CN219536398U

CN219536398U - Chip quick heat conduction and dissipation structure

Info

Publication number: CN219536398U
Application number: CN202320493925.9U
Authority: CN
Inventors: 叶宪波
Original assignee: Hangzhou Sky Lighting Co ltd
Current assignee: Hangzhou Sky Lighting Co ltd
Priority date: 2023-03-15
Filing date: 2023-03-15
Publication date: 2023-08-15
Anticipated expiration: 2033-03-15

Abstract

The utility model relates to the technical field of heat dissipation of electronic components, and particularly relates to a chip rapid heat conduction and dissipation structure which comprises polygonal heat conduction holes arranged below a chip, wherein the heat conduction holes penetrate through the front surface to the back surface of a PCB (printed Circuit Board) and are provided with copper-clad layers on the hole walls, soldering tin for heat conduction is filled in the holes, the front surface of the soldering tin is connected with the bottom surface of the chip into a whole, and the back surface of the soldering tin is welded with a copper-clad plate on the back surface of the PCB into a whole.

Description

Chip quick heat conduction and dissipation structure

Technical Field

The utility model relates to the technical field of heat dissipation of electronic components, in particular to a chip rapid heat conduction and dissipation structure.

Background

The chips on the PCB board can generate heat in the operation process, the heat productivity of the chips with larger power is larger, the heat can rapidly improve the internal temperature of the chips, if the heat is not released timely, the chips can fail due to overheating, the normal operation of the whole electronic equipment is affected, and therefore good heat dissipation treatment on the chips is very important.

One of the traditional heat dissipation means is to add auxiliary heat dissipation measures such as heat dissipation silica gel to a chip, but the problem of poor process consistency exists in manual gluing, so that the heat dissipation cannot be solved with high quality due to time and labor waste. Another conventional heat dissipation method is shown in fig. 1, in which a thermal via hole 3 is formed in a PCB 2 at the bottom of a chip 1, so as to improve the heat dissipation capability in the thickness direction of the PCB, and since the space at the bottom of the chip is limited, the aperture of a single thermal via hole is usually smaller, the heat dissipation speed is often not equal to the heat dissipation speed, and the heat conduction requirement is often not satisfied, so that the reliability of the chip is affected, and the normal operation of the electronic device is affected.

Disclosure of Invention

The utility model aims to overcome the defects in the background technology, and provides a rapid heat conduction and dissipation structure for a chip, which can remarkably improve the heat dissipation speed of the chip.

The technical scheme adopted by the utility model is as follows: the utility model provides a quick heat conduction heat radiation structure of chip, includes the polygonal heat conduction hole of setting in the chip below, and this heat conduction hole runs through to the back from the front of PCB board and the pore wall is equipped with the copper-clad layer, and the downthehole soldering tin that has the heat conduction usefulness of packing, the front of soldering tin and the bottom surface of chip link as an organic wholely, and the back of soldering tin and the copper-clad plate welding at the PCB board back are as an organic wholely.

Preferably, the bottom surface of the chip is provided with a bare metal sheet, and the front surface of the soldering tin is welded with the metal sheet into a whole.

Preferably, the soldering tin is outwards diffused on the copper-clad plate at the back of the PCB to form a heat dissipation block larger than the sectional area of the heat conduction hole.

Preferably, the back of the soldering tin is connected with a heat dissipation structure outside the PCB, and heat is transferred to the heat dissipation structure outside.

The utility model has the beneficial effects that: according to the utility model, the thermal via hole with smaller aperture is changed into the heat conducting hole with larger aperture and copper covered on the wall, tin is planted in the heat conducting hole, and the soldering tin and the metal at the bottom of the chip are welded into a whole by utilizing the welding processes of reflow soldering, wave soldering and the like, so that the one-step automatic forming can be realized in the welding process, and the labor cost is not increased additionally. The soldering tin can rapidly conduct out the heat of the chip, the copper-clad plate is reused, the soldering tin rapidly radiates the heat, other heat radiation structures of the electronic equipment can be utilized to accelerate heat radiation, and the heat radiation effect is obviously improved.

Drawings

Fig. 1 is a schematic diagram of a conventional heat dissipation structure of a chip.

Fig. 2 is a schematic diagram of a heat dissipation structure according to an embodiment of the present utility model.

Fig. 3 is a schematic structural view of the heat conduction hole.

The drawings are as follows: chip 1, PCB board 2, thermal via hole 3, soldering tin 4, heat dissipation piece 4.1, copper-clad layer 5, copper-clad plate 6, heat conduction hole 7.

Detailed Description

The objects, technical solutions and advantages of the present utility model will be further described with reference to the accompanying drawings and examples, but the present utility model is not limited to the following examples, for the purpose of making the objects, technical solutions and advantages of the present utility model more clearly understood by those skilled in the art.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

As shown in fig. 2 and 3, this embodiment provides a chip rapid heat conduction and dissipation structure, including the polygonal heat conduction hole 7 that sets up in chip 1 below, this heat conduction hole 7 runs through to the back (i.e. the bottom) from the front (i.e. the top layer) of PCB board and the pore wall is equipped with copper-clad layer 5, and the copper-clad plate on front and back can weld as an organic wholely through copper-clad layer 5, plays rapid heat conduction's effect. The heat conduction holes 7 are filled with solder 4 for heat conduction, the front surface of the solder 4 is connected with the bottom surface of the chip 1 into a whole, and the back surface of the solder 4 is welded with the copper-clad plate 6 on the back surface of the PCB into a whole.

For the chip 1 with the exposed metal sheet at the bottom, the front surface of the soldering tin 4 is welded with the metal sheet into a whole, and the soldering tin 4 can rapidly conduct out heat through the metal sheet. In order to increase the heat dissipation area of the solder 4, the solder 4 diffuses outwards on the copper-clad plate 6 at the back of the PCB to form a heat dissipation block 4.1 larger than the cross-sectional area of the heat conduction hole 7, and it should be noted that the diffusion area of the solder 4 needs to avoid short circuit with other electronic components. Further, the back of the solder 4 may be connected to a heat dissipation structure outside the PCB board, so as to transfer heat to the heat dissipation structure outside. For example, when the embodiment is applied to an LED lamp to dissipate heat of an IC chip 1 on a power driving board, the heat dissipation block 4.1 on the back can be connected with a sealing heat-conducting adhesive in the lamp cap, so that heat is conducted to a metal piece of the lamp cap, and heat dissipation is accelerated.

When the chip 1 is used, heat emitted by the chip 1 is transferred to the soldering tin 4 from the bottom of the chip 1, and is conducted to the copper-clad plate 6 on the back of the PCB through the soldering tin 4 to rapidly dissipate heat, and the soldering tin 4 can dissipate heat to a certain extent, so that the chip 1 is maintained at a proper working temperature.

The foregoing description is only of the preferred embodiments of the present utility model, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The utility model provides a quick heat conduction heat radiation structure of chip which characterized in that: including setting up polygonal heat conduction hole (7) in chip (1) below, this heat conduction hole (7) run through to the back from the front of PCB board and the pore wall is equipped with copper-clad layer (5), and the downthehole soldering tin (4) that has the heat conduction usefulness of packing, the front of soldering tin (4) link as an organic wholely with the bottom surface of chip (1), and the back of soldering tin (4) welds as an organic wholely with copper-clad plate (6) at the PCB board back.

2. The chip rapid thermal conductive heat dissipation structure according to claim 1, wherein: the bottom surface of the chip (1) is provided with a bare metal sheet, and the front surface of the soldering tin (4) is welded with the metal sheet into a whole.

3. A chip rapid thermal conductive heat dissipation structure as defined in claim 1 or 2, wherein: the soldering tin (4) is outwards diffused on the copper-clad plate (6) on the back of the PCB to form a radiating block (4.1) with the cross section larger than the heat conducting hole (7).

4. A chip rapid thermal conductive heat dissipation structure as defined in claim 3, wherein: the back of the soldering tin (4) is connected with a heat dissipation structure outside the PCB, and heat is transferred to the heat dissipation structure outside.