CN210628345U - COB circuit support with bendable end part - Google Patents
COB circuit support with bendable end part Download PDFInfo
- Publication number
- CN210628345U CN210628345U CN201922156837.6U CN201922156837U CN210628345U CN 210628345 U CN210628345 U CN 210628345U CN 201922156837 U CN201922156837 U CN 201922156837U CN 210628345 U CN210628345 U CN 210628345U
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- Prior art keywords
- layer
- cob
- bendable
- support
- main body
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- 239000000919 ceramic Substances 0.000 claims abstract description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 7
- 239000006185 dispersion Substances 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
The utility model is suitable for a COB circuit support technical field of LED. The utility model discloses a COB circuit support with a bendable end, which comprises a support main body (10); welding parts (100) are arranged at two ends of the bracket main body (10); the welding part (100) is provided with a vertical part (101); the vertical part (101) is used for being bent by 90 degrees through equipment; the support main body (10) is provided with an ink layer (11), a circuit layer (12), an insulating layer (13), an aluminum layer (14) and a ceramic layer (15); the beneficial effects of the utility model reside in that: vertical parts are additionally arranged at two ends of the product bracket, and the vertical parts can be bent by 90 degrees through equipment, so that the bending angle is better realized; still be equipped with the ceramic layer, heat dispersion is better, and simple structure.
Description
Technical Field
The utility model relates to a COB circuit support technical field of LED, in particular to COB circuit support's that tip can be bent technical field.
Background
An LED (Light Emitting Diode) is a solid semiconductor device, which can directly convert electrical energy into Light, and has the advantages of small size, low power consumption, long service life, high brightness, low heat, environmental protection, firmness and durability, and is one of the most ideal Light sources. In daily life, LED lamps are supported and packaged through COB circuit brackets of LEDs. With the progress of science and technology, the application of the LED lamp is more and more popular, so the application of the COB circuit support of the LED is more and more popular.
As is well known, in the use process of the COB circuit support of the conventional strip-shaped LED, the COB circuit support needs to be bent by 90 degrees, but the welding part of the COB circuit support is straight, so that the COB circuit support is not convenient to be bent by 90 degrees, and the heat dissipation performance of the COB circuit support is not good.
SUMMERY OF THE UTILITY MODEL
The utility model mainly solves the technical problem of providing a COB circuit support with a bendable end part, wherein vertical parts are added at two ends of the support, and the vertical parts can be bent for 90 degrees, so that the bending angle can be better realized; and the heat dispersion is better, simple structure.
In order to solve the problems, the utility model provides a COB circuit bracket with a bendable end part, which comprises a bracket main body; welding parts are arranged at two ends of the bracket main body; the welding part is provided with a vertical part; the vertical part is used for being bent by 90 degrees through equipment; the support main part is equipped with printing ink layer, circuit layer, insulating layer, aluminium lamination, ceramic layer, and is formed by printing ink layer, circuit layer, insulating layer, aluminium lamination, ceramic layer stack in proper order.
Furthermore, the ink layer is photosensitive solder resist ink and is coated or printed on the surface of the circuit layer.
Furthermore, the circuit layer is electrolytic copper or rolled copper foil.
Furthermore, the insulating layer is a heat-conducting glue film or a resin glue.
Further, the aluminum layer is an aluminum material.
Further, the ceramic layer is a ceramic material.
Further, the main body of the bracket is in a strip shape.
When the LED lamp support is used, the LED lamp chip is attached to the support main body, and the anode and the cathode of the LED lamp chip are connected; the vertical part is used for being bent by 90 degrees through equipment; the bending application is convenient, the power supply is connected again, and the ceramic layer has better heat dissipation performance.
The beneficial effects of the utility model reside in that: vertical parts are additionally arranged at two ends of the product bracket, and the vertical parts can be bent by 90 degrees through equipment, so that the bending angle is better realized; still be equipped with the ceramic layer, heat dispersion is better, and simple structure.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a front schematic view of the present invention.
Fig. 2 is a schematic cross-sectional view of the present invention.
The objects, features and advantages of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments, not all embodiments, of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1 and 2, the bendable end COB circuit support includes a support body 10; welding parts 100 are arranged at two ends of the bracket main body 10; the welding part 100 is provided with a vertical part 101; the vertical part 101 is used for bending by 90 degrees through equipment; the support main body 10 is provided with an ink layer 11, a circuit layer 12, an insulating layer 13, an aluminum layer 14 and a ceramic layer 15, and is formed by sequentially overlapping the ink layer 11, the circuit layer 12, the insulating layer 13, the aluminum layer 14 and the ceramic layer 15.
Specifically speaking: attaching an LED lamp chip to the support main body 10T, and connecting the anode and the cathode of the LED lamp chip; the vertical part 101 is used for bending by 90 degrees through equipment; the bending application is convenient, the power supply is connected again, and the ceramic layer has better heat dissipation performance.
Further, the ink layer 11 is photosensitive solder resist ink, and is coated or printed on the surface of the circuit layer 12.
Further, the circuit layer 12 is electrolytic copper or rolled copper foil.
Further, the insulating layer 13 is a heat conductive adhesive film or a resin adhesive.
Further, the aluminum layer 14 is an aluminum material.
Further, the ceramic layer 15 is a ceramic material.
Further, the stent main body 10 is a strip shape.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: it is to be understood that modifications may be made to the above-described arrangements in the embodiments or equivalents may be substituted for some of the features of the embodiments without departing from the spirit or scope of the present invention.
Claims (7)
1. A bendable-end COB circuit support is characterized by comprising a support body (10); welding parts (100) are arranged at two ends of the bracket main body (10); the welding part (100) is provided with a vertical part (101); the vertical part (101) is used for being bent by 90 degrees through equipment; the support main body (10) is provided with an ink layer (11), a line layer (12), an insulating layer (13), an aluminum layer (14) and a ceramic layer (15), and is formed by sequentially superposing the ink layer (11), the line layer (12), the insulating layer (13), the aluminum layer (14) and the ceramic layer (15).
2. Bendable-end COB wire support according to claim 1, characterized in that the ink layer (11) is a photosensitive solder resist ink, which is coated or printed on the surface of the wire layer (12).
3. Bendable end COB wire rack according to claim 1, characterized in that the wire layer (12) is electrolytic copper or rolled copper foil.
4. Bendable-end COB circuit support according to claim 1, characterized in that the insulating layer (13) is a thermally conductive glue film or resin glue.
5. Bendable end COB wire rack according to claim 1, characterized in that the aluminium layer (14) is of aluminium material.
6. Bendable end COB wire rack according to claim 1, characterized in that the ceramic layer (15) is a ceramic material.
7. Bendable-end COB line carrier according to claim 1, characterized in that the carrier body (10) is elongated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922156837.6U CN210628345U (en) | 2019-12-05 | 2019-12-05 | COB circuit support with bendable end part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922156837.6U CN210628345U (en) | 2019-12-05 | 2019-12-05 | COB circuit support with bendable end part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210628345U true CN210628345U (en) | 2020-05-26 |
Family
ID=70761919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922156837.6U Active CN210628345U (en) | 2019-12-05 | 2019-12-05 | COB circuit support with bendable end part |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210628345U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116528458A (en) * | 2023-04-06 | 2023-08-01 | 深圳市基石新材料技术有限公司 | Circuit board module with heat dissipation structure and manufacturing method |
-
2019
- 2019-12-05 CN CN201922156837.6U patent/CN210628345U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116528458A (en) * | 2023-04-06 | 2023-08-01 | 深圳市基石新材料技术有限公司 | Circuit board module with heat dissipation structure and manufacturing method |
| CN116528458B (en) * | 2023-04-06 | 2023-10-20 | 深圳市基石新材料技术有限公司 | Circuit board module with heat dissipation structure and manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240514 Address after: 337009 Ganxiang Cooperation Industrial Park (Shangli Industrial Park), Jinshan Town, Shangli County, Pingxiang City, Jiangxi Province Patentee after: Jiangxi Xinju Energy Technology Co.,Ltd. Country or region after: China Address before: 518000 5f-c122, Pengcheng Huihe logistics park, Gangtou Industrial Zone, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN JUNENG DAYE PHOTOELECTRIC TECHNOLOGY CO.,LTD. Country or region before: China |
|
| TR01 | Transfer of patent right |