CN1250056C - A printed circuit board and processing method thereof - Google Patents
A printed circuit board and processing method thereof Download PDFInfo
- Publication number
- CN1250056C CN1250056C CN 02153980 CN02153980A CN1250056C CN 1250056 C CN1250056 C CN 1250056C CN 02153980 CN02153980 CN 02153980 CN 02153980 A CN02153980 A CN 02153980A CN 1250056 C CN1250056 C CN 1250056C
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- printed circuit
- circuit board
- heat radiation
- radiation pad
- via hole
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Abstract
The present invention discloses a printed circuit board and a processing method thereof. The printed circuit board at least comprises a first heat dissipation welding disk with a through hole, and large copper foil of the inner layer of the printed circuit board, wherein the first heat dissipation welding disk is positioned on the top surface of the printed circuit board. The printed circuit board has the structure characteristics that a second heat dissipation welding disk is also arranged on the bottom surface of the printed circuit board; the second heat dissipation welding disk is corresponding to the first heat dissipation welding disk; heat conduction metal material is filled in the through hole; the two heat dissipation welding disks are hot communicated by the heat conduction metal material.
Description
Technical field
The present invention relates to printed circuit board (PCB) and make manufacture field, specifically refer to a kind of method of processing printed circuit board.
Background technology
In present single board design, utilize device application that the veneer Copper Foil dispels the heat more and more widely.The silicon chip of device inside is attached on the heat radiation pad of device package bottom surface, as shown in Figure 1, and comprising lead frame 1, silicon chip 2, silicon chip adhesion layer 3, central heat sink pad 4 and embedding 5.Add and man-hour the heat radiation pad of the device bottom surface heat radiation pad with printed circuit board is welded, and on the printed board heat radiation pad a plurality of via holes are arranged, these via holes are connected the heat radiation pad of the printed board big Copper Foil with the PCB internal layer.
Heat pathway on the device inside silicon chip is: pad → via hole → PCB internal layer large tracts of land Copper Foil dispels the heat in silicon chip → device package bottom heat dissipation plate → welding region → printed board.
As long as wherein there is any one link thermal resistance big, will become the bottleneck of entire heat dissipation path, reduce radiating efficiency.What especially need to pay close attention to is " welding region " and " via hole " two parts.
In PCB design part, industry conventional design method is a green oil beyond the Great Wall in via hole at present, and green oil is filled in from the bottom surface of printed board.To avoid adding man-hour, the scolding tin that melts on the end face heat radiation pad runs off by via hole, has reduced the welding region area, influences radiating effect greatly.
In a word, at present the industry method of filling in green oil in via hole mainly contains following problem:
(1) in the control of PWB processing technology, bigger difficulty is arranged, can't guarantee that green oil can not pollute the heat radiation pad of end face.The pollution that green oil causes end face via hole periphery will directly reduce the welding region area, reduce the conduction efficiency of heat.
This is original with regard to very little device for the heatsink welding disc area, and influence can be very big.For example the heat radiation pad of LPP16 encapsulation is of a size of 2.4 * 2.4mm, removes hollow area in the 9PCS via hole again, and last actual welding region area seldom.
(2) solvent in the green oil is water white, and flowability and diffusion area are bigger, after pad is polluted, can cause equally and can not weld, and reduce the bonding area of heat radiation pad, and this problem is more hidden, is difficult to find this problem.
(3) the green oil material is the non-conductor of heat, and the green oil of plug in via hole can not play the effect of conduction heat.Heat can only conduct by the copper ring sidewall area on the via hole limit.From another aspect, the part cylindrical volume of via hole hollow is a kind of very big wasting of resources, does not use.
Summary of the invention
The invention provides a kind of method of processing printed circuit board, to solve the relatively poor problem of printed circuit board radiating ability in the prior art.
Technical solution of the present invention is as follows:
A kind of method of processing printed circuit board, it comprises the steps:
(1), at printed circuit board bottom surface brush solder(ing) paste;
(2), the surface mounted device that needs is installed in the printed circuit board bottom surface is mounted on corresponding position;
(3), the device of printed circuit board bottom surface is welded together by reflow with the corresponding second heat radiation pad on the printed circuit board, and make solder(ing) paste scolder on the second heat radiation pad fill via hole in the heat radiation pad;
(4), at printed circuit plate top surface brush solder(ing) paste;
(5), the surface mounted device that needs is installed in the printed circuit plate top surface is mounted on corresponding position;
(6), with the device of printed circuit plate top surface with welding together by reflow with the corresponding first heat radiation pad of the described second heat radiation pad on the printed circuit board; The described first heat radiation pad is connected by the scolding tin in the described via hole with the second heat radiation pad.
According to said method:
Carrying out step (4) comprises before the reflow quality is checked and/or repaired.
Also comprise step: the reflow quality of step (6) is checked and/or repaired.
The advantage of printed circuit board of the present invention is that the loss that it not only can not cause end face scolding tin also can increase the welding region area; The via hole hollow parts that can not participate in conducting heat has originally become hot good conductor scolding tin cylinder, has strengthened radiating effect greatly, also avoids the contaminated possibility of end face heat radiation pad simultaneously fully.
Description of drawings
Fig. 1 is installed in the device architecture schematic diagram on the printed circuit board;
The cross sectional representation of Fig. 2 printed circuit board of the present invention;
The flow chart of Fig. 3 printed circuit board method of the present invention.
Embodiment
With reference to shown in Figure 2:
The end face of printed circuit board a has the first heat radiation pad c, has a plurality of via hole k (on the heat radiation pad of actual Printed Circuit Board Design a plurality of via holes are arranged, for the purpose of simplifying the description, only identify 1 via hole herein) on this heat radiation pad.The second heat radiation pad i is set on the corresponding bottom surface of the first heat radiation pad c, have on this heat radiation pad and the corresponding via hole k of the first heat radiation pad, the Kong Zhongyong thermal conductive metallic material fills up, that adopt in the present embodiment is scolding tin j, and the big Copper Foil h in scolding tin j and the printed circuit board and the first heat radiation pad c, the second heat radiation pad i are connected.The heat radiation pad f of device d and the first heat radiation pad c have bonding area e, and the pin of device d is fixed on the device pin pad g by solder joint b.Like this, the cylindrical volume of via hole k also becomes thermal conduction path, the big Copper Foil h that the heat of the first heat radiation pad c on the printed circuit board more effectively is delivered to intralamellar part go up and the second heat dissipation plate i on.Compare with the structure that is full of green oil in the via hole in the prior art, scolding tin can improve heat transfer efficiency greatly.
But, if consider from the processing technology aspect, if the via hole on the printed circuit board heat radiation pad is not filled in green oil, then only carry out technology: the tin cream → paster → reflow → quality examination of printed circuit plate top surface brush for the heatsink welding disc portion, then when Reflow Soldering, the scolding tin that melts on the heat radiation pad can run off a lot by via hole, does not reach the heat radiation requirement that bonding area surpasses 50% pad.Therefore, add the heat radiation pad too in the printed board bottom surface, and welding resistance is windowed.When the processing end face, owing to filled up scolding tin in the via hole, the tin cream of end face can not run off again like this, and, end face first heat radiation pad and the bottom surface second heat radiation pad are by the mutual thermal communication of scolding tin in the via hole, thus the increase area of dissipation, and radiating efficiency can be further enhanced.
To introduce the machining process of printed circuit board of the present invention in detail below.
Consult shown in Figure 3ly, at first, add the heat radiation pad too at the printed board back side, and welding resistance windows, then, when the processing bottom surface, print solder paste on pad makes that via hole has filled up scolding tin in advance on the heat radiation pad after the reflow of bottom surface earlier.At last, when processing end face before the reflow second time, owing to filled up scolding tin in the via hole, the tin cream of end face can not run off again.
Concrete steps are as described below:
The first step is at printed circuit board bottom surface brush tin cream;
Second step, utilize chip mounter equipment, the surface mounted device that needs is installed in the printed circuit board bottom surface is mounted on corresponding position;
The 3rd step, utilize Reflow Soldering pot arch equipment, printed circuit board is required to heat according to being provided with, make the solder(ing) paste solder fusing of printed circuit board bottom surface, the device of printed circuit board bottom surface is welded together with respective pad on the printed circuit board.Simultaneously, the also fusing simultaneously of the solder(ing) paste scolder of second heat radiation on the pad, will dispel the heat via hole in the pad of liquid scolder is filled and is expired.When printed circuit board moves out of reflow soldering, the printed circuit board cooling, the liquid scolding tin of fusing becomes solid-state, has filled up solid-state scolding tin in the via hole on the heat radiation pad;
In the 4th step, if QC check is defective then place under repair through the QC check, is carried out next step then after qualified;
The 5th step, printed circuit plate top surface brush solder(ing) paste;
The 6th step, utilize chip mounter equipment, the surface mounted device that needs is installed in the printed circuit plate top surface is mounted on corresponding position;
The 7th step, utilize Reflow Soldering pot arch equipment, printed circuit board is required to heat according to being provided with, make the scolder on printed circuit board two sides all melt, the device of printed circuit plate top surface is welded together with respective pad on the printed circuit board.Simultaneously, also fusing simultaneously of the solder(ing) paste scolder on the first heat radiation pad is because via hole has been pre-charged with full weld tin on the heat radiation pad when the 3rd step, so the scolding tin that melt on the heat radiation pad this moment first will not have loss.When printed circuit board moves out of reflow soldering, the printed circuit board cooling, the liquid scolding tin of fusing becomes solid-state, guarantees that enough soldering tin amounts are arranged on the first heat radiation pad, thereby the heat radiation pad that has guaranteed the device bottom is not less than 50% with the bonding area of printed circuit board heat radiation pad;
The 8th step, QC check, if defective then place under repair, until qualified.
Adopt above-mentioned technology, the bonding area of heat radiation pad substantially exceeds 50%, all more than 60-70%.
After machining the bottom surface, find that via hole has part scolding tin to be penetrated on the end face heat radiation pad, through measuring, the scolding tin that finds no protrusion is higher than the situation of 0.12mm, guarantees can not exceed steel mesh thickness, can not have influence on the processing of back operation.
Compared with prior art, the invention has the advantages that: the present invention not only can not cause the loss of end face scolding tin, Also can increase the welding region area. The via hole hollow parts that originally can not participate in conducting heat has become the good of heat Conductor scolding tin cylinder has strengthened radiating effect greatly, also avoids the end face heat dissipation bonding pad contaminated fully simultaneously Possibility.
Claims (3)
1. a method of processing printed circuit board is characterized in that comprising the steps:
(1), at printed circuit board bottom surface brush solder(ing) paste;
(2), the surface mounted device that needs is installed in the printed circuit board bottom surface is mounted on corresponding position;
(3), the device of printed circuit board bottom surface is welded together by reflow with the corresponding second heat radiation pad on the printed circuit board, and make solder(ing) paste scolder on the second heat radiation pad fill via hole in the heat radiation pad;
(4), at printed circuit plate top surface brush solder(ing) paste;
(5), the surface mounted device that needs is installed in the printed circuit plate top surface is mounted on corresponding position;
(6), with the device of printed circuit plate top surface with welding together by reflow with the corresponding first heat radiation pad of the described second heat radiation pad on the printed circuit board; The described first heat radiation pad is connected by the scolding tin in the described via hole with the second heat radiation pad.
2, the method for claim 1 is characterized in that carrying out step (4) and comprises before the reflow quality is checked and/or repaired.
3, method as claimed in claim 1 or 2 is characterized in that also comprising step:
(7) the reflow quality of step (6) is checked and/or repaired.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02153980 CN1250056C (en) | 2002-12-05 | 2002-12-05 | A printed circuit board and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02153980 CN1250056C (en) | 2002-12-05 | 2002-12-05 | A printed circuit board and processing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1505456A CN1505456A (en) | 2004-06-16 |
| CN1250056C true CN1250056C (en) | 2006-04-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02153980 Expired - Fee Related CN1250056C (en) | 2002-12-05 | 2002-12-05 | A printed circuit board and processing method thereof |
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| Country | Link |
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| CN (1) | CN1250056C (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101613A (en) * | 2014-11-19 | 2015-11-25 | 芜湖蓝宙电子科技有限公司 | Method for improving heat conduction capability of printed board of surface-mounted device |
| CN106332437B (en) * | 2015-06-26 | 2018-11-02 | 健鼎（无锡）电子有限公司 | Electro-plating method |
| CN105307384B (en) * | 2015-09-14 | 2018-05-08 | 广东威创视讯科技股份有限公司 | A kind of method for improving integrated chip heat-sinking capability |
| CN105338757A (en) * | 2015-12-04 | 2016-02-17 | 深圳威迈斯电源有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN107278034A (en) * | 2017-08-02 | 2017-10-20 | 华讯方舟科技有限公司 | It is a kind of to improve the method that high-frequency circuit board mesopore leaks tin |
| JP7107810B2 (en) * | 2018-10-19 | 2022-07-27 | 株式会社ソニー・インタラクティブエンタテインメント | Semiconductor device manufacturing method and screen |
| JP6835788B2 (en) | 2018-10-19 | 2021-02-24 | 株式会社ソニー・インタラクティブエンタテインメント | Power supply |
| JP7250474B2 (en) | 2018-10-19 | 2023-04-03 | 株式会社ソニー・インタラクティブエンタテインメント | power supply |
| CN113225902B (en) * | 2021-05-18 | 2022-08-09 | 深圳市中孚能电气设备有限公司 | Printed circuit structure, miner's lamp and rectifier |
| CN115052415A (en) * | 2022-07-27 | 2022-09-13 | 广东通元精密电路有限公司 | Circuit board with high heat dissipation structure |
-
2002
- 2002-12-05 CN CN 02153980 patent/CN1250056C/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN1505456A (en) | 2004-06-16 |
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