressure on the power device and the radiator for assembling.
5) The pattern gaps of the silk screen plate can continuously release volatile gas generated by the soldering flux in the process of welding the power device and the radiator at low temperature; the large-area welding is realized, and the void ratio is very low.
6) The direct welding method is suitable for various packaging form power modules and is suitable for large-scale automatic application.
7) The utility model discloses low cost is fit for terminal product manufacture factory and uses.
8) Use the utility model discloses, the product of same power level can reduce the cost input of radiator material by a wide margin, and the volume that makes the system simultaneously is littleer, and the cost is lower.
9) The utility model discloses be suitable for various power component products, like converter, dc-to-ac converter, machine controller etc..
Drawings
Fig. 1 is a schematic structural diagram of a power device direct welding device according to the present invention.
Detailed Description
In order to further understand the structure, characteristics and other objects of the present invention, the following detailed description is given with reference to the accompanying preferred embodiments, which are only used to illustrate the technical solution of the present invention and are not intended to limit the present invention.
Firstly, as shown in fig. 1, fig. 1 is a schematic structural diagram of a power device direct welding apparatus according to the present invention; the direct welding device mainly comprises a copper substrate 1, a DBC board 2, a chip 3, a silk-screen welding paste board 4, a metal clamp 5 and a metal solder 6; the copper substrate 1, the DBC board 2 and the chip 3 jointly form a power device; the copper substrate 1 is positioned at the bottom end of the whole power device; the DBC plate 2 is welded on the copper substrate 1; the chip 3 is soldered on the DBC board 2; the metal clamp 5 clamps the copper substrate 1; the surface of the silk-screen welding paste plate 4 is provided with silk-screen patterns, and the metal solder 6 is pre-coated on the silk-screen patterns of the silk-screen welding paste plate 4.
The parts of the copper substrate 1 in direct metal contact with the reference surface of the heat sink have good metal-level thermal conductivity, but the tiny convex parts are easy to generate air gaps, and the parts need to be filled with metal solder. The corresponding position of the DBC plate 2 and the corresponding position of the chip 3 in the power device can cause the copper substrate 1 of the power device to generate extremely tiny convex deformation. At the corresponding position of the chip 3, because the stress of the chip 3 and the soldering stress of the DBC board 2 are simultaneously superposed, the stress variation generated on the copper substrate 1 is more obvious.
When the power device is in high-voltage large-current power, the chip 3 can generate high heat energy and needs to be dissipated; the position of the chip 3 is both the heat source position and the position where an air gap is easily generated in contact with the heat sink.
Further, the design of the silk-screen solder paste plate 4 follows the following design rules: 1) coating low-density soldering paste on the good metal contact part of the power device and the radiator; 2) the coating density of the soldering paste is increased at the position of the DBC board 2 of the power device; 3) the solder paste coating density is further increased at the chip 3 position of the power device.
The method can efficiently fill the air gap caused by the surface deformation of the copper substrate 1; the air gap is filled with metal solder 6, so that the copper substrate 1 and the radiator form good metal interconnection, and the radiating efficiency is greatly improved.
In addition, the patterns on the screen printing soldering paste plate 4 can be formed by various simple patterns such as circles, squares, diamonds and polygons, the patterns are arranged into an array form according to a certain rule, certain intervals are formed among the patterns, and the interval is 1-5 mm.
In addition, the direct solder paste technique includes the steps of:
1) the metal solder 6 is coated on the surface of the copper substrate 1 or directly coated on the surface of the silk-screen welding paste plate 4;
2) the power module is fixed by the metal clamp 5;
3) alignment marks are arranged on the metal clamp 5, the silk-screen welding paste plate 4 and the DBC plate 2, so that the three can be aligned simultaneously or in pairs;
4) after alignment, the silk-screen pattern can be accurately coated on the corresponding position of the power device or the radiator; the alignment mark can be designed for laser self-alignment and is subjected to automatic coating and printing; the solder paste can also be precoated by designing an alignment pattern, an alignment clamping groove and the like to carry out manual alignment.
5) And after the metal solder 6 is coated, taking away the silk-screen welding paste plate 4, wherein the silk-screen welding paste plate 4 can be repeatedly used.
In addition, the metal clamp 5 is provided with a threaded through hole or a mechanical pressure contact at the threaded holes on the four sides of the power device, and the power device and the radiator can be fixed by generating pressure of 50N-200N through manual threaded mounting or automatic equipment. Under corresponding pressure, the pre-coated solder paste pattern is extruded and expanded, and the solder substantially completely fills the contact interface of the copper substrate 1 and the heat radiator; the pre-coated solder paste patterns have a slight gap therebetween.
In addition, the method adopts low-temperature solder for coating; the highest temperature of a welding reflow curve is 125-200 ℃, the temperature can ensure that the internal packaging cannot be influenced when the power device is welded, and the welding flux cannot be melted when the product works at high power; during welding, the solder is melted, and volatile gas generated by soldering flux and the like is volatilized through tiny gaps of the coating; the pre-coated solder coating is further expanded to be completely fused under the action of pressure, and finally, an assembly product with extremely low voidage is formed.
Finally, the utility model discloses a power device direct welding device and method, its specific technical characterstic is as follows:
1) the power device is directly welded, so that the device and the radiator are interconnected through the metal solder, and the heat dissipation efficiency of the product is greatly improved; the thermal conductivity of the contact interface reaches 250-300W/mk, which is much higher than that of the prior art thermal conductive silicone grease by 1-5W/mk.
2) And pre-coating a soldering paste technology, wherein when the silk-screen printing soldering paste plate 4 is designed, the internal packaging layout of a power device, and stress and deformation generated on the surface of the copper substrate 1 are fully considered.
3) The solder filling amount of a welding interface is reflected through reasonable change of the pattern density of the silk screen printing plate; through the design of silk screen printing soldering cream board 4, can realize filling the abundant of the little deformation in power device copper base plate 1 surface.
4) The gaps of the silk screen plate patterns can release gas in a contact interface in the process of applying pressure on the power device and the radiator for assembling.
5) The pattern gaps of the silk screen plate can continuously release volatile gas generated by the soldering flux in the process of welding the power device and the radiator at low temperature; the large-area welding is realized, and the void ratio is very low.
6) The direct welding method is suitable for various packaging form power modules and is suitable for large-scale automatic application.
7) The utility model discloses low cost is fit for terminal product manufacture factory and uses.
8) Use the utility model discloses, the product of same power level can reduce the cost input of radiator material by a wide margin, and the volume that makes the system simultaneously is littleer, and the cost is lower.
9) The utility model discloses be suitable for various power component products, like converter, dc-to-ac converter, machine controller etc..
It should be noted that the above mentioned embodiments and embodiments are intended to demonstrate the practical application of the technical solution provided by the present invention, and should not be interpreted as limiting the scope of the present invention. Various modifications, equivalent substitutions and improvements will occur to those skilled in the art and are intended to be within the spirit and scope of the present invention. The protection scope of the present invention is subject to the appended claims.
Claims (5)
1. The direct welding device for the power device is characterized by comprising a copper substrate (1), a DBC (direct bonding copper) board (2), a chip (3), a silk-screen welding paste board (4), a metal clamp (5) and metal welding flux (6); the copper substrate (1), the DBC board (2) and the chip (3) jointly form a power device; the copper substrate (1) is positioned at the bottom end of the whole power device; the DBC plate (2) is welded on the copper substrate (1); the chip (3) is welded on the DBC board (2); the metal clamp (5) clamps the copper substrate (1); the surface of the silk-screen welding paste plate (4) is provided with silk-screen patterns, and the metal solder (6) is pre-coated on the silk-screen patterns of the silk-screen welding paste plate (4).
2. Direct soldering device according to claim 1, characterized in that the solder coating density at the location of the chip (3) is greater than the solder coating density at the location of the DBC board (2).
3. The direct welding device according to claim 1, characterized in that the silk-screen pattern on the surface of the silk-screen welding paste plate (4) is composed of various simple patterns, and the patterns have a certain spacing, and the spacing is 1um-5 mm.
4. The direct welding device according to claim 1, characterized in that the metal fixture (5) is fixedly connected with the copper substrate (1) by screw thread, and a screw thread through hole is arranged at the fixedly connected position to generate a pressure of 50N-200N.
5. Direct soldering device according to claim 1, characterised in that the metal solder (6) is applied to the silk-screen paste board (4) at a low temperature, the solder reflow profile temperature being 125 ℃ -200 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920718308.8U CN210789570U (en) | 2019-05-20 | 2019-05-20 | Direct welding device for power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920718308.8U CN210789570U (en) | 2019-05-20 | 2019-05-20 | Direct welding device for power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210789570U true CN210789570U (en) | 2020-06-19 |
Family
ID=71247222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920718308.8U Expired - Fee Related CN210789570U (en) | 2019-05-20 | 2019-05-20 | Direct welding device for power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210789570U (en) |
-
2019
- 2019-05-20 CN CN201920718308.8U patent/CN210789570U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200619 Termination date: 20210520 |
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| CF01 | Termination of patent right due to non-payment of annual fee |