CN210183767U - Heat sink and electronic apparatus - Google Patents
Heat sink and electronic apparatus Download PDFInfo
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- CN210183767U CN210183767U CN201920813035.5U CN201920813035U CN210183767U CN 210183767 U CN210183767 U CN 210183767U CN 201920813035 U CN201920813035 U CN 201920813035U CN 210183767 U CN210183767 U CN 210183767U
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Abstract
The utility model provides a fin and electronic equipment, wherein, the fin includes: the first surface of the fixing layer is attached to the first surface of the heat dissipation layer, the second surface of the fixing layer is provided with a concave-convex structure, and the second surface of the fixing layer is used for being attached to the heat dissipation surface of the heating element and is opposite to the first surface of the fixing layer. The technical proposal provided by the utility model can reduce the contact area between the radiating fin and the radiating surface of the heating element, and can ensure that the radiating fin realizes the self-exhaust function through the concave-convex structure, thereby effectively reducing the bubbles generated when the radiating fin is assembled; in addition, the area of the heat dissipation layer does not need to be reduced, so that the heat dissipation effect of the heat dissipation sheet can be improved.
Description
Technical Field
The utility model relates to the field of electronic technology, especially, relate to a fin and electronic equipment.
Background
Electronic equipment, such as mobile phones, generate a large amount of heat during operation; as the performance and power consumption of electronic devices are increased, the amount of heat generated by the electronic devices is also increased. Therefore, in order to reduce the heat of the electronic device and ensure the safe operation of the electronic device, a heat dissipation structure is required to be equipped in the electronic device for heat dissipation. The heat sink has become a common heat dissipation structure in electronic devices such as mobile phones due to its good heat dissipation effect and thin thickness.
Some places of electronic equipment need to be pasted with a large-area radiating fin to solve the radiating problem of the whole machine, however, for the large-area radiating fin, the problem of bubbles cannot be avoided during pasting; and when the surface to be pasted is a curved surface, air bubbles are inevitable. The bubbles generated during the assembly can cause appearance quality problems of other structural members, for example, in a mobile phone, the bubbles generated during the assembly of the heat sink can cause the impression of glass contacted with the heat sink, thereby affecting the appearance of the whole mobile phone. In order to reduce bubbles generated during assembly of the heat sink and improve the appearance quality of the electronic device, a common method at present is to form through holes at multiple positions on the heat sink to reduce the area of the heat sink, thereby reducing the generation of bubbles.
However, although the electronic device with the through hole on the heat sink reduces the bubbles generated during the assembly of the heat sink and improves the appearance quality of the whole device, the heat dissipation effect of the heat sink in the electronic device is affected, so that the phenomenon of excessive heat generation is easily generated during the use process of a user.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a heat sink and an electronic device for reducing air bubbles generated during assembling the heat sink and improving the heat dissipation effect of the heat sink.
In order to achieve the above object, in a first aspect, the present invention provides a heat sink for being attached to a heat dissipating surface of a heat generating component, including: the first surface of the fixing layer is attached to the first surface of the heat dissipation layer, the second surface of the fixing layer is provided with a concave-convex structure, and the second surface of the fixing layer is used for being attached to the heat dissipation surface of the heating element and is opposite to the first surface of the fixing layer.
The concave-convex structure is arranged on the second surface (namely the surface facing the radiating surface) of the fixing layer of the radiating fin, so that the contact area between the radiating fin and the radiating surface of the heating element can be reduced, and the radiating fin can realize the self-exhausting function through the concave-convex structure, so that bubbles generated during the assembly of the radiating fin can be effectively reduced; moreover, the area of the heat dissipation layer is not changed, so that compared with the existing structure of punching a through hole on the heat dissipation sheet, the technical scheme provided by the embodiment can improve the heat dissipation effect of the heat dissipation sheet.
As an optional embodiment of the present invention, the concave-convex structure is uniformly distributed on the second surface of the fixed layer, and the concave portion of the concave-convex structure is communicated with the edge of the fixed layer.
In the above embodiment, the concave portion of the concave-convex structure is communicated with the edge of the fixing layer, so that the self-venting function can be realized, the concave-convex structure is uniformly distributed, and bubbles generated during the assembly of the radiating fin can be reduced better.
As an optional implementation of the present invention, the concave-convex structure is an air-discharging mesh.
By adopting the reticulate pattern structure as the concave-convex structure, the exhaust capacity of the radiating fin can be improved, and bubbles generated during the assembly of the radiating fin are further reduced.
As an optional implementation of the present invention, the concave-convex structure is a wavy reticulate pattern.
As an optional implementation manner of the present invention, the concave-convex structure is a dot-like mesh.
As an optional embodiment of the present invention, the convex portion of the concave-convex structure tends to gradually contract from the bottom end to the top end. Thus, the fixing layer can be closely attached to the heat dissipation surface of the heating element.
As an optional embodiment of the present invention, the concave-convex structure is formed by transferring the second surface of the fixing layer.
In the above embodiment, the uneven structure is formed by a transfer method, and the manufacturing cost of the heat sink can be reduced.
As an optional embodiment of the present invention, the heat sink further includes a protective layer covering the second surface of the heat dissipation layer, and the second surface of the heat dissipation layer is opposite to the first surface of the heat dissipation layer.
Through setting up the protective layer on the second face on heat dissipation layer, can protect heat dissipation layer through the protective layer, reduce the impact force that heat dissipation layer received, improve the life of fin.
As an optional embodiment of the present invention, the protective layer is an insulating protective film.
By adopting the insulating protective film as the protective layer, the service life of the heat sink can be prolonged, and the heat sink can play an insulating role.
As an optional embodiment of the present invention, the heat dissipation layer is a graphite layer.
By adopting the graphite layer as the heat dissipation layer, the heat dissipation effect of the heat dissipation sheet can be improved, the weight of the heat dissipation sheet is reduced, and the application range and the heat dissipation effect of the heat dissipation sheet are improved.
As an optional embodiment of the present invention, the fixing layer is a rubber surface layer.
By adopting the rubber surface layer as the fixing layer, the assembly of the radiating fin can be facilitated, and the cost can be saved.
In a second aspect, the present invention provides an electronic device, including: the heat sink may further include a housing, a heat generating element located within the housing, and the heat sink according to any one of the first aspect and the first aspect, wherein the heat sink is attached to a heat dissipating surface of the heat generating element.
The beneficial effects of the electronic device provided by the second aspect and the possible embodiments of the second aspect may refer to the beneficial effects brought by the first aspect and the possible embodiments of the first aspect, and are not described herein again.
Drawings
Fig. 1 is a schematic structural diagram of a heat sink according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a concave-convex structure according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another concave-convex structure provided in an embodiment of the present invention;
fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Description of reference numerals:
1-a heat dissipation layer; 2-a fixing layer;
3-a protective layer; 21-a relief structure;
10-a housing; 20-a heating element;
30-heat sink.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In order to reduce bubbles generated during assembly of the heat sink in the conventional electronic device, a common method is to form through holes at multiple positions on the heat sink to reduce the area of the heat sink, thereby reducing the generation of bubbles. Although the bubbles generated during the assembly of the radiating fin are reduced, the area of the radiating fin is reduced, and the radiating effect is affected, so that the phenomenon of overlarge heat generation is easy to occur during the use process of a user. In addition, there is a method of using an exhaust air mesh adhesive on the mounting surface side of the heat sink, however, in some electronic devices using a heat sink with a special lamination structure, such as a mobile phone with a model number of MoToX4, a PI adhesive tape is additionally laminated on the mounting surface side of the heat sink; the PI adhesive tapes on the market are common plane adhesives and do not have mesh adhesives, so that the exhausting function cannot be realized, namely the application range of the method has certain limitation.
In order to solve the technical problem, an embodiment of the utility model provides a fin and electronic equipment mainly through set up concave-convex structure in the fixed bed of fin towards heating element's one side, reduces the bubble that the fin produced when the equipment, promotes the radiating effect of fin simultaneously, enlarges the application scope of fin.
The technical solution of the present invention will be described in detail with reference to the accompanying drawings. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
Fig. 1 is a schematic structural diagram of a heat sink provided in an embodiment of the present invention, and the heat sink provided in this embodiment is used for being attached to a heat dissipation surface of a heat generating element. As shown in fig. 1, the present embodiment provides a heat sink including: the heat dissipation layer comprises a heat dissipation layer 1 and a fixing layer 2, wherein a first surface of the fixing layer 2 is attached to a first surface of the heat dissipation layer 1, a concave-convex structure 21 is arranged on a second surface of the fixing layer 2, and the second surface of the fixing layer 2 is used for being attached to a heat dissipation surface of a heating element and is opposite to the first surface of the fixing layer 2.
Specifically, the heat dissipation layer 1 may be made of a heat conductive material such as graphite, copper, or aluminum. The heat conductivity of graphite is better than that of heat-conducting metal materials such as copper and aluminum, and the heat conduction is uniform, so that in order to improve the heat dissipation effect of the heat dissipation plate, in this embodiment, as an optimal implementation manner, the heat dissipation layer 1 is a graphite layer. In addition, because the weight of graphite is light, the graphite layer is used as the heat dissipation layer 1, so that the weight of the heat dissipation sheet can be effectively reduced, and the weight of the electronic equipment assembled with the heat dissipation sheet is further reduced; moreover, the graphite layer can be smoothly attached to any plane and any curved surface and can be cut in any form according to requirements, so that the graphite layer is used as the radiating fin of the radiating layer 1, the application range is wide, and the radiating effect is better.
The fixing layer 2 is used for fixing the heat dissipation layer 1 on the heat dissipation surface of the heat generating element, and may be a flexible thin layer. The fixing layer 2 may be specifically an adhesive surface layer, for example: a glue surface layer formed by glue or adhesive tape is adopted, and the heat dissipation layer 1 is adhered to the heat dissipation surface of the heating element through the glue surface layer; the fixing layer 2 may also be other fixing structures, such as: the fixing layer 2 may be perforated with a thin sheet made of other material, and the heat dissipation layer 1 may be fixed to the heat dissipation surface of the heating element by a fixing member such as a screw. In this embodiment, as a preferred embodiment, the fixing layer 2 is a glue surface layer, so that when a user attaches the heat sink to the heat dissipation surface of the heat dissipation element, the user only needs to attach the heat sink to the heat dissipation surface of the heat dissipation element through the glue surface layer on the heat dissipation plate without using tools, the assembly is simple, and the cost can be saved. In a specific implementation, the adhesive surface layer may be a double-sided adhesive tape, so as to facilitate adhesion between the fixing layer 2 and the heat dissipation layer 1 and the heat dissipation surface of the heating element.
In order to reduce the bubbles generated during the assembly of the heat sink, i.e. when the heat sink is attached to the heat dissipating surface of the heat generating component, in the present embodiment, the concave-convex structure 21 is disposed on the second surface (i.e. the surface facing the heat dissipating surface) of the fixing layer 2, so as to reduce the contact area between the heat sink and the heat dissipating surface of the heat generating component, thereby reducing the bubbles generated when the heat sink is attached to the heat dissipating surface of the heat generating component; when the concave-convex structure 21 is provided, the concave part of the concave-convex structure 21 is communicated with the edge of the fixed layer 2, so that air between the fixed layer 2 of the heat sink and the heat dissipation surface of the heating element can be exhausted through the concave-convex structure 21, the heat sink can realize a self-exhausting function, and bubbles can be prevented from being generated during assembly. In addition, in this embodiment, the area of the heat dissipation layer 1 is not changed, so compared with the existing structure of punching a through hole on the heat dissipation plate, the technical scheme provided by this embodiment can improve the heat dissipation effect of the heat dissipation plate.
The concave-convex structures 21 provided on the second surface of the fixing layer 2 may be uniformly distributed or non-uniformly distributed. During concrete implementation, concave-convex structure 21 can be the exhaust reticulate pattern, and the shape of reticulate pattern structure is more regular, and it is even to distribute, adopts the reticulate pattern structure can improve the exhaust capacity of fin, the bubble that produces when effectively reducing the fin equipment.
Fig. 2 is the embodiment of the present invention provides a schematic structural diagram of a concave-convex structure 21, as shown in fig. 2, the concave-convex structure 21 can be a wavy reticulate pattern. Fig. 2 specifically shows a schematic structural view of a longitudinal section of the concave-convex structure 21. In particular implementations, the wavy webbing may be implemented in a variety of ways, such as: the shape of the longitudinal section of the convex part or the concave part of the wavy reticulate pattern can be a triangle, a circular arc, a trapezoid, a rectangle and the like. In fig. 1, the shape of the vertical cross section of the convex portion of the wavy mesh is a trapezoid, and the shape of the vertical cross section of the concave portion is a triangle, and in fig. 2, the shape of the vertical cross section of the convex portion and the concave portion of the wavy mesh is a triangle.
Fig. 3 is a schematic structural diagram of another concave-convex structure 21 provided in the embodiment of the present invention, and as shown in fig. 3, the concave-convex structure 21 may also be a dotted cross-hatched pattern. Fig. 3 specifically shows a front view of the concave-convex structure 21. In particular, the dot-like texture can also be realized in various ways, such as: the convex portion of the dot-shaped mesh may be a hemisphere, a cylinder, a rectangle, a frustum, or the like, and fig. 3 exemplifies that the convex portion of the dot-shaped mesh is a cylinder.
Of course, the concave-convex structure 21 may be realized by other methods, and this embodiment is not particularly limited thereto.
In order to make the fixing layer 2 closely adhere to the heat dissipation surface of the heat generating element, in the present embodiment, the convex portion of the concave-convex structure 21 tends to gradually shrink from the bottom end to the top end, for example: the longitudinal section of the convex portion of the concave-convex structure 21 is a trapezoid as shown in fig. 1, and this structure is a structure in which the convex portion gradually shrinks from the bottom end to the top end.
In this embodiment, the concave-convex structure 21 provided on the second surface of the fixing layer 2 can be formed in various ways, for example: the concave-convex structure 21 may be formed by the transfer printing method on the second surface of the fixing layer 2, and the concave-convex structure 21 may be formed by the Roll-to-Roll (RTR) automatic lamination method on the second surface of the fixing layer 2. In this embodiment, as a preferred implementation manner, the concave-convex structure 21 is formed by the second surface of the fixed layer 2 through a transfer printing method, that is, when the implementation is performed, the concave-convex structure matching with the concave-convex structure 21 on the fixed layer 2 is formed on the carrier, one surface of the concave-convex structure of the carrier is covered on the second surface of the fixed layer 2, then the heat sink and the carrier are placed between two rollers together, the two rollers are locked to press the heat sink and the carrier, and the concave-convex structure on the carrier is transferred onto the fixed layer 2, so that the concave-convex structure 21 matching with the concave-convex structure on the carrier is formed on the fixed layer 2. The transfer printing method has simple process and lower cost.
In order to improve the service life of the heat sink, in the present embodiment, the heat sink may further include a protective layer 3, and the protective layer 3 covers the second surface of the heat dissipation layer 1. Therefore, the protective layer 3 can protect the heat dissipation layer 1, reduce the impact force on the heat dissipation layer 1 and prolong the service life of the heat dissipation sheet.
In a specific implementation, the protective layer 3 may be an insulating protective film, which may play an insulating role while increasing the service life of the heat sink. The insulating protective film can be, for example, a polyethylene terephthalate (PET) film, and the PET film has good mechanical properties, can adapt to a complex environment, is not easy to damage, and can prolong the service life of the radiating fin; and the price is low, and the cost of the radiating fin can be saved.
In order to reduce bubbles generated during assembly of the heat sink, in the prior art, the first implementation mode of reducing bubbles by perforating through holes at multiple positions on the heat sink to reduce the area of the heat sink, thereby affecting the heat dissipation effect of the heat sink, and the cost for perforating through holes at multiple positions is increased; and in the second mode, the exhaust mesh glue is used on one side of the surface mounting surface of the radiating fin, so that the radiating fin can realize the exhaust function, and the application range has certain limitation. In the embodiment, the concave-convex structure 21 is disposed on the surface of the fixing layer 2 facing the heat dissipating surface, so that the contact area between the heat dissipating plate and the heat dissipating surface of the heat generating element can be reduced, and the heat dissipating plate can realize a self-venting function through the concave-convex structure 21, thereby effectively reducing bubbles generated during assembly of the heat dissipating plate. Compared with the first implementation mode of perforating holes at multiple positions on the radiating fin, the technical scheme provided by the embodiment does not reduce the area of the radiating layer, so that the radiating effect of the radiating fin can be improved, perforating holes are not needed, the structure of the fixing layer of the radiating fin is only needed to be changed, and the cost is lower; compare the second kind and use the realization mode that the net grain glued of exhausting was pasted dress one side of face at the fin, the technical scheme that this embodiment provided is applicable to various fins, and the range of application is wider.
According to the radiating fin provided by the embodiment, the concave-convex structure is arranged on the surface, facing the radiating surface, of the fixing layer of the radiating fin, so that the contact area between the radiating fin and the radiating surface of the heating element can be reduced, and the radiating fin can realize a self-exhausting function through the concave-convex structure, so that bubbles generated during assembly of the radiating fin can be effectively reduced; moreover, the area of the heat dissipation layer is not reduced, so that compared with the existing structure of punching a through hole on the heat dissipation plate, the technical scheme provided by the embodiment can improve the heat dissipation effect of the heat dissipation plate.
Fig. 4 is a schematic structural diagram of an electronic device provided in an embodiment of the present invention, as shown in fig. 4, the electronic device provided in this embodiment includes: the heat-generating device comprises a shell 10, a heat-generating element 20 positioned in the shell 10 and a heat sink 30, wherein the heat sink 30 is attached to a heat radiating surface of the heat-generating element 20.
Specifically, the electronic device may be a mobile terminal, a notebook, a tablet computer, or a desktop computer, which requires the heat sink 30.
The structure of the housing 10 may refer to a corresponding structure in an existing electronic device, and this embodiment is not particularly limited thereto.
The heating element 20 may be a Central Processing Unit (CPU), a display circuit, a main circuit board, etc., and the heat sink 30 is attached to the heat dissipation surface of the heating element 20, which can effectively improve the heat dissipation performance of the electronic device.
The specific structure of the heat sink 30 is the same as that of the heat sink in the embodiment shown in fig. 1, and for specific description, reference may be made to the embodiment shown in fig. 1, which is not described herein again.
According to the electronic equipment provided by the embodiment, the concave-convex structure is arranged on the surface, facing the radiating surface, of the fixing layer of the radiating fin, so that the contact area between the radiating fin and the radiating surface of the heating element can be reduced, and the radiating fin can realize a self-exhausting function through the concave-convex structure, so that bubbles generated during assembly of the radiating fin can be effectively reduced, and the appearance quality of the electronic equipment can be improved; moreover, the area of the heat dissipation layer is not changed, so that the structure of the existing heat dissipation fin with the through hole is compared, the technical scheme provided by the embodiment can improve the heat dissipation effect of the heat dissipation fin, and further improve the heat dissipation effect of the electronic equipment.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. A heat sink, comprising: the heat dissipation layer and the fixed layer, the first face laminating of fixed layer is in on the first face of heat dissipation layer, be provided with concave-convex structure on the second face of fixed layer, wherein, the second face of fixed layer is used for laminating on heating element's the cooling surface, and with the first face of fixed layer is relative.
2. The heat sink as recited in claim 1, wherein the relief structure is evenly distributed on the second side of the fixed layer and the recesses of the relief structure communicate with the edges of the fixed layer.
3. The heat sink according to claim 2, wherein the uneven structure is an air discharge mesh, and the air discharge mesh is a wavy mesh or a dotted mesh.
4. The heat sink as recited in claim 1, wherein the convex portion of the relief structure has a tendency to gradually contract from the bottom end toward the top end.
5. The heat sink according to claim 1, wherein the concave-convex structure is formed by transfer printing on the second surface of the fixing layer.
6. The heat sink of claim 1, further comprising a protective layer overlying a second side of the heat spreading layer, the second side of the heat spreading layer being opposite the first side of the heat spreading layer.
7. The heat sink of claim 6, wherein the protective layer is an insulating protective film.
8. The heat sink of any of claims 1-7, wherein the heat spreading layer is a graphite layer.
9. The heat sink as recited in any one of claims 1 to 7, wherein the securing layer is an adhesive facing.
10. An electronic device, comprising: a housing, a heat-generating component within the housing, and the heat sink of any of claims 1-9, wherein the heat sink is attached to a heat-dissipating surface of the heat-generating component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920813035.5U CN210183767U (en) | 2019-05-31 | 2019-05-31 | Heat sink and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920813035.5U CN210183767U (en) | 2019-05-31 | 2019-05-31 | Heat sink and electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210183767U true CN210183767U (en) | 2020-03-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920813035.5U Active CN210183767U (en) | 2019-05-31 | 2019-05-31 | Heat sink and electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210183767U (en) |
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2019
- 2019-05-31 CN CN201920813035.5U patent/CN210183767U/en active Active
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