CN212021269U

CN212021269U - Silicon wafer wire cutting machine

Info

Publication number: CN212021269U
Application number: CN202020578089.0U
Authority: CN
Inventors: 周易芳; 刘向荣; 张银鹏; 张海龙; 何俊
Original assignee: Yuze Jiangxi Semiconductor Co ltd
Current assignee: Yichun Yuze New Energy Co ltd
Priority date: 2020-04-17
Filing date: 2020-04-17
Publication date: 2020-11-27
Anticipated expiration: 2030-04-17

Abstract

The utility model relates to a silicon wafer wire cutting machine, which provides a proposal that comprises a supporting table, a frame, a motor, a supporting plate, a fixed rod plate and a limiting rod; a rack is arranged on one side of the top end of the supporting table, a motor is mounted at the top of the rack, a screw rod is connected to a motor shaft of the motor and located inside a thread groove, the thread groove is formed in the middle of the supporting plate, the supporting plate is fixed to the bottom end of the cutting table, rod grooves are formed in two sides of the supporting plate, limiting rods are inserted into the rod grooves, two ends of each limiting rod are connected with rod fixing plates, and the rod fixing plates are located at the top of the supporting table; the four corners of the cutting table bottom are all fixed with wheel carriers, the inside of the wheel carriers is provided with rollers, and the left side of the cutting table top is fixed with a left clamping shell. The utility model discloses a junction of brace table and cutting bed is provided with actuating mechanism, when the fixed cutting that needs is accomplished to the silicon chip, the cutting bed can be located the brace table and carries out quick position control to convenience when improving the silicon chip cutting greatly.

Description

Silicon wafer wire cutting machine

Technical Field

The utility model relates to a cutting machine especially relates to a silicon chip wire cut electrical discharge machining.

Background

At present, in the production process of silicon wafers, a silicon wafer cutting machine is needed to cut the silicon wafers into pieces, so that the silicon wafers are made into the sizes needed to be used.

In the use process of the cutting machine in the prior art, a common fixing mechanism cannot rapidly fix a silicon wafer, and meanwhile, a silicon wafer fixing mechanism does not comprise a moving adjusting mechanism, so that the cutting convenience is poor, the cutting efficiency is reduced, and the problem existing in the cutting process is solved.

SUMMERY OF THE UTILITY MODEL

The utility model provides a silicon chip wire cut electrical discharge machining is provided with actuating mechanism through the junction of brace table and cutting bed, accomplishes when fixed needs cutting at the silicon chip, and the cutting bed can be located the brace table and carries out quick position control to convenience when improving the silicon chip cutting greatly has solved the problem of proposing among the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a silicon wafer wire cutting machine comprises a supporting table, a rack, a motor, a supporting plate, a rod fixing plate and a limiting rod;

a rack is arranged on one side of the top end of the supporting table, a motor is mounted at the top of the rack, a screw rod is connected to a motor shaft of the motor and located inside a thread groove, the thread groove is formed in the middle of the supporting plate, the supporting plate is fixed to the bottom end of the cutting table, rod grooves are formed in two sides of the supporting plate, limiting rods are inserted into the rod grooves, two ends of each limiting rod are connected with rod fixing plates, and the rod fixing plates are located at the top of the supporting table;

the four corners of cutting bed bottom all is fixed with the wheel carrier, and the inside of wheel carrier is provided with the gyro wheel, and the left side on cutting bed top is fixed with left press from both sides the shell, and the spout has been seted up on the right side on cutting bed top, and the spout embeds there is the slider, and the top of slider is fixed with right press from both sides the shell, and the right side of cutting bed is provided with electric putter.

Preferably, the push rod of the electric push rod penetrates through the inside of the sliding groove, and the tail end of the push rod of the electric push rod is connected with the side wall of the sliding block.

Preferably, the bottom of the roller engages the top of the support table.

Preferably, the end of the screw rod is fixed with a limiting piece.

Preferably, a silicon wafer is clamped between the left clamping shell and the right clamping shell.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a junction of brace table and cutting bed is provided with actuating mechanism, when the fixed cutting that needs is accomplished to the silicon chip, the cutting bed can be located the brace table and carries out quick position control to convenience when improving the silicon chip cutting greatly.

2. The utility model discloses a top of cutting bed is provided with fixture, places at the top back of cutting bed at the silicon chip, and actuating mechanism will carry out the centre gripping to the silicon chip fast, makes the stable fixing of silicon chip between left press from both sides shell and right press from both sides shell, does benefit to follow-up cutting equipment and carries out stable cutting to the silicon chip.

Drawings

Fig. 1 is a schematic view of the overall structure of a silicon wafer wire cutting machine according to the present invention;

fig. 2 is a schematic structural diagram of the top of a cutting table of the silicon wafer wire cutting machine according to the present invention;

fig. 3 is a schematic side view of a supporting table of the silicon wafer wire cutting machine according to the present invention.

In the figure: 1. a support table; 2. a frame; 3. a motor; 4. a screw rod; 5. a limiting sheet; 6. a support plate; 7. a thread groove; 8. a rod groove; 9. a rod fixing plate; 10. a limiting rod; 11. a wheel carrier; 12. a roller; 13. cutting table; 14. a left cartridge shell; 15. a chute; 16. a right pod; 17. an electric push rod; 18. a slider; 19. and (3) a silicon wafer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected" and "disposed" are to be interpreted broadly, and may be, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed; the utility model discloses in the model of providing with electrical apparatus only refer to, can be through changing the different models that the function is the same according to the actual use condition with electrical apparatus, to the ordinary technical personnel in this field, can understand that above-mentioned term is in by particular case the utility model provides a concrete meaning.

Referring to fig. 1-3, a silicon wafer wire cutting machine comprises a support table 1, a frame 2, a motor 3, a support plate 6, a rod fixing plate 9 and a limiting rod 10;

a rack 2 is arranged on one side of the top end of the support table 1, a motor 3 is mounted at the top of the rack 2, a screw rod 4 is connected to a motor shaft of the motor 3, the screw rod 4 is located inside a threaded groove 7, the threaded groove 7 is formed in the middle of a support plate 6, the support plate 6 is fixed to the bottom end of a cutting table 13, rod grooves 8 are formed in two sides of the support plate 6, a limiting rod 10 is inserted into the rod grooves 8, two ends of the limiting rod 10 are connected with rod fixing plates 9, and the rod fixing plates 9 are located at the top of the support table 1;

the four corners of cutting table 13 bottom all is fixed with wheel carrier 11, and the inside of wheel carrier 11 is provided with gyro wheel 12, and the left side on cutting table 13 top is fixed with left press from both sides shell 14, and spout 15 has been seted up on the right side on cutting table 13 top, and spout 15 embeds there is slider 18, and slider 18's top is fixed with right press from both sides shell 16, and cutting table 13's right side is provided with electric putter 17.

In the embodiment, referring to fig. 1, the driving mechanism is arranged at the joint of the supporting table 1 and the cutting table 13, when the silicon wafer 19 is fixed and needs to be cut, the cutting table 13 can be positioned on the supporting table 1 for rapid position adjustment, so that the convenience of cutting the silicon wafer 19 is greatly improved.

Wherein, the push rod of the electric push rod 17 runs through the inside of the sliding slot 15, and the end of the push rod of the electric push rod 17 is connected with the side wall of the sliding block 18.

Wherein, the bottom of the roller 12 is attached to the top of the support table 1.

Wherein, the tail end of the screw rod 4 is fixed with a limiting sheet 5.

Wherein, a silicon wafer 19 is clamped between the left clamping shell 14 and the right clamping shell 16.

The utility model discloses during the use: before the silicon wafer 19 is cut, the silicon wafer 19 is placed on the cutting table 13, the push rod of the electric push rod 17 pushes the slide block 18, the slide block 18 drives the right clamping shell 16 to move, so that the silicon wafer 19 is fixed between the left clamping shell 14 and the right clamping shell 16 to achieve stable clamping, when the position of the cutting needs to be changed, the motor 3 is started, the motor shaft of the motor 3 drives the screw rod 4 to rotate in the thread groove 7 in the supporting plate 6, at the moment, the cutting table 13 moves based on the supporting table 1, thereby driving the cutting position of the silicon wafer 19 to move, and the rollers 12 arranged at four corners of the bottom end of the cutting table 13 move on the basis of the supporting table 1, which is beneficial to improving the lubrication of the cutting table 13 during adjustment and movement, when the cutting table 13 moves, the limiting rod 10 is located in the rod groove 8 in the supporting plate 6 to move, stability of the cutting table 13 during moving is guaranteed, the design is simple, and convenience in cutting of the silicon wafer 19 is improved.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A silicon wafer wire cutting machine is characterized by comprising a supporting table (1), a rack (2), a motor (3), a supporting plate (6), a rod fixing plate (9) and a limiting rod (10);

one side of the top end of the supporting table (1) is provided with a rack (2), the top of the rack (2) is provided with a motor (3), a motor shaft of the motor (3) is connected with a screw rod (4), the screw rod (4) is located inside a threaded groove (7), the threaded groove (7) is formed in the middle of a supporting plate (6), the supporting plate (6) is fixed at the bottom end of a cutting table (13), rod grooves (8) are formed in two sides of the supporting plate (6), a limiting rod (10) is inserted into the rod grooves (8), two ends of the limiting rod (10) are connected with rod fixing plates (9), and the rod fixing plates (9) are located at the top of the supporting table (1);

the four corners of the bottom end of the cutting table (13) are all fixed with wheel carriers (11), rollers (12) are arranged inside the wheel carriers (11), a left clamping shell (14) is fixed on the left side of the top end of the cutting table (13), a sliding groove (15) is formed in the right side of the top end of the cutting table (13), a sliding block (18) is arranged in the sliding groove (15), a right clamping shell (16) is fixed on the top end of the sliding block (18), and an electric push rod (17) is arranged on the right side of the cutting table (13).

2. The silicon wafer wire cutting machine according to claim 1, wherein the push rod of the electric push rod (17) penetrates through the inside of the slide groove (15), and the end of the push rod of the electric push rod (17) is connected with the side wall of the slide block (18).

3. The silicon wafer wire cutting machine according to claim 1, wherein the bottom of the roller (12) is attached to the top of the supporting table (1).

4. The silicon wafer wire cutting machine according to claim 1, wherein a stopper piece (5) is fixed to the end of the screw (4).

5. The silicon wafer wire cutting machine according to claim 1, wherein the silicon wafer (19) is held between the left cassette (14) and the right cassette (16).