CN104625887B - A kind of optical element automatization chamfered edge processing method - Google Patents

A kind of optical element automatization chamfered edge processing method Download PDF

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Publication number
CN104625887B
CN104625887B CN201410704080.9A CN201410704080A CN104625887B CN 104625887 B CN104625887 B CN 104625887B CN 201410704080 A CN201410704080 A CN 201410704080A CN 104625887 B CN104625887 B CN 104625887B
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olpf
substrate
cylinder
right angle
sheet
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CN104625887A (en
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罗远昭
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Zhejiang TBest Electronic Information Technology Co Ltd
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Zhejiang TBest Electronic Information Technology Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/14Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of optical work, e.g. lenses, prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/005Feeding or manipulating devices specially adapted to grinding machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/91Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers

Abstract

A kind of optical element automatization chamfered edge processing method, belongs to processing method technical field, comprises the following steps: 1 adjusts the distance accommodating the size in chamber, the direction of horizontal horizontal air cylinder and horizontal air cylinder apart from machine table;The OLPF substrate that one group to be processed is stacked in the receiving chamber of Zhu Pian mechanism;The OLPF substrate stacked is divided into monolithic and sends by feeding mechanism by 2: OLPF substrate to be processed is transported to machine table by charging crane by 3, and the OLPF substrate of completion of processing is also transported to finished product box storage;The 4 OLPF substrates being accurately positioned in machine table by perpendicular positioning mechanism and level locating mechanism;5. pair OLPF substrate to be processed is processed;Step 2 is also being carried out simultaneously, and feeding mechanism separation single monolithic piece is also sent;After 6OLPF substrate completion of processing, repeat step 3, circulate with this.This method achieves the automatic partition of OLPF substrate from sending the function of sheet, and feeding process waits without shutting down, overcomes and deficiency that precision the highest is positioned manually.

Description

A kind of optical element automatization chamfered edge processing method
Technical field
The invention belongs to processing method technical field, be particularly related to a kind of optical element automatization chamfered edge processing method.
Background technology
Camera, mobile phone optical filter substrate, also referred to as OLPF substrate, form by synthetic quartz, special optical glass and other Optical Crystal Processing.OLPF is a kind of for a kind of optical element through the unwanted light of light line reflection needed, and is mainly used in single electricity digital camera, smart mobile phone, intelligent surveillance equipment anti-, single etc..In production process, need OLPF substrate is carried out chamfered edge process.
In traditional optical element automatization chamfered edge course of processing, the method using artificial feeding and location.The process being positioned manually is as follows: OLPF substrate is first placed and specified position by workman, and then pull-up stationary fixture puts into OLPF substrate, opens vacuum cup and holds OLPF substrate, then positioning fixture is put back to appointment position can start shooting processing.During handling OLPF substrate, need to shut down wait, waste a large amount of activity duration, and it is the highest that precision is positioned manually, repeatable poor, the crudy of product can not be guaranteed.
Summary of the invention
It is an object of the invention to overcome defect mentioned above and deficiency, and a kind of optical element automatization chamfered edge processing method is provided.
The technical scheme that the present invention realizes the employing of its purpose is as follows.
A kind of optical element automatization chamfered edge processing method, comprises the following steps:
1 adjusts the direction of the horizontal air cylinder accommodating the size in chamber, level locating mechanism and the distance of horizontal air cylinder distance machine table of Zhu Pian mechanism according to the size of optics OLPF substrate;Then the optics OLPF substrate that a group to be processed is stacked in the receiving chamber of Zhu Pian mechanism;
Described level locating mechanism includes the second right angle backer, horizontal plate, horizontal air cylinder and horizontal air cylinder fixed mount;Described horizontal air cylinder is horizontally disposed with, and the outfan of horizontal air cylinder is equipped with horizontally disposed horizontal plate;The second right angle backer it is fixedly installed on described horizontal plate;Described horizontal air cylinder is fixed on workbench by horizontal air cylinder fixed mount;Horizontal air cylinder drives horizontal plate horizontal rectilinear motion, thus realizes horizontally advancing of the second right angle backer and retreat with level;Offer a pair up/down perforation and the transverse groove being parallel to each other on horizontal air cylinder fixed mount, in described transverse groove, be equipped with regulation screw;Cannelure orthogonal with transverse groove is offered on described workbench;Regulation screw is each passed through transverse groove and then cannelure is fixed with nut;
Unscrew regulation screw, change transverse groove position on cannelure and direction, adjust level locating mechanism lateral attitude, lengthwise position and angle on the table so that the distance of the direction of the horizontal air cylinder of level locating mechanism and horizontal air cylinder distance machine table is suitable with the size of OLPF substrate;
The OLPF substrate stacked is divided into monolithic and sends by feeding mechanism by 2:
Described feeding mechanism includes sending sheet base, sending sheet cylinder, guide rail and guide plate;Described guide rail is arranged on and send on sheet base;Described sending is provided with storage sheet on sheet base;Described guide plate and slide connect;Described guide plate is arranged on the outfan sending sheet cylinder;The front end of described guide plate is provided with one and contains sheet frame;Described Sheng sheet frame bottom is more than monolithic OLPF substrate thickness and the thickness sum less than two panels OLPF substrate to the difference in height bottom montant;
Be positioned over the whole lamination accommodating chamber of Zhu Pian mechanism, under a piece of OLPF substrate fall into Sheng sheet frame;Then sending sheet cylinder action, guide plate is for linear motion along guide rail, is sent by the first OLPF substrate under, and second OLPF substrate of bottom is blocked by bottom montant, thus the OLPF substrate stacked is divided into monolithic and is sent;And the stroke of sheet cylinder is sent by control, control the unloading position of OLPF substrate, it is achieved the first location of workpiece;
OLPF substrate to be processed is transported to machine table by charging crane by 3, and meanwhile, the OLPF substrate of completion of processing is also transported to finished product box storage;
The 4 OLPF substrates being accurately positioned in machine table by perpendicular positioning mechanism and level locating mechanism:
Described perpendicular positioning mechanism includes the first right angle backer, riser, transverse slat and vertical cylinder;Described vertical cylinder is erect and is arranged, and the outfan of vertical cylinder is equipped with horizontally disposed transverse slat;Described riser upper end is fixing with transverse slat to be connected, and touches with vertical cylinder inside riser, is fixedly connected with horizontally disposed first right angle backer outside riser;Described vertical cylinder is fixed on workbench by vertical cylinder fixed mount;Vertical cylinder band motion plate knee-action, thus drive riser and the first right angle backer to synchronize knee-action;Owing to touching with vertical cylinder inside riser, enhance the stability of first right angle backer's knee-action;Described first right angle backer mutually touches with machine table, and the first right angle backer is L-shaped with the cross section in the face that touches of machine table;Described second right angle backer presents L-shaped towards the end face of machine table side;Described horizontal air cylinder, the second right angle backer and the first right angle backer are on same straight line;
Perpendicular positioning mechanism action, after vertical cylinder drives the first right angle backer rise to put in place, then level locating mechanism action, horizontal air cylinder drives the second right angle backer to push along OLPF substrate diagonal, until the first right angle backer and the second right angle backer clamp fixing OLPF substrate;The vacuum equipment of inhaling opening machine table holds OLPF substrate to be processed;Level locating mechanism is first return, and then the first right angle backer decline of perpendicular positioning mechanism puts in place;
5. pair OLPF substrate to be processed is processed;Step 2 is also being carried out simultaneously, and feeding mechanism separation single monolithic piece is also sent;
After 6OLPF substrate completion of processing, repeat step 3, circulate with this.
In described step 1,
Described Zhu Pian mechanism, refers to including storage sheet and storage sheet;Described storage sheet horizontal positioned, and middle part offers the storage film trap of up/down perforation;Described storage sheet refers to include horizontally disposed cross bar and erect the montant arranged;Storage sheet is fixed in described cross bar one end, and the other end is connected with montant;Described montant is arranged in storage film trap, and the cross section of montant is L-shaped;Described storage sheet has four, and the montant of four storage sheet encloses and sets out a receiving chamber housing OLPF substrate;Offering elongated slot in described storage sheet, described cross bar one end is equipped with screw, and screw through one end of cross bar and elongated slot and is fixed with nut;
Unscrewing screw, regulation storage sheet refers to the relative position in storage sheet, and then regulation accommodates the size in chamber, is allowed to be applicable to place different size of OLPF substrate, then tightens screw, the fixing size accommodating chamber.
In described step 3,
Described charging crane includes load sucker, load cylinder, unloading piece sucker, unloading piece cylinder and finished product box;Described load sucker is arranged on the outfan of load cylinder;Described unloading piece sucker is arranged on the outfan of unloading piece cylinder;Described load cylinder and unloading piece cylinder are fixed on dockboard;It is additionally provided with electric rotating machine on described dockboard;The outfan of described electric rotating machine is equipped with cutter;Electric rotating machine band cutter carries out chamfer machining;It is equipped with machine table below described cutter;Described dockboard is disposed in upper and lower displacement mechanism;Described upper and lower displacement mechanism is disposed in left and right displacement mechanism;Described load sucker is identical with the level interval containing sheet frame and machine table with the level interval of unloading piece sucker;Described machine table is positioned at finished product box and contains the middle part of sheet frame;
Left and right displacement mechanism action so that load sucker is positioned at above Sheng sheet frame, and meanwhile, unloading piece sucker is positioned at above machine table;Upper and lower displacement mechanism works, load sucker is descending hold OLPF substrate to be processed after the most up, unloading piece sucker DL synchronization is the most up after holding the OLPF substrate of completion of processing;OLPF substrate to be processed is transported to machine table by left and right displacement mechanism, and meanwhile, the OLPF substrate of completion of processing is also transported to finished product box storage.
This method achieves the automatic partition of OLPF substrate from the function sending sheet; whole folded OLPF substrate is divided into monolithic send; and position at the beginning of when sending; feeding process waits without shutting down, and improves work efficiency, reduces labor intensity; and before processing to being accurately positioned that OLPF substrate is carried out; overcoming and deficiency that precision the highest, favorable repeatability are positioned manually, the quality of product is guaranteed.
Figure of description
Fig. 1 is the workbench top view of the present invention;
Fig. 2 is the top view of the present invention;
Fig. 3 is the Zhu Pian mechanism front view of the present invention;
Fig. 4 is perpendicular positioning mechanism of the present invention and level locating mechanism front view;
In figure: storage sheet 1, elongated slot 1a, screw 1b, storage film trap 1c, storage sheet refers to 2, cross bar 2a, montant 2b, accommodate chamber 2c, send sheet base 3, guide plate 4, contain sheet frame 4a, guide rail 5, send sheet cylinder 6, load sucker 7, load cylinder 8, unloading piece sucker 9, unloading piece cylinder 10, dockboard 11, electric rotating machine 12, cutter 13, machine table 14, upper and lower displacement mechanism 15, left and right displacement mechanism 16, finished product box 17, first right angle backer 18, riser 19, transverse slat 20, vertical cylinder 21, vertical cylinder fixed mount 22, workbench 23, cannelure 24, second right angle backer 25, horizontal plate 26, horizontal air cylinder 27, horizontal air cylinder fixed mount 28, transverse groove 29.
Detailed description of the invention
Below in conjunction with the accompanying drawings, the present invention is described in further detail.
A kind of optical element automatization chamfered edge processing method, comprises the following steps:
1 adjusts the direction of the horizontal air cylinder 27 accommodating the size of chamber 2c, level locating mechanism of Zhu Pian mechanism and horizontal air cylinder 27 distance apart from machine table 14 according to the size of OLPF substrate;Then the OLPF substrate that a group to be processed is stacked in the receiving chamber 2c of Zhu Pian mechanism.
Described Zhu Pian mechanism, in order to stack one group of OLPF substrate to be processed, such as 50, refers to 2 including storage sheet 1 and storage sheet;Described storage sheet 1 horizontal positioned, and middle part offers the storage film trap 1c of up/down perforation.Described storage sheet refers to that 2 include horizontally disposed cross bar 2a and erect the montant 2b arranged.Storage sheet 1 is fixed in described cross bar 2a one end, and the other end is connected with montant 2b.Described montant 2b is arranged in storage film trap 1c, and the cross section of montant 2b is L-shaped.As preferably, described storage sheet 1 has four, and the montant 2b of four storage sheet 1 encloses and sets out a receiving chamber 2c housing OLPF substrate.Offering elongated slot 1a in described storage sheet 1, described cross bar 2a one end is equipped with screw 1b, screw 1b and through one end of cross bar 2a and elongated slot 1a and fixes with nut.Unscrewing screw 1b, regulation storage sheet refers to the 2 relative positions in storage sheet 1, and then regulation accommodates the size of chamber 2c, is allowed to be applicable to place different size of OLPF substrate, then tightens screw 1b, and the fixing size accommodating chamber 2c adds the suitability of this device.
Described level locating mechanism includes the second right angle backer 25, horizontal plate 26, horizontal air cylinder 27 and horizontal air cylinder fixed mount 28.Described horizontal air cylinder 27 is horizontally disposed with, and the outfan of horizontal air cylinder 27 is equipped with horizontally disposed horizontal plate 26.The second right angle backer 25 it is fixedly installed on described horizontal plate 26.Described horizontal air cylinder 27 is fixed on workbench 23 by horizontal air cylinder fixed mount 28.Horizontal air cylinder 27 drives horizontal plate 26 horizontal rectilinear motion, thus realizes horizontally advancing of the second right angle backer 25 and retreat with level.
Offer a pair up/down perforation and the transverse groove 29 being parallel to each other on horizontal air cylinder fixed mount 28, in described transverse groove 29, be equipped with regulation screw.Cannelure 24 orthogonal with transverse groove 29 is offered on described workbench 23.Regulation screw is each passed through transverse groove 29 and then cannelure 24 is fixed with nut.Unscrew regulation screw, change the transverse groove 29 position on cannelure 24 and direction, adjust level locating mechanism lateral attitude, lengthwise position and angle on workbench 23 so that the direction of the horizontal air cylinder 27 of level locating mechanism and horizontal air cylinder 27 can be suitable with the size of OLPF substrate apart from the distance of machine table 14.
2. by feeding mechanism, the OLPF substrate stacked is divided into monolithic and sends:
Described feeding mechanism includes sending sheet base 3, sending sheet cylinder 6, guide rail 5 and guide plate 4.Described guide rail 5 is arranged on and send on sheet base 3;Described sending is provided with storage sheet 1 on sheet base 3.Described guide plate 4 and guide rail 5 are slidably connected.Described guide plate 4 is arranged on the outfan sending sheet cylinder 6.Send sheet cylinder 6 action, drive guide plate 4 to slide along guide rail 5.The front end of described guide plate 4 is provided with one and contains sheet frame 4a;To the difference in height bottom montant 2b more than monolithic OLPF substrate thickness and less than the thickness sum of two panels OLPF substrate bottom described Sheng sheet frame 4a.
Be positioned over the whole lamination of the receiving chamber 2c of Zhu Pian mechanism, under a piece of OLPF substrate fall into Sheng sheet frame 4a.Then sending sheet cylinder 6 action, guide plate 4 is for linear motion along guide rail 5, is sent by the first OLPF substrate under, and second OLPF substrate of bottom blocks bottom montant 2b, and the OLPF substrate stacked is divided into monolithic and is sent.
Realize the function of monolithic discharging.Additionally by controlling to send the stroke of sheet cylinder 6, control the unloading position of OLPF substrate, it is achieved the first location of workpiece.
OLPF substrate to be processed is transported to machine table 14 by charging crane by 3, and meanwhile, the OLPF substrate of completion of processing is also transported to finished product box 17 and stores:
Described charging crane includes load sucker 7, load cylinder 8, unloading piece sucker 9, unloading piece cylinder 10 and finished product box 17.Described load sucker 7 is arranged on the outfan of load cylinder 8.Described unloading piece sucker 9 is arranged on the outfan of unloading piece cylinder 10.Described load cylinder 8 and unloading piece cylinder 10 are fixed on dockboard 11.It is additionally provided with electric rotating machine 12 on described dockboard 11.The outfan of described electric rotating machine 12 is equipped with cutter 13.Electric rotating machine 12 band cutter 13 carries out chamfer machining.It is equipped with machine table 14 below described cutter 13.Described dockboard 11 is disposed in upper and lower displacement mechanism 15;Described upper and lower displacement mechanism 15 is disposed in left and right displacement mechanism 16.Described load sucker 7 is identical with the level interval containing sheet frame 4a and machine table 14 with the level interval of unloading piece sucker 9.Described machine table 14 is positioned at finished product box 17 and contains the middle part of sheet frame 4a.
Left and right displacement mechanism 16 action so that load sucker 7 is positioned at above Sheng sheet frame 4a, and meanwhile, unloading piece sucker 9 is positioned at above machine table 14.Upper and lower displacement mechanism 15 works, load sucker 7 is descending hold OLPF substrate to be processed after the most up, unloading piece sucker 9 DL synchronization is the most up after holding the OLPF substrate of completion of processing.OLPF substrate to be processed is transported to machine table 14 by left and right displacement mechanism 16, and meanwhile, the OLPF substrate of completion of processing is also transported to finished product box 17 and stores.One operation, is simultaneously achieved feeding and the recovery of finished product of just finished product, saves more than 6 hours artificial workpiece loading and unloading time every day, and process velocity improves 50%.
The 4 OLPF substrates being accurately positioned in machine table 14 by perpendicular positioning mechanism and level locating mechanism:
Described perpendicular positioning mechanism includes the first right angle backer 18, riser 19, transverse slat 20 and vertical cylinder 21.Described vertical cylinder 21 is erect and is arranged, and the outfan of vertical cylinder 21 is equipped with horizontally disposed transverse slat 20.Described riser 19 upper end is fixing with transverse slat 20 to be connected, and touches with vertical cylinder 21 inside riser 19, is fixedly connected with horizontally disposed first right angle backer 18 outside riser 19.Described vertical cylinder 21 is fixed on workbench 23 by vertical cylinder fixed mount 22.Vertical cylinder 21 band motion plate 20 knee-action, thus drive riser 19 and the first right angle backer 18 to synchronize knee-action.Owing to touching with vertical cylinder 21 inside riser 19, enhance the stability of the first right angle backer 18 knee-action.
Described first right angle backer 18 mutually touches with machine table 14, and the first right angle backer 18 is L-shaped with the cross section in the face that touches of machine table 14.
Described second right angle backer 25 presents L-shaped towards the end face of machine table 14 side.
Described horizontal air cylinder the 27, second right angle backer 25 and the first right angle backer 18 are on same straight line.
Then perpendicular positioning mechanism action, after vertical cylinder 21 drives the first right angle backer 18 rise to put in place, then level locating mechanism action, horizontal air cylinder 27 drives the second right angle backer 25 to push along OLPF substrate diagonal, until the first right angle backer 18 and the second right angle backer 25 clamp fixing OLPF substrate.The vacuum equipment of inhaling opening machine table 14 holds OLPF substrate to be processed.Level locating mechanism is first return, and then the first right angle backer 18 decline of perpendicular positioning mechanism puts in place.
5. pair OLPF substrate to be processed is processed;Step 2 is also being carried out simultaneously, and feeding mechanism separation single monolithic piece is also sent;
After 6OLPF substrate completion of processing, repeat step 3, circulate with this.
The present invention is illustrated according to embodiment, and on the premise of without departing from present principles, this method can also make some deformation and improvement.It should be pointed out that, the technical scheme that the modes such as all employing equivalents or equivalent transformation are obtained, all fall within protection scope of the present invention.

Claims (3)

1. an optical element automatization chamfered edge processing method, it is characterised in that comprise the following steps:
1) direction and the distance of horizontal air cylinder (27) distance machine table (14) of the horizontal air cylinder (27) of the size in receiving chamber (2c) of Zhu Pian mechanism, level locating mechanism is adjusted according to the size of optics OLPF substrate;Then the optics OLPF substrate that a group to be processed is stacked in the receiving chamber (2c) of Zhu Pian mechanism;
Described level locating mechanism includes the second right angle backer (25), horizontal plate (26), horizontal air cylinder (27) and horizontal air cylinder fixed mount (28);Described horizontal air cylinder (27) is horizontally disposed with, and the outfan of horizontal air cylinder (27) is equipped with horizontally disposed horizontal plate (26);The second right angle backer (25) it is fixedly installed on described horizontal plate (26);Described horizontal air cylinder (27) is fixed on workbench (23) by horizontal air cylinder fixed mount (28);Horizontal air cylinder (27) drives horizontal plate (26) horizontal rectilinear motion, thus realizes horizontally advancing of the second right angle backer (25) and retreat with level;Offering a pair up/down perforation and the transverse groove (29) being parallel to each other on horizontal air cylinder fixed mount (28), described transverse groove is equipped with regulation screw in (29);Offer on described workbench (23) and transverse groove (29) orthogonal cannelure (24);Regulation screw is each passed through transverse groove (29) and cannelure (24) is then fixed with nut;
Unscrew regulation screw, change the transverse groove (29) position on cannelure (24) and direction, adjust level locating mechanism lateral attitude, lengthwise position and angle on workbench (23) so that the direction of horizontal air cylinder (27) of level locating mechanism, horizontal air cylinder (27) distance machine table (14) distance suitable with the size of OLPF substrate;
2) by feeding mechanism, the OLPF substrate stacked is divided into monolithic and sends:
Described feeding mechanism includes sending sheet base (3), sending sheet cylinder (6), guide rail (5) and guide plate (4);Described guide rail (5) is arranged on and send on sheet base (3);Described sending is provided with storage sheet (1) on sheet base (3);Described guide plate (4) and guide rail (5) are slidably connected;Described guide plate (4) is arranged on the outfan sending sheet cylinder (6);The front end of described guide plate (4) is provided with one and contains sheet frame (4a);The difference in height of described Sheng sheet frame (4a) bottom to montant (2b) bottom is more than monolithic OLPF substrate thickness and the thickness sum less than two panels OLPF substrate;
Be positioned over the whole lamination in the receiving chamber (2c) of Zhu Pian mechanism, under a piece of OLPF substrate fall into Sheng sheet frame (4a);Then sending sheet cylinder (6) action, guide plate (4) is for linear motion along guide rail (5), is sent by the first OLPF substrate under, and second OLPF substrate of bottom is blocked by montant (2b) bottom, thus the OLPF substrate stacked is divided into monolithic and is sent;And the stroke of sheet cylinder (6) is sent by control, control the unloading position of OLPF substrate, it is achieved the first location of workpiece;
3) by charging crane, OLPF substrate to be processed being transported to machine table (14), meanwhile, the OLPF substrate of completion of processing is also transported to finished product box (17) storage;
4) it is accurately positioned the OLPF substrate in machine table (14) by perpendicular positioning mechanism and level locating mechanism:
Described perpendicular positioning mechanism includes the first right angle backer (18), riser (19), transverse slat (20) and vertical cylinder (21);Described vertical cylinder (21) is erect and is arranged, and the outfan of vertical cylinder (21) is equipped with horizontally disposed transverse slat (20);Described riser (19) upper end is fixing with transverse slat (20) to be connected, and riser (19) inner side touches with vertical cylinder (21), and riser (19) outside is fixedly connected with horizontally disposed first right angle backer (18);Described vertical cylinder (21) is fixed on workbench (23) by vertical cylinder fixed mount (22);Vertical cylinder (21) band motion plate (20) knee-action, thus drive riser (19) and the first right angle backer (18) to synchronize knee-action;Owing to riser (19) inner side touches with vertical cylinder (21), enhance the stability of the first right angle backer (18) knee-action;Described first right angle backer (18) mutually touches with machine table (14), and the first right angle backer (18) is L-shaped with the cross section in the face that touches of machine table (14);Described second right angle backer (25) presents L-shaped towards the end face of machine table (14) side;Described horizontal air cylinder (27), the second right angle backer (25) and the first right angle backer (18) are on same straight line;
Perpendicular positioning mechanism action, after vertical cylinder (21) drives the first right angle backer (18) rise to put in place, then level locating mechanism action, horizontal air cylinder (27) drives the second right angle backer (25) to push along OLPF substrate diagonal, until the first right angle backer (18) and the second right angle backer (25) clamp fixing OLPF substrate;The vacuum equipment of inhaling opening machine table (14) holds OLPF substrate to be processed;Level locating mechanism is first return, and then the first right angle backer (18) decline of perpendicular positioning mechanism puts in place;
5). OLPF substrate to be processed is processed;Step 2 simultaneously) also carrying out, feeding mechanism separation single monolithic piece is also sent;
6), after OLPF substrate completion of processing, repeat step 3), circulate with this.
2. a kind of optical element automatization as claimed in claim 1 chamfered edge processing method, it is characterised in that in described step 1),
Described Zhu Pian mechanism, refers to (2) including storage sheet (1) and storage sheet;Described storage sheet (1) horizontal positioned, and middle part offers the storage film trap (1c) of up/down perforation;Described storage sheet refers to that (2) include horizontally disposed cross bar (2a) and erect the montant (2b) arranged;Storage sheet (1) is fixed in described cross bar (2a) one end, and the other end is connected with montant (2b);Described montant (2b) is arranged in storage film trap (1c), and the cross section of montant (2b) is L-shaped;Described storage sheet (1) has four, and the montant (2b) of four storages sheet (1) encloses and sets out a receiving chamber (2c) housing OLPF substrate;Offering elongated slot (1a) on described storage sheet (1), described cross bar (2a) one end is equipped with screw (1b), and screw (1b) through one end of cross bar (2a) and elongated slot (1a) and is fixed with nut;
Unscrewing screw (1b), regulation storage sheet refers to (2) relative position in storage sheet (1), and then regulation accommodates the size in chamber (2c), is allowed to be applicable to place different size of OLPF substrate, then tightens screw (1b), the fixing size accommodating chamber (2c).
3. a kind of optical element automatization as claimed in claim 2 chamfered edge processing method, it is characterised in that in described step 3),
Described charging crane includes load sucker (7), load cylinder (8), unloading piece sucker (9), unloading piece cylinder (10) and finished product box (17);Described load sucker (7) is arranged on the outfan of load cylinder (8);Described unloading piece sucker (9) is arranged on the outfan of unloading piece cylinder (10);Described load cylinder (8) and unloading piece cylinder (10) are fixed on dockboard (11);Electric rotating machine (12) it is additionally provided with on described dockboard (11);The outfan of described electric rotating machine (12) is equipped with cutter (13);Electric rotating machine (12) band cutter (13) carries out chamfer machining;Described cutter (13) lower section is equipped with machine table (14);Described dockboard (11) is disposed in upper and lower displacement mechanism (15);Described upper and lower displacement mechanism (15) is disposed in left and right displacement mechanism (16);Described load sucker (7) is identical with the level interval containing sheet frame (4a) and machine table (14) with the level interval of unloading piece sucker (9);Described machine table (14) is positioned at finished product box (17) and contains the middle part of sheet frame (4a);
Left and right displacement mechanism (16) action so that load sucker (7) is positioned at Sheng sheet frame (4a) top, and meanwhile, unloading piece sucker (9) is positioned at machine table (14) top;Upper and lower displacement mechanism (15) works, load sucker (7) is descending hold OLPF substrate to be processed after the most up, unloading piece sucker (9) DL synchronization is the most up after holding the OLPF substrate of completion of processing;OLPF substrate to be processed is transported to machine table (14) by left and right displacement mechanism (16), and meanwhile, the OLPF substrate of completion of processing is also transported to finished product box (17) storage.
CN201410704080.9A 2014-11-30 2014-11-30 A kind of optical element automatization chamfered edge processing method Active CN104625887B (en)

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CN110116904A (en) * 2019-04-22 2019-08-13 芜湖黑特新能源汽车科技有限公司 It is a kind of for making the electrode slice automatic charging device of PTC heating sheet
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JPH08243891A (en) * 1995-03-07 1996-09-24 Kao Corp Chamfer work device for substrate
JP4003882B2 (en) * 2003-09-26 2007-11-07 シャープ株式会社 Substrate transfer system
CN201455767U (en) * 2009-07-29 2010-05-12 陈耀龙 Optical element machining center
CN202668285U (en) * 2012-06-15 2013-01-16 浙江台佳电子信息科技有限公司 Chamfering device for optical parts
CN103506910B (en) * 2012-06-20 2017-09-15 山东博达光电有限公司 Optical low-pass filter substrate processing technology
CN102909629B (en) * 2012-11-16 2014-08-27 厦门大学 End face polishing and beveling machine of optical element

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