CN210403681U

CN210403681U - Guide vane device

Info

Publication number: CN210403681U
Application number: CN201921859210.0U
Authority: CN
Inventors: 李兵; 陈瑶; 邓伟伟
Original assignee: CSI Cells Co Ltd; CSI Solar Power Group Co Ltd
Current assignee: Canadian Solar Inc; CSI Cells Co Ltd
Priority date: 2019-10-31
Filing date: 2019-10-31
Publication date: 2020-04-24
Anticipated expiration: 2029-10-31

Abstract

The utility model relates to a solar cell production facility technical field discloses a guide piece device. This guide device includes the buffer memory frame and gets the piece frame, the buffer memory frame sets up the opening part of arranging the silicon chip basket in, the buffer memory frame includes two bears the frame that sets up relatively, every bears all to be provided with a plurality of second card boards along vertical direction interval on the frame, form the second draw-in groove that is used for placing the silicon chip between two adjacent second card boards, the first draw-in groove one-to-one that forms between two adjacent first card boards on second draw-in groove and the silicon chip basket, it includes a plurality of inserted sheet boards that set up along vertical direction interval to get the piece frame, a plurality of inserted sheet boards homoenergetic stretch into the bottom that is located the silicon chip of first draw-in groove or second draw-in groove, and hold up the silicon chip and shift. This guide device simple structure, convenient operation, the guide is fast, and manufacturing cost is lower, and at the guide in-process, the silicon chip does not contact with first card board or second card board, can not cause the fish tail of silicon chip edge, can guarantee the quality of silicon chip.

Description

Guide vane device

Technical Field

The utility model relates to a solar cell production facility technical field especially relates to a guide piece device.

Background

Solar energy is a clean renewable energy source, and solar cells based on the photovoltaic effect have good application prospects, and are devices for directly converting light energy into electric energy through the photoelectric effect or the photochemical effect, wherein silicon solar cells are the most developed at present.

In the production and processing process of silicon chips, silicon chips are usually carried by using a silicon chip basket, as shown in fig. 1, the silicon chip basket 100 comprises a basket body 101 and first card plates 102, a plurality of first card plates 102 are arranged on two opposite side walls inside the basket body 101, the first card plates 102 are arranged at intervals along the vertical direction, first clamping grooves for accommodating the silicon chips are formed between two adjacent first card plates 102 on the same side wall, and one side wall of the basket body 101, which is not provided with the first card plates 102, is provided with an opening, so that the silicon chips can be conveniently taken and placed. In the actual production process, different process machines have different requirements on the material or the size of the silicon wafer basket 100, and therefore, the silicon wafers are often required to be transferred from one silicon wafer basket 100 to another silicon wafer basket 100.

SUMMERY OF THE UTILITY MODEL

Based on above, the utility model aims to provide a guide device, simple structure, work efficiency is higher, and the silicon chip is difficult to produce and pollutes and the fish tail, reduces the human cost.

In order to achieve the purpose, the utility model adopts the following technical proposal:

a guide device for transferring a plurality of silicon wafers in a silicon wafer basket, the guide device comprising:

the buffer storage frame is arranged at an opening of the silicon wafer basket and comprises two opposite bearing frames, a plurality of second card boards are arranged on each bearing frame at intervals along the vertical direction, a second card slot for placing the silicon wafer is formed between every two adjacent second card boards, and the interval between every two adjacent second card boards is equal to the interval between every two adjacent first card boards on the silicon wafer basket;

and the wafer taking frame comprises a plurality of wafer inserting plates which are arranged at intervals along the vertical direction, and the plurality of wafer inserting plates can stretch into the bottoms of the silicon wafers which are positioned in the first clamping grooves or the second clamping grooves and support the silicon wafers for transfer.

As a preferred scheme of the guide device, the guide device further comprises a guide assembly, the wafer taking frame is connected to the guide assembly, and the guide assembly can drive the wafer taking frame to reciprocate between the silicon wafer basket and the cache frame.

As a preferable aspect of the guide vane device, the guide assembly includes:

the support is connected with the sheet taking frame;

the sliding rod is arranged above the cache frame;

the sliding block is connected to the support and is in sliding fit with the sliding rod.

As a preferable aspect of the guide vane device, the guide assembly further includes a limiting member configured to limit sliding of the sliding block along the sliding rod.

As an optimal scheme of the guide vane device, the limiting parts are limiting blocks sleeved at two ends of the sliding rod, and the limiting blocks are made of rubber materials.

As a preferable aspect of the sheet guide device, the sheet guide device further includes an adjusting assembly configured to adjust a position of the sheet taking frame relative to the support.

As a preferable aspect of the guide vane device, the adjusting assembly includes:

one end of the connecting rod is connected with the sheet taking frame, and the other end of the connecting rod is in threaded connection with the support;

the fixing piece is arranged at one end, far away from the sheet taking frame, of the connecting rod;

a spring disposed between the fixing member and the bracket.

As a preferred scheme of the guide device, each of the insertion plates includes a connecting portion and a card portion connected to the connecting portion, the insertion plates are connected through the connecting portion, and the card portion can hold up the silicon wafer.

As a preferable mode of the guide device, the card portion of each of the card plates is plural, and the plural card portions are provided at intervals in a longitudinal direction of the connecting portion.

As a preferable mode of the guide device, the number of the second card plates is larger than that of the first card plates of the silicon wafer basket.

The utility model has the advantages that:

the utility model provides a guide device, the transfer of a plurality of silicon chips in mainly used silicon chip basket of flowers. The silicon wafer guiding device comprises a cache frame and a silicon wafer taking frame, wherein an inserting plate of the silicon wafer taking frame can support a silicon wafer and transfer the silicon wafer; through setting up the frame of keeping in for keep in the silicon chip when another silicon chip basket of flowers has not been conveyed to the guide device position yet, prevent to get the unstable emergence of piece frame and put the piece and drop. The guide vane device has the advantages of simple structure, convenient operation, high guide vane speed and lower manufacturing cost.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a silicon wafer basket provided by the prior art;

fig. 2 is a schematic structural diagram of a guide vane device provided in an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a sheet taking rack and an adjusting assembly of the sheet guiding device according to an embodiment of the present invention.

In the figure:

100-silicon wafer flower basket; 101-a flower basket body; 102-a first card sheet;

1-a cache shelf; 11-a carrier; 12-a second card sheet;

2-taking the film frame; 21-a card board; 211-a connecting portion; 212-card portion;

3-a guiding component; 31-a scaffold; 32-a slide bar; 33-a slide block;

4-a regulating component; 41-a connecting rod; 42-a fixing member; 43-spring.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

The embodiment provides a guide device, which is mainly used for transferring a plurality of silicon wafers in a silicon wafer basket 100, and has the advantages of simple operation and high transferring speed.

As shown in fig. 2 to fig. 3, the film guiding device provided by this embodiment includes a buffer storage frame 1 and a film taking frame 2, where the buffer storage frame 1 is disposed at an opening of the silicon wafer basket 100, the buffer storage frame 1 includes two opposite bearing frames 11, each bearing frame 11 is provided with a plurality of second card plates 12 at intervals along a vertical direction, a second slot for placing a silicon wafer is formed between two adjacent second card plates 12, an interval between two adjacent second card plates 12 is equal to an interval between two adjacent first card plates 102 on the silicon wafer basket 100, the film taking frame 2 includes a plurality of film inserting plates 21 disposed at intervals along the vertical direction, and each of the plurality of film inserting plates 21 can extend into a bottom of a silicon wafer located in the first slot or the second slot and lift up the silicon wafer for transferring.

In the wafer guiding device provided by this embodiment, the wafer inserting plate 21 of the wafer taking frame 2 can support and transfer the silicon wafer, and when the wafer taking frame 2 supports the silicon wafer, the silicon wafer does not contact with the first card plate 102 or the second card plate 12 in the wafer guiding process, so that the edge of the silicon wafer is not scratched, and the quality of the silicon wafer can be ensured; through setting up the temporary storage frame 1 for store in the silicon chip when another silicon chip basket of flowers 100 has not been conveyed to the guide device position yet, prevent to get the unstable emergence of putting the piece of frame 2 and drop.

In order to adapt to the picking and placing operations of silicon wafers with different widths, in the present embodiment, the distance between the two bearing frames 11 may be set to be the same as the width of the silicon wafer basket 100 for bearing the silicon wafer with the largest size in the production process, and the width of the second card plate 12 may be increased appropriately. By adopting the mode, the silicon wafers with different sizes can be taken and placed only by utilizing one guide piece device, so that the manufacturing cost is saved, and the space occupancy rate is saved.

Further, in the actual production process, the specifications of different silicon wafer baskets 100 are different, for example: 51 groups of first card plates 102 are arranged in some silicon wafer flower baskets 100 to form 50 first card slots which can be used for bearing 50 silicon wafers; some silicon wafer baskets 100 are provided with 101 sets of first card plates 102, forming 100 first card slots, which can be used for bearing 100 silicon wafers. In order to accommodate the taking and placing of silicon wafers in silicon wafer baskets 100 of different specifications, in the present embodiment, the number of the second card plates 12 is greater than the number of the first card plates 102 of the silicon wafer baskets 100.

Further, the guide device further comprises a guide assembly 3, the wafer taking frame 2 is connected to the guide assembly 3, and the guide assembly 3 can drive the wafer taking frame 2 to reciprocate between the silicon wafer basket 100 and the cache frame 1. Through setting up direction subassembly 3, can provide the direction for getting the removal of piece frame 2, guarantee its direction of motion's accuracy.

Specifically, the guiding assembly 3 comprises a support 31, a sliding rod 32 and a sliding block 33, the wafer taking frame 2 is arranged on the support 31, the sliding block 33 is arranged on the support 31, the sliding rod 32 is arranged above the buffer frame 1 and extends along the connecting line direction between the buffer frame 1 and the silicon wafer basket 100, and the sliding block 33 is in sliding fit with the sliding rod 32. Specifically, in the present embodiment, the sliding block 33 is provided with a guiding hole, and the sliding rod 32 is inserted into the guiding hole and slidably engaged with the guiding hole.

Further, the guiding assembly 3 further comprises a limiting member configured to limit the sliding of the sliding block 33 along the sliding rod 32. Specifically, the limiting members are limiting members sleeved at two ends of the slide rod 32, and when the slide block 33 abuts against the limiting members, the support 31 and the sheet taking frame 2 can stop moving, so that the slide block 33 is prevented from slipping off from the slide rod 32. Preferably, the shape of stopper can be square or circular, and the stopper adopts the rubber material to make, and the rubber material has better elasticity, when slider 33 bumps with the stopper, can not cause slider 33's damage, can prolong slider 33's life.

Further, the guide vane device further comprises an adjusting component 4, and the adjusting component 4 is configured to adjust the position of the slide holder 2 relative to the bracket 31. Specifically, the adjusting assembly 4 includes a connecting rod 41 and a fixing member 42, one end of the connecting rod 41 is connected to the sheet taking frame 2, the other end of the connecting rod is connected to the bracket 31 by screw threads, and the fixing member 42 is disposed at one end of the connecting rod 41 far away from the sheet taking frame 2. Specifically, the connecting rod 41 is provided with an external thread, the bracket 31 is provided with an internal thread, when the position of the sheet taking frame 2 relative to the bracket 31 needs to be adjusted, the fixing piece 42 can be loosened, the connecting rod 41 can be screwed, the connecting rod 41 can move in the vertical direction relative to the bracket 31, the sheet taking frame 2 is driven to be close to or far away from the bracket 31, and when the position is adjusted to a proper position, the fixing piece 42 is screwed.

Preferably, a spring 43 is provided between the fixing member 42 and the bracket 31. In this embodiment, because the distance between the sheet taking frame 2 and the support 31 is adjusted manually by the adjusting component 4, the rotating speed and the descending or ascending distance of the connecting rod 41 are not easily controlled precisely by an operator, and the movement of the sheet taking frame 2 along the vertical direction can be buffered by arranging the spring 43 between the fixing piece 42 and the support 31, so that the collision between the silicon sheet and the first card plate 102 or the second card plate 12 is prevented, and the quality of the silicon sheet is ensured.

Preferably, in this embodiment, each first card plate 101 of the silicon wafer basket 100 can be located at the same horizontal plane as one of the second card plates 12 of the buffer frame 1, so that the adjusting assembly 4 can transfer silicon wafers between the silicon wafer basket 100 and the buffer frame 1 by adjusting the wafer taking frame 2 once, thereby reducing the adjusting workload of an operator and improving the wafer guiding efficiency.

Further, as shown in fig. 3, each of the chip boards 21 includes a connection portion 211 and a card portion 212 vertically disposed on the connection portion 211, the plurality of chip boards 21 are connected by the connection portion 211, and the card portion 212 can hold up a silicon wafer. Specifically, each connecting portion 211 is provided with a connecting hole, and the connecting rod 41 sequentially penetrates through the connecting holes in the connecting portions 211 to sequentially connect the plurality of inserting plate 21.

Preferably, the number of the card portions 212 on each of the card plates 21 is plural, and the plural card portions 212 are provided at intervals along the length direction of the connection portion 211. By providing the plurality of card portions 212 in the connecting portion 211, the contact area between the interposer 21 and the silicon wafer can be increased, and the stability of the guiding process can be improved. Preferably, each connecting portion 211 and the plurality of card portions 212 disposed thereon are of an integrated structure, which can save assembly time and improve installation efficiency.

It can be understood that the distance between the outer sides of the two card portions 212 at the two ends of the connecting portion 211 is smaller than the distance between the inner sides of the two first card plates 102 or the two second card plates 12 arranged oppositely, so as to ensure that the card portions 212 do not contact with the first card plates 102 or the second card plates 12 during the movement of the taking frame 2 between the silicon wafer basket 100 and the buffer frame 1, thereby ensuring the safety of the taking process.

For the convenience of understanding, the operation process of the guide vane device is briefly described below with reference to fig. 1 to 3:

(1) when a silicon wafer basket 100 is conveyed to be arranged opposite to the cache frame 1, an operator manually drives the sliding block 33 to move towards the direction close to the silicon wafer basket 100 along the sliding rod 32, and adjusts the position between the wafer taking frame 2 and the support 31 by using the adjusting component 4, so that each card part 212 can be inserted into the bottom of a first card slot of the silicon wafer basket 100;

(2) loosening the fixing piece 42, screwing the connecting rod 41, so as to drive the sheet taking frame 2 to move upwards, so that each card part 212 can support a corresponding silicon sheet, the silicon sheets are not in contact with the first card plate 102, and then screwing the fixing piece 42;

(3) an operator manually drives the sliding block 33 to move towards the direction close to the buffer frame 1 along the sliding rod 32, and adjusts the position between the wafer taking frame 2 and the support 31 by using the adjusting component 4 so as to transfer the silicon wafers on the card part 212 to the buffer frame 1;

(4) when another silicon wafer basket 100 is conveyed to be arranged opposite to the buffer storage rack 1, an operator manually drives the sliding block 33 to move towards the direction close to the buffer storage rack 1 along the sliding rod 32, and adjusts the position between the wafer taking rack 2 and the support 31 by using the adjusting component 4, so that each card part 212 can be inserted into the bottom of a second card slot of the buffer storage rack 1;

(5) loosening the fixing piece 42, screwing the connecting rod 41 to drive the sheet taking frame 2 to move upwards, so that each card part 212 can support a corresponding silicon sheet and the silicon sheet is not in contact with the second card plate 12, and then screwing the fixing piece 42;

(6) the operator manually drives the sliding block 33 to move along the sliding rod 32 in the direction close to the silicon wafer basket 100, and adjusts the position of the taking frame 2 relative to the bracket 31 by using the adjusting assembly 4 so as to transfer the silicon wafers on the card part 212 to the silicon wafer basket 100.

The guide device that this embodiment provided simple structure, convenient operation, the guide is fast, and manufacturing cost is lower, and at the guide in-process, the silicon chip does not contact with first card board 102 or second card board 12, can not cause the fish tail of silicon chip edge, can guarantee the quality of silicon chip.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims

1. A guide device for transferring a plurality of silicon wafers in a silicon wafer basket (100), the guide device comprising:

the buffer storage frame (1) is arranged at an opening of the silicon wafer basket (100), the buffer storage frame (1) comprises two opposite bearing frames (11), each bearing frame (11) is provided with a plurality of second card plates (12) at intervals along the vertical direction, a second clamping groove for placing the silicon wafer is formed between every two adjacent second card plates (12), and the interval between every two adjacent second card plates (12) is equal to the interval between every two adjacent first card plates (102) on the silicon wafer basket (100);

get piece frame (2), it includes a plurality of picture peg boards (21) that set up along vertical direction interval to get piece frame (2), and is a plurality of picture peg board (21) homoenergetic stretches into and is located first draw-in groove or the second draw-in groove the bottom of silicon chip, and will the silicon chip holds up and shifts.

2. The guide vane device according to claim 1, characterized in that the guide vane device further comprises a guide assembly (3), the taking rack (2) is connected to the guide assembly (3), and the guide assembly (3) can drive the taking rack (2) to reciprocate between the silicon wafer basket (100) and the buffer rack (1).

3. The guide vane device according to claim 2, characterized in that the guide assembly (3) comprises:

the support (31), the take-up rack (2) is connected to the support (31);

the sliding rod (32), the sliding rod (32) is arranged above the buffer frame (1);

a slider (33), the slider (33) being connected to the support (31), the slider (33) being slidably fitted to the slide bar (32).

4. The guide vane device according to claim 3, characterized in that the guide assembly (3) further comprises a limit stop configured to limit the sliding of the slide block (33) along the slide bar (32).

5. The guide vane device according to claim 4, wherein the limiting members are limiting members sleeved at two ends of the sliding rod (32), and the limiting members are made of rubber.

6. The guide vane device of claim 3, further comprising an adjustment assembly (4), the adjustment assembly (4) being configured to adjust the position of the take-off stand (2) relative to the support (31).

7. The guide vane device of claim 6, wherein the adjustment assembly (4) comprises:

one end of the connecting rod (41) is connected with the film taking frame (2), and the other end of the connecting rod is in threaded connection with the bracket (31);

the fixing piece (42) is arranged at one end, far away from the sheet taking frame (2), of the connecting rod (41);

a spring (43) disposed between the fixing member (42) and the bracket (31).

8. The guide plate device according to any one of claims 1 to 7, wherein each of the insert plates (21) comprises a connecting portion (211) and a card portion (212) connected to the connecting portion (211), a plurality of the insert plates (21) are connected by the connecting portion (211), and the card portion (212) can lift the silicon wafer.

9. The guide vane device of claim 8, wherein the card portion (212) of each of the insert plates (21) is plural, and the plural card portions (212) are provided at intervals in a length direction of the connection portion (211).

10. The guide vane device of any one of claims 1-7, wherein the number of second card plates (12) is greater than the number of first card plates (102) of the silicon wafer basket (100).