CN213659400U

CN213659400U - Computer chip heat abstractor

Info

Publication number: CN213659400U
Application number: CN202023285794.0U
Authority: CN
Inventors: 吕自强
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-12-30
Filing date: 2020-12-30
Publication date: 2021-07-09
Anticipated expiration: 2030-12-30

Abstract

The utility model discloses a computer chip heat abstractor, including the chip main part, radiator fan and heat dissipation case, the top of heat dissipation case is equipped with radiator fan, the bottom of heat dissipation case is equipped with the heat-sink shell, the left side of heat dissipation bottom of the case portion is equipped with the condenser conveyer pipe, the right side of heat dissipation bottom of the case portion is equipped with the condenser recovery tube, the left side at the condensing box is connected on the top of condenser conveyer pipe, the right side of condensing box is connected on the top of condenser recovery tube, connect refrigeration controller on the condensing box, the surface of condensing box is equipped with semiconductor fin, the last surface mounting of heat dissipation bottom of the case portion has the chip main part, the right side of chip. Computer chip heat abstractor dismantles the convenience, and the maintenance of being convenient for dispels the heat convenient and fast more, and the cooling water can further absorb the heat that the chip main part during operation produced, prevents that the intraformational cooling water of heat absorption from spilling over, makes the device damage, and the radiating efficiency is high, has greatly strengthened computer chip's heat dissipation and protection, the life of extension device.

Description

Computer chip heat abstractor

Technical Field

The utility model relates to a heat abstractor field specifically is a computer chip heat abstractor.

Background

Modern computer chips integrate up to billions of transistors in hundreds of square millimeters of area, with dominant frequencies up to over 5GHz, and thermal design power consumption up to hundreds of watts. If the heat generated by the computer chip during operation cannot be quickly dissipated, the computer chip can be overheated to work down or burn out. Active heat dissipation techniques used for heat dissipation of computer chips in recent years include air-cooled heat dissipation and water-cooled heat dissipation. The water cooling adopts a water pump to make liquid in the pipeline circularly flow, and the cooling is carried out by blowing through a fan. Although water-cooling heat dissipation has the capability of bearing high heat load naturally, after long-term use, a water-cooling pipeline is easy to leak liquid to cause a short circuit of a circuit, so that the reliability is low. Air-cooled heat dissipation does not have the risk. The air-cooled heat dissipation device generally absorbs heat of a computer chip by a heat dissipation fin, and air flow generated by a fan flows through the heat dissipation fin to carry away the heat so as to cool the computer chip. To withstand high thermal loads, air-cooled heat dissipation often employs large tower fins, including up to hundreds of metal fins. Such large volume air-cooled heat sinks are often difficult to mount and block memory slots or motherboard mounting holes in microcomputer applications. The air flow produced by the axial fan of the air cooling heat dissipation device penetrates through the large tower type heat dissipation fins, and the heated hot air can fill the computer case, so that the temperature in the computer case rises, and the heat dissipation effect is influenced. The air-cooled heat dissipation device can quickly discharge hot air by forming an air duct by matching with the front fan, the rear fan, the upper fan and the lower fan of the computer case. Many computer chassis do not form a wind tunnel.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a computer chip heat abstractor has strengthened computer chip heat-sinking capability, and the radiating efficiency is high, has greatly strengthened computer chip's heat dissipation and protection, has improved computer chip's computation performance's advantage indirectly, can solve the problem among the prior art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a computer chip heat abstractor, includes chip main part, radiator fan and heat dissipation case, the top of heat dissipation case is equipped with radiator fan, the bottom of heat dissipation case is equipped with the heat-sink shell, the left side of heat dissipation bottom of the case portion is equipped with the condenser conveyer pipe, the right side of heat dissipation bottom of the case portion is equipped with the condenser recovery tube, the left side at the condensing box is connected on the top of condenser conveyer pipe, the right side of condensing box is connected on the top of condenser recovery tube, connect refrigeration controller on the condensing box, the surface of condensing box is equipped with the semiconductor fin, the last surface mounting of heat dissipation bottom of the case portion has the chip main part, the.

Preferably, the heat absorbing layer is filled with cooling water, the heat absorbing layer is provided with a water inlet and a water outlet, and the water inlet and the water outlet are both provided with sealing covers.

Preferably, the heat dissipation plate is attached to the outer portion of the chip main body, and the heat conduction plate is arranged inside the side wall of the heat dissipation box.

Preferably, the bracket for the heat dissipation fan is fixed to the top of the heat dissipation box through a bolt, and the heat dissipation fan is communicated with the inside of the heat dissipation box.

Preferably, a condensing pump is arranged on the condenser conveying pipe, and the control end of the condensing pump is connected with the signal output end of the refrigeration controller.

Preferably, the signal output end of the temperature sensor is electrically connected with the refrigeration controller, and the cooling fan and the refrigeration controller are both electrically connected with the outside.

Preferably, the bottoms of the condenser conveying pipe and the condenser recycling pipe are communicated with the heat absorbing layer.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. this computer chip heat abstractor through the bolt fastening in the top of heat dissipation case, makes between the two connection more firm, and it is convenient to dismantle, the maintenance of being convenient for, and radiator fan communicates with each other with the heat dissipation incasement portion, and the heat dissipation is convenient and fast more.

2. This computer chip heat abstractor, the heat absorption in situ that the bottom of heat dissipation case set up is filled with cooling water, and the cooling water can be further the heat that the absorption chip main part during operation produced, and the cooling water is conveniently poured into to the water inlet that sets up on the heat absorption layer, and the intraformational cooling water of heat absorption is conveniently changed to the delivery port, improves heat abstractor's life, all is equipped with sealed lid on water inlet and the delivery port, prevents that the intraformational cooling water of heat absorption from spilling over, makes the device damage, causes economic loss.

3. This computer chip heat abstractor carries to the heat-sink shell through passing through the condenser conveyer pipe with the air conditioning in the condensing box, siphons away the absorptive steam of cooling water in the heat-sink shell, and in the condensing box was withdrawed to rethread condensate gas recovery tube, the heat-sink shell temperature reduceed under the circulation effect of air conditioning, and the effectual chip main part cooling that is, through cyclic utilization, the radiating efficiency is high, has greatly strengthened computer chip's heat dissipation and protection, extension fixture's life.

Drawings

Fig. 1 is a front view of the present invention;

fig. 2 is a top view of the present invention;

FIG. 3 is an internal structural view of the present invention;

FIG. 4 is a partial view of the structure of the present invention;

fig. 5 is an enlarged view of a part of the structure of the present invention.

In the figure: 1. a chip body; 2. a heat radiation fan; 3. a heat dissipation box; 4. a heat absorbing layer; 5. a condenser conveying pipe; 6. a condenser recovery tube; 7. a condenser tank; 8. a refrigeration controller; 9. a semiconductor heat sink; 10. a temperature sensor; 11. a heat sink; 12. a condensate pump; 13. a water inlet; 14. a water outlet; 15. a heat conductive sheet.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, a computer chip heat sink comprises a chip main body 1, a heat dissipating fan 2 and a heat dissipating box 3, the heat dissipating fan 2 is disposed on the top of the heat dissipating box 3, the heat dissipating fan 2 is fixed on the top of the heat dissipating box 3 by a bracket through a bolt, the heat dissipating fan and the heat dissipating box are connected through a fixing bolt, the heat dissipating box 3 is more firmly connected, the heat dissipating device is convenient to disassemble, the heat dissipating device can be observed by disassembling the fan, the heat dissipating device is convenient to maintain, the heat dissipating fan 2 is communicated with the heat dissipating box 3, the heat is more convenient to dissipate, a heat absorbing layer 4 is disposed on the side wall of the heat dissipating box 3, cooling water is filled in the heat absorbing layer 4, the cooling water can further absorb heat generated by the chip main body 1 during operation, a water inlet 13 and a water outlet 14 are disposed on the heat absorbing layer 4, the water inlet 13 is convenient, the water inlet 13 and the water outlet 14 are both provided with a sealing cover which seals the water inlet 13 and the water outlet 14 to prevent cooling water in the heat absorbing layer 4 from overflowing to cause device damage and economic loss, the left side of the bottom of the heat dissipation box 3 is provided with a condenser conveying pipe 5, the bottoms of the condenser conveying pipe 5 and the condenser recycling pipe 6 are both communicated with the heat absorbing layer 4, the right side of the bottom of the heat dissipation box 3 is provided with a condenser recycling pipe 6, the top end of the condenser conveying pipe 5 is connected with the left side of the condensation box 7, the top end of the condenser recycling pipe 6 is connected with the right side of the condensation box 7, the condensation box 7 is connected with a refrigeration controller 8, the condenser conveying pipe 5 is provided with a condenser pump 12, the control end of the condenser pump 12 is connected with the signal output end of the refrigeration controller 8, the outer surface of the condensation box 7, the external part of the chip main body 1 is pasted with a radiating fin 11, the side wall of the radiating box 3 is internally provided with a heat conducting fin 15, the right side of the chip main body 1 is provided with a temperature sensor 10, the temperature sensor 10 can sense the temperature in the radiating box 3, so that the radiating device has certain intellectualization, the signal output end of the temperature sensor 10 is electrically connected with the cooling controller 8, the radiating fan 2 and the cooling controller 8 are both electrically connected with the external part, when the temperature of the chip main body 1 is not particularly high, the radiating fan 2, the radiating fin 11 pasted on the external part of the chip main body 1 and the heat conducting fin 15 in the side wall of the radiating box 3 are used for radiating, when the temperature of the chip main body 1 is overhigh, the temperature sensor 10 feeds back a signal to the cooling controller 8, the cooling controller 8 controls a condensing pump 12, and cold air in the condensing box 7 is conveyed to the heat absorption layer 4, the hot air absorbed by the cooling water in the heat absorption layer 4 is absorbed away and then is recovered into the condensation box 7 through the condenser recovery pipe 6, so that the temperature of the heat absorption layer 4 is reduced under the circulation action of cold air, and the chip main body 1 is effectively cooled.

In conclusion, the computer chip heat dissipation device has the advantages of enhancing the heat dissipation capability of a computer chip, having high heat dissipation efficiency, greatly enhancing the heat dissipation and protection of the computer chip and indirectly improving the computing performance of the computer chip, the heat dissipation fan 2 is fixed on the top of the heat dissipation box 3 by a bracket through a bolt, so that the heat dissipation fan 2 and the heat dissipation box 3 are connected more firmly, the disassembly is convenient, the maintenance is convenient, the heat dissipation fan 2 is communicated with the inside of the heat dissipation box 3, the heat dissipation is more convenient and faster, the heat absorption layer 4 arranged at the bottom of the heat dissipation box 3 is filled with cooling water, the cooling water can further absorb the heat generated when the chip main body 1 works, the water inlet 13 arranged on the heat absorption layer 4 is convenient for injecting the cooling water, the water outlet 14 is convenient for replacing the cooling water in the heat absorption layer 4, the service life of the heat dissipation device is prolonged, prevent that the cooling water in the heat-sink shell 4 from spilling over, make the device damage, cause economic loss, carry to the heat-sink shell 4 through passing through condenser conveyer pipe 5 with the air conditioning in the condensing box 7, absorb away the absorptive steam of cooling water in the heat-sink shell 4, in condensing box 7 is withdrawed to rethread condenser recovery tube 6, the temperature of heat-sink shell 4 reduces under the loop action of air conditioning, effectually be the cooling of chip main part 1, through cyclic utilization, the radiating efficiency is high, the heat dissipation and the protection of computer chip have greatly been strengthened, extension fixture's life.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a computer chip heat abstractor, includes chip main part (1), radiator fan (2) and heat dissipation case (3), its characterized in that: the top of heat dissipation case (3) is equipped with radiator fan (2), the bottom of heat dissipation case (3) is equipped with heat-sink shell (4), the left side of heat dissipation case (3) bottom is equipped with condenser conveyer pipe (5), the right side of heat dissipation case (3) bottom is equipped with condenser recovery tube (6), the left side in condensing box (7) is connected on the top of condenser conveyer pipe (5), the right side of condensing box (7) is connected on the top of condenser recovery tube (6), connect refrigeration controller (8) on condensing box (7), the surface of condensing box (7) is equipped with semiconductor fin (9), the last surface mounting of heat dissipation case (3) bottom has chip main part (1), the right side of chip main part (1) is equipped with temperature sensor (10).

2. The heat dissipation device of claim 1, wherein: the heat absorption layer (4) is filled with cooling water, the heat absorption layer (4) is provided with a water inlet (13) and a water outlet (14), and the water inlet (13) and the water outlet (14) are both provided with sealing covers.

3. The heat dissipation device of claim 1, wherein: the chip is characterized in that a radiating fin (11) is attached to the outer portion of the chip main body (1), and a heat conducting fin (15) is arranged inside the side wall of the radiating box (3).

4. The heat dissipation device of claim 1, wherein: the heat dissipation fan (2) is fixed at the top of the heat dissipation box (3) through a support through a bolt, and the heat dissipation fan (2) is communicated with the interior of the heat dissipation box (3).

5. The heat dissipation device of claim 1, wherein: and a condensing pump (12) is arranged on the condenser conveying pipe (5), and the control end of the condensing pump (12) is connected with the signal output end of the refrigeration controller (8).

6. The heat dissipation device of claim 1, wherein; the signal output end of the temperature sensor (10) is electrically connected with the refrigeration controller (8), and the cooling fan (2) and the refrigeration controller (8) are both electrically connected with the outside.

7. The heat dissipation device of claim 1, wherein: the bottoms of the condenser conveying pipe (5) and the condenser recovery pipe (6) are communicated with the heat absorption layer (4).