TW201917802A - Wafer level testing structure for multi-sites solution - Google Patents

Abstract

A wafer-level testing structure for multi-sites solution is disclosed. The wafer-level testing structure for multi-sites solution includes a printed circuit board (PCB); at least two socket assemblies set side by side on the PCB, wherein each socket assembly comprises a bottom plate and a positioning stiffener combined to form a socket; one of at least two sub PCB assemblies set on the socket, wherein each sub PCB assembly includes a sub PCB and a final testing substrate; a fixing ring set on the PCB and said fixing ring is provided with a hollow portion, wherein said socket assembly and sub PCB assembly is positioned on the hollow portion; and a probe head assembly set above said sub PCB assembly, and is fixed on the fixing ring. A plurality of final testing substrates arranged side by side are utilized for a wafer-level testing process with multi-sites to improve the testing efficiency. In addition, the socket design is utilized to achieve a function of good accessibility for replacement and good accessibility for testing.

Description

Wafer-level multipoint test structure

The invention relates to a probe test structure, in particular to a wafer-level multi-point test structure.

In the manufacturing process of semiconductor products, wafer testing refers to the technology of performing circuit testing on semiconductor integrated circuits on a wafer to ensure the normal operation of the circuit and to know the yield of the product. Among them, automatic test equipment (ATE) is used to form a temporary electrical connection between the integrated circuits on the wafer to verify the normal electrical characteristics of the integrated circuits. During wafer testing, a probe card device is used to pass signals to the integrated circuit.

Referring to FIG. 1, a conventional conventional circuit test probe card structure 1 mainly includes a circuit board 10, a probe substrate 12, and a probe head group 14. In addition, according to different structural designs, a fixing ring 16 and a reinforcing pad 18 are respectively combined on both sides of the circuit board to stabilize and increase the strength of the circuit board to avoid deformation under high temperature or external force environment. The probe substrate 12 is disposed in the hollow portion of the fixing ring 16. A plurality of solder balls 122 on one side surface of the probe substrate 12 are respectively corresponding to the contacts 102 of the circuit board 10. Point 102 is welded. A plurality of internal contacts 124 are provided on the other surface of the substrate 10, and a plurality of conductive lines are provided in the probe substrate 12 to connect between the internal contacts 124 and the solder balls 122. The probe head group 14 is fixed on the other side of the fixing ring 16, and one end of each of the plurality of probes passes through the positioning hole on the probe holder so that the ends of each probe maintain a proper convex length for resistance to the probe. The inner contact point 124 of the pin substrate 12. The other end of each probe can extend outward through the lower hole of the probe holder and maintain a compression elasticity for forming an electrical connection with an external circuit test point. However, the probe substrate of the prior art is a monolithic substrate. In addition to the difficulty in replacing the probe substrate due to its assembly method, the test efficiency is also limited. In addition, when testing different products, it is impossible to directly replace the probe substrate only, which is extremely inconvenient. It is a very important issue in the industry to provide a multi-point test device that is more efficient, more convenient to operate, and can meet various production requirements.

The invention provides a wafer-level multi-point test structure, which uses multiple final test substrates to be aligned side-by-side to perform multi-point test on a wafer at the same time, which not only increases test efficiency, but also enables pluggable design to achieve convenient testing and The effect of replacement.

A wafer-level multi-point test structure according to an embodiment of the present invention includes: a printed circuit board having a test side and a wafer side opposite to the test side; at least two socket seat components are disposed on the printed circuit board. On the wafer side, each slot seat assembly has a slot hole, wherein each slot seat assembly includes a slot seat bottom plate and a positioning reinforcement plate, and the positioning reinforcement plate ring is fixed on the periphery of the slot seat bottom plate. To form a slot; at least a secondary circuit board component, one of which is removably disposed in a slot, wherein each primary circuit board component includes: a primary circuit board; and a final test The substrate is fixed on the secondary circuit board, wherein the secondary circuit board is located between the final test substrate and the slot; a fixing ring is arranged on the printed circuit board, and the fixing ring has an exposed part, wherein the socket seat assembly and the The secondary circuit board component is located in the exposed part; and a probe head component is disposed above the secondary circuit board component and fixedly disposed on the fixing ring.

In the following, detailed description will be given through specific embodiments in conjunction with the accompanying drawings to make it easier to understand the purpose, technical content, characteristics and effects achieved by the present invention.

The invention mainly provides a wafer-level multi-point test structure, and a plurality of final test circuit boards are arranged side by side to complete the multi-point test of the wafer. Hereinafter, the embodiments of the present invention will be described in detail, and illustrated with the drawings. In addition to these detailed descriptions, the present invention can also be widely implemented in other embodiments, and easy replacements, modifications, and equivalent changes of any of the embodiments are included in the scope of this case, and the scope of subsequent patents is quasi. In the description of the specification, in order to provide the reader with a more complete understanding of the present invention, many specific details are provided; however, the present invention may be implemented without omitting some or all of these specific details. In addition, well-known steps or elements are not described in detail to avoid unnecessary limitations of the present invention. The same or similar elements in the drawings will be represented by the same or similar symbols. It is particularly noted that the drawings are for illustrative purposes only and do not represent the actual size or number of components, and irrelevant details have not been completely drawn in order to simplify the drawings.

Please refer to FIG. 2 first, which is an assembly schematic diagram of a wafer-level multi-point test structure according to an embodiment of the present invention. As shown in the figure, a wafer-level multi-point test structure 2 according to an embodiment of the present invention includes a printed circuit board 20, at least two socket seat assemblies 22, at least secondary circuit board assemblies 24, a fixing ring 26, and a Probe head assembly 28. In the embodiment of FIG. 2, the number of the socket seat components 22 includes but is not limited to two, and the number of the secondary circuit board components 24 also includes but is not limited to two. The printed circuit board 20 has a test side 201 and a wafer side 202 opposite to the test side 201. The socket base assemblies 22 are arranged side by side on the wafer side 202 of the printed circuit board 20, and each socket base assembly 22 has a slot hole 221. Each of the secondary circuit board components 24 is removably disposed in the slot 221. Each of the secondary circuit board components 24 includes: a secondary circuit board 241; and a final test substrate 242 is fixed on the secondary circuit board 241. Above, the secondary circuit board 241 is located between the final test substrate 242 and the slot 221. Because the height of the test machine is fixed, the secondary circuit board 241 can be used to thicken the final test substrate 242 (that is, increase the secondary The overall thickness of the circuit board assembly 24) to match the height of the machine. In one embodiment, the final test substrate 242 is disposed on the secondary circuit board 241 in an appropriate form, such as Surface Mount Technology (SMT) or other bonding methods. In an embodiment, if the size of each die area of the wafer to be tested is 10 mm (mm) x 10 mm (mm), the size of the final test substrate 242 includes, but is not limited to, 17 mm (mm) x 17 mm (mm). In addition, each final test substrate 242 can be defined as a unit test area (1 site). The invention can test at least two unit test areas (2 site) at the same time at the same time. Efficiency issues. In yet another embodiment, the secondary circuit board 241 of the secondary circuit board assembly 24 includes a plurality of fixing portions 2412. The secondary circuit board assembly 24 can be positioned on the socket base assembly 22 using the plurality of fixing portions 2412. In another example, in another embodiment, the plurality of fixing portions 2412 include, but are not limited to, fixing holes, which are fixed to the socket seat assembly 22 by a suitable method, for example, by screwing. The fixing ring 26 is disposed on the printed circuit board 20, and the fixing ring 26 has an exposed portion 261. The slot seat component 22 and the secondary circuit board component 24 are located in the exposed portion 261. The probe head assembly 28 is disposed above the secondary circuit board assembly 24 and is fixedly disposed on the fixing ring 26. In one embodiment, the structure of the secondary circuit board assembly 24 and the socket seat assembly 22 after being assembled on the printed circuit board is shown in FIG. 3.

Continuing the above, in order to clearly explain the structure of the socket seat assembly, please continue to refer to FIG. 2 and FIG. 4A and FIG. 4B, wherein FIG. 4A and FIG. As shown in the figure, each slot seat assembly 22 includes a slot seat bottom plate 222 and a positioning reinforcement plate 224, and the positioning reinforcement plate 224 is fixed around the periphery of the slot seat bottom plate 222 to form a slot hole 221. The secondary circuit board assembly 24 is removably correspondingly disposed in the slot 221. The secondary circuit board assembly 24 can be easily replaced by a plurality of fixing parts 2412. In addition, the secondary circuit of a different design can be replaced by using The board assembly 24 is applicable to various products, thereby reducing costs.

According to an embodiment, in one embodiment, the socket seat assembly 22 further includes at least one set screw 226 disposed on the periphery of the positioning reinforcing plate 224 to control the horizontal displacement of the secondary circuit board assembly 24 disposed thereon as required. In another embodiment, please refer to FIG. 2, FIG. 5A and FIG. 5B together. As shown in the figure, the socket base assembly 22 may further include a polyester film gasket 228 disposed on the socket base assembly 22 and the printed circuit. Between the boards 20, or alternatively, a polyester film gasket 228 may be disposed between the socket seat assembly 22 and the secondary circuit board assembly 24 to adjust the height and flatness of the secondary circuit board assembly 24 as required. By fine-tuning the horizontal displacement, height, and flatness of the secondary circuit board assembly 24, in addition to improving the accuracy of the test machine, detailed adjustments can also be made according to the test needs of different objects or products to be tested.

According to the above, the wafer-level multi-point test structure of the present invention utilizes multiple final test circuit boards side by side to complete the multi-point test of the wafer to increase test efficiency. In addition, the final test circuit board generally has no space for additional fixing, so the present invention uses a secondary circuit board in combination with the final test circuit board to effectively increase the locking space; and the plug-in assembly method of the socket seat assembly is convenient for operators to operate Replacement and alignment. In addition, the secondary circuit board components can be easily replaced by a plurality of fixing parts to apply to various products, thereby reducing the development cost of the test machine. Furthermore, the use of stop screws and / or polyester film gaskets on the socket seat components can effectively adjust the vertical height and horizontal position of multiple sets of side-by-side secondary circuit board components to meet the requirements of different products under test. demand.

To sum up, the wafer-level multi-point test structure of the present invention utilizes multiple final test substrates to be aligned side-by-side to perform multi-point test on the wafer at the same time, which not only increases test efficiency, but also enables pluggable design for convenient testing. The effect of convenient replacement.

The above-mentioned embodiments are only for explaining the technical ideas and characteristics of the present invention. The purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. When the scope of the patent of the present invention cannot be limited, That is, any equivalent changes or modifications made in accordance with the spirit disclosed in the present invention should still be covered by the patent scope of the present invention.

1‧‧‧Circuit test probe card structure

10‧‧‧Circuit Board

102‧‧‧Contact

12‧‧‧ Probe substrate

122‧‧‧ solder ball

124‧‧‧Internal contact

14‧‧‧ Probe Head Set

16‧‧‧ fixed ring

18‧‧‧ Reinforcement pad

2‧‧‧ Wafer-level multi-point test structure

20‧‧‧printed circuit board

201‧‧‧Test side

202‧‧‧Wafer side

22‧‧‧Slot Block Assembly

221‧‧‧Slot

222‧‧‧Slot base plate

224‧‧‧Positioning plate

226‧‧‧stop screw

228‧‧‧Polyester film gasket

24‧‧‧ secondary circuit board components

241‧‧‧ secondary circuit board

2412‧‧‧Fixed section

242‧‧‧Final test substrate

26‧‧‧Fixed ring

261‧‧‧ Open Air Department

28‧‧‧ Probe head assembly

FIG. 1 is a schematic diagram of a conventional conventional circuit test probe card structure. FIG. 2 is a schematic diagram to be assembled of a wafer-level multi-point test structure according to an embodiment of the present invention. FIG. 3 is a schematic diagram of a partially assembled wafer-level multi-point test structure according to an embodiment of the present invention. 4A and 4B are schematic diagrams of a socket base assembly according to an embodiment of the present invention. FIG. 5A is a schematic diagram of a socket seat assembly according to another embodiment of the present invention. FIG. 5B is a partially enlarged schematic diagram of FIG. 5A.

Claims (6)

A wafer-level multi-point test structure includes: a printed circuit board having a test side and a wafer side opposite to the test side; at least two socket seat components arranged side by side on the crystal of the printed circuit board On the round side, and each of the slot seat components has a slot hole, wherein each of the slot seat components includes a slot seat bottom plate and a positioning reinforcing plate, and the positioning reinforcing plate ring is fixed to the slot seat A periphery of the bottom plate to form the slot; at least a secondary circuit board component, one of the secondary circuit board components is removably disposed in one of the slot holes, and each of the secondary circuit board components includes: a primary A circuit board; and a final test substrate, fixed on the secondary circuit board, wherein the secondary circuit board is located between the final test substrate and the slot; a fixing ring, disposed on the printed circuit board, and The fixing ring has an exposed part, wherein the socket seat component and the secondary circuit board component are located in the exposed part; and a probe head component is disposed above the secondary circuit board component and is fixedly disposed on the secondary circuit board component. On the retaining ring. The wafer-level multi-point test structure according to claim 1, wherein the secondary circuit board of the secondary circuit board assembly includes a plurality of fixing parts, and the secondary circuit board assembly is positioned on the socket base using the plurality of fixing parts. Components. The wafer-level multi-point test structure according to claim 2, wherein the plurality of fixing portions are fixing holes. The wafer-level multi-point test structure according to claim 1, further comprising at least one stop screw disposed on the positioning reinforcing plate to control the horizontal displacement of the secondary circuit board component. The wafer-level multi-point test structure as described in claim 1, further comprising a polyester film gasket disposed between the socket seat assembly and the printed circuit board to adjust the height and flatness of the secondary circuit board assembly degree. The wafer-level multi-point test structure as described in claim 1, further comprising a polyester film gasket disposed between the socket seat component and the secondary circuit board component to adjust the height of the secondary circuit board component. With flatness.