CN210671156U - RRU equipment cooling system - Google Patents
RRU equipment cooling system Download PDFInfo
- Publication number
- CN210671156U CN210671156U CN201921896932.3U CN201921896932U CN210671156U CN 210671156 U CN210671156 U CN 210671156U CN 201921896932 U CN201921896932 U CN 201921896932U CN 210671156 U CN210671156 U CN 210671156U
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- unit box
- heat
- digital
- cavity
- heat dissipation
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Abstract
The utility model relates to a RRU equipment cooling system belongs to communication equipment and makes technical field. The heat dissipation device comprises a cavity, a cover plate, heat conduction silicone grease, a heat conduction silicone pad and a heat pipe, wherein a digital unit box, a power amplification unit box and a power supply unit box are tightly attached to the bottom of the cavity through the heat conduction silicone grease, and heat dissipation teeth manufactured on the cavity correspond to the installation heights of the digital unit box, the power amplification unit box and the power supply unit box; the duplexer, the baseband unit box and the interface unit box are mounted on the upper layer of the cavity in a hanging manner, and the top surfaces of the duplexer and the baseband unit box are closely attached to the cover plate through the heat-conducting silica gel pad; the digital unit box is connected with the side wall of the cavity through the heat pipe; four heating chips arranged on the front surface of the digital unit printed board are respectively and tightly attached to the digital cover board through heat-conducting silicone grease, and the back surface of the digital unit printed board is tightly connected with the digital bottom board through a copper-laying grounding area. The contact tightness of the radiating surface is enhanced, the heat conduction and the heat radiation are rapid, the effect is good, the weight is light, the volume is small, and the manufacturing and using cost is low.
Description
Technical Field
The utility model relates to a RRU equipment cooling system belongs to communication equipment and makes technical field.
Background
The communication external hanging machine RRU equipment transmits information through the optical fiber and transmits the information through the network port and the E1, the power consumption of the communication external hanging machine RRU equipment is increased while the functions are increased, and the heat production quantity of the whole equipment is increased. The traditional heat dissipation structure mode that the heating device in the RRU equipment only clings to the cavity and contacts can not satisfy the heat dissipation requirement of modern RRU equipment, can not guarantee the normal operation of RRU equipment, can shorten RRU equipment's life, increase manufacturing and use cost. Therefore, it is necessary to develop a RRU device heat dissipation system that can enhance the contact tightness of the heat dissipation surface, conduct and dissipate heat quickly, has good effect and strong working reliability, reduces the manufacturing and using costs, meets the heat dissipation requirements of modern RRU devices, ensures the normal operation of RRU devices, and improves the service life thereof.
Disclosure of Invention
The utility model aims at providing a RRU equipment heat dissipation system which can effectively enhance the contact tightness of a heat dissipation surface, has rapid heat conduction and heat dissipation, good effect, strong working reliability, light weight and small volume, reduces the manufacturing and using cost, meets the heat dissipation requirement of modern RRU equipment, ensures the normal operation of the RRU equipment and prolongs the service life aiming at the defects of the prior art; the problems of poor heat conduction, small power, large size and large weight of the existing RRU equipment are solved.
The utility model discloses a realize above-mentioned purpose through following technical scheme:
a heat dissipation system of RRU equipment comprises a cavity, a cover plate, a heat pipe, heat-conducting silicone grease and a heat-conducting silicone pad, wherein a digital unit box, a power amplifier unit box, a power supply unit box, a duplexer, a baseband unit box and an interface unit box are arranged in the cavity, and the digital unit box comprises a digital unit printed board, four heating chips, a digital cover plate, a digital bottom plate and a copper-laying grounding area; the method is characterized in that: the digital unit box, the power amplifier unit box and the power supply unit box are tightly attached to the bottom of the cavity through heat-conducting silicone grease, and heat dissipation teeth are manufactured on the cavity and correspond to the mounting heights of the digital unit box, the power amplifier unit box and the power supply unit box; the duplexer, the baseband unit box and the interface unit box are mounted on the upper layer of the cavity in a hanging manner, and the top surfaces of the duplexer and the baseband unit box are closely attached to the cover plate through the heat-conducting silica gel pad; the digital unit box is connected with the side wall of the cavity through the heat pipe; the front surface of the digital unit printed board is provided with four heating chips, the four heating chips are respectively attached to the digital cover board through heat-conducting silicone grease, and the back surface of the digital unit printed board is tightly connected with the digital bottom board through a copper-laying grounding area.
The manufacturing height of the heat dissipation teeth is 40 mm.
The copper-laid grounding area accounts for 80% of the back of the digital unit printed board.
The bottom unsettled installation of baseband unit box and duplexer, baseband unit box top surface and duplexer top surface closely laminate the installation through heat conduction silica gel pad and apron.
The specification of the heat-conducting silica gel pad comprises: two kinds of the X-ray materials are 89mm, 1mm and 160mm, 120mm and 1 mm.
Compared with the prior art, the utility model beneficial effect lie in:
this RRU equipment cooling system has promoted the efficiency of cavity heat and air heat-conduction and heat exchange through the heat dissipation tooth, closely laminates the installation with digital apron through heat conduction silicone grease with four positive chips that generate heat of digital unit printing board, and what make between digital unit printing board back and the digital bottom plate accounts for the copper laying ground connection area at whole printing board back 80%, ensures the heat reliable transmission to the digital bottom plate of four chips that generate heat, distributes away through digital bottom plate coating heat conduction silicone grease full and cavity in close contact with the heat on transmitting the cavity high-efficiently. Meanwhile, the digital unit box is tightly attached to the heat pipe, heat is transferred to the side wall of the cavity through the heat pipe, and the heat pipe extends out of the side wall of the cavity and finally conducts and emits the heat to the RRU equipment. The contact tightness of the heat dissipation surface is effectively enhanced, the heat conduction and the heat dissipation are rapid, the effect is good, the working reliability is strong, the weight is light, the size is small, the manufacturing and using cost is reduced, the heat dissipation requirement of modern RRU equipment is met, the normal operation of the RRU equipment is ensured, and the service life of the RRU equipment is prolonged. The problems of poor heat conduction, small power, large size and large weight of the RRU equipment in the prior art are solved.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a heat dissipation system of RRU equipment;
FIG. 2 is a schematic diagram of a backside structure of the chamber;
fig. 3 is a front structure diagram of a digital unit printed board;
fig. 4 is a schematic diagram of a back structure of the digital unit printed board;
FIG. 5 is a schematic view of the connection structure of the heat pipe with the chamber and the digital unit;
fig. 6 is a schematic diagram of a heat dissipation working principle of a heat dissipation system of RRU equipment.
In the figure: 1-cavity, 2-digital unit box, 3-power amplifier unit box, 4-power unit box, 5-duplexer, 6-baseband unit box, 7-interface unit box, 8-cover plate, 9-heat dissipation tooth and 10-heat pipe;
201-digital unit printed board, 202-four heating chips, 203-copper laying grounding area.
Detailed Description
The following describes an embodiment of the heat dissipation system of the RRU device in further detail with reference to the accompanying drawings (see fig. 1 to 6):
the RRU equipment heat dissipation system comprises a cavity 1, a cover plate 8, a heat pipe 10, heat-conducting silicone grease and a heat-conducting silicone pad, wherein a digital unit box 2, a power amplifier unit box 3, a power supply unit box 4, a duplexer 5, a baseband unit box 6 and an interface unit box 7 are arranged in the cavity 1, and the digital unit box 2 comprises a digital unit printed board 201, four heating chips 202, a copper-laying grounding area 203, a digital cover plate and a digital bottom plate; the digital unit box 2, the power amplifier unit box 3 and the power supply unit box 4 are tightly attached to the bottom of the cavity 1 through heat-conducting silicone grease, the cavity 1 is provided with heat dissipation teeth 9, and the heat dissipation teeth 9 correspond to the installation heights of the digital unit box 2, the power amplifier unit box 3 and the power supply unit box 4; (see fig. 2); the duplexer 5, the baseband unit box 6 and the interface unit box 7 are mounted on the upper layer of the cavity 1 in a hanging manner, and the top surfaces of the duplexer 5 and the baseband unit box 6 are closely attached to the cover plate 8 through a heat-conducting silica gel pad; the digital unit box 2 is connected with the side wall of the cavity 1 through a heat pipe 10; the front surface of the digital unit printed board 201 is provided with four heat-generating chips 202 (see fig. 3), the four heat-generating chips 202 are respectively and tightly mounted on the digital cover board through heat-conducting silicone grease, and the back surface of the digital unit printed board 201 is tightly connected with the digital backplane through a copper-laid grounding area 203 (see fig. 4).
The manufacturing height of the radiating teeth 9 is 40 mm. The copper-laid ground region 203 occupies 80% of the back surface of the digital cell printed board 201. The bottom unsettled installation of baseband unit box 6 and duplexer 5, baseband unit box 6 top surface and duplexer 5 top surface are through the installation of closely laminating of heat conduction silica gel pad with apron 8. The specification of heat conduction silica gel pad includes: two kinds of the X-ray materials are 89mm, 1mm and 160mm, 120mm and 1 mm.
The four heating chips 202 are of the type — -, respectively
Chip a: XC7Z100-FFG 900I;
chip b: u58AD 9684B-BPZ-500;
and c, chip c: AD9162 BBCAZ;
chip d: LMK 04832.
The back of the cavity 1 is provided with heat dissipation teeth 9 with the height of 40mm, the heat dissipation teeth 9 transfer the heat of the internal unit box to the air, and the huge surface area of the heat dissipation teeth 9 greatly improves the heat conduction and heat exchange efficiency of the heat and the air (see fig. 2). The heat of the digital unit box 2 is 16.5 watts, and the digital unit box 2 is internally provided with the following components in sequence from top to bottom: a digital cover board, a digital unit printed board 201, and a digital backplane. Four heating chips 202 (see fig. 3) are mounted on the front surface of the digital unit printed board 201; the four heating chips 202 are directly contacted with the digital cover plate through heat-conducting silicone grease; the back of the digital unit printed board 201 is not provided with large devices, a large-area copper-laying grounding area 203 is arranged between the digital unit printed board 201 and the digital bottom board, and the copper-laying grounding area 203 accounts for 80% of the back of the whole digital unit printed board 201 (see fig. 4), so that heat of the four heating chips 202 is transmitted to the digital bottom board. The heat-conducting silicone grease is fully coated on the digital bottom plate to be in contact with the cavity 1, so that heat can be efficiently transferred to the cavity 1; the digital unit box 2 is mounted against the heat pipe 10, and transfers heat to the side wall of the chamber 1 to be dissipated (see fig. 5).
The heat dissipation mode of the power amplifier unit box 3 and the power supply unit box 4 is the same as that of the digital unit box 2, and the heat of electronic components in the power amplifier unit box is transferred to the bottom of the cavity 1 through heat conduction silicone grease on the bottom plate of the corresponding unit box and then diffused out of the equipment.
The heat of baseband unit box 6 and 5 heats of duplexer are 5W and 6.5W respectively, and the bottom of baseband unit box 6 and duplexer 5 is unsettled, and 6 top surfaces of baseband unit box are closely laminated with apron 8 through the specification for 214mm x 89mm x 1mm heat conduction silica gel pad, and 5 top surfaces of duplexer are closely laminated with apron 8 through the specification for 160mm x 120mm x 1mm heat conduction silica gel pad, conduct the equipment surface with the heat (refer to fig. 6).
According to the GJB151B-2013 standard and the technical requirements of the product, the product can normally operate under the condition that the maximum ambient temperature is 65 ℃ (the temperature of the four heating chips 202 and devices on the digital unit printed board 201 cannot be higher than 95 ℃ for a long time). The setting conditions are 65 ℃ ambient temperature, 1.01 MPa atmospheric pressure and outdoor suspension installation. The Flow Simulation plug-in Simulation result of the Solidworks software shows that the average temperature rise of the whole RRU equipment heat dissipation system is only 13 ℃, the maximum temperature rise of the surfaces of the four heating chips 202 is 19 ℃, the GJB151B-2013 standard and the design requirements of the product are met, the heat dissipation effect is good, the normal operation of the whole RRU under the severe temperature environment condition is practically ensured, and the service life of the RRU is effectively prolonged.
The main technical indexes of the RRU equipment heat dissipation system are as follows:
a) the size of the whole machine is as follows: length 419, height 134, width 245
b) The weight of the whole machine is as follows: 11kg of
c) The heat of the whole machine: 60.5W
Wherein:
digital cell box 2: 16W; power amplifier unit box 3: 21.5W; power supply unit box 4: 11.5W; and a duplexer 5: 6.5W; base band unit case 6: 5W.
The main radiating elements of the radiating system of the RRU equipment are as follows:
1) the heat pipe 10 is made of a novel copper material;
thermal conductivity of 390W。C/m is a high-efficiency heat dissipation element with the best heat conduction performance in common materials and is divided into a heat absorption end of a heat pipe, a copper pipe and a heat release end of the heat pipe. The heat dissipation principle is as follows: in the gravity direction, the position of the heat absorption end is lower than that of the heat release end, after the heat absorption end absorbs heat, liquid water in the copper pipe is heated to be changed into water vapor, and the water vapor is heatedThe water is lightened and moved upwards to the heat release end and flows back to the heat absorption end when meeting cold liquefaction, and because the inner wall of the copper pipe is provided with a plurality of tiny bulges, the water flows along the wall of the copper pipe due to capillary phenomenon during the backflow, the movement of water vapor cannot be influenced, and therefore, the water can form self circulation in the heat pipe 10. The heat pipe 10 has advantages of small volume and fast heat exchange, and is entering more application fields.
2) The heat-conducting silicone grease is a liquid heat-conducting material;
its thermal conductivity is 5-10W。C/m (air thermal conductivity of about 0.001W)。C/m, aluminum alloy 239W。C/m), when the surfaces of the two devices can not be completely contacted, the heat-conducting silicone grease can perfectly fill the gap between the surfaces of the two devices, and the heat-conducting property is improved.
3) The heat-conducting silica gel pad is a solid thin plate-shaped heat-conducting material, and is mainly used between two planes with small heat and certain installation tolerance due to certain elasticity. Its thermal conductivity is 2-5W。C/m 。
4) The heat dissipation teeth 9 with the height of 40mm and made on the back surface of the cavity 1 have the following functions: the surface area of the outer surface of the cavity 1 is increased, so that the heat exchange area of the cavity 1 and the air is increased, and the radiating teeth 9 have mature application background.
The above description is only a preferred embodiment of the present invention, and the above illustration does not limit the essence of the present invention in any form, and any simple modification or variation of the above embodiments based on the technical essence of the present invention and equivalent embodiments which may be changed or modified to equivalent variations by using the technical essence of the present invention by those of ordinary skill in the art after reading the present description still belong to the technical solution of the present invention without departing from the essence and scope of the present invention.
Claims (5)
1. A radiating system of RRU equipment comprises a cavity (1), a cover plate (8), a heat pipe (10), heat-conducting silicone grease and a heat-conducting silicone pad, wherein a digital unit box (2), a power amplifier unit box (3), a power supply unit box (4), a duplexer (5), a baseband unit box (6) and an interface unit box (7) are arranged in the cavity (1), and the digital unit box (2) comprises a digital unit printed board (201), four heating chips (202), a copper-laying grounding area (203), a digital cover plate and a digital bottom plate; the method is characterized in that: the digital unit box (2), the power amplifier unit box (3) and the power supply unit box (4) are tightly attached to the bottom of the cavity (1) through heat-conducting silicone grease, heat dissipation teeth (9) are manufactured on the cavity (1), and the heat dissipation teeth (9) correspond to the installation heights of the digital unit box (2), the power amplifier unit box (3) and the power supply unit box (4); the duplexer (5), the baseband unit box (6) and the interface unit box (7) are mounted on the upper layer of the cavity (1) in a hanging manner, and the top surfaces of the duplexer (5) and the baseband unit box (6) are closely attached to the cover plate (8) through a heat-conducting silica gel pad; the digital unit box (2) is connected with the side wall of the cavity (1) through a heat pipe (10); the front surface of the digital unit printed board (201) is provided with four heating chips (202), the four heating chips (202) are respectively tightly attached to the digital cover plate through heat-conducting silicone grease, and the back surface of the digital unit printed board (201) is tightly connected with the digital bottom plate through a copper-laying grounding area (203).
2. The RRU device heat dissipation system of claim 1, wherein: the manufacturing height of the heat dissipation teeth (9) is 40 mm.
3. The RRU device heat dissipation system of claim 1, wherein: the copper-laid grounding area (203) accounts for 80% of the back of the digital unit printed board (201).
4. The RRU device heat dissipation system of claim 1, wherein: the bottom unsettled installation of baseband unit box (6) and duplexer (5), baseband unit box (6) top surface and duplexer (5) top surface pass through heat conduction silica gel pad and apron (8) installation of closely laminating.
5. The RRU device heat dissipation system of claim 1, wherein: the specification of the heat-conducting silica gel pad comprises:
214mm 89mm 1mm, 160mm 120m 1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921896932.3U CN210671156U (en) | 2019-11-06 | 2019-11-06 | RRU equipment cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921896932.3U CN210671156U (en) | 2019-11-06 | 2019-11-06 | RRU equipment cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210671156U true CN210671156U (en) | 2020-06-02 |
Family
ID=70819927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921896932.3U Expired - Fee Related CN210671156U (en) | 2019-11-06 | 2019-11-06 | RRU equipment cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210671156U (en) |
-
2019
- 2019-11-06 CN CN201921896932.3U patent/CN210671156U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200602 Termination date: 20211106 |