CN210121596U - Substrate surface cleaning device and cleaning equipment - Google Patents
Substrate surface cleaning device and cleaning equipment Download PDFInfo
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- CN210121596U CN210121596U CN201920737956.8U CN201920737956U CN210121596U CN 210121596 U CN210121596 U CN 210121596U CN 201920737956 U CN201920737956 U CN 201920737956U CN 210121596 U CN210121596 U CN 210121596U
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Abstract
The utility model provides a base plate surface belt cleaning device and cleaning equipment, include: adsorption equipment and air current cleaning device, wherein, the adsorption equipment includes: a adsorption plate and rotating-structure for adsorbing the base plate, rotating-structure with the adsorption plate is connected, rotating-structure is used for making the adsorption plate upset, air current cleaning device with adsorption device corresponds the setting, works as the base plate quilt the adsorption plate adsorbs and passes through rotating-structure upset is to the level when downwards, air current cleaning device along the adsorption plate removes to blow off the air current extremely the base plate, the direction that the air current flows with non-perpendicularly between the surface of base plate, the utility model provides a base plate surface cleaning device and cleaning equipment are being cleaned after the base plate upset, have avoided the damage that the foreign matter caused the base plate surface when clean, have greatly improved the clean effect of base plate.
Description
Technical Field
The utility model relates to a flat panel display trade equipment field especially relates to a base plate surface cleaning device and cleaning equipment.
Background
A Liquid Crystal Display (LCD) is a most widely used Display product in the current market, wherein the LCD mainly includes a Liquid Crystal Display panel and a backlight module, the Liquid Crystal Display panel mainly includes an array substrate, a color filter substrate and a Liquid Crystal filled between the array substrate and the color filter substrate, the substrate needs to be placed on a conveyor belt for transportation after production, and the surface of the substrate needs to be cleaned at the same time.
At present, the way of cleaning the surface of the substrate mainly depends on the powerful airflow to clean, as shown in fig. 1, the substrate is placed on the transmission belt and moves along with the transmission belt, when the transmission belt moves to the cleaning area, the airflow device can be close to the surface of the substrate, and blows out the powerful airflow from the top of the substrate, the airflow blows to the surface of the substrate to blow off the attached foreign matters from the surface of the substrate, and the purpose of cleaning the surface of the substrate is achieved.
However, this cleaning method has certain defects, the foreign matter attached to the surface of the substrate is not only dust, but also some hard granular foreign matters, which are attached to the surface of the substrate, and when cleaned by the airflow, the airflow is blown from above the substrate, when the airflow blows the foreign matter, the foreign matter will be blown to both sides of the substrate by the surface attached to the substrate under the action of its own gravity, and will always contact with the surface of the substrate during the movement of the foreign matter, causing scratches on the surface of the substrate, meanwhile, in order to protect the substrate, the surface of the substrate will generally have a protective film or a colloid protective layer, and the foreign matter will also scrape glue during the detachment, even stick to the frame, which not only has a poor cleaning effect on the foreign matter, but also the foreign matter will easily damage the surface of the substrate.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned defect among the prior art, the utility model provides a substrate surface belt cleaning device and cleaning equipment has solved the clean effect that appears in the current substrate cleaning process not good, and substrate surface's foreign matter easily causes substrate surface damage's technical problem when wasing.
In order to achieve the above object, a first aspect of the present invention provides a substrate surface cleaning apparatus, including:
adsorption equipment and air current cleaning device, wherein, the adsorption equipment includes: an adsorption plate and revolution mechanic for adsorbing the base plate, revolution mechanic with the adsorption plate is connected, revolution mechanic is used for making the adsorption plate upset, air current cleaning device with adsorption equipment corresponds the setting, works as the base plate quilt the adsorption plate adsorbs and passes through revolution mechanic upset to the level when downwards, air current cleaning device along the adsorption plate removes to blow off the air current extremely the base plate, the direction that the air current flows with it is non-perpendicular between the surface of base plate.
Furthermore, one side of the airflow cleaning device, which faces the adsorption plate, is provided with a plurality of injection holes, the injection holes are uniformly arranged on the airflow cleaning device, and the airflow cleaning device can reciprocate along the horizontal direction on the side surface of the adsorption plate.
Optionally, the airflow cleaning device is located below the adsorption device, after the adsorption plate is turned over, the airflow cleaning device moves below the adsorption plate along a horizontal direction, and the jet holes jet the airflow to the surface of the substrate obliquely upward.
Optionally, the airflow cleaning device is located on a lateral side of the horizontal direction of the adsorption device, after the adsorption plate is turned over, the airflow cleaning device moves along the lateral side of the adsorption plate, and the jet hole jets out the airflow clinging to the surface of the substrate toward the substrate.
Optionally, the number of the airflow cleaning devices is multiple, and the airflow cleaning devices are respectively arranged on the left side and the right side of the adsorption device, and the multiple airflow cleaning devices can simultaneously move on the two sides of the adsorption device and jet airflow towards the surface of the substrate.
Optionally, the adsorption plate has first terminal surface and second terminal surface, wherein, first terminal surface is used for adsorbing the base plate, the second terminal surface is located the offside of first terminal surface, be equipped with a plurality of through-holes on the adsorption plate, through-hole align to grid is in on the adsorption plate, just the through-hole intercommunication first terminal surface with the second terminal surface.
Further, be equipped with a plurality of air exhaust devices on the second terminal surface, air exhaust device's one end cover on the through-hole, air exhaust device is used for extracting the inside air of through-hole, so that the base plate is adsorbed on first terminal surface.
Further, a buffer pad is arranged in the through hole, one part of the buffer pad is arranged on the inner wall of the hole of the through hole in a cushioning mode, and the other part of the buffer pad extends out of the through hole and is attached to the surface of the first end face.
Further, revolution mechanic is the pivot, the pivot is worn to establish the inside of adsorption plate, the axle center of pivot with the center of adsorption plate is parallel, just the pivot is close to the second terminal surface.
A second aspect of the present invention provides a cleaning apparatus, including: conveyer belt and above-mentioned substrate surface cleaning device, wherein, the conveyer belt includes: the substrate surface cleaning device is positioned between the first conveyor belt and the second conveyor belt, and a first end face of the substrate surface cleaning device is flush with the conveying end faces of the first conveyor belt and the second conveyor belt.
The utility model provides a substrate surface belt cleaning device and cleaning equipment for the clearance adheres to the foreign matter on substrate surface, through including: adsorption equipment and air current cleaning device, wherein, adsorption equipment includes: the adsorption plate and the rotating structure are connected, the end face of the adsorption plate, which faces upwards horizontally, is used for placing a substrate, the substrate is adsorbed and turned over by the rotating structure, so that the substrate is in a state of facing downwards horizontally, foreign matters on the surface of the substrate fall downwards under the influence of self gravity and pull away from the surface of the substrate for a certain gap, the airflow cleaning device moves on the side face of the substrate and has a certain safety distance with the substrate, meanwhile, the airflow cleaning device jets airflow which is in contact with the foreign matters, and the foreign matters are separated from the surface of the substrate under the impact of the airflow, so that the problem that the foreign matters remained on the surface of the substrate are difficult to clean is solved, in the prior art, the foreign matters easily scratch the surface of the substrate during cleaning, even the colloidal film on the surface of the substrate is scratched, or the foreign matters are stuck on the frame of the substrate, the substrate is cleaned after being turned over, the problem that the foreign matters scratch the surface of the substrate is avoided, the airflow strength of the airflow cleaning device can be increased, the working efficiency of cleaning the foreign matters is improved, the surface of the substrate is effectively protected, and the cleaning effect of the foreign matters is remarkably improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art substrate cleaning;
fig. 2 is a schematic view of an overall structure of a substrate surface cleaning apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural view of an airflow cleaning device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a substrate surface cleaning apparatus according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a substrate surface cleaning apparatus according to an embodiment of the present invention;
fig. 6 is a schematic view of a structural flow of an adsorption plate according to an embodiment of the present invention;
fig. 7 is a schematic view of an overall structure of a cleaning apparatus according to an embodiment of the present invention.
Reference numerals:
1-a substrate surface cleaning device;
10-a substrate;
20-an adsorption device;
21-an adsorption plate;
211-a first end face;
212-a second end face;
213-a through hole;
214-a suction device;
215-a cushion;
22-a rotating structure;
30-an air flow cleaning device;
31-an injection hole;
41-a first conveyor belt;
42-second conveyor belt.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be described in more detail below with reference to the drawings in the preferred embodiments of the present invention. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are only some, but not all embodiments of the invention. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention. Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Example one
The present embodiment provides a substrate surface cleaning apparatus 1, as shown in fig. 2, for cleaning the surface of a substrate 10, ensuring the surface of the substrate 10 to be clean, and avoiding the adhesion of foreign matters, comprising: adsorption equipment 20 and air current cleaning device 30, adsorption equipment 20 includes: the adsorption plate 21 is a plate-shaped structure with a certain thickness, the adsorption plate 21 has an upper end face and a lower end face, the size of the end faces is slightly larger than that of the base plate 10, and the adsorption plate 21 can be turned over through the rotating structure 22.
Specifically, in the present embodiment, when the adsorption plate 21 is in a normal state, both the upper and lower end faces of the adsorption plate 21 are in a horizontal state, wherein the end face facing upward horizontally is used for placing the substrate 10, when the substrate 10 is placed on the adsorption plate 21, the adsorption plate 21 adsorbs the substrate 10, and the rotation structure 22 is turned over, so that the substrate 10 is turned over from a state facing upward horizontally to a state facing downward horizontally, at this time, the end face of one end of the substrate 10 is adsorbed by the adsorption plate 21, while the other end of the substrate 10, that is, the end face of the substrate 10 with the foreign matters attached thereon, is in a state facing downward horizontally, the foreign matters originally attached on the surface of the substrate 10 will be influenced by its own gravity and will form some gaps with the surface of the substrate 10, which can be understood that the surface of the substrate 10 is turned over, so that the foreign matters on the surface will fall down due to gravity, but because the surface of the substrate, the foreign matter still sticks to the surface of the substrate 10, but does not stick to the surface of the substrate 10, but has a certain gap between the surfaces of the substrates 10.
Further, in the present embodiment, the substrate 10 is turned over and in a horizontally inverted state by the suction plate 21 and the rotating structure 22, the airflow cleaning device 30 moves on the side of the suction plate 21, and during the movement, the airflow cleaning device 30 can jet an airflow, which is used for contacting with the foreign matters on the surface of the substrate 10 and displacing the foreign matters horizontally to separate from the surface of the substrate 10.
It should be noted that, in this embodiment, after the substrate 10 is horizontally turned over by the adsorption plate 21, the foreign object is dropped downward by the action of gravity and forms a certain gap with the surface of the substrate 10, at this time, when the airflow cleaning device 30 blows the foreign object through the airflow, the foreign object is subjected to both the vertical downward force and the horizontal force, and the foreign object is not subjected to the upward force, and meanwhile, a certain gap is also formed between the foreign object and the substrate 10, so that the foreign object is more easily separated from the surface of the substrate 10, and when the foreign object is separated, the foreign object does not move upward and adheres to the surface of the substrate, and damages the substrate 10, and is difficult to hang on the frame of the substrate 10, thereby improving the cleaning capability of the airflow cleaning device 30 on the surface of the substrate 10.
Further, in the present embodiment, the airflow cleaning device 30 moves along the side of the substrate 10, and when moving, the airflow cleaning device 30 and the substrate 10 have a certain safety distance, and the airflow cleaning device 30 does not contact with the substrate 10, because the airflow cleaning device 30 blows off the foreign objects by the blown airflow, and does not directly contact with the substrate 10, and the surface of the substrate 10 is damaged once the foreign objects contact with the substrate, the airflow cleaning device 30 always moves along the side of the substrate 10 at a certain safety distance.
Further, in the embodiment, the airflow jetted by the airflow cleaning device 30 has a certain intensity, which is to rapidly blow off the foreign matter, and once the intensity of the airflow is not enough, the airflow contacts the foreign matter, but the foreign matter cannot be blown off, in the prior art, because the foreign matter is tightly attached to the surface of the substrate 10, when the airflow with intensity blows off the foreign matter, the foreign matter will scratch the surface of the substrate 10, and even scrape off the glue coated on the surface of the substrate 10, while in the embodiment, the foreign matter is blown by the airflow, and will not damage the surface of the substrate 10, therefore, in order to improve the cleaning efficiency, the intensity of the airflow can be properly improved, so as to achieve the purpose of blowing off the foreign matter more rapidly, although the surface of the substrate 10 is coated with substances such as a glue film, but the increase of the intensity of the airflow will not damage the glue film, the colloidal film is afraid of being scratched by foreign matters in a contact manner, and the colloidal film cannot be damaged by the blowing of the airflow.
The present embodiment provides a substrate surface cleaning apparatus 1 for cleaning foreign matter attached to a surface of a substrate 10, by including: adsorption apparatus 20 and air current cleaning device 30, wherein, adsorption apparatus 20 includes: the adsorption plate 21 and the rotation structure 22, the rotation structure 22 is connected with the adsorption plate 21, the horizontal upward end face in the adsorption plate 21 is used for placing the substrate 10, and when adsorbing the substrate 10, the substrate 10 is turned over by the rotation structure 22, so that the substrate 10 is in a horizontal downward state, the foreign matters on the surface of the substrate 10 fall down under the influence of self gravity and pull away a certain gap from the surface of the substrate 10, the airflow cleaning device 30 moves on the side face of the substrate 10 and has a certain safety distance with the substrate 10, meanwhile, the airflow cleaning device 30 jets airflow which contacts with the foreign matters, the foreign matters are separated from the surface of the substrate 10 under the impact of the airflow, and the problem that the foreign matters remained on the surface of the substrate 10 are difficult to clean is solved, in the prior art, the foreign matters easily scratch the surface of the substrate 10 during cleaning, even the glue scraping condition of the colloidal film on the surface of the substrate 10 is caused, or the foreign matter is stuck on the frame of the substrate 10, in the embodiment, the substrate 10 is cleaned after being turned over, so that the problem that the foreign matter can scratch the surface of the substrate 10 is avoided, the airflow strength of the airflow cleaning device 30 can be increased, the working efficiency of cleaning the foreign matter is improved, the surface of the substrate 10 is effectively protected, and the cleaning effect of the foreign matter is obviously improved.
Alternatively, in this embodiment, as shown in fig. 3, a plurality of injection holes 31 are provided on the gas flow cleaning device 30, and the injection holes 31 are provided on a side surface of the gas flow cleaning device 30, specifically, the gas flow cleaning device 30 moves on a side surface of the substrate 10, a plurality of injection holes 31 are provided on a side surface of the gas flow cleaning device 30 facing the substrate 10, and all the injection holes 31 are uniformly arranged in a row, and when the gas flow cleaning device 30 operates, the plurality of injection holes 31 together inject gas toward the substrate 10, and the gas flows injected from the plurality of injection holes 31 together form an air knife, and when the gas flow cleaning device 30 moves on the side surface of the substrate 10, the air knife contacts with and cuts off foreign matters on the surface of the substrate 10, thereby forcing the foreign matters to be separated from the surface.
It should be noted that, in this embodiment, the design that the row of spraying holes 31 are arranged side by side is adopted for the airflow cleaning device 30, and an air outlet is not directly formed in the side surface of the airflow cleaning device 30, because the structure of the spraying holes 31 is favorable for increasing the intensity of the air during the air ejection, so that the air is ejected, an air knife is formed between the air ejected from the row of spraying holes, and a certain gap is formed between the foreign matter and the surface of the substrate 10 under the influence of gravity at this time, the air knife is as close as possible to the surface of the substrate 10 and cuts into the gap between the foreign matter and the surface of the substrate 10, so as to ensure the separation between the foreign matter and the substrate 10, and avoid the foreign matter from contacting the surface of the substrate 10 again.
Optionally, in this embodiment, the airflow cleaning device 30 is located below the adsorption device 20, and when the adsorption device 20 adsorbs and turns the substrate 10 to a state of being horizontally downward, the airflow cleaning device 30 reciprocates in a horizontal direction below the substrate 10 and sprays airflow obliquely upward, and the sprayed airflow obliquely blows on the foreign matters attached to the surface of the substrate 10, so that the foreign matters are separated from the surface of the substrate 10 under the impact of the airflow.
In another possible implementation manner, as shown in fig. 4 and 5, the airflow cleaning device 30 moves on the side surface of the substrate 10 in a reciprocating manner, and the reciprocating movement ensures that the foreign matters on the surface of the substrate 10 are cleaned, and the foreign matters are repeatedly cleaned to ensure the cleaning effect because the foreign matters can be adhered to substances such as a colloidal film on the surface of the substrate 10.
Alternatively, in this embodiment, the number of the airflow cleaning devices 30 may be multiple, when a plurality of airflow cleaning devices 30 are provided, the airflow cleaning devices 30 are disposed on two sides of the substrate 10, and at the same time, the spraying holes 31 between the airflow cleaning devices disposed on two sides of the substrate 10 are opposite to each other, it can be understood that the airflow cleaning devices 30 are symmetrically disposed on two sides of the substrate 10, the spraying holes 31 of the two airflow cleaning devices 30 are opposite to each other in front, the spraying holes 31 between the spraying holes 31 face to the spraying holes 31 on the opposite side, an air knife capable of covering the surface of the substrate 10 in the horizontal direction is formed between the spraying holes 31 on two sides together, and the airflow spraying devices on two sides move together to perform overall coverage cleaning on the surface of the substrate 10.
It should be noted that, in this embodiment, the number of the airflow cleaning devices 30 can be set according to actual conditions, when only one airflow cleaning device 30 is provided, the intensity of the jet airflow needs to be ensured, because the cleaning foreign matter mainly depends on the jet intensity of the airflow, the jet intensity of the airflow gradually attenuates with the distance, the intensity of the airflow is relatively larger on the side close to the jet hole 31, the cleaning effect is better, and the cleaning effect is slightly worse on the side far from the jet hole 31, and certainly the cleaning effect can be ensured by multiple reciprocating movements, therefore, the arrangement of a plurality of airflow cleaning devices 30 on both sides can accelerate the working efficiency and ensure the cleaning effect, but can increase the overall cost of the device, so the specific number of the airflow cleaning devices 30 can be set according to actual conditions, and when a plurality of airflow cleaning devices 30 are provided, the movement pattern of the airflow cleaning devices 30 is not unique, and the airflow cleaning devices 30 on two sides can move in tandem and in a crossing manner, in short, the actual number and movement pattern of the airflow cleaning devices 30 are not limited specifically here.
Optionally, in this embodiment, the spraying hole 31 of the airflow cleaning device 30 is flush with the end surface of the substrate 10 to which the foreign object is attached, specifically, the airflow sprayed from the spraying hole 31 spreads around in a spraying manner, but the airflow sprayed from the center of the spraying hole 31 has the highest intensity, an air knife is formed between the portions of the airflow having the highest intensity of the spraying holes 31, the rest of the airflow spreading around can be ignored, although a certain gap is formed between the foreign object on the surface of the substrate 10 and the surface of the substrate 10 under the influence of gravity, the volume of the foreign object itself is not large and the foreign object is mostly bonded to the surface of the substrate 10, the distance of the gap is not significant, in order to avoid the foreign object from floating around under the influence of the airflow of the spraying hole 31, the spraying hole needs to be cut off as quickly as possible, therefore, it is necessary to ensure that the position of the spraying hole 31 is flush with the surface, the air knife ejected from the ejection hole 31 can keep a parallel tangent plane with the surface of the substrate 10, and when the air cleaning device 30 moves, the air knife can be cut closely to the surface of the substrate 10, so that the air knife is just cut at the gap between the foreign object and the surface of the substrate 10, and the foreign object and the substrate 10 can be separated quickly.
It should be noted that the position of the airflow cleaning device 30 may be set according to actual conditions, and the purpose of removing the foreign matter can be achieved regardless of whether the airflow cleaning device is disposed below the adsorption device 20 or on the side surface, but the direction of the airflow is different, and when the airflow cleaning device is disposed below, the direction of the airflow is directed obliquely upward, and when the airflow cleaning device is disposed on the side surface, the direction of the airflow is closely attached to the surface of the substrate 10.
Alternatively, in this embodiment, as shown in fig. 6, the adsorption plate 21 includes a first end surface 211 and a second end surface 212, wherein when the adsorption plate 21 is in the initial state, the adsorption plate 21 is in a horizontal state, and at this time, the first end surface 211 and the second end surface 212 are both in a horizontal state, the first end surface 211 faces directly above, and the second end surface 212 faces directly below, the first end surface 211 is used for placing the substrate 10, so that the first end surface 211 is slightly larger in size than the substrate 10, the second end surface 212 is opposite to the first end surface 211, the second end surface 212 is the same in size as the first end surface 211, but only the first end surface 211 is used for placing the substrate 10, when the substrate 10 is placed on the first end surface 211, the adsorption plate 21 starts to be turned over, and is turned over to the first end surface 211 facing downward and the second end surface 212 facing upward, until after cleaning is completed, the adsorption plate 21 is turned over again, returning to the initial state where the first end surface 211 faces horizontally upward and the second end surface 212 faces horizontally downward, the cleaned substrate 10 is carried away until the substrate 10 is again placed on the first end surface 211.
Optionally, in this embodiment, a plurality of through holes 213 are disposed on the adsorption plate 21, the through holes 213 are uniformly arranged on the adsorption plate 21, the through holes 213 penetrate through the whole adsorption plate 21 and communicate the first end surface 211 with the second end surface 212, positions and ranges of the through holes 213 are all related to the substrate 10, specifically, the through holes 213 are disposed along a circumference of a frame of the substrate 10, meanwhile, the through holes 213 are also disposed at a center of the substrate 10, and the through holes 213 are used for adsorbing the substrate 10, so that the through holes 213 are concentrated at the frame and the center of the substrate 10, a contact area between the through holes 213 and the substrate 10 can be ensured, and meanwhile, the through holes 213 can effectively reduce the weight of the adsorption plate 21, when the adsorption plate 21 is turned over, energy consumption required by turning over is reduced, and cost is saved.
Optionally, in this embodiment, a plurality of air extracting devices 214 are disposed on the second end surface 212, the number of the air extracting devices 214 is the same as that of the through holes 213, one end of the air extracting device 214 is connected to the through holes 213 and covers the openings of the through holes 213, specifically, the air extracting device 214 is disposed on the second end surface 212, a portion of the air extracting device 214 extends into the through holes 213, and another portion of the air extracting device 214 is left outside the through holes 213, i.e. on the second end surface 212, so that the second end surface 212 cannot be used for placing the substrate 10, the air extracting device 214 completely blocks the openings of the through holes 213 at one end of the second end surface 212, the air extracting device 214 can extract air inside the through holes 213 to make the through holes 213 in a vacuum state, when the substrate 10 is placed on the first end surface 211, the air extracting device 214 starts to extract air, and the back surface of the substrate 10 contacts, air extraction device 214 extracts the air inside through hole 213, so that adsorption occurs between through hole 213 and substrate 10, the inside vacuum of through hole 213 adsorbs substrate 10 contacting with through hole 213 on through hole 213, fix the position of substrate 10, when adsorption plate 21 overturns, substrate 10 is adsorbed and hugs closely on first terminal surface 211, until the foreign matter on substrate 10 surface is cleaned, and when adsorption plate 21 overturns again to make substrate 10 be in the level up, air extraction device 214 stops extracting air, adsorption plate 21 no longer produces the adsorption to substrate 10.
It should be noted that, in the embodiment, the air suction device 214 generates a suction force on the substrate 10 by the air inside the suction through hole 213, and after the substrate 10 is sucked by the through hole 213, the air suction device 214 starts to maintain the suction force without increasing the suction force, so as to avoid the damage of the substrate 10 caused by excessive force continuously applied to the substrate 10.
Optionally, in this embodiment, a buffer pad 215 is further disposed in the through hole 213, the buffer pad 215 is disposed at the opening of the through hole 213, specifically, the buffer pad 215 is disposed at the opening of the through hole 213 of the first end face 211, a portion of the surrounding pad of the buffer pad 215 is disposed on the inner wall of the opening of the through hole 213, another portion of the buffer pad 215 protrudes from the inside of the through hole 213 and extends to the surface of the first end face 211, it can be understood that the through hole 213 has two openings on the adsorption plate 21, the opening on the second end face 212 is covered by the air-extracting device 214, and a layer of the buffer pad 215 is disposed on the edge of the opening of the first end face 211, the surrounding pad of the buffer pad 215 is disposed only on the periphery of the opening of the through hole 213, and does not block the opening of the through hole 213 from the air-extracting device 214, and a portion of the buffer pad 215 protrudes from, since the buffer pad 215 is closely attached to the first end surface 211 and functions to protect the substrate 10, and on the one hand, the back surface of the substrate 10 is in contact with the suction plate 21, and on the other hand, when suction occurs, the through hole 213 sucks the substrate 10 by vacuum generated by the suction device 214, there is a possibility that the substrate 10 is damaged, and therefore, in order to protect the substrate 10, the buffer pad 215 is provided between the substrate 10 and the through hole 213, thereby preventing the substrate 10 from being damaged.
Optionally, in this embodiment, the rotating structure 22 is a rotating shaft, the rotating structure 22 is disposed in the adsorbing plate 21 in a penetrating manner, so that the adsorbing plate 21 can be turned over under the action of the rotating structure 22, an axis of the rotating structure 22 is parallel to a center of the adsorbing plate 21, and the rotating structure 22 is opened into the second end surface 212, specifically, the rotating structure 22 is located at a position below the center of the adsorbing plate 21, the center of the adsorbing plate 21 is mainly for maintaining balance of the adsorbing plate 21, the adsorbing plate 21 can start turning over only when the substrate 10 is completely placed on the first end surface 211, the balance during turning is maintained to be beneficial for protecting the substrate 10, and the position close to the second end surface 212 is also for protecting the substrate 10, so that the rotating structure 22 is far away from the substrate 10 as possible, and damage caused by unnecessary collision is avoided.
Example two
The present embodiment provides a cleaning apparatus, as shown in fig. 7, for cleaning a substrate 10, including: conveyer belt and the substrate surface cleaning device 1 that the first embodiment provided above, wherein, the conveyer belt includes: the substrate surface cleaning device 1 is located between the first conveyor belt 41 and the second conveyor belt 42, the substrate surface cleaning device 1 is mainly used for cleaning the surface of the substrate 10, but the substrate 10 cannot be conveyed, the substrate 10 needs to be conveyed and conveyed by the conveyor belts, and the surface of the substrate 10 needs to be cleaned in the production process of the substrate 10, because the surface of the substrate 10 is provided with a protective film made of colloid, and foreign matters are easy to adhere to the surface of the substrate 10 and need to be cleaned without damaging the surface of the substrate 10, so the substrate surface cleaning device 1 is used for cleaning the substrate 10.
Specifically, the substrate 10 is firstly transported on the first conveyor belt 41 until being transported to the substrate surface cleaning device 1, the substrate surface cleaning device 1 is connected with the first conveyor belt 41 through the conveyor wheel, the conveyor wheel is arranged on the end surface of the substrate surface cleaning device 1, the substrate 10 to be cleaned is transported from the first conveyor belt 41 to the adsorption plate 21 through the conveyor wheel, after the substrate 10 is transported to the first end surface 211 of the adsorption plate 21, at this time, the first conveyor belt 41 stops operating, so as to avoid that the substrate 10 is continuously transported to affect the cleaning of the substrate surface cleaning device 1 on the substrate 10, after the first conveyor belt 41 stops, the substrate surface cleaning device 1 starts operating, the air suction device 214 at the second end surface 212 starts to suck air inside the through holes 213, the through holes 213 will be in a vacuum state, and the substrate 10 on the first end surface 211 will be under the influence of the vacuum state of the through holes 213, the substrate 10 and the first end surface 211 are in a horizontal state, the surface to be cleaned in the substrate 10 faces to the right upper side, and after the turning starts, the substrate 10 and the adsorption plate 21 rotate together until the surface to be cleaned in the substrate 10 is in a horizontal state and faces to the right lower side, which can be understood that the adsorption plate 21 drives the substrate 10 to turn 180 degrees together.
Further, in this embodiment, after the substrate 10 is turned over, the air cleaning device 30 starts to operate, the air cleaning device 30 moves on the side surface or the lower portion of the substrate 10, meanwhile, the air cleaning device 30 is provided with a row of spraying holes 31 on the side surface facing the side surface of the substrate 10, the spraying holes 31 continuously spray air together, the air removes the foreign matters attached to the surface of the substrate 10, the air cleaning device 30 reciprocates on the side surface or the lower portion of the substrate 10 and continuously cleans the surface of the substrate 10, after the cleaning is finished, the air cleaning device 30 stops moving, the adsorption plate 21 starts to turn over again, the substrate 10 turns over back to the initial state, the substrate 10 returns to the horizontal upward state again, meanwhile, the air suction device 214 stops sucking air, the adsorption plate 21 stops adsorbing the substrate 10 again, the cleaned substrate 10 is transferred from the adsorption plate 21 to the second conveyor belt 42 again through the conveyor wheels, the cleaned substrate 10 is transported by the second conveyor 42 and then proceeds to the next process.
Optionally, in this embodiment, the conveying end surfaces of the first conveyor belt 41 and the second conveyor belt 42 and the first end surface 211 of the substrate surface cleaning device 1 are flush with each other, so that it can be ensured that the substrate 10 moves on a relatively flat plane all the time in the conveying process, and the damage of the substrate 10 due to height drop is avoided.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. A substrate surface cleaning apparatus, comprising:
adsorption equipment and air current cleaning device, wherein, the adsorption equipment includes: an adsorption plate and revolution mechanic for adsorbing the base plate, revolution mechanic with the adsorption plate is connected, revolution mechanic is used for making the adsorption plate upset, air current cleaning device with adsorption equipment corresponds the setting, works as the base plate quilt the adsorption plate adsorbs and passes through revolution mechanic upset to the level when downwards, air current cleaning device along the adsorption plate removes to blow off the air current extremely the base plate, the direction that the air current flows with it is non-perpendicular between the surface of base plate.
2. The apparatus of claim 1, wherein the gas flow cleaning device has a plurality of spraying holes arranged on a side of the gas flow cleaning device facing the adsorption plate, the spraying holes being uniformly arranged on the gas flow cleaning device, and the gas flow cleaning device is reciprocally movable in a horizontal direction on a side surface of the adsorption plate.
3. The apparatus of claim 2, wherein the gas flow cleaning device is located below the adsorption device, and when the adsorption plate is turned upside down, the gas flow cleaning device moves in a horizontal direction below the adsorption plate, and the injection holes inject the gas flow obliquely upward to the surface of the substrate.
4. The apparatus of claim 2, wherein the gas flow cleaning device is located at a horizontal side of the adsorption device, and when the adsorption plate is turned upside down, the gas flow cleaning device moves along the side of the adsorption plate, and the jet holes jet the gas flow closely attached to the surface of the substrate toward the substrate.
5. The substrate surface cleaning apparatus according to claim 3, wherein the gas flow cleaning device is provided in plurality and disposed on both left and right sides of the adsorption device, respectively, and the plurality of gas flow cleaning devices are simultaneously movable on both sides of the adsorption device and eject gas flows toward the surface of the substrate.
6. The device for cleaning the surface of the substrate according to claim 2, wherein the adsorption plate has a first end surface and a second end surface, wherein the first end surface is used for adsorbing the substrate, the second end surface is located at the opposite side of the first end surface, a plurality of through holes are arranged on the adsorption plate, the through holes are uniformly arranged on the adsorption plate, and the through holes are communicated with the first end surface and the second end surface.
7. The apparatus for cleaning the surface of the substrate according to claim 6, wherein a plurality of air-extracting devices are disposed on the second end surface, one end of each air-extracting device covers the through hole, and the air-extracting devices are used for extracting air inside the through hole, so that the substrate is adsorbed on the first end surface.
8. The apparatus of claim 7, wherein a buffer pad is disposed in the through hole, a portion of the buffer pad is disposed on an inner wall of the aperture of the through hole, and another portion of the buffer pad protrudes from the through hole and is attached to the surface of the first end face.
9. The apparatus of claim 8, wherein the rotating structure is a rotating shaft, the rotating shaft is disposed inside the suction plate, an axis of the rotating shaft is parallel to a center of the suction plate, and the rotating shaft is close to the second end surface.
10. A cleaning apparatus, comprising: a conveyor and the apparatus for cleaning a surface of a substrate as claimed in any one of claims 1 to 9, wherein the conveyor comprises: the substrate surface cleaning device is positioned between the first conveyor belt and the second conveyor belt, and a first end face of the substrate surface cleaning device is flush with the conveying end faces of the first conveyor belt and the second conveyor belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920737956.8U CN210121596U (en) | 2019-05-22 | 2019-05-22 | Substrate surface cleaning device and cleaning equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920737956.8U CN210121596U (en) | 2019-05-22 | 2019-05-22 | Substrate surface cleaning device and cleaning equipment |
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| CN210121596U true CN210121596U (en) | 2020-03-03 |
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| CN201920737956.8U Active CN210121596U (en) | 2019-05-22 | 2019-05-22 | Substrate surface cleaning device and cleaning equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113731905A (en) * | 2021-07-23 | 2021-12-03 | 星源电子科技(深圳)有限公司 | Cleaning and drying equipment for processing light guide plate |
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2019
- 2019-05-22 CN CN201920737956.8U patent/CN210121596U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113731905A (en) * | 2021-07-23 | 2021-12-03 | 星源电子科技(深圳)有限公司 | Cleaning and drying equipment for processing light guide plate |
| CN113731905B (en) * | 2021-07-23 | 2022-07-01 | 星源电子科技(深圳)有限公司 | Cleaning and drying equipment for processing light guide plate |
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Address after: No. 1778, Qinglan Road, Huangjia Street, Shuangliu District, Chengdu, Sichuan 610200 Patentee after: Chengdu BOE Display Technology Co.,Ltd. Country or region after: China Address before: No. 1778, Qinglan Road, Gongxing street, Shuangliu District, Chengdu, Sichuan 610200 Patentee before: CHENGDU ZHONGDIAN PANDA DISPLAY TECHNOLOGY Co.,Ltd. Country or region before: China |