CN204834569U - IC encapsulation chip assay device - Google Patents
IC encapsulation chip assay device Download PDFInfo
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- CN204834569U CN204834569U CN201520248873.4U CN201520248873U CN204834569U CN 204834569 U CN204834569 U CN 204834569U CN 201520248873 U CN201520248873 U CN 201520248873U CN 204834569 U CN204834569 U CN 204834569U
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Abstract
The utility model discloses a IC encapsulation chip assay device, but include and bear chassis rotating face plate, but rotating face plate has seted up a plurality of chip holding portions along the circumferencial direction, but rotating face plate's periphery still is equipped with loading work station and uninstallation workstation, is equipped with the detection achievement station between loading work station and the uninstallation workstation, the detection achievement station is including surperficial measuring station and electrical property measuring station, the surface measuring station including the image acquisition device that is used for pick -up chip surface image and with image acquisition device signal connection's host computer, the electrical property measuring station includes test probe and is used for driving test probe controls the positioning system who removes, positioning system and host computer signal connection from top to bottom, the host computer carries out the surface detection according to the image of image acquisition device conveying to the chip, fixes a position the electrically conductive weld pad of chip simultaneously, and positioning system counterpoints test probe according to the signal of host computer output with electrically conductive weld pad, carry out the electrical property and detect. The utility model discloses simple structure, detection efficiency is high.
Description
Technical field
The utility model relates to a kind of IC packaged chip checkout gear, belongs to chip encapsulation technology field.
Background technology
In manufacture of semiconductor, often generate tiny particulate or defect because of some unavoidable reasons.Improving constantly of with circuit close extreme is constantly reduced along with component size in manufacture of semiconductor, these atomic little defects or the impact of particulate on integrated circuit quality are also on the rise, therefore for maintaining the stable of product quality, usually while carrying out every manufacture of semiconductor, also defects detection must be carried out for produced semiconductor element, to analyze according to the result detected the basic reason causing these defects, could avoid by the adjustment of process parameter or reduce the generation of defect further afterwards, to reach the object promoting manufacture of semiconductor yield and reliability.
For achieving the above object, Chinese patent database discloses on January 14th, 2015 patent application that a patent name is " the loading work station of IC packaged chip checkout gear ", its patent No. is ZL201420407917.9, it comprises: comprise bearing chassis, be located at the rotatable turntable in bearing chassis, rotatable turntable along the circumferential direction offers some receive chips portions, close on rotatable turntable and be also provided with loading work station, unload station, load between work station and unload station and be also provided with testing station, testing station comprises electrical detection station and Surface testing station.Be adjacent to rotatable turntable before electrical detection station and die orientation measuring station and die orientation adaptation stations are also set, whether IC packaged chip is correct in the detected orientation of putting of die orientation measuring station, when IC packaged chip put orientation incorrect time, the sector-meeting of IC encapsulated core can be adjusted in die orientation adaptation stations and correct put orientation, makes the detector probe at follow-up electrical detection station and the conductive welding pad contraposition of IC packaged chip.Surface testing station obtains front image and the back side image of IC packaged chip by image-pickup assembly, and is sent to image process unit and compares and analyze, to detect the surface whether defectiveness existence of IC packaged chip.
Its weak point is: its complex structure, in order to the electrical detection and surface defects detection that complete IC packaged chip are provided with die orientation measuring station, die orientation adaptation stations, electrical detection station and Surface testing station, detect through multiprogramming, detection efficiency is low.
Utility model content
The purpose of this utility model is to overcome deficiency of the prior art, provides a kind of IC packaged chip checkout gear, solves the technical problem that in prior art, IC packaged chip structure of the detecting device is complicated, trace routine is numerous and diverse, operating efficiency is low.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of IC packaged chip checkout gear, comprises bearing chassis, the rotatable turntable be located in bearing chassis, and rotatable turntable along the circumferential direction offers some receive chips portions; The periphery of rotatable turntable is also provided with and loads work station and unload station, is provided with testing station between described loading work station and unload station; Described testing station comprises Surface testing station and electrical detection station; Described Surface testing station comprises for the image collecting device of acquisition chip surface image and the host computer that is connected with image collecting device signal; Described electrical detection station comprises detector probe and the navigation system for driving detector probe to move up and down, and described navigation system is connected with host computer signal;
The image that host computer transmits according to image collecting device carries out Surface testing to chip, positions the conductive welding pad of chip simultaneously, and detector probe and conductive welding pad are carried out contraposition by the signal that navigation system exports according to host computer, carry out electrical detection.
Described image collecting device comprises the first video camera of acquisition chip upper surface image and the second video camera of acquisition chip lower surface image, and the below of rotatable turntable is located at by described second video camera, and the bottom in receive chips portion is provided with transparent chips supporting plate.
Described image collector is set to CCD or cmos sensor.
Described image collecting device and navigation system are connected with host computer wireless signal respectively.
Described navigation system comprises left and right directive slide track, is located at the first slide block on the directive slide track of left and right and slides up and down with the first slide block the second slide block be connected, and described detector probe is located on the second slide block.
Described navigation system is mechanical arm, and described detector probe is located on mechanical arm.
Compared with prior art, the beneficial effect that the utility model reaches is: chip surface detects and chip conductive weld pad positioning synchronous carries out, and realize electrical detection by controlling navigation system mobility detect probe, structure is simple, and detection efficiency is high.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation at testing station in Fig. 1.
In figure: 1, bearing base; 2, rotatable turntable; 3, receive chips portion; 4, work station is loaded; 5, unload station; 6, testing station; 7a, the first video camera; 7b, the second video camera; 8a, left and right directive slide track; 8b, detector probe; 8c, the first slide block; 8d, the second slide block; 9, IC packaged chip; 10, transparent chips supporting plate.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.Following examples only for clearly the technical solution of the utility model being described, and can not limit protection range of the present utility model with this.
As shown in Figure 1, be the structural representation of IC packaged chip 9 checkout gear, comprise bearing base 1, the rotatable turntable 2 be located on bearing base 1, the circumferencial direction along rotatable turntable 2 offers some receive chips portions 3.Close on rotatable turntable 2 and be provided with loading work station 4 and unload station 5, load between work station 4 and unload station 5 and be provided with testing station 6.
As shown in Figure 2, be the structural representation at testing station 6, testing station 6 comprises Surface testing station and electrical detection station.Surface testing station comprises for the image collecting device of acquisition chip surface image and the host computer (not shown) that is connected with image collecting device wireless signal.Preferably, image collector is set to CCD or cmos sensor.Image collecting device comprises the first video camera 7a of acquisition chip upper surface image and the second video camera 7b of acquisition chip lower surface image, second video camera 7b is located at the below of rotatable turntable 2, the bottom in receive chips portion 3 is provided with transparent chips supporting plate 10, second video camera 7b and can pass through the image that transparent chips supporting plate 10 absorbs IC packaged chip 9 lower surface.
As an embodiment of the present utility model, the top of rotatable turntable 2 is located at electrical detection station, and accordingly, IC packaged chip 9, when loading, should make to be provided with the surface of conductive welding pad upward.Electrical detection station comprises detector probe 8b and the navigation system for driving detector probe 8b to move up and down, and navigation system is connected by wireless network wireless signal with host computer.Navigation system comprises left and right directive slide track 8a, is located at the first slide block 8c on the directive slide track 8a of left and right and slides up and down with the first slide block 8c the second slide block 8d be connected, and detector probe 8b is located on the second slide block 8d.As another embodiment of the present utility model, navigation system also can select mechanical arm, and detector probe 8b is located on mechanical arm.
The image that host computer transmits according to image collecting device carries out Surface testing to chip, the conductive welding pad of IC packaged chip 9 is positioned simultaneously, detector probe 8b and conductive welding pad are carried out contraposition by the signal that navigation system exports according to host computer, carry out electrical detection.
The above is only preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model know-why; can also make some improvement and distortion, these improve and distortion also should be considered as protection range of the present utility model.
Claims (5)
1.IC packaged chip checkout gear, comprises bearing chassis, the rotatable turntable be located in bearing chassis, and rotatable turntable along the circumferential direction offers some receive chips portions; The periphery of rotatable turntable is also provided with and loads work station and unload station, is provided with testing station between described loading work station and unload station; It is characterized in that, described testing station comprises Surface testing station and electrical detection station; Described Surface testing station comprises for the image collecting device of acquisition chip surface image and the host computer that is connected with image collecting device signal; Described electrical detection station comprises detector probe and the navigation system for driving detector probe to move up and down, and described navigation system is connected with host computer signal;
The image that host computer transmits according to image collecting device carries out Surface testing to chip, positions the conductive welding pad of chip simultaneously, and detector probe and conductive welding pad are carried out contraposition by the signal that navigation system exports according to host computer, carry out electrical detection;
Described image collecting device comprises the first video camera of acquisition chip upper surface image and the second video camera of acquisition chip lower surface image, and the below of rotatable turntable is located at by described second video camera, and the bottom in receive chips portion is provided with transparent chips supporting plate.
2. IC packaged chip checkout gear according to claim 1, it is characterized in that, described image collector is set to CCD or cmos sensor.
3. IC packaged chip checkout gear according to claim 1, it is characterized in that, described image collecting device and navigation system are connected with host computer wireless signal respectively.
4. IC packaged chip checkout gear according to claim 1, it is characterized in that, described navigation system comprises left and right directive slide track, is located at the first slide block on the directive slide track of left and right and slides up and down with the first slide block the second slide block be connected, and described detector probe is located on the second slide block.
5. IC packaged chip checkout gear according to claim 1, is characterized in that, described navigation system is mechanical arm, and described detector probe is located on mechanical arm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520248873.4U CN204834569U (en) | 2015-04-23 | 2015-04-23 | IC encapsulation chip assay device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520248873.4U CN204834569U (en) | 2015-04-23 | 2015-04-23 | IC encapsulation chip assay device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204834569U true CN204834569U (en) | 2015-12-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520248873.4U Expired - Fee Related CN204834569U (en) | 2015-04-23 | 2015-04-23 | IC encapsulation chip assay device |
Country Status (1)
| Country | Link |
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| CN (1) | CN204834569U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105513982A (en) * | 2015-12-14 | 2016-04-20 | 重庆远创光电科技有限公司 | Chip vision detection system |
| CN112786509A (en) * | 2021-01-26 | 2021-05-11 | 湖南大学 | Positioning system, positioning method and computing equipment |
| CN113714151A (en) * | 2021-07-23 | 2021-11-30 | 谢志飞 | Medical high accuracy thermistor detects sorting unit |
| CN113970658A (en) * | 2021-10-22 | 2022-01-25 | 深圳台达创新半导体有限公司 | Probe station for semiconductor detection |
-
2015
- 2015-04-23 CN CN201520248873.4U patent/CN204834569U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105513982A (en) * | 2015-12-14 | 2016-04-20 | 重庆远创光电科技有限公司 | Chip vision detection system |
| CN112786509A (en) * | 2021-01-26 | 2021-05-11 | 湖南大学 | Positioning system, positioning method and computing equipment |
| CN112786509B (en) * | 2021-01-26 | 2024-02-23 | 江苏优普纳科技有限公司 | Positioning system, positioning method and computing equipment |
| CN113714151A (en) * | 2021-07-23 | 2021-11-30 | 谢志飞 | Medical high accuracy thermistor detects sorting unit |
| CN113970658A (en) * | 2021-10-22 | 2022-01-25 | 深圳台达创新半导体有限公司 | Probe station for semiconductor detection |
| CN113970658B (en) * | 2021-10-22 | 2024-02-23 | 深圳台达创新半导体有限公司 | Probe station for semiconductor detection |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 Termination date: 20200423 |