CN105513982A - Chip vision detection system - Google Patents

Chip vision detection system Download PDF

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Publication number
CN105513982A
CN105513982A CN201510924477.3A CN201510924477A CN105513982A CN 105513982 A CN105513982 A CN 105513982A CN 201510924477 A CN201510924477 A CN 201510924477A CN 105513982 A CN105513982 A CN 105513982A
Authority
CN
China
Prior art keywords
chip
installation
image
guide rail
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510924477.3A
Other languages
Chinese (zh)
Inventor
李志远
耿世慧
李熙春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongqing Fivision Technology Co Ltd
Original Assignee
Chongqing Fivision Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chongqing Fivision Technology Co Ltd filed Critical Chongqing Fivision Technology Co Ltd
Priority to CN201510924477.3A priority Critical patent/CN105513982A/en
Publication of CN105513982A publication Critical patent/CN105513982A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Abstract

The invention provides a chip vision detection system. A chip frame provided with a chip moves on a guide rail and a camera arranged on the guide rail shoots the chip in the chip frame so that a chip image is obtained. The chip image is processed by use of an image detection system, and whether the chip is qualified is determined. By use of the chip vision detection system provided by the invention, machine automatic detection can be performed on the chip, the disadvantage of manually determining whether the chip is qualified or not in prior detection art is overcome, and compared to a manual detection mode, the efficiency is higher.

Description

Chip vision detection system
Technical field
The present invention relates to and utilize image to carry out the technical field of chip detection, particularly relate to a kind of chip vision detection system.
Background technology
One of restriction China's development of computer and universal key technology are chips, and the development bottleneck of chip is manufacturing equipment and production technology.Can Godson popularize one of key factor on China's computer is exactly the production technology that China's manufacture of microchips must grasp chip.The technology that production technology relates to is a lot, and it is one of important content that the outward appearance wherein in chip manufacturing proces detects.The outward appearance detection system of current chip manufacture process is standard and the technology of American I NTEL and AMD substantially.China does not also have this type of chip outward appearance detection system a set of at present.Therefore China's self-developing chip outward appearance detection system is an extremely important project and engineering to China's chip manufacturing.
In existing production process, or the main quality of mode to chip of manual detection that adopt detects, and how providing a kind of effective image to detect servicing unit to carry out image detection, needing the problem solved with regard to having become those skilled in the art.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of chip vision detection system, is suitable for solving in prior art relying on manually to come detect chip and cause the problem that detection efficiency is not high.
For achieving the above object and other relevant objects, the invention provides following technical scheme:
A kind of chip vision detection system, comprises guide rail, is suitable for providing mobile route; Stopper, is arranged on the mobile route that guide rail provides according to predeterminated position; Chi frame, comprises the installation position for chip placement that two row are parallel to each other, is suitable for the chip be placed on installation position to move that the chip be placed on installation position is transported to predeterminated position along the mobile route that guide rail provides; Image acquiring device, comprise transducer and camera, described sensor setting is in the below of described guide rail, and described camera and described transducer are arranged at above track just over the ground, be suitable for taking pictures to the chip be placed on installation position when chi frame moves to described predeterminated position along described guide rail, and acquired chip image is exported; Whether image detecting system, connects image acquiring device, is suitable for identifying in described chip image input detection model, qualified to determine the chip corresponding to chip image.
Preferably, described chi frame comprises two row and to be in a parallel set installation position, often arrange on installation position and there is the equal installation position of 5-7 spacing.
Preferably, described image detecting system is computer.
As mentioned above, the present invention at least has following beneficial effect: the present invention utilizes said chip vision detection system can carry out machine to chip and automatically detects, overcome in existing detection technique individual, adopt and artificially judge the deficiency that whether qualified chip is, and compare the mode of manual detection, more efficiently.
Accompanying drawing explanation
Fig. 1 is a kind of schematic diagram of chip vision detection system.
Drawing reference numeral explanation
1 guide rail
2 chi frames
21 installation positions
22 through holes
3 transducers
4 cameras
5 image detecting systems
6 stoppers
Embodiment
By particular specific embodiment, embodiments of the present invention are described below, person skilled in the art scholar the content disclosed by this specification can understand other advantages of the present invention and effect easily.
Notice, structure, ratio, size etc. that this specification institute accompanying drawings illustrates, content all only in order to coordinate specification to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this specification as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
Refer to Fig. 1, be a kind of schematic diagram of chip vision detection system, as shown in the figure, this chip vision detection system comprises: guide rail 1, is suitable for providing mobile route; Stopper 6, is arranged on the mobile route that guide rail provides according to predeterminated position; Chi frame 2, comprises the installation position 21 for chip placement that two row are parallel to each other, is suitable for the chip be placed on installation position 21 to move that the chip be placed on installation position 21 is transported to predeterminated position along the mobile route that guide rail 1 provides; Image acquiring device, comprise transducer 3 and camera 4, described transducer 3 is arranged at the below of described guide rail 1, and described camera 4 is arranged at above track just over the ground with described transducer 3, be suitable for the transducer 3 when chi frame 2 moves along described guide rail 1 to trigger described camera 4 by the through hole 22 on described chi frame 2 and take pictures to the chip be placed on installation position 21, and obtained chip image is exported; Whether image detecting system 5, connects image acquiring device, is suitable for identifying in described chip image input detection model, qualified to determine the chip corresponding to chip image.
In concrete enforcement, image detecting system is generally computer, can process by installation and measuring software in a computer, thus realize testing goal to chip image.Wherein, the principle of image detecting system is, the picture obtained is processed, existing picture Processing Technique can be passed through, judge that whether some condition in picture is identical with the condition preset, or in pre-conditioned scope, if it is judge that it is qualified, if not then judge that it is defective.Particularly, when defective, alarm can be made in image detecting system.
In concrete enforcement, often arrange on installation position and there is the equal installation position of 5-7 spacing.
In concrete enforcement, transducer is photoelectric sensor, comprises photosignal reflector and photoelectric signal receiver, wherein, photosignal reflector can be arranged on below guide rail, and photoelectric signal receiver is arranged on camera, is suitable for the photosignal receiving the transmission of photosignal reflector.
The present invention utilizes said chip vision detection system can carry out machine to chip and automatically detects, and overcomes in existing detection technique individual, adopts and artificially judge the deficiency that whether qualified chip is, and compare the mode of manual detection, more efficiently.So the present invention effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not is suitable for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.

Claims (3)

1. a chip vision detection system, is characterized in that, comprising:
Guide rail, is suitable for providing mobile route;
Stopper, is arranged on the mobile route that guide rail provides according to predeterminated position;
Chi frame, comprises the installation position for chip placement that two row are parallel to each other, is suitable for the chip be placed on installation position to move that the chip be placed on installation position is transported to predeterminated position along the mobile route that guide rail provides;
Image acquiring device, comprise transducer and camera, described sensor setting is in the below of described guide rail, and described camera and described transducer are arranged at above track just over the ground, be suitable for taking pictures to the chip be placed on installation position when chi frame moves to described predeterminated position along described guide rail, and acquired chip image is exported;
Whether image detecting system, connects image acquiring device, is suitable for identifying in described chip image input detection model, qualified to determine the chip corresponding to chip image.
2. chip vision detection system according to claim 1, is characterized in that: described chi frame comprises two row and to be in a parallel set installation position, often arranges on installation position and has the equal installation position of 5-7 spacing.
3. chip vision detection system according to claim 1, is characterized in that: described image detecting system is computer.
CN201510924477.3A 2015-12-14 2015-12-14 Chip vision detection system Pending CN105513982A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510924477.3A CN105513982A (en) 2015-12-14 2015-12-14 Chip vision detection system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510924477.3A CN105513982A (en) 2015-12-14 2015-12-14 Chip vision detection system

Publications (1)

Publication Number Publication Date
CN105513982A true CN105513982A (en) 2016-04-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510924477.3A Pending CN105513982A (en) 2015-12-14 2015-12-14 Chip vision detection system

Country Status (1)

Country Link
CN (1) CN105513982A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109712918A (en) * 2018-12-29 2019-05-03 铜陵富仕三佳机器有限公司 Chip detects collecting device and its application method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102109342A (en) * 2009-12-29 2011-06-29 比亚迪股份有限公司 Automatic detecting method and system of patch product
CN103021899A (en) * 2012-12-21 2013-04-03 日月光半导体(昆山)有限公司 Semiconductor product detecting machine and detecting method thereof
CN204834569U (en) * 2015-04-23 2015-12-02 昆山群悦精密模具有限公司 IC encapsulation chip assay device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102109342A (en) * 2009-12-29 2011-06-29 比亚迪股份有限公司 Automatic detecting method and system of patch product
CN103021899A (en) * 2012-12-21 2013-04-03 日月光半导体(昆山)有限公司 Semiconductor product detecting machine and detecting method thereof
CN204834569U (en) * 2015-04-23 2015-12-02 昆山群悦精密模具有限公司 IC encapsulation chip assay device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109712918A (en) * 2018-12-29 2019-05-03 铜陵富仕三佳机器有限公司 Chip detects collecting device and its application method
CN109712918B (en) * 2018-12-29 2021-03-16 铜陵富仕三佳机器有限公司 Chip detection and collection equipment and use method thereof

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Application publication date: 20160420

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