CN210295753U - 一种基于半椭球胶体模压成型的led模组 - Google Patents
一种基于半椭球胶体模压成型的led模组 Download PDFInfo
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- CN210295753U CN210295753U CN201921558790.XU CN201921558790U CN210295753U CN 210295753 U CN210295753 U CN 210295753U CN 201921558790 U CN201921558790 U CN 201921558790U CN 210295753 U CN210295753 U CN 210295753U
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Address after: 518000 zone a, 8 and 9, floor 1, building e, Guancheng Low Carbon Industrial Park, No. 20, Hedi Road, Gongming street, Guangming New Area, Shenzhen, Guangdong Patentee after: Guangdong Xusheng Semiconductor Co.,Ltd. Address before: 518000 zone a, 8 and 9, floor 1, building e, Guancheng Low Carbon Industrial Park, No. 20, Hedi Road, Gongming street, Guangming New Area, Shenzhen, Guangdong Patentee before: SHENZHEN XUSHENG SEMICONDUCTOR CO.,LTD. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: LED module based on semi ellipsoid colloid molding Effective date of registration: 20220323 Granted publication date: 20200410 Pledgee: Bank of China Limited by Share Ltd. Heyuan branch Pledgor: Guangdong Xusheng Semiconductor Co.,Ltd. Registration number: Y2022980003071 |