CN210465615U - Chip aging test module - Google Patents
Chip aging test module Download PDFInfo
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- CN210465615U CN210465615U CN201921185232.3U CN201921185232U CN210465615U CN 210465615 U CN210465615 U CN 210465615U CN 201921185232 U CN201921185232 U CN 201921185232U CN 210465615 U CN210465615 U CN 210465615U
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- block
- test module
- limiting insertion
- insertion block
- spacing inserted
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- 238000012360 testing method Methods 0.000 title claims abstract description 87
- 230000032683 aging Effects 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 238000003780 insertion Methods 0.000 claims description 44
- 230000037431 insertion Effects 0.000 claims description 44
- 238000000034 method Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000009863 impact test Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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Abstract
The utility model discloses a chip aging testing module, concretely relates to test module technical field, including supporting baseplate, supporting baseplate's top surface is provided with the test module base plate, and supporting baseplate's bottom surface is provided with the protrusion piece, the quantity of protrusion piece is provided with four, and four protrusion pieces set up to the integral type structure with supporting baseplate, supporting baseplate's surface runs through and has seted up first locating hole. The utility model discloses set up first spacing inserted block and the spacing inserted block of second, the screw thread rotates between expansion block and first spacing inserted block and the spacing inserted block of second, the cooperation is protruding most advanced and can be avoided first spacing inserted block and the spacing inserted block of second to appear droing and leave the phenomenon in first locating hole, the connection between test module base plate and the supporting substrate has been realized, the spring has been set up, the power accessible spring that test module board received transmits the supporting substrate on, reduce rocking on the test module base plate.
Description
Technical Field
The utility model relates to a test module technical field, more specifically say, the utility model relates to a chip aging testing module.
Background
Testing of integrated circuit chips is essential at various stages of semiconductor processing, each IC chip must be tested in both wafer (wafer) and package (package) formats to ensure its electrical function, and as chip functionality is enhanced and complicated, the need for high speed and accurate testing is even more important, and individual chips are tested in wafer format in a process known as wafer probing (wafer probing), which establishes temporary electrical contact between the chip and automated test equipment, which is an important test of IC design and function to screen out good IC chips before chip separation and subsequent packaging.
The invention patent of patent application publication No. CN 108107342A discloses a test module wiring method and a test module, the invention comprises a top plate, a bottom plate, an inner plate, an array hole, a cold and hot impact test hole and wiring; the wiring method of the test module and the test module can be used for not only carrying out thermal stress test, but also carrying out cold and hot impact test, testing each board, having small reliability difference, and reducing the cost without more material feeding.
However, in practical use, there are still many disadvantages, such as the inability to quickly detach the supporting substrate from the testing module substrate, and difficulty in testing the chip.
SUMMERY OF THE UTILITY MODEL
In order to overcome prior art's above-mentioned defect, the embodiment of the utility model provides a chip aging testing module, through having set up first spacing inserted block and the spacing inserted block of second, twist and move the inflation piece, the screw thread rotates between inflation piece and first spacing inserted block and the spacing inserted block of second, can install first locating hole and second locating hole with the spacing inserted block of second in, the connection between test module base plate and the supporting substrate has been realized, test module base plate and supporting substrate installation are dismantled simply, in order to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a chip aging test module comprises a supporting substrate, wherein a test module substrate is arranged on the top end surface of the supporting substrate, protruding blocks are arranged on the bottom end surface of the supporting substrate, the number of the protruding blocks is four, and the four protruding blocks and the supporting substrate are arranged into an integrated structure;
the surface of the supporting substrate is provided with a first positioning hole in a penetrating mode, the surface of the testing module substrate is provided with a second positioning hole in a penetrating mode, the top end surface of the testing module substrate is provided with an insulating gasket, the second positioning hole and the first positioning hole are arranged in a vertical collinear mode, a first limiting insertion block is arranged inside the second positioning hole and the first positioning hole, and a second limiting insertion block is arranged on one side of the first limiting insertion block.
In a preferred embodiment, the first limiting insertion block and the second limiting insertion block have the same structure, and are symmetrically arranged about a vertical central axis of the first positioning hole.
In a preferred embodiment, the inner cavities of the first and second limiting insertion blocks are both provided with thread grooves, and the bottom ends of the first and second limiting insertion blocks are both provided with protruding tips.
In a preferred embodiment, the first limit insertion block and the second limit insertion block are embedded with expansion blocks, the outer wall of the circumferential side of each expansion block is provided with a thread, the expansion blocks are in threaded connection with the first limit insertion block and the second limit insertion block, and the surfaces of the expansion blocks are attached to the insulating gaskets.
In a preferred embodiment, the top surface of the test module substrate is provided with a test module board, and the bottom surface of the test module substrate is provided with contacts, and the surface of the test module board is coated with traces.
In a preferred embodiment, the top end surface of the supporting substrate is provided with a plurality of contact grooves, and the plurality of contact grooves are matched with the contacts.
In a preferred embodiment, a lower fixing block is arranged on one side, close to the contact groove, of the top end surface of the supporting substrate, and a first hanging block is arranged at the top end of the lower fixing block.
In a preferred embodiment, one end of the first hanging block is connected with a spring, one end of the spring is connected with a second hanging block, an upper fixing block is arranged at the top end of the second hanging block, and the upper fixing block is fixedly connected with the bottom surface of the test module substrate.
The utility model discloses a technological effect and advantage:
1. the utility model discloses a set up first spacing inserted block and second spacing inserted block, twist and move the inflation piece, screw rotation between inflation piece and first spacing inserted block and the second spacing inserted block, can install first spacing inserted block and second spacing inserted block in first locating hole and the second locating hole, the setting of salient point can avoid first spacing inserted block and second spacing inserted block to appear droing and leave the phenomenon inside the first locating hole, and then realized being connected between test module base plate and the support substrate, test module base plate and support substrate installation are dismantled simply;
2. the utility model discloses a set up the spring, the second hanger block that will go up in the fixed block is connected with the spring to be connected with first hanger block with the one end of spring, at this moment the spring is located the fixed block and down between the fixed block, when carrying out chip aging testing, the power accessible spring that the test module board received transmits the supporting substrate on, reduces rocking on the test module base plate.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic view of the contact connection of the present invention.
Fig. 3 is a schematic view of the installation structure of the expansion block of the present invention.
Fig. 4 is an enlarged view of a portion a of fig. 3.
Fig. 5 is a schematic view of a second spacing insert block of the present invention.
The reference signs are: the test device comprises a support substrate 1, a test module substrate 2, a test module plate 3, a wiring line 4, an expansion block 5, a contact 6, a contact groove 7, an upper fixing block 8, a spring 9, a lower fixing block 10, a protruding block 11, a first positioning hole 12, a second positioning hole 13, an insulating gasket 14, a first limiting insertion block 15, a second limiting insertion block 16, a protruding tip 17 and a thread groove 18.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model relates to a chip aging testing module, including supporting baseplate 1, supporting baseplate 1's top surface is provided with test module base plate 2, and supporting baseplate 1's bottom surface is provided with protrusion piece 11, the quantity of protrusion piece 11 is provided with four, and four protrusion pieces 11 set up to the integral type structure with supporting baseplate 1.
Referring to the attached drawings 1, 3 and 5 in the specification, the chip aging test module of the embodiment includes a first positioning hole 12, the surface of the support substrate 1 is provided with the first positioning hole 12 in a penetrating manner, the surface of the test module substrate 2 is provided with a second positioning hole 13 in a penetrating manner, the top end surface of the test module substrate 2 is provided with an insulating gasket 14, the second positioning hole 13 and the first positioning hole 12 are vertically arranged in a collinear manner, a first limiting insertion block 15 is arranged inside the second positioning hole 13 and the first positioning hole 12, and a second limiting insertion block 16 is arranged on one side of the first limiting insertion block 15.
Further, the first limiting insertion block 15 and the second limiting insertion block 16 are identical in structure, the first limiting insertion block 15 and the second limiting insertion block 16 are symmetrically arranged about the vertical central axis of the first positioning hole 12, threaded grooves 18 are formed in inner cavities of the first limiting insertion block 15 and the second limiting insertion block 16, and protruding tips 17 are arranged at the bottom ends of the first limiting insertion block 15 and the second limiting insertion block 16.
Further, the inside embedding of first spacing inserted block 15 and the spacing inserted block 16 of second is provided with inflation piece 5, the circumference side outer wall of inflation piece 5 is seted up threadedly, and threaded connection between inflation piece 5 and first spacing inserted block 15 and the spacing inserted block 16 of second, the surface and the insulating gasket 14 of inflation piece 5 are laminated mutually.
The implementation scenario is specifically as follows: in the actual use process, a user puts the test module substrate 2 on the top end surface of the support substrate 1, vertically collinearly arranges the second positioning hole 13 and the first positioning hole 12, then sequentially penetrates the first limiting insert 15 and the second limiting insert 16 through the insulating gasket 14, the second positioning hole 13 and the first limiting hole 12, at this time, puts the expansion block 5 between the first limiting insert 15 and the second limiting insert 16, screws the expansion block 5, and rotates the expansion block 5 and the first limiting insert 15 and the second limiting insert 16 through threads, so that the first limiting insert 15 and the second limiting insert 16 can be installed in the first positioning hole 12 and the second positioning hole 13, and due to the arrangement of the convex tip 17, the phenomenon that the first limiting insert 15 and the second limiting insert 16 fall off and leave the inside of the first positioning hole 12 can be avoided, and the connection between the test module substrate 2 and the support substrate 1 is further realized, the test module substrate 2 and the support substrate 1 are simple to mount and dismount and easy to operate and use.
Referring to fig. 1-4 of the specification, the chip aging test module of this embodiment includes a test module board 3, the top surface of the test module substrate 2 is provided with the test module board 3, and the bottom surface of the test module substrate 2 is provided with contacts 6, the surface of the test module board 3 is coated with a routing strip 4, the top surface of the support substrate 1 is provided with a plurality of contact grooves 7, the number of the contact grooves 7 is provided with a plurality of contact grooves 7, and the plurality of contact grooves 7 are matched with the contacts 6.
Further, one side of the top end surface of the supporting substrate 1, which is close to the contact groove 7, is provided with a lower fixing block 10, and the top end of the lower fixing block 10 is provided with a first hanging block.
Further, the one end of first hanging piece is connected with spring 9, the one end of spring 9 is connected with the second hanging piece, the top of second hanging piece is provided with fixed block 8, go up fixed block 8 and test module base plate 2's bottom fixed surface and be connected.
The implementation scenario is specifically as follows: during the use, a plurality of contact grooves 7 phase-match that a plurality of contacts 6 in the test module base plate 2 and the supporting substrate 1 surface were seted up, can realize the accurate installation of test module base plate 2, the second hanger block that will go up in the fixed block 8 afterwards is connected with spring 9, and be connected with first hanger block with spring 9's one end, at this moment spring 9 is located fixed block 8 and down between the fixed block 10, when carrying out chip aging testing, the power accessible spring 9 that test module board 3 received transmits supporting substrate 1 on, reduce the rocking on the test module base plate 2, prolong test module base plate 2's test life.
The utility model discloses a theory of operation:
referring to the attached drawings 1, 3 and 5 in the specification, a first limiting insertion block 15 and a second limiting insertion block 16 are arranged, the expansion block 5 is screwed, the expansion block 5, the first limiting insertion block 15 and the second limiting insertion block 16 are in threaded rotation, the first limiting insertion block 15 and the second limiting insertion block 16 can be installed in the first positioning hole 12 and the second positioning hole 13, the protruding tip 17 is arranged, the phenomenon that the first limiting insertion block 15 and the second limiting insertion block 16 fall off and leave the inner part of the first positioning hole 12 can be avoided, connection between the test module substrate 2 and the support substrate 1 is achieved, and the test module substrate 2 and the support substrate 1 are easy to install and detach.
Referring to the attached drawings 1-4 in the specification, a spring 9 is arranged, a second hanging block in an upper fixing block 8 is connected with the spring 9, one end of the spring 9 is connected with a first hanging block, the spring 9 is located between the upper fixing block 8 and a lower fixing block 10, when the chip aging test is carried out, the force applied to a test module board 3 can be transmitted to a supporting substrate 1 through the spring 9, and the shaking of the test module board 2 is reduced.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A chip aging test module comprises a supporting substrate (1), and is characterized in that: the testing module substrate (2) is arranged on the top end surface of the supporting substrate (1), the protruding blocks (11) are arranged on the bottom end surface of the supporting substrate (1), the number of the protruding blocks (11) is four, and the four protruding blocks (11) and the supporting substrate (1) are arranged into an integrated structure;
the surface of supporting baseplate (1) runs through and has been seted up first locating hole (12), the surface of test module base plate (2) runs through and has been seted up second locating hole (13), and the top surface of test module base plate (2) is provided with insulating gasket (14), the vertical collineation setting in second locating hole (13) and first locating hole (12), and the inside of second locating hole (13) and first locating hole (12) is provided with first spacing inserted block (15), one side of first spacing inserted block (15) is provided with the spacing inserted block of second (16).
2. The chip burn-in test module of claim 1, wherein: the structure of the first limiting insertion block (15) is the same as that of the second limiting insertion block (16), and the first limiting insertion block (15) and the second limiting insertion block (16) are symmetrically arranged around the vertical central axis of the first positioning hole (12).
3. The chip burn-in test module of claim 1, wherein: threaded grooves (18) are formed in inner cavities of the first limiting insertion block (15) and the second limiting insertion block (16), and protruding tips (17) are arranged at the bottom ends of the first limiting insertion block (15) and the second limiting insertion block (16).
4. The chip burn-in test module of claim 3, wherein: the expansion block (5) is arranged in the first limiting insertion block (15) and the second limiting insertion block (16) in an embedded mode, threads are formed in the outer wall of the circumferential side of the expansion block (5), the expansion block (5) is in threaded connection with the first limiting insertion block (15) and the second limiting insertion block (16), and the surface of the expansion block (5) is attached to the insulating gasket (14).
5. The chip burn-in test module of claim 1, wherein: the testing module comprises a testing module substrate (2), and is characterized in that a testing module board (3) is arranged on the top end surface of the testing module substrate (2), contacts (6) are arranged on the bottom end surface of the testing module substrate (2), and walking lines (4) are coated on the surface of the testing module board (3).
6. The chip burn-in test module of claim 5, wherein: the top surface of supporting baseplate (1) has been seted up and has been touched groove (7), the quantity that touches groove (7) is provided with a plurality ofly, and a plurality ofly touches groove (7) and contact (6) phase-match.
7. The chip burn-in test module of claim 6, wherein: one side that the top surface of supporting baseplate (1) is close to touching groove (7) is provided with down fixed block (10), the top of fixed block (10) is provided with first hanger block down.
8. The chip burn-in test module of claim 7, wherein: the one end of first hanger block is connected with spring (9), the one end of spring (9) is connected with the second hanger block, the top of second hanger block is provided with fixed block (8), go up the bottom fixed surface who fixed block (8) and test module base plate (2) and be connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921185232.3U CN210465615U (en) | 2019-07-26 | 2019-07-26 | Chip aging test module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921185232.3U CN210465615U (en) | 2019-07-26 | 2019-07-26 | Chip aging test module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210465615U true CN210465615U (en) | 2020-05-05 |
Family
ID=70447765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921185232.3U Expired - Fee Related CN210465615U (en) | 2019-07-26 | 2019-07-26 | Chip aging test module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210465615U (en) |
-
2019
- 2019-07-26 CN CN201921185232.3U patent/CN210465615U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200505 |
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| CF01 | Termination of patent right due to non-payment of annual fee |