CN210365436U - Automatic clamping device of chip substrate bin - Google Patents
Automatic clamping device of chip substrate bin Download PDFInfo
- Publication number
- CN210365436U CN210365436U CN201920864127.6U CN201920864127U CN210365436U CN 210365436 U CN210365436 U CN 210365436U CN 201920864127 U CN201920864127 U CN 201920864127U CN 210365436 U CN210365436 U CN 210365436U
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- bin
- support
- plate
- clamping device
- pressing plate
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Abstract
The utility model relates to an automatic clamping device of chip substrate feed bin, the device includes support, telescopic machanism, elevating system, the bottom of support is equipped with the backup pad and bears the weight of the feed bin with the level, telescopic machanism installs in the bottom, its front end is equipped with the grip block, telescopic machanism telescopic control grip block is compared with the support fore-and-aft movement, in order to realize the clamping operation to the feed bin in the horizontal direction, elevating system installs on the support, the last clamp plate that installs of elevating system, elevating system lift control clamp plate is compared with the backup pad up-and-down motion, in order to realize the clamping operation to the feed bin; the middle part of the support is provided with a positioning block, and the positioning block is assembled with the storage bin in a matching way to position the storage bin. The improved clamping device can effectively ensure that the stock bin is accurately positioned, and the yield of subsequent processing is ensured. And elevating system, telescopic machanism can also strengthen clamping device's application scope, can be used to the centre gripping of multiple size base plate feed bin, have improved the interchange and the universalization rate of equipment, bring higher economic benefits for the enterprise.
Description
Technical Field
The utility model relates to a feed bin clamping device of chip base plate.
Background
Due to the rapid development of electronic information technologies in various industries, the demand of integrated circuit chips is increasing, various processing or detection procedures are numerous, and a chip substrate bin is often used as an integral module to enter an automatic loading and unloading link of the procedures in a circulating manner. Because there is the clearance of placing base plate and feed bin, again because of the chip is small, processing and detect the precision high, on the last unloading station in each process, the inaccurate situation in feed bin position location often can appear in current clamping device during operation, make follow-up station dock inaccurate or skew dislocation, lead to chip processing mistake to increase the disability rate, perhaps detect inaccurate increase erroneous judgement rate, can cause production efficiency low simultaneously, cause the waste of manpower and materials resources, bring various losses for the enterprise. There is therefore a need for improvements in existing clamping devices.
SUMMERY OF THE UTILITY MODEL
One technical problem addressed by one aspect of the present disclosure is to provide an improved chip substrate magazine clamping device.
The utility model provides a technical scheme that its technical problem adopted is: the automatic clamping device for the chip substrate bin comprises a support, a telescopic mechanism and a lifting mechanism, wherein a support plate is arranged at the bottom of the support to horizontally bear the bin, the telescopic mechanism is arranged at the bottom, a clamping plate is arranged at the front end of the telescopic mechanism, the telescopic mechanism telescopically controls the clamping plate to move back and forth compared with the support so as to realize clamping operation on the bin in the horizontal direction, the lifting mechanism is arranged on the support, a pressing plate is arranged on the lifting mechanism, and the lifting mechanism elevates and controls the pressing plate to move up and down compared with the support plate so as to realize clamping operation on the bin in the vertical direction; the middle of the support is provided with a positioning block, and the positioning block is assembled with the storage bin in a matching mode to position the storage bin.
As before automatic clamping device of chip base plate feed bin, the backup pad is two, and is parallel to each other, two install between the backup pad telescopic machanism.
According to the automatic clamping device for the chip substrate bin, the positioning block is provided with the transverse groove so as to be matched with the embedded block of the bin, and the positioning block is provided with the photoelectric position detector.
The automatic clamping device for the chip substrate bin comprises a pressing plate, a fixing and connecting plate and a pressing plate, wherein the fixing and connecting plate is fixed with a support, the pressing plate is movably arranged at the bottom of the fixing and connecting plate, the pressing plate is provided with a torsion spring component, and the pressing plate is pressed downwards by the elasticity of the torsion spring component.
According to the automatic clamping device for the chip substrate bin, the auxiliary torsion spring is arranged at the mounting position of the clamping plate to generate elasticity to clamp the clamping plate towards the clamped bin.
One advantageous effect brought by one aspect of the present disclosure: the improved clamping device realizes the clamping operation of the stock bin through the movement of the lifting mechanism and the telescopic mechanism, and the supporting plate is matched with the positioning block to position the stock bin, so that the accuracy of the position of the stock bin is effectively ensured in each process, and the processing efficiency and the quality are improved.
Drawings
Certain embodiments of the invention will now be described in detail, by way of example and not limitation, with reference to the figures, in which like reference numerals identify identical or similar parts or features. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale.
In the drawings:
FIG. 1 is a schematic view of the present invention;
FIG. 2 is a schematic view of the present invention in use;
the designations in the figures illustrate the following:
1. a support; 2. a lifting mechanism; 3. a telescoping mechanism; 30. a clamping plate; 4. a support plate; 5. pressing a plate; 50. fixing and connecting the plates; 51. pressing a plate; 52. a torsion spring member; 6. positioning blocks; 60. a transverse slot; 7. a photoelectric position detector; 8. a sensor; 9. a storage bin.
Detailed Description
In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined below to clearly and completely describe the technical solution of the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them.
All other embodiments, which can be obtained by a person skilled in the art without any inventive work based on the described embodiments of the present invention, belong to the protection scope of the present invention. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by those of ordinary skill in the art to which the invention belongs.
The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a," "an," or "the" and similar referents do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
Referring to fig. 1-2, the automatic clamping device for the chip substrate bin comprises a support 1, a telescopic mechanism 3 and a lifting mechanism 2, wherein a support plate 4 is arranged at the bottom of the support 1 to horizontally support the bin 9, the telescopic mechanism 3 is arranged at the bottom, a clamping plate 30 is arranged at the front end of the telescopic mechanism 3, the telescopic mechanism 3 telescopically controls the clamping plate 30 to move back and forth compared with the support 1 so as to clamp the bin 9 in the horizontal direction, the lifting mechanism 2 is arranged on the support 1, a pressing plate 5 is arranged on the lifting mechanism 2, and the lifting mechanism 2 elevates and controls the pressing plate 5 to move up and down compared with the support plate 4 so as to clamp the bin 9 in the vertical direction; wherein, support 1 middle part is equipped with locating piece 6, locating piece 6 with feed bin 9 adaptation equipment is in order to fix a position feed bin 9.
The support 1 can comprise a main board and a base, wherein the base is positioned at the bottom of the front side of the main board, two support plates 4 extend forwards on the base, the two support plates 4 are parallel, a telescopic mechanism 3 is arranged between the two support plates 4, the telescopic mechanism 3 is formed by a cylinder part, a cylinder body is fixed on the base, and an output shaft of the cylinder body horizontally extends and retracts in the front-back direction; the lifting mechanism 2 can also be realized through a cylinder part, a cylinder body is fixed on the main board, and an output shaft of the cylinder body longitudinally moves up and down.
During operation, place feed bin 9 in backup pad 4, guarantee the horizontal location of feed bin 9 basically, then 3 output shafts of telescopic machanisms contract towards the back (support 1 direction) for grip block 30 and support 1 (base) are with the feed bin 9 front and back centre gripping. And the output shaft of the lifting mechanism 2 moves downwards so that the pressure plate 5 is pressed down at the top of the storage bin 9, and meanwhile, the positioning block 6 is matched with the corresponding position of the storage bin 9, so that the positioning accuracy of the storage bin 9 is enhanced.
From this, feed bin 9 is fixed by telescopic machanism 3, 2 centre grippings of elevating system in every round of process, and backup pad 4, 6 accurate location of guaranteeing feed bin 9 of locating piece can effectively avoid the inaccurate or situation of skew of follow-up station butt joint, are favorable to promoting chip processing yield, reduce the loss. Furthermore, the telescopic mechanism and the lifting mechanism can be provided with a sensor 8 to detect the clamping state of the storage bin. For example, the sensor 8 detects a retraction stroke, and a clamping space formed after the stroke retraction is smaller than the height and the width of the bin 9, so that the sensor 8 can detect whether the bin 9 is in place.
The positioning block 6 can be provided with a transverse groove 60, and the transverse groove 60 is matched with an embedded block on the storage bin 9 to strengthen the positioning of the storage bin 9 in the horizontal and vertical directions. Preferably, a photoelectric position detector 7 is arranged beside the positioning block 6, and a distance is reserved between the emitting and receiving photoelectric tubes through the photoelectric position detector 7, so that light forms an angle between the emitting and receiving, thereby judging the current positioning state of the bin 9.
In some embodiments, the pressing plate comprises a fixing plate 50 and a pressing plate 51, the fixing plate 50 is fixed with the bracket 1, the pressing plate 51 is movably mounted at the bottom of the fixing plate 50, the pressing plate 51 is provided with a torsion spring component 52, and the pressing plate 51 is pressed downwards by the elasticity of the torsion spring component 52. The pressure applying plate 51 is provided with a torsion spring frame, the torsion spring frame is provided with a shaft lever, a torsion spring is sleeved on the shaft lever, one elastic foot is limited, and the other elastic foot acts on the pressure applying plate 51 to generate continuous pressing elastic force for the pressure applying plate 51. Therefore, the buffer function can be realized when the storage bin 9 is clamped, and the clamping acting force is prevented from being too rigid to cause damage.
Similarly, the auxiliary torsion spring can be configured on the clamping plate, if the clamping plate is rotatably arranged on the telescopic mechanism through the rotating shaft, the rotating amplitude of the auxiliary torsion spring can be controlled in a smaller range through the travel stop block at the rotating shaft, the elastic force generated by the auxiliary torsion spring acts on the clamping plate to push the clamping plate towards the direction of the storage bin, and therefore when the storage bin is clamped, the auxiliary torsion spring can ensure the clamping force of the clamping plate on the storage bin and avoid the excessive rigidity of the clamping force. Preferably, the torsion spring member 52 and the auxiliary torsion spring can be provided with corresponding sensors for detecting the clamping force to determine the clamping force.
In conclusion, the improved clamping device can effectively ensure that the bin 9 is accurately positioned and the yield of subsequent processing is ensured. And elevating system 2, telescopic machanism 3 can also strengthen clamping device's application scope, can be used to the centre gripping of multiple size base plate feed bin 9, have improved the interchange and the universalization rate of equipment, bring higher economic benefits for the enterprise.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, which may be modified, combined, and varied by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (5)
1. Automatic clamping device of chip base plate feed bin, its characterized in that: the device comprises a support, a telescopic mechanism and a lifting mechanism, wherein a support plate is arranged at the bottom of the support to horizontally bear the stock bin, the telescopic mechanism is arranged at the bottom, a clamping plate is arranged at the front end of the telescopic mechanism, the telescopic mechanism telescopically controls the clamping plate to move back and forth compared with the support so as to realize the clamping operation of the stock bin in the horizontal direction, the lifting mechanism is arranged on the support, a pressing plate is arranged on the lifting mechanism, and the lifting mechanism controls the pressing plate to move up and down compared with the support plate so as to realize the clamping operation of the stock bin in the vertical direction; the middle of the support is provided with a positioning block, and the positioning block is assembled with the storage bin in a matching mode to position the storage bin.
2. The automatic clamping device for the chip substrate bin according to claim 1, wherein: the backup pad is two, and is parallel to each other, two install between the backup pad telescopic machanism.
3. The automatic clamping device for the chip substrate bin according to claim 2, wherein: the locating piece has a transverse slot to match with the embedded block of the bin, and the locating piece is configured with a photoelectric position detector.
4. The automatic clamping device for the chip substrate bin according to claim 1, wherein: the pressing plate comprises a fixing and connecting plate and a pressing plate, the fixing and connecting plate is fixed with the support, the pressing plate is movably mounted at the bottom of the fixing and connecting plate, the pressing plate is provided with a torsion spring component, and the pressing plate is pressed downwards by the elasticity of the torsion spring component.
5. The automatic clamping device for the chip substrate bin according to claim 1, wherein: and an auxiliary torsion spring is arranged at the mounting position of the clamping plate to generate elasticity to clamp the clamping plate towards the clamped stock bin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920864127.6U CN210365436U (en) | 2019-06-06 | 2019-06-06 | Automatic clamping device of chip substrate bin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920864127.6U CN210365436U (en) | 2019-06-06 | 2019-06-06 | Automatic clamping device of chip substrate bin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210365436U true CN210365436U (en) | 2020-04-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920864127.6U Expired - Fee Related CN210365436U (en) | 2019-06-06 | 2019-06-06 | Automatic clamping device of chip substrate bin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210365436U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113148639A (en) * | 2021-05-28 | 2021-07-23 | 浙江水晶光电科技股份有限公司 | Feed bin clamping device and support plate output equipment |
| CN113523581A (en) * | 2021-07-16 | 2021-10-22 | 深圳泰德半导体装备有限公司 | Laser marking device |
-
2019
- 2019-06-06 CN CN201920864127.6U patent/CN210365436U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113148639A (en) * | 2021-05-28 | 2021-07-23 | 浙江水晶光电科技股份有限公司 | Feed bin clamping device and support plate output equipment |
| CN113148639B (en) * | 2021-05-28 | 2023-08-25 | 浙江水晶光电科技股份有限公司 | Feed bin clamping device and carrier plate output equipment |
| CN113523581A (en) * | 2021-07-16 | 2021-10-22 | 深圳泰德半导体装备有限公司 | Laser marking device |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200421 Termination date: 20210606 |
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| CF01 | Termination of patent right due to non-payment of annual fee |