CN210295013U

CN210295013U - Efficient heat dissipation device for computer CPU

Info

Publication number: CN210295013U
Application number: CN201921279151.XU
Authority: CN
Inventors: 娄鑫坡; 孔玉静; 段娜; 苏靖枫; 赵军民
Original assignee: Henan University of Urban Construction
Current assignee: Henan University of Urban Construction
Priority date: 2019-08-08
Filing date: 2019-08-08
Publication date: 2020-04-10
Anticipated expiration: 2029-08-08

Abstract

A high-efficiency heat dissipation device for a computer CPU comprises a mainframe box, wherein the mainframe box is divided into an upper box cavity and a lower box cavity, the inner wall of the top of the lower box cavity is provided with a mainboard, the CPU is fixedly arranged on the mainboard, a vertical copper pipe is fixedly arranged in the upper box cavity, the CPU is arranged in the first copper pipe, a fan is fixedly arranged on the inner wall of the upper part of the copper pipe, the fan is connected with a computer power supply, a plurality of heat dissipation fins are fixedly arranged on the inner wall of the middle part of the copper pipe, the heat dissipation fins are positioned on the lower side of the fan and positioned on the upper side of the CPU, two transverse air pipes are respectively arranged on the lower parts of the left side and the right side of the copper pipe, the CPU of the utility model can dissipate heat when in operation, the fan is started simultaneously, the heat dissipation fins absorb partial heat, the copper, the utility model discloses the radiating effect is obvious, can effectually prevent that the computer card from pausing.

Description

Efficient heat dissipation device for computer CPU

Technical Field

The utility model belongs to computer CPU heat abstractor field, specifically speaking are used for high-efficient heat abstractor of computer CPU.

Background

The CPU is the most important part of the computer, and when the computer is in operation, the CPU needs to perform a large amount of operations, so that a large amount of heat can be dissipated, and if the heat generated by the CPU cannot be dissipated in time, the computer may be in failure.

SUMMERY OF THE UTILITY MODEL

The utility model provides a be used for high-efficient heat abstractor of computer CPU for solve the defect among the prior art.

The utility model discloses a following technical scheme realizes:

the utility model provides a be used for high-efficient heat abstractor of computer CPU, including the mainframe box, the mainframe box divide into box epicoele and box cavity of resorption, box cavity of resorption top inner wall is equipped with the mainboard, fixed mounting CPU on the mainboard, the vertical copper pipe of intracavity fixed mounting on the box, CPU establishes inside first copper pipe, copper pipe upper portion inner wall fixed mounting fan, the fan switch-on computer power, several heat radiation fins of copper pipe middle part inner wall fixed mounting, heat radiation fins is located the downside of fan, be located CPU's upside, copper pipe left and right sides lower part all is equipped with two horizontal tuber pipes.

According to the efficient heat dissipation device for the CPU of the computer, the water tank is fixedly installed on the inner wall of the top of the right side of the upper cavity of the box body, the water pump is fixedly installed on the inner wall of the left side of the water tank, the square copper pipe is arranged on the left side of the water pump, one end of the square copper pipe is connected to the lower portion of the left side of the water pump, and the other end of the square copper pipe is closely connected with the.

The efficient heat radiating device for the CPU of the computer is characterized in that a round copper pipe is arranged on the left side of the water pump, one end of the round copper pipe is connected to the upper portion of the left side of the water pump, and the other end of the round copper pipe is connected with the water return tank after rotating above the fan in the copper pipe for a plurality of circles.

According to the efficient heat dissipation device for the computer CPU, the rubber pad is arranged between the top of the copper pipe and the inner wall of the upper cavity of the box body.

The efficient heat radiator for the CPU of the computer is characterized in that the top surface of the CPU is provided with the transverse heat conducting fins, the bottom surfaces of the heat conducting fins are bonded on the top surface of the CPU through the heat radiating silica gel, the top surfaces of the heat conducting fins are in contact with the bottom surfaces of the heat radiating fins, and two sides of each heat conducting fin are in contact with the inner wall of the copper pipe.

The utility model has the advantages that: the utility model discloses a CPU can give off the heat when beginning to operate, and the fan starts simultaneously, and heat radiation fins absorbs partial heat, because the good heat conductivity of copper pipe, the copper pipe can absorb most with the heat that CPU disperses everywhere, and at this moment under the forced convection effect of fan, with the tuber pipe discharge mainframe box of heat through copper pipe lower part, the utility model discloses the radiating effect is obvious, can effectually prevent that the computer card from pausing.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.

Fig. 1 is a schematic structural diagram of the present invention; fig. 2 is a top view of the present invention; fig. 3 is a view from the direction of B of fig. 1, and fig. 4 is a view from the direction of a of fig. 1.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The utility model provides a be used for high-efficient heat abstractor of computer CPU, as shown in the figure, including mainframe box 1, mainframe box 1 divide into box epicoele 2 and box cavity of resorption 3, 3 top inner walls in box cavity of resorption are equipped with mainboard 4, fixed mounting CPU5 on mainboard 4, the vertical copper pipe of box epicoele 2 internal fixed mounting 6, CPU5 establishes inside

first copper pipe

6, 6 upper portion inner wall fixed mounting fans 7 of copper pipe, fan 7 switches on computer power, the several heat radiation fins 8 of 6 middle part inner walls fixed mounting of copper pipe, heat radiation fins 8 are located the downside of fan 7, be located CPU 5's upside, 6 left and right sides lower parts of copper pipe all are equipped with two horizontal tuber pipes 9. The utility model discloses a CPU5 can give off the heat when beginning to operate, and fan 7 starts simultaneously, and heat radiation fins 8 absorbs partial heat, because the good heat conductivity of copper pipe 6, copper pipe 6 can absorb the heat most that CPU5 disperses everywhere, and at this moment under fan 7's forced convection effect, with the heat through the tuber pipe 9 discharge mainframe box 1 of copper 6 lower part, the utility model discloses the radiating effect is obvious, can effectually prevent that the computer card from pausing.

Particularly, as shown in the figure, this embodiment 2 right side top inner wall fixed mounting water tanks 10 on the box epicoele, water tank 10 left side inner wall fixed mounting water pump 11, water pump 11 left side are equipped with square copper pipe 12, square copper pipe 12 termination in water pump 11 left side lower part, square copper pipe 12 other end connect water return tank 10 after closely surrounding 6 outer lane of copper pipe a week. Use square copper pipe 12, not only can provide good heat conductivility, and the rectangle copper pipe is compared in cylindric copper pipe and can increases area of contact when encircleing copper pipe 6, it is more superior to make the heat conductivility, water pump 11 pumps away the water in water tank 10 through square copper pipe 12, because square copper pipe 12 closely encircles in copper pipe 6 outer lane, water in the square copper pipe 12 can disperse CPU5 and absorb the heat on copper pipe 6 then bring into water tank 10 via square copper pipe 12, continue to pump away from the square copper pipe 12 pump in upper portion after the cooling of water tank 10, form a hydrologic cycle that has the cooling action, thereby accelerate CPU 5's heat dissipation.

Specifically, as shown in the figure, the left side of the water pump 11 described in this embodiment is provided with a circular copper pipe 15, one end of the circular copper pipe 15 is connected to the upper portion of the left side of the water pump 11, and the other end of the circular copper pipe 15 is connected to the water tank 10 after rotating above the fan 7 in the copper pipe 6 for several turns. CPU5 gives off the heat at the during operation, copper pipe 6 constantly heaies up, under the effect of heat transfer, copper pipe 6 gives square copper pipe 12 with heat transfer, square copper pipe 12 gives the water in the pipe with heat transfer, under the effect of water pump 11, it constantly gets into water tank 10 to have adsorbed thermal water, water in water tank 10 can keep rising temperature, at this moment, because circular copper pipe 15 becomes spiral netted above fan 7, the warm water flows in copper pipe 15 simultaneously, outside cold air is when inhaling copper pipe 6 via fan 7, can cool off the warm water in circular copper pipe 15, the rivers income water tank after the cooling, water pump 11 can send out the water pump in water tank 10 and continue the cooling.

Further, as shown in the figure, a rubber pad 13 is disposed between the top of the copper tube 6 and the inner wall of the upper chamber 2 of the box body. When the fan 7 is operated, a vibration phenomenon occurs, and the main body case 1 is constantly buzzed, and the rubber pad 13 absorbs most of the vibration, thereby reducing noise.

Furthermore, as shown in the figure, the top surface of the CPU5 of the present embodiment is provided with a transverse heat conducting strip 14, the bottom surface of the heat conducting strip 14 is bonded to the top surface of the CPU5 by using heat dissipation silicone, the top surface of the heat conducting strip 14 contacts with the bottom surface of the heat dissipation fins 8, and both sides of the heat conducting strip contact with the inner wall of the copper tube 6. The heat conducting sheet 14 can further conduct heat from the CPU5 quickly by contacting the copper tube 6 and the heat dissipating fin 8.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. An efficient heat dissipation device for a computer CPU is characterized in that: including mainframe box (1), mainframe box (1) divide into box epicoele (2) and box cavity (3) down, box cavity (3) top inner wall is equipped with mainboard (4), fixed mounting CPU (5) are gone up in mainboard (4), vertical copper pipe of box epicoele (2) internal fixation installation (6), CPU (5) are established inside first copper pipe (6), copper pipe (6) upper portion inner wall fixed mounting fan (7), fan (7) switch-on computer power supply, several heat radiation fins (8) of copper pipe (6) middle part inner wall fixed mounting, heat radiation fins (8) are located the downside of fan (7), be located the upside of CPU (5), copper pipe (6) left and right sides lower part all is equipped with two horizontal tuber pipes (9).

2. The efficient heat dissipation device for the computer CPU as recited in claim 1, wherein: the water tank is fixedly installed on the inner wall of the right side top of the upper cavity (2) of the box body, the water pump (11) is fixedly installed on the inner wall of the left side of the water tank (10), a square copper pipe (12) is arranged on the left side of the water pump (11), one end of the square copper pipe (12) is connected to the lower portion of the left side of the water pump (11), and the other end of the square copper pipe (12) is closely connected with the water return tank (10) after surrounding the outer.

3. The efficient heat dissipation device for the computer CPU according to claim 2, wherein: the water pump is characterized in that a round copper pipe (15) is arranged on the left side of the water pump (11), one end of the round copper pipe (15) is connected to the upper portion of the left side of the water pump (11), and the other end of the round copper pipe (15) is connected with the water return tank (10) after rotating a plurality of circles above the fan (7) in the copper pipe (6).

4. The efficient heat dissipation device for the computer CPU as recited in claim 1, wherein: and a rubber pad (13) is arranged between the top of the copper pipe (6) and the inner wall of the upper chamber (2) of the box body.

5. The efficient heat dissipation device for the computer CPU as recited in claim 1, wherein: the heat dissipation structure is characterized in that a transverse heat conducting fin (14) is arranged on the top surface of the CPU (5), the bottom surface of the heat conducting fin (14) is bonded on the top surface of the CPU (5) through heat dissipation silica gel, the top surface of the heat conducting fin (14) is in contact with the bottom surface of the heat dissipation fin (8), and the two sides of the heat conducting fin are in contact with the inner wall of the copper pipe (6).