CN211856803U

CN211856803U - Transfer testing device for chip detection

Info

Publication number: CN211856803U
Application number: CN201922418407.7U
Authority: CN
Inventors: 赵志刚; 文东升
Original assignee: Suzhou Kelinyuan Electronic Co ltd
Current assignee: Suzhou Kelinyuan Electronic Co ltd
Priority date: 2019-12-25
Filing date: 2019-12-25
Publication date: 2020-11-03
Anticipated expiration: 2029-12-25

Abstract

The utility model belongs to chip testing auxiliary structure field, concretely relates to transfer testing arrangement for chip detects, set up in the fixed probe of tool bottom plate, fixed the tool backplate that sets up in tool bottom plate top and be used for protecting a plurality of fixed probes including being used for setting up tool bottom plate, a plurality of perpendicular in PCB mainboard top, tool backplate upper surface is used for placing the chip that awaits measuring, and fixed probe makes the chip that awaits measuring and the PCB mainboard of lower extreme switch on. This scheme is through the aforesaid setting, no longer will await measuring chip and the direct fixed mounting of PCB mainboard before detecting, but use the PCB mainboard to switch on through foretell transfer tool and the chip that awaits measuring, can directly take away unqualified chip from the transfer tool and scrap if there is unqualified chip after detecting, can not influence the PCB mainboard, can realize that a PCB mainboard detects the polylith chip one by one, has practiced thrift the processing cost.

Description

Transfer testing device for chip detection

Technical Field

The utility model belongs to chip detects the auxiliary structure field, concretely relates to transfer testing arrangement for chip detects.

Background

A chip, also called integrated circuit (ic), is a micro electronic device or component, and is manufactured by interconnecting transistors, diodes, resistors, capacitors, inductors and other elements and wires required in a circuit together on one or more small semiconductor wafers or dielectric substrates by a certain process, and then packaged in a package to form a micro structure with the required circuit function; all the components are structurally integrated, and the miniaturization, low power consumption and high reliability of electronic components are greatly advanced. It is denoted by the letter "IC" in the circuit.

In the chip production line, all need pass through one detection process before the chip is accomplished the market by manufacturing, the detection process of traditional production line is all fixed with the installation of the good chip of processing with the PCB mainboard earlier, is detecting, but this mode is when the chip that detects is unqualified, because chip and PCB mainboard have been fixed, can only be with chip intercommunication PCB mainboard together scrapping, long this in the past just can cause huge cost loss.

SUMMERY OF THE UTILITY MODEL

In order to overcome the not enough of prior art, the utility model aims to provide a transfer testing arrangement for chip detection, including being used for setting up the tool bottom plate in PCB mainboard top, a plurality of perpendicular set up in the fixed probe of tool bottom plate, fixed set up in tool bottom plate top and be used for protecting the tool backplate of a plurality of fixed probes, tool backplate upper surface is used for placing the chip that awaits measuring, and fixed probe makes the chip that awaits measuring and the PCB mainboard of lower extreme switch on. This scheme is through the aforesaid setting, no longer will await measuring chip and the direct fixed mounting of PCB mainboard before detecting, but use the PCB mainboard to switch on through foretell transfer tool and the chip that awaits measuring, can directly take away unqualified chip from the transfer tool and scrap if there is unqualified chip after detecting, can not influence the PCB mainboard, can realize that a PCB mainboard detects the polylith chip one by one, has practiced thrift the processing cost.

The purpose of the utility model is realized by adopting the following technical scheme:

compared with the prior art, the beneficial effects of the utility model reside in that:

the utility model discloses a transfer testing arrangement for chip detection, including being used for setting up tool bottom plate, a plurality of perpendicular setting in the fixed probe of tool bottom plate, the fixed tool backplate that sets up in tool bottom plate top and be used for protecting a plurality of fixed probes in PCB mainboard top, tool backplate upper surface is used for placing the chip that awaits measuring, and fixed probe makes the chip that awaits measuring and the PCB mainboard of lower extreme switch on. This scheme is through the aforesaid setting, no longer will await measuring chip and the direct fixed mounting of PCB mainboard before detecting, but use the PCB mainboard to switch on through foretell transfer tool and the chip that awaits measuring, can directly take away unqualified chip from the transfer tool and scrap if there is unqualified chip after detecting, can not influence the PCB mainboard, can realize that a PCB mainboard detects the polylith chip one by one, has practiced thrift the processing cost.

Drawings

FIG. 1 is a top view of a preferred embodiment of a transfer test apparatus for chip detection according to the present invention;

fig. 2 is a front view of a transfer testing device for chip detection according to a preferred embodiment of the present invention.

In the figure: 1. a transfer testing device for chip detection; 2. a jig base plate; 3. immobilizing the probe; 4. a first jig guard plate; 5. a second jig guard plate; 51. a groove; 6. a PCB main board; 7. and (3) a chip.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.

The utility model discloses a transfer testing arrangement 1 for chip detection is as shown in fig. 1-fig. 2, including being used for setting up tool bottom plate 2, a plurality of perpendicular setting in tool bottom plate 2 above PCB mainboard 6 the fixed probe 3, fixed setting in tool bottom plate 2 top and be used for protecting the tool backplate of a plurality of fixed probes 3, tool backplate upper surface is used for placing chip 7 that awaits measuring, and fixed probe 3 makes chip 7 that awaits measuring switch on with the PCB mainboard 6 of lower extreme. This scheme is through the aforesaid setting, no longer will await measuring chip 7 and the direct fixed mounting of PCB mainboard 6 before detecting, but use PCB mainboard 6 to switch on with the chip 7 that awaits measuring through foretell transfer tool (the chip 7 that awaits measuring of transfer tool top and the PCB mainboard 6 of transfer tool below switch on through a plurality of probes messenger), can directly take away unqualified chip 7 from the transfer tool and scrap if there is unqualified chip 7 after the detection, can not influence PCB mainboard 6, can realize that a PCB mainboard 6 detects polylith chip 7 one by one, the processing cost has been practiced thrift.

Preferably, the fixed probe 3 is 0.3mm higher than the upper surface of the jig guard plate. This design makes the probe can direct contact to the chip 7 that awaits measuring, guarantees the stability of switching on of chip 7 and PCB mainboard 6 that awaits measuring simultaneously.

The jig protection plate in this embodiment includes a first jig protection plate 4 and a second jig protection plate 5, the first jig protection plate 4 is disposed in the center of the jig bottom plate 2, a concave pit adapted to the first jig protection plate 4 is disposed at the bottom of the second jig protection plate 5, and the second jig protection plate 5 is embedded on the first jig protection plate 4 through the concave pit. Wherein first tool backplate 4 and second tool backplate 5 lie in play with the bottom plate be connected guarantee await measuring chip 7 and PCB mainboard 6 switch on the stability outside, because probe itself comparatively fine take place crooked or break easily, and can wrap up the probe through setting up of first tool backplate 4 and second tool backplate 5, only the part exposes and is connected with chip 7 that awaits measuring, plays the effect of protection probe.

Simultaneously for chip 7 that awaits measuring can fix a position fast and guarantee chip 7 and the stability of probe connection that awaits measuring simultaneously, second tool backplate 5 upper surface is equipped with the recess 51 that is used for placing chip 7 that awaits measuring, the setting that fixed probe 3 corresponds is in the recess 51. During detection, the chip 7 to be detected can be directly placed in the groove 51 to realize quick positioning and detection, and meanwhile, even if the chip 7 to be detected is slightly collided in the detection process, the stable connection between the chip 7 to be detected and the probe can be ensured, and the detection is ensured to be smoothly carried out.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims

1. A transfer testing arrangement for chip detection, its characterized in that: the fixture comprises a fixture bottom plate, a plurality of fixed probes and a fixture protection plate, wherein the fixture bottom plate is arranged above a PCB main board, the fixed probes are vertically arranged on the fixture bottom plate, the fixture protection plate is fixedly arranged above the fixture bottom plate and is used for protecting the fixed probes, the upper surface of the fixture protection plate is used for placing a chip to be tested, and the fixed probes enable the chip to be tested to be conducted with the PCB main board at the lower end.

2. The relay test device for chip detection according to claim 1, wherein: the fixed probe is 0.3mm higher than the upper surface of the jig guard plate.

3. The relay test device for chip detection according to claim 1, wherein: the jig protection plate comprises a first jig protection plate and a second jig protection plate, the first jig protection plate is arranged on the jig bottom plate in the middle, the bottom of the second jig protection plate is provided with a pit matched with the first jig protection plate, and the second jig protection plate is embedded on the first jig protection plate through the pit.

4. The relay test device for chip detection according to claim 3, wherein: the upper surface of the second jig protection plate is provided with a groove for placing a chip to be tested, and the fixed probes are correspondingly arranged in the groove.