CN214249201U

CN214249201U - Lamp structure with printed circuit board

Info

Publication number: CN214249201U
Application number: CN202023154936.XU
Authority: CN
Inventors: 郑联盟; 郑雨轩; 李跃; 王海川; 陈彤; 黄宏业; 王彬弘
Original assignee: Fluor Optoelectronic Co ltd
Current assignee: Fluor Optoelectronic Co ltd
Priority date: 2020-12-24
Filing date: 2020-12-24
Publication date: 2021-09-21
Anticipated expiration: 2030-12-24

Abstract

The utility model discloses a lamps and lanterns structure of printing formation circuit board, including the lamp body, scribble the circuit that is equipped with the copper thick liquid electric conductor and constitutes on the lamp body through being provided with heat conduction insulating ink layer, scribble the white oil layer on the copper thick liquid electric conductor, luminous light source sets up on the white oil layer and leads with the copper thick liquid electric conductor and connect. In the utility model, the copper paste conductor is coated and protected by the white oil layer, which is beneficial to the better performance of the copper paste conductor in the conductive function, avoiding short circuit and protecting the conductive layer to prolong the service life; the copper paste conductor is arranged on the aluminum foil, and the aluminum foil layer is provided with the adhesive layer to be conveniently arranged on the bottom wall of the lamp shell, so that the copper paste conductor is convenient for workers to quickly attach and is beneficial to social assembly line work; the glue film is covered by the release film, a processor can process the whole circuit board consisting of copper paste on the aluminum foil outside the lamp shell, and then the circuit board is pasted on the glue film for standby use by the release film, so that the processing difficulty is reduced, and meanwhile, the later-stage transportation and use are facilitated.

Description

Lamp structure with printed circuit board

Technical Field

The utility model relates to a printing forms lamps and lanterns structure of circuit board.

Background

The traditional lamp has a structure of forming a circuit by printing copper paste, and comprises a shell, wherein an insulating layer is arranged on the bottom wall of the shell, a conductive bonding layer is fixedly bonded on the insulating layer, the conductive bonding layer forms a conductive circuit, the conductive bonding layers are separated by gaps, a light source and electronic components forming a lighting circuit are arranged at each gap, the light source and the electronic components are connected with the conductive bonding layers on the two sides of the gap, and the two ends of the conductive circuit formed by the conductive bonding layers are connected with the positive electrode and the negative electrode of a power supply. The conductive bonding layer of the lamp is not well protected, and the conductive bonding layer is inconvenient to arrange on the lamp, so that the mass social processing with stable performance is difficult to realize.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a lamps and lanterns structure of printing formation circuit board is provided, this lamps and lanterns structure of printing formation circuit board can protect the circuit better and be convenient for process.

Therefore, the utility model provides a printing forms lamps and lanterns structure of circuit board, characterized by: the LED lamp comprises a lamp shell, wherein a circuit formed by copper paste electric conductors is coated on the lamp shell through a heat conduction insulating ink layer, the heat conduction insulating ink layer, a white oil layer is coated on the copper paste electric conductors, and a light-emitting source is arranged on the white oil layer and is in conductive connection with the copper paste electric conductors.

Preferably, the heat-conducting insulating ink layer is coated on an aluminum foil, a hot-pressing adhesive layer is arranged on the lower surface of the aluminum foil, and the aluminum foil is fixed at the bottom of the lamp housing in a pressing mode through the hot-pressing adhesive layer.

Preferably, the heat-conducting insulating ink layer is coated on an aluminum foil, a heat-resistant adhesive layer is arranged on the lower surface of the aluminum foil, and the aluminum foil is fixed at the bottom of the lamp housing by heating and pressurizing through the heat-resistant adhesive layer.

Preferably, the heat-conducting insulating ink layer is directly coated on the bottom wall of the lamp housing.

The utility model provides a technological effect:

1) the utility model discloses in, the protection is paintd on the white oil layer to copper thick liquid electric conductor adoption, is favorable to the better performance conductive function of copper thick liquid electric conductor, avoids the short circuit to and the protection conducting layer is in order to prolong its life.

2) The copper paste conductor is arranged on the aluminum foil, and the aluminum foil layer is provided with the adhesive layer to be conveniently arranged on the bottom wall of the lamp shell, so that the copper paste conductor is convenient for workers to quickly attach and is beneficial to social assembly line work;

3) the glue film is covered by the release film, a processor can process the whole circuit board consisting of copper paste on the aluminum foil outside the lamp shell, and then the circuit board is pasted on the glue film for standby use by the release film, so that the processing difficulty is reduced, and meanwhile, the later-stage transportation and use are facilitated.

Drawings

Fig. 1 is a schematic structural diagram of a lamp structure printed with a circuit board according to embodiment 1 provided in the present invention, in which a thermal compression adhesive and a release film are disposed on the lower portion of an aluminum foil.

Fig. 2 is a schematic structural view of the aluminum foil of fig. 1 after a heat-conducting insulating ink layer is coated on the upper surface of the aluminum foil.

Fig. 3 is a schematic structural view of the thermal conductive insulating ink layer of fig. 2 after a copper paste conductor is printed or coated on the upper surface of the thermal conductive insulating ink layer.

Fig. 4 is a schematic structural diagram of the copper paste conductor in fig. 3 after being coated with a white oil layer.

Fig. 5 is a schematic structural view of the composite layer of fig. 4 after the release film is torn off and then the composite layer is bonded to the bottom wall of the lamp housing.

Fig. 6 is a schematic structural diagram of the copper paste conductor in fig. 5 after a light-emitting source is disposed thereon.

Fig. 7 is a schematic structural diagram of a lamp structure printed with a circuit board according to embodiment 2 of the present invention, in which a heat-resistant adhesive and a release film are disposed on the lower portion of an aluminum foil.

Fig. 8 is a schematic structural view of the aluminum foil of fig. 7 after a heat-conducting insulating ink layer is coated on the upper surface of the aluminum foil.

Fig. 9 is a schematic structural view of the thermal conductive insulating ink layer of fig. 8 after a copper paste conductor is printed or coated on the upper surface of the thermal conductive insulating ink layer.

Fig. 10 is a schematic structural view of the copper paste conductor of fig. 9 after being coated with a white oil layer.

Fig. 11 is a schematic structural view of the copper paste conductor in fig. 10 after a light-emitting source is disposed thereon.

Fig. 12 is a schematic structural view of the composite layer of fig. 11 after the release film is torn off and then the composite layer is bonded to the bottom wall of the lamp housing.

Fig. 13 is a schematic structural view of a lamp structure printed with a circuit board according to embodiment 3, in which a heat-conducting insulating ink layer is directly coated on an aluminum plate constituting a lamp housing.

Fig. 14 is a schematic structural view of the thermal conductive insulating ink layer of fig. 13 after a copper paste conductor is printed or coated on the upper surface thereof.

Fig. 15 is a schematic structural view of the copper paste conductor of fig. 14 after being coated with a white oil layer.

Fig. 16 is a schematic structural view of the aluminum plate constituting the lamp envelope of fig. 15 after being processed into a lamp envelope.

Fig. 17 is a schematic structural view of the copper paste conductor in fig. 16 after a light-emitting source is disposed thereon.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. In which like parts are designated by like reference numerals. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "bottom" and "top," "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.

Referring to fig. 1-6, the utility model provides a printing forms lamps and lanterns structure of circuit board, including the lamp body, on the lamp body through being provided with heat conduction insulating ink layer, the circuit that is equipped with the copper thick liquid electric conductor on the heat conduction insulating ink layer and constitutes, the circuit that this copper thick liquid electric conductor constitutes, luminous light source and other electronic component constitute the illumination return circuit, be equipped with the white oil layer on the copper thick liquid electric conductor, luminous light source sets up on the white oil layer and leads with the copper thick liquid electric conductor and connect, do not brush white oil in the position that needs the fixed luminous light source of soldering tin, luminous light source is luminous chip, luminous chip soldering connection is fixed and is being related to establishing the position at the light source, the copper thick liquid adopts the mode setting of printing, also can fix a point copper thick liquid of notes. The heat-conducting insulating ink layer is coated on the aluminum foil, the hot-pressing adhesive layer is arranged on the lower surface of the aluminum foil, and the aluminum foil is fixed at the bottom of the lamp shell in a pressing mode through the hot-pressing adhesive layer.

Referring to fig. 1 to 6, in the above embodiment 1, the present invention provides a process for processing the lamp structure of the printed circuit board, including the following steps:

A. fixing the heat-conducting insulating ink layer on the bottom wall of the lamp shell;

B. coating copper paste on the heat-conducting insulating ink layer to form a copper paste conductor, wherein the copper paste conductor forms a lamp circuit;

C. coating a white oil layer on the copper paste conductor;

D. and arranging the light-emitting light source on the copper paste conductor and forming conductive connection.

In the above embodiment 1, the heat conductive insulating ink layer in the step a is coated on the aluminum foil, the bottom of the aluminum foil is provided with the hot-pressing adhesive layer, and the outer surface of the hot-pressing adhesive layer is covered with the release film; a step C1 is added between the step C and the step D: and D, uncovering a release film from the composite layer formed in the step C, and then pressing and fixing the composite layer on the bottom wall of the lamp shell.

Referring to fig. 7 to 12, embodiment 2 of the present invention is substantially the same as embodiment 1, except that: the heat-conducting insulating ink layer is coated on the aluminum foil, the lower surface of the aluminum foil is provided with a heat-resistant adhesive layer, and the aluminum foil is heated and pressurized to be fixed at the bottom of the lamp shell by adopting the heat-resistant adhesive layer.

Referring to fig. 7 to 12, the processing method of the above example 2 is substantially the same as that of the example 1, and the difference is only that: in the step A, the heat-conducting insulating ink layer is coated on the aluminum foil, the bottom of the aluminum foil is provided with a heat-resistant adhesive layer, and the outer surface of the heat-resistant adhesive layer is covered with a release film; a step C1 is added between the step C and the step D: and C, firstly arranging a light-emitting source on the copper paste conductor of the composite layer formed in the step C, connecting the light-emitting source with the copper paste conductor in a conduction mode, then uncovering the release film, and then heating and pressurizing to fix the composite layer and the light-emitting source on the bottom wall of the lamp shell together.

Referring to fig. 13-17, embodiment 3 of the present invention is substantially the same as embodiment 1, except that: the heat-conducting insulating ink layer is directly coated on the bottom wall of the lamp shell.

Referring to fig. 13 to 17, the processing method of the above example 3 is substantially the same as that of the example 1, and the difference is only that: and in the step A, the heat-conducting insulating ink layer is directly coated on the bottom wall of the lamp housing.

It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims

1. A lamp structure of a printed circuit board is characterized in that: the LED lamp comprises a lamp shell, wherein a circuit formed by copper paste electric conductors is coated on the lamp shell through a heat conduction insulating ink layer, the heat conduction insulating ink layer, a white oil layer is coated on the copper paste electric conductors, and a light-emitting source is arranged on the white oil layer and is in conductive connection with the copper paste electric conductors.

2. The printed wiring board lamp structure of claim 1, wherein: the heat-conducting insulating ink layer is coated on the aluminum foil, the hot-pressing adhesive layer is arranged on the lower surface of the aluminum foil, and the aluminum foil is fixed at the bottom of the lamp shell in a pressing mode through the hot-pressing adhesive layer.

3. The printed wiring board lamp structure of claim 1, wherein: the heat-conducting insulating ink layer is coated on the aluminum foil, the lower surface of the aluminum foil is provided with a heat-resistant adhesive layer, and the aluminum foil is heated and pressurized to be fixed at the bottom of the lamp shell by adopting the heat-resistant adhesive layer.

4. The printed wiring board lamp structure of claim 1, wherein: the heat-conducting insulating ink layer is directly coated on the bottom wall of the lamp shell.

5. A printed wiring board forming light fixture construction as claimed in claim 1 or 2 or 3 or 4, wherein: the heat-conducting insulating ink layer is directly coated on the bottom wall of the lamp shell.