KR19980042221A - Semiconductor device test device - Google Patents

Abstract

Provided is an IC test apparatus that can test ICs having different protruding lengths of terminals even without preparing various types of device-specific adapters equipped with IC sockets. The frame frame 24, the plurality of socket boards 27 mounted on the upper surface 24A of the frame frame 24 via the spacers 26, and the plurality of socket boards 27 mounted on the lower surface 24B of the frame frame 24 On the socket board 27 of the device specific adapter 23 constituted by the insulating board 30 and the connect board 29 electrically connecting the socket board 27 and the insulating board 30. The IC socket 22 is mounted on the IC socket 22, and the device specific adapter 23 is mounted in the opening 21 formed in the bottom of the thermostat of the handler 12, and the IC socket is placed in the test section. At this time, the thickness adjusting member is provided on either side of the contact surface between the device Pacific adapter and the opening of the bottom of the thermostat chamber, so that the protrusion amount HH of the IC socket on the reference surface of the device Pacific adapter can be changed. Configure.

Description

Semiconductor device test device

The present invention relates to a semiconductor device transfer processing apparatus (generally called a handler) which is conveyed for testing a semiconductor device (for example, a semiconductor integrated circuit) and which classifies the tested semiconductor device according to the test result. The present invention relates to a semiconductor device test apparatus. In particular, a semiconductor device under test (generally referred to as a DUT) that is conveyed to a test unit of a handler by an automatic transport mechanism built into the semiconductor device transport processing apparatus (hereinafter referred to as a handler) is provided. It is about improvement of the part to test and measure.

As described above, a semiconductor device test apparatus for testing a semiconductor device may be connected with a handler for conveying the semiconductor device under test to perform a predetermined test and for classifying the tested semiconductor device according to the test result. many. For simplicity, hereinafter, a semiconductor device test apparatus (generally referred to as an IC tester) for testing a semiconductor integrated circuit (hereinafter referred to as IC), which is a representative example of a semiconductor device, is described as an example.

Fig. 4 is a side view schematically showing an example of this type of semiconductor device test apparatus (hereinafter referred to as IC tester). The IC tester is mainly connected to the tester main body 11 accommodating the electric circuit device, the handler 12 including the automatic transfer mechanism for conveying the IC, and the tester main body 11, but is configured separately. And the test head 13 attached to the test part of the handler 12.

The IC under test returned to the test unit by the automatic transfer mechanism of the handler 12 is electrically contacted with the test head 13 (specifically, the IC socket installed in the test head 13) of the tester body 11, As a result, the IC under test is electrically connected to the tester main body 11 through the test head 13 and the cable group 14. The test signal of a predetermined pattern supplied from the tester body 11 to the test head 13 through the cable group 14 is applied to the IC under test, and the response signal read from the IC under test is transmitted to the test head 13 and the cable. It is sent to the tester main body 11 through the group 14, and the electrical characteristics of the IC under test are measured.

Since the test section of the handler needs to test the IC under test in a designated temperature atmosphere, it is installed in a thermostat (not shown) for imparting a predetermined temperature stress to the IC under test. In order to make the IC under test returned to the test section electrically contact the test head 13 with the IC socket, an opening is provided in the bottom of the thermostat, and the test head 13 and the handler 12 of the IC tester are provided in the opening. A fitting for electrically coupling the test unit in the thermostat (it is called a device specific adapter in the technical field, hereinafter referred to as a device specific adapter), It is fixed.

Fig. 3 shows a structure of an example of a device specific adapter for coupling the test section and the test head 13 in the thermostat of the handler 12 described above to the test in the thermostat of the test head 13 and the handler 12. It is shown with wealth. An opening 21 is formed in the bottom surface of the thermostat of the handler 12, and the device special adapter 23 is attached to the opening 21. Frame 12B surrounding the periphery of the opening 21 represents a heat insulating wall on the bottom of the thermostat.

In this example, the device specific adapter 23 is provided via a spacer 26 on a frame 24 and one surface (in this example, an upper surface) 24A of the frame frame 24. A plurality of (two in this example) socket boards 27, a plurality of (two in this example) insulating boards 30 and sockets on the opposite side (lower surface in this example) 24B of the frame-shaped frame 24 It is comprised by the connecting board 29 (Connecting Board) which electrically connects between the board 27 and the insulating board 30. As shown in FIG. The frame frame 24 is generally formed of a resin-based heat insulating material, and is configured such that the temperature of the thermostat of the handler 12 does not leak to the outside.

IC sockets 22 are mounted on the upper surfaces of the two socket boards 27 mounted on the upper surface 24A of the frame frame 24, and two insulating boards 30 are disposed on the lower surface 24B of the frame frame 24, respectively. ), A predetermined number of male contacts 28 are respectively provided in a state of protruding outward. Between the terminal of each IC socket 22 and the corresponding male contact 28, in this example, the socket board 27 and the insulating board 30 are electrically connected to the upper and lower surfaces of the frame-shaped frame 24. It is electrically connected by the connect board 29 mentioned above. It goes without saying that the connecting means such as cables or wires other than the connect board 29 may electrically connect the terminals of the respective IC sockets 22 and the corresponding male contacts 28.

The male contact 28 of the device special adapter 23 is electrically connected to a plurality of contacts (female contact in this example) 31 on the upper surface of the motherboard portion 25. The motherboard portion 25 includes a frame 25F, an insulating board 37 on the upper surface of the frame 25F, and an insulating board 33 provided on the lower surface of the frame 25F, and on the insulating board 37 on the upper surface. The plurality of female contacts 31 are provided on the insulating board 33 on the lower surface with a plurality of contacts (in this example, a male contact 38 protruding outward).

The female contact 31 on the upper surface of the motherboard portion 25 is configured to be electrically and mechanically coupled to the male contact 28 on the lower surface of the frame frame 24, and the motherboard portion 25 is also provided. The male contact 38 on the lower surface is configured to be electrically and mechanically coupled to the female contact 39 provided on a performance board (not shown).

In addition, although the female contact 31 of the upper surface of the motherboard part 25 and the male contact 38 of the lower surface are electrically connected by the coaxial cable 32 in this example, it should be mentioned that it is not limited to a coaxial cable. There is no. For example, a normal connection cable or wire, a connect board, or the like may be used.

A performance board (not shown) is mounted on the top of the test head 13, and a motherboard portion 25 is mounted on the performance board, and an IC socket 22 is mounted on the motherboard portion 25. The device special adapter 23 is mounted. Generally, in this technical field, the combination of the device specific adapter 23 and the motherboard part 25 is called a hi-fix base or a test fixture. In this way, the driver group DR which sets the test signal of a predetermined pattern to the IC under test and the read-out signal from the IC under test, which are set in the test head 13, have a high (H) logic signal or low ( L) The comparator group CP for determining whether it is a logic signal, the power supply line, and the IC under test 34 are connected to the female contact 39 of the performance board, the male contact 38 on the lower surface of the motherboard 25, and the coaxial. The male contact 28 of the lower surface of the cable contact 32, the female contact 31 of the upper surface of the motherboard part 25, the device specific adapter 23, the connect board 29, and the device specific Electrical connection is possible via the IC socket 22 on the upper surface of the adapter 23.

The plurality of IC sockets 22 mounted on the opening 21 formed in the bottom surface of the thermostat of the handler 12 by mounting the device specific adapter 23 having the above-described configuration, and mounted on the upper surface 24A of the frame frame 24. ) Is exposed to a thermostat, and the IC 34, which has been conveyed by the automatic transfer mechanism, is brought into electrical contact with these IC sockets 22, so that the electrical test of the IC 34 under test is performed. Is done. In addition, although two IC sockets 22 and 22 are shown in FIG. 3, this is only a mere example and it goes without saying that the number of IC sockets increases and decreases according to the configuration of the handler.

In Fig. 3, there is shown a gap between the upper frame surface 24A of the frame-shaped frame 24 and the surface 21A facing downward of the end set at the periphery of the opening 21 of the handler 12, but these surfaces 21A and 24A are pressed against each other in a practical state. That is, there is no gap between the two faces 21A and 24A. In this pressure contact state, the upper surface (surface indicated by a dashed line) of the IC socket 22 coincides with the supply surface 35 of the IC 34 under test (the lower surface of the package of the IC 34 under test). In one position, the frame frame 24 is fixed to the handler 12 side by the suppression means 36. Therefore, the upper surface of the IC socket 22 and the supply surface 35 of the IC under test 34 remain in agreement with each other, and the terminals of the IC under test 34 reliably contact the terminals of the IC socket 22. Done.

As described above, since the IC socket 22 is mounted on the socket board 27 mounted on the upper surface 24A of the frame frame 24 through the spacer 26, the thickness of the spacer 26 and the socket board 27 Protrusion amount of the IC socket 22 on the upper surface 24A of the frame-shaped frame 24 (the surface in contact with the periphery of the opening 21 of the handler 12, i.e., the reference surface of the device specific adapter 23). (Distance or Length) HH is defined, and the amount of insertion of the device specific adapter 23 to be inserted into the opening 21 of the handler 12 is defined by this protrusion amount HH.

By the way, when the kind of IC 34 under test is changed and the length of the terminal of the IC under test 34 is different, for example, the protrusion amount HH of the IC socket 22 must be changed. In this case, conventionally, the thickness HH of the IC socket 22 is set by changing the thickness of the spacer 26 and the height of the connect board 29.

In the end, this means a design change. Therefore, whenever the type of IC changes, conventionally, the device specific adapter 23 made with the length which the protrusion amount HH of the IC socket 22 conformed to the IC is replaced with. I was preparing.

In addition, since such a situation occurs even when the IC sockets 22 having different heights are used, the user of the IC tester for testing a variety of ICs must prepare a variety of device specific adapters 23, There was a flaw in the economic burden.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device testing apparatus which can be tested using the same device specific adapter even when there are many kinds of semiconductor devices under test or when sockets having different heights are used. will be.

1 is a schematic cross-sectional view showing the structure of main parts of a first embodiment of an IC tester according to the present invention.

Fig. 2 is a schematic sectional view showing the structure of main parts of a second embodiment of an IC tester according to the present invention.

3 is a schematic sectional view showing the structure of an essential part of an example of a conventional IC tester.

4 is a side view for explaining a schematic configuration of an IC tester.

According to the first aspect of the present invention, a handler incorporating an automatic transport mechanism for a semiconductor device, a device special adapter mounted to an opening of the handler, and a predetermined protrusion from the device special adapter A socket which is supported by a quantity, is inserted into an opening of the handler and is brought into contact with the semiconductor device under test carried by the automatic transport mechanism of the semiconductor device, and electrically connects the semiconductor device under test to the tester body; Thickness adjustment for adjusting the protrusion amount of the socket by selecting a thickness in a direction between the handler and the device specific adapter, which is mounted on one of the facing surfaces of the special adapter and the handler. A semiconductor device test apparatus provided with a member is provided, and the above object is achieved.

According to a second aspect of the present invention, there is provided a thermostat for imparting a predetermined temperature stress to a semiconductor device under test, a test section for testing a semiconductor device under test, and a test unit for testing the semiconductor device under test. A handler having an automatic transfer mechanism for carrying it to a test part, a device / special adapter attached to an opening formed in the bottom surface of the thermostatic chamber of the handler, and electrically connecting the test part and the tester main body to the device; At least one socket supported on an upper portion of the special adapter in a state of protruding above a predetermined distance from the device special adapter, wherein the device special adapter is provided at an opening of the bottom of the thermostat. By the automatic transfer mechanism of the handler, with the socket mounted in the test section of the thermostat. In any of the contact surfaces of the socket for electrically connecting the semiconductor device under test with the test-device semiconductor under test, which is connected to the tester body, and the opening of the bottom of the device-specific adapter and the thermostat chamber. There is provided a semiconductor device test apparatus including a thickness adjusting member for adjusting the protruding distance of the socket into the test section when a device specific adapter is mounted in the opening of the bottom of the thermostat. do.

In a preferred embodiment, the device specific adapter comprises at least one socket frame, at least one socket board at one side of the frame frame, and a spacer at one side of the frame frame, and at least one side opposite to the frame frame. Two insulating boards and means for electrically connecting between the socket board and the insulating board.

In addition, the thickness adjusting member is composed of a plurality of adjusting members having different thicknesses. The thickness adjusting member may be one frame member having a predetermined thickness.

It is preferable that the said thickness adjusting member consists of a plurality of frame shape adjusting members of which the thickness is substantially the same in shape and dimension as the said frame shape, and is plural.

In a preferred embodiment, the thickness adjusting member including the plurality of frame shape adjusting members is provided on a surface in contact with an opening of the bottom surface of the thermostatic chamber of the device special adapter.

Further, the thickness adjusting member is provided on a surface of the device specific adapter which is in contact with the opening of the bottom surface of the thermostatic chamber, and the thickness adjusting member is also provided on the surface of the device special adapter opposite to the contact surface. Is provided, and the disassembly adjustment member is provided when a part of the plurality of adjustment members constituting the thickness adjustment member is dismantled from the contact surface of the device, the Pacific adapter, for thickness adjustment. The said installation means is equipped in the surface on the opposite side to the said contact surface of the said device specific adapter.

In another preferred embodiment, the thickness adjusting member including the plurality of frame shape adjusting members is the device of the opening of the bottom of the thermostat. It is attached to the surface which contacts a special adapter.

Therefore, according to the present invention, it is possible to correspond to the specifications of various semiconductor devices or the sockets of various heights without changing the structure of the device specific adapter. Therefore, it is possible to obtain an advantage that the operating cost can be greatly reduced in the practical use of the semiconductor device test apparatus.

(Detailed Description of the Preferred Embodiments)

Fig. 1 is a schematic sectional view showing the structure of main parts of a first embodiment of an IC tester according to the present invention. That is, only the part of the opening part 21 and the device special adapter 23 which were formed in the bottom face of the thermostat of the handler 12 is shown. In addition, the same code | symbol is attached | subjected to the part (element) corresponding to FIG. 3, and the description is abbreviate | omitted unless it is needed.

According to the present invention, the surface where the device specific adapter 23 inserted into the opening 21 of the handler 12 is in contact with the periphery of the opening 21 of the handler 12 (device specific adapter). The device specific adapter 23 to either of the reference planes of the reference plane) and the surface of the peripheral portion of the opening portion 21 of the handler 12 in contact with the surface of the device special adapter 23. Is characterized in that the thickness adjusting member 41 for adjusting the amount of protrusion of the IC socket 22 (protrusion distance or length from the reference surface of the device / specific adapter 23) HH is installed.

The first embodiment shown in FIG. 1 is a surface in which the device specific adapter 23 inserted into the opening 21 of the handler 12 is in contact with the periphery of the opening 21 of the handler 12. In other words, the frame thickness adjusting member 41 is provided on the upper frame surface 24A of the frame frame 24 in contact with the surface 21A facing downward of the end set at the periphery of the opening 21 of the handler 12. One case is shown.

The thickness adjusting member 41 can be configured by forming a plurality of adjusting members formed by, for example, a metal plate having a predetermined thickness into a frame shape. Each frame-shaped adjustment member is a frame having substantially the same shape and dimensions as the frame-shaped frame 24 (actually, the frame has a narrow width for only 26 minutes), and is placed on the upper frame surface 24A of the frame-shaped frame 24. It is mounted in an overlapped state.

Usually, frame shape adjustment members of various thicknesses are prepared and superimposed, and the thickness adjustment member 41 composed of a plurality of nested adjustment members is mounted on the upper frame surface 24A of the frame frame 24. Therefore, the thickness adjusting member 41 which has a plurality of frame shape adjusting members having various thicknesses sets the protrusion amount HH of the IC socket 22. Further, the plurality of frame shape adjusting members constituting the thickness adjusting member 41 need not necessarily differ in thickness from each other.

In the embodiment shown in Fig. 1, the upper frame surface 24A of the frame-shaped frame 24 is made to have a lower thickness of the thickness adjusting member 41 in advance except for the portion where the spacer 26 is fixed. That is, the portion of the upper frame surface 24A in contact with the surface 21A of the peripheral portion of the opening portion 21 of the handler 12 of the frame-shaped frame 24 is scraped off in advance by the thickness of the thickness adjusting member 41. The thickness of the frame-shaped frame 24 is made thin only by the thickness of the thickness adjusting member 41. Then, the thinned and thinned portion, that is, the frame-shaped frame 24 is newly formed of the upper frame surface 24A, and the thickness adjusting member 41 made up of a plurality of adjusting members is provided on the upper portion of the frame, and the thickness of the portion is adjusted. The case where it is made substantially the same as thickness AA of the conventional frame-shaped frame 24 is shown.

According to the above configuration, the projected amount HH of the IC socket 22 is formed on the upper surface of the uppermost layer of the thickness adjusting member 41 (the reference plane of the new device, SPECIAL ADAPTER 23 in contact with the periphery of the opening 21 of the handler 12). It can be prescribed | regulated by the distance (length) to the upper surface of the socket 22. In order to increase this protrusion amount (protrusion distance or length from the reference surface of the device / specific adapter 23) HH, a part of the plurality of frame shape adjusting members constituting the thickness adjusting member 41 may be removed. In addition, in order to reduce the protrusion amount HH, the number of the plurality of frame shape adjusting members constituting the thickness adjusting member 41 may be increased. In this embodiment, the plurality of frame shape adjusting members constituting the thickness adjusting member 41 are firmly fixed to the upper frame surface 24A of the frame frame 24 with screws or the like. Therefore, in order to change the thickness of the whole thickness adjusting member 41, it is only necessary to remove a screw and increase / decrease the frame shape adjusting member, Therefore, the thickness of the whole thickness adjusting member 41 can be changed easily.

Preferably, a plurality of frame-shaped adjusting members prepared in advance for forming the thickness adjusting member 41 are stacked, and the IC is placed on the upper frame surface 24A of the frame-shaped frame 24 as the thickness adjusting member 41. When the socket 22 is set to the lowest position, and at this setting position, the IC with the longest terminal can be tested and, in turn, the IC with shorter terminal length is tested, the thickness adjusting member 41 is removed. Remove the frame-shaped adjusting member to be formed one by one or a predetermined number of times from the upper frame surface 24A side, and increase the position of the IC socket 22 in order to shorten the length of the terminal in sequence at the setting position of each IC socket 22. It is good to configure so that IC can be tested and improve workability.

By the way, in this embodiment, it is comprised so that the frame shape adjustment member removed from the upper frame surface 24A side may be attached to the lower frame surface 24B on the opposite side to the frame frame 24. As shown in FIG. For this reason, the screw hole (screw hole) is formed also in the lower frame surface 24B side, and it is comprised so that the frame shape adjustment member removed from the upper frame surface 24A side can be fixed to the lower frame surface 24B with a screw.

Thus, by mounting the frame shape adjusting member removed from the upper frame surface 24A side of the frame frame 24 on the lower frame surface 24B on the opposite side, the thickness of the frame frame 24 can be always maintained at a constant value AA. . In such a configuration, the suppression means 36 can obtain the advantage that the frame 12 can be suppressed by the handler 12 in a constant condition at all times. Incidentally, in Fig. 1, reference numeral 41 'denotes a frame shape adjusting member (shown in dashed lines) which is detached from the upper frame surface 24A side and installed on the lower frame surface 24B side. Fig. 2 is a schematic sectional view showing the structure of the main part of the second embodiment of the IC tester according to the present invention. In this second embodiment, the upper portion of the frame-shaped frame 24 serving as a reference plane of the device-specific adapter 23 (specifically, the device-specific adapter 23 inserted into the opening 21 of the handler 12). Frame thickness adjustment on the surface of the peripheral part of the opening part 21 of the handler 12 which the frame surface 24A contacts, and specifically, the surface 21A facing the lower side of the edge part set in the peripheral part of the opening part 21 of the handler 12. The case where the member 41 is provided is shown.

Also in this embodiment, the thickness adjusting member 41 can be formed by stacking a plurality of adjusting members formed by forming a metal plate having a predetermined thickness into a frame shape, for example. Each frame-shaped adjustment member is a frame body of substantially the same shape and dimension as the surface 21A facing the lower side of the end set at the periphery of the opening 21, and is fixed in the state overlapping the surface 21A facing the lower side of the edge of the opening 21 at the periphery. do.

As in the first embodiment, a frame adjustment member having various thicknesses is usually prepared and superimposed, and the thickness adjustment member 41 composed of the plurality of frame shape adjustment members is stacked toward the lower side of the end portion of the periphery of the opening 21. It is mounted on the surface 21A. Therefore, also in this embodiment, the thickness adjusting member 41 having a plurality of frame-shaped adjusting members of various thicknesses causes the protrusion amount of the IC socket 22 (distance or length from the reference plane of the device / specific adapter 23) HH. Will be set. Further, the plurality of frame shape adjusting members constituting the thickness adjusting member 41 need not necessarily differ in thickness from each other. The plurality of frame shape adjusting members constituting the thickness adjusting member 41 are firmly fixed to the surface 21A facing the lower end of the edge portion of the opening 21 by screws or the like. Therefore, in order to change the whole thickness of the thickness adjusting member 41, it is only necessary to remove the screw and increase or decrease the frame shape adjusting member, so that the thickness of the whole thickness adjusting member 41 can be simply changed. In addition, when the frame shape adjusting member removed from the surface 21A facing the lower end of the periphery of the opening 21 is configured to be mounted on the lower frame surface 24B of the frame frame 24 as in the first embodiment, the second frame is provided. Also in the embodiment, the suppression means 36 can obtain the advantage that the frame 12 can always be suppressed by the handler 12 in a certain condition.

In each of the above embodiments, the thickness adjusting member 41 is configured by forming a plurality of frame shape adjusting members, but one thickness adjusting member 41 may be used. In this case, the thickness of the thickness adjusting member 41 is set corresponding to the length of the terminal of the IC under test, and the thickness of the thickness adjusting member 41 is set corresponding to the height of the IC socket 22. Depending on the type of IC under test and the height of the IC socket 22 to be used, the thickness adjusting member having a corresponding thickness is placed on the upper frame surface 24A of the frame-shaped frame 24 or the surface 21 facing the lower end of the periphery of the opening 21. It is good to put in A.

In addition, although the present invention has been described with respect to the case where the present invention is applied to an IC tester for testing an IC which is a representative example of a semiconductor device, the present invention can be applied to various semiconductor device test apparatuses for testing other semiconductor devices other than the IC. Needless to say, the same effect can be achieved.

As described above, according to the present invention, the socket board 27 is mounted on the upper frame surface 24A of the frame-shaped frame 24, which is one component of the device-specific adapter 23, through the spacer 26. In the semiconductor device test apparatus, the socket 22 is mounted on the socket board 27, and the socket 22 and the test head 13 are electrically connected by the connect board 29. Protrusion amount of the socket 22 on the reference surface of the special adapter 23 (surface contacting the opening 21 of the handler 12, specifically, the upper surface of the thickness adjusting member 41 or the upper frame surface 24A of the frame frame 24) (Distance or length at the reference plane of the device / specific adapter 23) By changing only the thickness of the thickness adjusting member 41 without having to change the height of the spacer 26 and the connect board 29, HH. You can change it.

Therefore, each time the type of semiconductor device changes, or whenever the height of the socket to be used changes, the device spacing in which the protrusion amount HH of the socket 22 has a length equal to the height of the semiconductor device or the socket is conventional. It is not necessary to prepare the serial adapter 23. After all, many kinds of device specific. There is no need to prepare the adapter 23.

As a result, the same device special adapter 23 can be useful for testing semiconductor devices of various standards, and the same device special adapter 23 is useful even when the height of the socket is changed. As a result, the economic burden on the user of this kind of semiconductor device test apparatus is greatly reduced, and the remarkable advantage that the operating cost of the semiconductor device test apparatus can be greatly reduced is obtained.

Claims (15)

A handler incorporating an automatic transport mechanism for a semiconductor device, It is supported by the device specific adapter mounted in the opening of this handler, and a predetermined protrusion amount from this device special adapter, inserted into the opening of the said handler, and conveyed by the automatic transfer mechanism of the said semiconductor device. A socket for contacting the semiconductor device under test and electrically connecting the semiconductor device under test to the tester body; The amount of protrusion of the socket is adjusted by selecting a thickness in a direction between the device special adapter and the surface facing the handler, and selecting a thickness in the direction between the handler and the device special adapter. Thickness adjusting member, And a device for testing a semiconductor device. The semiconductor device testing apparatus according to claim 1, wherein the opening of the handler is formed in the bottom of the thermostat for imparting a predetermined temperature stress to the semiconductor device under test. The said device specific adapter is a frame frame, the at least 1 socket board provided on one side of this frame frame via a spacer, and the at least one surface provided on the opposite side of the said frame frame. And an insulating board, and means for electrically connecting between the socket board and the insulating board. A thermostat is provided for imparting a predetermined temperature stress to the semiconductor device under test, a test section for testing the semiconductor device under test, and an automatic transport mechanism for returning the semiconductor device under test to the test section. Handlers, A device specific adapter mounted to an opening formed in the bottom surface of the thermostat of the handler, and electrically connecting the test section and the tester main body; This device special. At least one socket supported on an upper part of the adapter in a state of protruding above a predetermined distance from the device special adapter, wherein the device special adapter is mounted in an opening in the bottom of the thermostat chamber so that the socket is A socket in contact with the semiconductor device under test conveyed by the automatic transport mechanism of the handler in a state arranged in the test section in the thermostat, and electrically connecting the semiconductor device under test to the tester body; In the test section of the socket, provided on either of the contact surfaces of the device special adapter and the opening of the bottom of the thermostat, and the device special adapter is mounted in the opening of the bottom of the thermostat. Thickness adjusting member for adjusting the protruding distance of the furnace, And a device for testing a semiconductor device. The said device specific adapter is a frame frame, the at least 1 socket board provided on one side of this frame frame via a spacer, and at least 1 on the opposite side of the said frame frame. And an insulating board, and means for electrically connecting between the socket board and the insulating board. The semiconductor device test apparatus according to claim 1 or 4, wherein the thickness adjusting member is formed by enclosing a plurality of adjusting members having different thicknesses. The semiconductor device test apparatus according to claim 1 or 4, wherein the thickness adjusting member is a frame member having a predetermined thickness. 6. The semiconductor device testing device according to claim 5, wherein the thickness adjusting member comprises a plurality of frame shape adjusting members having different thicknesses and shapes of substantially the same shape and dimensions as the frame frame. 9. The semiconductor device testing apparatus according to claim 8, wherein the thickness adjusting member including the plurality of frame shape adjusting members is in contact with an opening of the bottom surface of the thermostatic chamber of the device special adapter. 9. The semiconductor device test according to claim 8, wherein the thickness adjusting member including the plurality of frame shape adjusting members is provided on a surface of the thermostatic chamber bottom in contact with the device specific adapter. Device. 5. The thickness adjusting member according to claim 4, wherein the thickness adjusting member comprises a plurality of adjusting members having different thicknesses, and is provided on a surface in contact with an opening of the bottom surface of the thermostatic chamber of the device / special adapter. The mounting means for attaching the thickness adjusting member is also provided on the surface of the device special adapter on the opposite side of the device, and a part of the plurality of adjusting members constituting the thickness adjusting member is the device special because of the thickness adjustment. A semiconductor device test apparatus characterized in that, when the pick adapter is detached from the contact surface of the pick adapter, the detachment adjustment member is provided on the side opposite to the contact surface of the device specific adapter by the mounting means. 4. The semiconductor device testing apparatus according to claim 3, wherein the thickness adjusting member comprises a plurality of frame shape adjusting members having different thicknesses and shapes having substantially the same shape and dimensions as the frame shape frame. 4. The semiconductor device testing apparatus according to claim 3, wherein the thickness adjusting member, which encloses the plurality of frame shape adjusting members, is provided on a surface in contact with an opening of the handler of the device special adapter. . 4. The semiconductor device test apparatus according to claim 3, wherein the thickness adjusting member which contains the plurality of frame shape adjusting members is in contact with the device specific adapter of the opening of the handler. The device according to claim 1, wherein the thickness adjusting member comprises a plurality of adjusting members having different thicknesses. It is provided in the surface which contacts the opening part of the said handler of a special adapter, and also the installation means which equips the surface of the said device special adapter on the opposite side to this contact surface is provided with the said thickness adjusting member, The said thickness When a part of the plurality of adjusting members constituting the adjusting member is detached from the contact surface of the device specific adapter due to the thickness adjustment, the separated adjusting member is separated by the mounting means. A semiconductor device testing device, characterized in that provided on the side opposite to the contact surface of the adapter.