CN210349844U - Anti-overflow stable surface mount diode packaging structure - Google Patents
Anti-overflow stable surface mount diode packaging structure Download PDFInfo
- Publication number
- CN210349844U CN210349844U CN201921615054.3U CN201921615054U CN210349844U CN 210349844 U CN210349844 U CN 210349844U CN 201921615054 U CN201921615054 U CN 201921615054U CN 210349844 U CN210349844 U CN 210349844U
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- Prior art keywords
- conductive pin
- overflow
- diode
- welding
- flat plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model provides an anti-overflow stable surface-mounted diode packaging structure, which comprises an insulating packaging body, wherein a first conductive pin and a second conductive pin are arranged in the insulating packaging body, and a diode chip is arranged between the first conductive pin and the second conductive pin; the electrically conductive pin of second is dull and stereotyped including the welding, and the dull and stereotyped bottom integrated into one piece of welding has the location lug, is connected with the soldering tin layer between the top of diode chip and the welding flat board, and the location lug is located the soldering tin in situ, and the dull and stereotyped one end integrated into one piece of keeping away from first electrically conductive pin of welding has the anti-overflow riser, and the top integrated into one piece of anti-overflow riser has and lifts the flat board, and it has the riser of bending to lift the flat board one end integrated into one piece of keeping away from the. The utility model discloses can effectively reduce the inside bad structures such as gas pocket that form of solder paste, in addition, can prevent effectively that the solder paste from spilling over along the electrically conductive pin of second, can effectively ensure SMD diode's performance.
Description
Technical Field
The utility model relates to a SMD diode specifically discloses a SMD diode packaging structure of firm type of anti-overflow.
Background
A diode is a device with two electrodes that allows current to flow in only a single direction, and many uses utilize its rectifying function. The diode mainly comprises a plug-in type and a patch type.
The SMD diode mainly comprises an insulating packaging body, a diode chip and two conductive pins, wherein one end of each of the two conductive pins protrudes out of the insulating packaging body, the diode chip is welded between the two conductive pins, the welding operation is generally carried out by coating solder paste between the diode chip and the conductive pins, and the solder paste is easy to overflow from the edge of the diode chip along the conductive pins above during the welding process to influence the performance of the SMD diode.
SUMMERY OF THE UTILITY MODEL
Based on this, it is necessary to provide a chip type diode packaging structure that prevents overflow and stabilizes to solve the problem in the prior art, and can effectively ensure the reliability of soldering tin structure, and the anti-overflow tin structure can ensure the performance of chip type diode.
In order to solve the prior art problem, the utility model discloses an anti-overflow stable surface mounted diode packaging structure, which comprises an insulating packaging body, wherein a first conductive pin and a second conductive pin which are not in contact with each other are arranged in the insulating packaging body, a diode chip is arranged between the first conductive pin and the second conductive pin, and the diode chip is welded on the top of the first conductive pin;
the electrically conductive pin of second is dull and stereotyped including the welding, and the dull and stereotyped bottom integrated into one piece of welding has the location lug, is connected with the soldering tin layer between the top of diode chip and the welding flat board, and the location lug is located the soldering tin in situ, and the dull and stereotyped one end integrated into one piece of keeping away from first electrically conductive pin of welding has the anti-overflow riser, and the top integrated into one piece of anti-overflow riser has and lifts the flat board, and it has the riser of bending to lift the flat board one end integrated into one piece of keeping away from the.
Further, the insulating package is an epoxy package.
Furthermore, the positioning lug is in a conical lug structure.
Furthermore, the height of the second conductive pin is H, the thickness of the positioning bump is d, and d is more than or equal to 0.1H and less than or equal to 0.15H.
Furthermore, the height of the anti-overflow vertical plate is H, and H is more than or equal to 0.12H and less than or equal to 0.18H.
Furthermore, a conductive silver glue layer is connected between the diode chip and the first conductive pin.
The utility model has the advantages that: the utility model discloses a SMD diode packaging structure of anti-overflow firm type is provided with special lug structure, has good receipts tin ability, can effectively reduce bad structures such as the inside formation gas pocket of solder paste to can effectively ensure soldering tin structure's reliability, in addition, the welding is dull and stereotyped and lift the flat board and lie in different horizontal planes, can effectively prevent that the solder paste from spilling over along the electrically conductive pin of second, can effectively ensure SMD diode's performance.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic diagram of the structure and size of the second conductive pin of the present invention.
The reference signs are: the semiconductor package comprises an insulating package body 10, a first conductive pin 20, a second conductive pin 30, a welding flat plate 31, a positioning bump 311, an anti-overflow vertical plate 32, a lifting flat plate 33, a bent vertical plate 34, a pin flat plate 35, a diode chip 40, a soldering tin layer 41 and a conductive silver adhesive layer 42.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
Refer to fig. 1 and 2.
The embodiment of the utility model discloses anti-overflow firm SMD diode packaging structure, including insulating packaging body 10, be equipped with first conductive pin 20 and second conductive pin 30 that do not contact each other in insulating packaging body 10, the one end protrusion of first conductive pin 20 is outside insulating packaging body 10, is equipped with diode chip 40 between first conductive pin 20 and the second conductive pin 30, and diode chip 40 welds in the top of first conductive pin 20;
the second conductive pin 30 comprises a flat soldering plate 31, a positioning bump 311 protruding downwards is integrally formed at the bottom of the flat soldering plate 31, a solder layer 41 is connected between the top of the diode chip 40 and the flat soldering plate 31, the horizontal projection of the flat soldering plate 31 is positioned in the diode chip 40, the positioning bump 311 is positioned in the solder layer 41, the positioning bump 311 protruding downwards can assist in gradually discharging the space inside the solder layer 41 to reduce the defects that the solder layer 41 has internal air holes and the like due to excessive air inside the solder layer 41 in the soldering process, the positioning bump 311 can provide an adhesion base for the solder layer 41, has good tin collecting capacity, can avoid irregular deformation of the solder layer 41 due to extrusion between two planes, can effectively ensure the reliability of the connection structure between the diode chip 40 and the flat soldering plate 31, and an anti-overflow vertical plate 32 is integrally formed at the end of the flat soldering plate 31 far away from the first conductive pin 20, the top of the anti-overflow vertical plate 32 is integrally formed with an upper lifting plate 33, the upper lifting plate 33 and the welding plate 31 are respectively connected with the upper end and the lower end of the anti-overflow vertical plate 32, the bottom surface of the welding plate 31 is directly contacted with the soldering tin layer 41, the position of the upper flat plate 33 is raised by the anti-overflow vertical plate 32, so that the upper flat plate 33 is prevented from contacting the solder layer 41, the horizontal projection of the solder flat plate is positioned in the diode chip 40, the influence of the solder layer 41 overflowing to the edge of the soldering flat plate 31 on the overall conductive performance of the second conductive pin 30 can be effectively avoided, meanwhile, the situation that the solder layer 41 overflows to the periphery of the diode chip 40 to affect the working performance of the diode chip can be avoided, a bent vertical plate 34 is integrally formed at one end, away from the anti-overflow vertical plate 32, of the lifting flat plate 33, a pin flat plate 35 is integrally formed at the bottom of the bent vertical plate 34, one end of the pin flat plate 35 protrudes out of the insulating packaging body 10, and the lifting flat plate 33 and the pin flat plate 35 are respectively located at the upper end and the lower end of the bent vertical plate 34.
The utility model discloses be provided with special lug structure, have good receipts tin ability, can effectively reduce the inside bad structures such as gas pocket that form of solder paste to can effectively ensure the reliability of soldering tin structure, in addition, the welding is dull and stereotyped 31 and lift dull and stereotyped 33 and be located the different horizontal planes, can prevent effectively that the solder paste from spilling over along the electrically conductive pin 30 of second, can effectively ensure the performance of SMD diode.
In this embodiment, the insulating package 10 is an epoxy package, and the epoxy has good mechanical and chemical resistances and can effectively protect the internal structure of the chip diode.
In this embodiment, the positioning bump 311 is a tapered bump structure with a downward tip, preferably, the positioning bump 311 is a pyramid or a cone, and the accuracy of the fit with the solder layer 41 can be effectively improved by the tapered structure with the downward tip, and meanwhile, a large amount of air holes can be further prevented from being formed inside the solder layer 41.
In this embodiment, the total height of the second conductive lead 30 is H, the thickness of the positioning bump 311 is d, d is greater than or equal to 0.1H and less than or equal to 0.15H, and the positioning bump 311 has a sufficient thickness to effectively ensure the solder receiving effect on the solder layer 41, preferably, H is 0.92mm, d is 0.1mm, and the thickness of the insulating package 10 is 1.1 mm.
Based on the above embodiment, the height of the anti-overflow vertical plate 32 is H, H is not less than 0.12H and not more than 0.18H, the anti-overflow vertical plate 32 is arranged to have a sufficient height, so that the occurrence of tin overflow can be effectively avoided, and preferably, H is 0.14 mm.
In this embodiment, a conductive silver glue layer 42 is further connected between the diode chip 40 and the first conductive pin 20, so that the firmness of the connection structure between the diode chip 40 and the first conductive pin 20 can be effectively improved through the conductive silver glue, and the conductivity of the diode chip 40 and the first conductive pin 20 can be effectively improved at the same time.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. An anti-overflow stable patch type diode packaging structure comprises an insulating packaging body (10), wherein a first conductive pin (20) and a second conductive pin (30) which are not in contact with each other are arranged in the insulating packaging body (10), and a diode chip (40) is arranged between the first conductive pin (20) and the second conductive pin (30), and is characterized in that the diode chip (40) is welded on the top of the first conductive pin (20);
the second conductive pin (30) comprises a welding flat plate (31), a positioning bump (311) is integrally formed at the bottom of the welding flat plate (31), a soldering tin layer (41) is connected between the top of the diode chip (40) and the welding flat plate (31), the positioning bump (311) is located in the soldering tin layer (41), an anti-overflow vertical plate (32) is integrally formed at one end of the first conductive pin (20) far away from the welding flat plate (31), a lifting flat plate (33) is integrally formed at the top of the anti-overflow vertical plate (32), the lifting flat plate (33) is far away from the one end of the anti-overflow vertical plate (32) and is provided with a bending vertical plate (34), and a pin flat plate (35) is integrally formed at the bottom of the bending vertical plate (34).
2. The anti-overflow stable patch diode package structure of claim 1, wherein the insulating package (10) is an epoxy package.
3. The anti-overflow stable patch diode package structure of claim 1, wherein the positioning bumps (311) are cone-shaped bumps.
4. The anti-overflow stable patch diode package structure of claim 1, wherein the height of the second conductive pin (30) is H, the thickness of the positioning bump (311) is d, and d is greater than or equal to 0.1H and less than or equal to 0.15H.
5. The anti-overflow stable patch diode package structure of claim 4, wherein the height of the anti-overflow vertical plate (32) is H, and H is greater than or equal to 0.12H and less than or equal to 0.18H.
6. The anti-spill stable chip diode package structure according to claim 1, wherein a conductive silver glue layer (42) is further connected between the diode chip (40) and the first conductive pin (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921615054.3U CN210349844U (en) | 2019-09-25 | 2019-09-25 | Anti-overflow stable surface mount diode packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921615054.3U CN210349844U (en) | 2019-09-25 | 2019-09-25 | Anti-overflow stable surface mount diode packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN210349844U true CN210349844U (en) | 2020-04-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921615054.3U Active CN210349844U (en) | 2019-09-25 | 2019-09-25 | Anti-overflow stable surface mount diode packaging structure |
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| CN (1) | CN210349844U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114743944A (en) * | 2022-06-08 | 2022-07-12 | 江苏泽润新材料有限公司 | Module diode and manufacturing method thereof |
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2019
- 2019-09-25 CN CN201921615054.3U patent/CN210349844U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114743944A (en) * | 2022-06-08 | 2022-07-12 | 江苏泽润新材料有限公司 | Module diode and manufacturing method thereof |
| CN114743944B (en) * | 2022-06-08 | 2022-09-02 | 江苏泽润新材料有限公司 | Module diode and manufacturing method thereof |
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