CN210272329U

CN210272329U - Packaging structure of electronic chip

Info

Publication number: CN210272329U
Application number: CN201921439578.1U
Authority: CN
Inventors: 童华
Original assignee: Donghe Semiconductor Equipment (nantong) Co Ltd
Current assignee: Donghe Semiconductor Equipment (nantong) Co Ltd
Priority date: 2019-09-02
Filing date: 2019-09-02
Publication date: 2020-04-07
Anticipated expiration: 2029-09-02

Abstract

The utility model discloses an electronic chip packaging structure, which comprises a first substrate, wherein the upper part of the first substrate is provided with a first groove, the inside of the first groove is fixedly connected with a first electronic chip, the rear side of the first substrate is connected with a heat dissipation aluminum plate through screws, and the heat dissipation aluminum plate is evenly provided with a strip-shaped ventilation groove, the utility model is provided with a first substrate and a second substrate, the upper part of the first substrate is provided with a first groove, the inside of the first groove is fixedly connected with a first electronic chip, the left side of the second substrate is fixedly connected with a second electronic chip, two electronic chips are separately packaged to help to reduce the heating of the substrates, the rear side of the first substrate is connected with a heat dissipation aluminum plate through screws, the heat dissipation aluminum plate is evenly provided with a strip-shaped ventilation groove, the rear side of the heat dissipation aluminum plate is connected with a second substrate through screws, and the heat dissipation aluminum plate and the strip-shaped ventilation groove can, the instability of the circuit board caused by excessive heat generation is prevented.

Description

Packaging structure of electronic chip

Technical Field

The utility model relates to an packaging structure technical field specifically is an electronic chip's packaging structure.

Background

For an integrated optoelectronic chip, the packaging is quite complex, and technologies such as mechanical protection, thermal isolation, electrical connection, optical coupling, electromagnetic shielding and the like are involved, but the traditional packaging technology only uses one substrate, and the problem of heat generation of a plurality of chips on the same substrate is serious, so that a printed circuit board is easy to age, the service life is shortened, and the packaging structure of the electronic chip cannot be applied to a scene with strict requirements on reliability.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic chip's packaging structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an electronic chip's packaging structure, includes first base plate, the upper portion of first base plate is equipped with first recess, the first electronic chip of the inside fixedly connected with of first recess, there is heat dissipation aluminum plate in the rear side of first base plate through screwed connection, the last bar air channel that has evenly seted up of heat dissipation aluminum plate, there is the second base plate in heat dissipation aluminum plate's rear side through screwed connection, the left side fixedly connected with second electronic chip of second base plate, be equipped with the breach that is used for placing second electronic chip on the heat dissipation aluminum plate, the downside of first base plate is equipped with the insulation board, be equipped with the contact pin on the insulation board.

The purpose that this set up is that this packaging structure of electronic chip has first base plate and second base plate, and the upper portion of first base plate is equipped with first recess, the first electronic chip of the inside fixedly connected with of first recess, the left side fixedly connected with second electronic chip of second base plate, separately pack two electronic chip and help reducing the base plate and generate heat, there is heat dissipation aluminum plate the rear side of first base plate through screwed connection, the bar ventilation groove has evenly been seted up on the heat dissipation aluminum plate, and there is the second base plate heat dissipation aluminum plate's rear side through screwed connection, and heat dissipation aluminum plate and bar ventilation groove can play the radiating effect.

Preferably, four first binding posts are arranged on the insulating plate and connected with the contact pins.

Preferably, four second terminals are arranged on the lower side of the first substrate, and a first insulating plastic strip is arranged between the four second terminals.

Preferably, three second insulating plastic strips are arranged between four first terminals.

Preferably, the upper side of the first binding post is connected with a wire, and one end of the wire is electrically connected with the second binding post.

Preferably, the lower side of the first substrate is fixedly connected with two clamping blocks, a rotating shaft is arranged between the two clamping blocks, and the rotating shaft is fixedly connected with the insulating plate.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses have first base plate and second base plate, the upper portion of first base plate is equipped with first recess, the first electronic chip of inside fixedly connected with of first recess, the left side fixedly connected with second electronic chip of second base plate, separately encapsulate two electronic chips and help reducing the base plate and generate heat, there is heat dissipation aluminum plate the rear side of first base plate through screwed connection, the bar ventilation groove has evenly been seted up on the heat dissipation aluminum plate, and there is the second base plate heat dissipation aluminum plate's rear side through screwed connection, and heat dissipation aluminum plate and bar ventilation groove can play the radiating action, have prevented the circuit board because the too big unstability that leads to generates heat.

Drawings

Fig. 1 is a schematic structural view of a first substrate of the present invention;

FIG. 2 is a schematic view of the back structure of the present invention;

FIG. 3 is a schematic side view of the present invention;

fig. 4 is a schematic view of a lower structure of the first substrate of the present invention.

In the figure: 1. a first substrate; 2. an insulating plate; 3. a heat dissipation aluminum plate; 4. a first electronic chip; 5. a first groove; 6. a second substrate; 7. a strip-shaped ventilation slot; 8. a second electronic chip; 9. a notch; 10. a first terminal post; 11. a second insulating plastic strip; 12. a second terminal; 13. inserting a pin; 14. a clamping block; 15. a rotating shaft; 16. a wire; 17. a first insulating plastic strip.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides an electronic chip's packaging structure, includes first base plate 1, the upper portion of first base plate 1 is equipped with first recess 5, the first electronic chip 4 of inside fixedly connected with of first recess 5, there is heat dissipation aluminum plate 3 first base plate 1's rear side through screwed connection, bar ventilation slot 7 has evenly been seted up on the heat dissipation aluminum plate 3, there is second base plate 6 heat dissipation aluminum plate 3's rear side through screwed connection, the left side fixedly connected with second electronic chip 8 of second base plate 6, be equipped with the breach 9 that is used for placing second electronic chip 8 on the heat dissipation aluminum plate 3, the downside of first base plate 1 is equipped with insulation board 2, be equipped with contact pin 13 on insulation board 2.

Specifically, four first binding posts 10 are arranged on the insulating plate 2, the first binding posts 10 are connected with a pin 13, and the pin 13 is used for being connected with other components.

Specifically, the lower side of the first substrate 1 is provided with four second terminals 12, four first insulating plastic strips 17 are arranged between the second terminals 12, and the first insulating plastic strips 17 play a role in isolation and prevent short circuit.

Specifically, three second insulating plastic strips 11 are arranged between four first terminals 10.

Specifically, a lead 16 is connected to the upper side of the first terminal 10, and one end of the lead 16 is electrically connected to the second terminal 12.

Specifically, two fixture blocks 14 are fixedly connected to the lower side of the first substrate 1, a rotating shaft 15 is arranged between the two fixture blocks 14, and the rotating shaft 15 is fixedly connected with the insulating plate 2, so that the insulating plate 2 can rotate by an angle, and the contact pin 13 can be conveniently connected with other components.

Specifically, during the use, this electronic chip's packaging structure has first base plate 1 and second base plate 6, and the upper portion of first base plate 1 is equipped with first recess 5, the first electronic chip 4 of the inside fixedly connected with of first recess 5, the left side fixedly connected with second electronic chip 8 of second base plate 6, separately encapsulate with two electronic chips and help reducing the base plate and generate heat, there is heat dissipation aluminum plate 3 rear side of first base plate 1 through screwed connection, bar ventilation groove 7 has evenly been seted up on heat dissipation aluminum plate 3, and there is second base plate 6 rear side of heat dissipation aluminum plate 3 through screwed connection, and heat dissipation aluminum plate 3 and bar ventilation groove 7 can play the radiating effect.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An electronic chip packaging structure, comprising a first substrate (1), characterized in that: the upper portion of first base plate (1) is equipped with first recess (5), the first electronic chip of inside fixedly connected with (4) of first recess (5), there is heat dissipation aluminum plate (3) rear side of first base plate (1) through screwed connection, bar ventilation slot (7) have evenly been seted up on heat dissipation aluminum plate (3), there is second base plate (6) rear side through screwed connection of heat dissipation aluminum plate (3), the left side fixedly connected with second electronic chip (8) of second base plate (6), be equipped with breach (9) that are used for placing second electronic chip (8) on heat dissipation aluminum plate (3), the downside of first base plate (1) is equipped with insulation board (2), be equipped with contact pin (13) on insulation board (2).

2. The electronic chip package structure of claim 1, wherein: four first binding posts (10) are arranged on the insulating plate (2), and the first binding posts (10) are connected with the contact pins (13).

3. The electronic chip package structure of claim 1, wherein: four second wiring terminals (12) are arranged on the lower side of the first substrate (1), and first insulating plastic strips (17) are arranged between the four second wiring terminals (12).

4. The electronic chip package structure of claim 2, wherein: and three second insulating plastic strips (11) are arranged among the four first binding posts (10).

5. The electronic chip package structure of claim 2, wherein: the upper side of the first binding post (10) is connected with a lead (16), and one end of the lead (16) is electrically connected with the second binding post (12).

6. The electronic chip package structure of claim 1, wherein: two clamping blocks (14) are fixedly connected to the lower side of the first base plate (1), a rotating shaft (15) is arranged between the two clamping blocks (14), and the rotating shaft (15) is fixedly connected with the insulating plate (2).