CN210120494U - High-heat-dissipation-performance vehicle-mounted high-power inverter - Google Patents
High-heat-dissipation-performance vehicle-mounted high-power inverter Download PDFInfo
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- CN210120494U CN210120494U CN201921199497.9U CN201921199497U CN210120494U CN 210120494 U CN210120494 U CN 210120494U CN 201921199497 U CN201921199497 U CN 201921199497U CN 210120494 U CN210120494 U CN 210120494U
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- circuit board
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- inverter circuit
- mos pipe
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Abstract
The utility model relates to an on-vehicle high-power dc-to-ac converter of high heat dispersion, including heat dissipation shell and inverter circuit board, the last integration of inverter circuit board has the electronic components who constitutes inverter circuit, and electronic components includes the MOS pipe of paster shape, and the heat dissipation shell includes drain pan and lid shell, and the drain pan forms the holding chamber that holds components and parts on inverter circuit board and the inverter circuit board with the mutual lock of lid shell, and the MOS pipe is on horizontal mode setting and the inverter circuit board, set up the window of stepping down that corresponds with the main part position of MOS pipe on the inverter circuit board, in the main part of MOS pipe stretches into the window of stepping down, the radiating surface up and the lid shell laminating of the main part of MOS pipe, the radiating surface down and the drain pan laminating of the main part of MOS pipe. Has the advantages of reasonable structural design and good heat dissipation effect.
Description
Technical Field
The utility model relates to an on-vehicle dc-to-ac converter.
Background
The inverter converts direct current electric energy into alternating current, is commonly used in automobiles, can convert DC12V into AC220V alternating current with the same commercial power, is used for common electric appliances, and is a convenient power converter for vehicles. One of the main power devices in the existing inverter is an MOS transistor welded on a circuit board, but the heat dissipation structure of the existing MOS transistor is unreasonable in design, resulting in poor heat dissipation effect.
Disclosure of Invention
The utility model discloses the invention purpose: for overcoming the defect that prior art exists, the utility model provides a structural design is reasonable, the on-vehicle dc-to-ac converter that the radiating effect is good.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model provides a high heat dispersion vehicle-mounted high-power inverter, includes heat dissipation shell and inverter circuit board, and the integration on the inverter circuit board has the electronic components who constitutes inverter circuit, and electronic components includes the MOS pipe of paster shape, and the heat dissipation shell includes drain pan and lid shell, and the mutual lock of drain pan and lid shell forms the holding chamber that holds components and parts on inverter circuit board and the inverter circuit board, its characterized in that: the MOS pipe be the horizontal mode set up with on the inverter circuit board, set up the window of stepping down that corresponds with the main part position of MOS pipe on the inverter circuit board, the main part of MOS pipe stretches into in the window of stepping down, the major part's of MOS pipe radiating surface up and the laminating of lid shell, the main part's of MOS pipe radiating surface down and drain pan laminating.
By adopting the technical scheme, the upper and lower radiating surfaces of the main body part of the MOS tube are attached to the radiating shell, so that contact radiating is realized, the radiating performance of the radiating shell is effectively utilized, and the radiating device has the advantage of good radiating effect.
Preferably, the heat conduction silica gel pads are respectively clamped between the upward radiating surface of the main body part of the MOS tube and the inner wall of the cover shell and between the downward radiating surface of the main body part of the MOS tube and the inner wall of the bottom shell. Under this structural design, realize forming good heat conduction contact between MOS pipe and the heat dissipation shell, guarantee heat dispersion.
Preferably, integrated into one piece is to the bellied MOS pipe laminating boss in holding chamber on the lid shell, and corresponding lid shell outside is sunken in the formation of MOS pipe laminating boss department of correspondence, is equipped with radiating fin in this is sunken, and the main part radiating surface and the laminating boss of MOS pipe are laminated to the major part of MOS pipe radiating surface up. Under this structural design, the lid shell corresponds MOS pipe position and adopts concave-convex structure design, and MOS pipe laminating boss can make the lid shell better press close to the MOS pipe and realize laminating heat conduction, sets up radiating fin in the sunken of corresponding formation, improves the radiating effect, and radiating fin locates in sunken, has compact structure's advantage.
Preferably, the bottom case is integrally formed with an MOS tube support boss protruding toward the accommodating cavity, a concave portion is formed at a position corresponding to the MOS tube support boss on the outer side of the corresponding bottom case, a heat dissipation rib plate is arranged in the concave portion, and a downward heat dissipation surface of the main body of the MOS tube is attached to the MOS tube support boss. Under this structural design, the drain pan corresponds MOS pipe position and adopts concave-convex structure design, can make the drain pan better press close to the MOS pipe and realize laminating heat conduction, sets up heat dissipation gusset in the concave part of corresponding formation, improves the radiating effect, and in heat dissipation gusset locates the concave part, has compact structure's advantage.
Preferably, the MOS transistor is disposed at an edge of the inverter circuit board. Under this structural design, have simple structure for processing shaping convenience's advantages such as concave-convex structure on window, the lid shell on the contravariant circuit board.
Preferably, the outer side wall of the bottom shell and the outer side wall of the cover shell are provided with heat dissipation convex ribs. Under this structural design, improve the heat radiating area of heat dissipation shell, improve the radiating effect.
Preferably, the edge of the bottom shell is provided with an annular buckling outer step groove, the edge of the cover shell is provided with a buckling inner step groove matched with the buckling outer step groove, and the buckling outer step groove of the bottom shell is in buckling fit with the buckling inner step groove of the cover shell. Under this structural design, lid shell and drain pan lock are sealed reliable, have good dustproof sealing performance.
Preferably, the mouth of the bottom shell is provided with a wire outlet notch, the upper opening of the wire outlet notch is sealed by the cover shell, the middle part of the wire outlet notch is provided with a positioning convex finger, the wire outlet notch is provided with a wire outlet sealing rubber seat in a positioning manner, the wire outlet sealing rubber seat is provided with an input wire passing hole and an output wire passing hole through which an input wire and an output wire on the inverter circuit board pass, and the wire outlet sealing rubber seat is provided with a positioning slot matched with the positioning convex finger between the input wire passing hole and the output. Under this structural design, the sealed rubber seat of being qualified for the next round of competitions realizes that input line and output line on the inverter circuit board are sealed to pass and are protected, and the notch of being qualified for the next round of competitions realizes the location of the sealed rubber seat of being qualified for the next round of competitions fixed, because supply input line and output line on the inverter circuit board to pass simultaneously on the sealed rubber seat of being qualified for the next round of competitions, horizontal length is longer, under the design of location protruding finger for the sealed rubber seat installation of.
Preferably, the bottom shell and the cover shell are aluminum shells. With the structural design, the aluminum shell has excellent heat dissipation performance and machinability.
The present invention will be further described with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic structural view of a high heat dissipation performance vehicle-mounted high-power inverter according to an embodiment of the present invention;
fig. 2 is an exploded view of the inverter circuit board and the bottom cover according to the embodiment of the present invention (the output line and the input line on the inverter circuit board are omitted);
FIG. 3 is a schematic view of a top case structure according to an embodiment of the present invention;
FIG. 4 is a schematic structural view of a bottom view of the bottom shell according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a bottom case according to an embodiment of the present invention.
Detailed Description
Referring to the attached drawings 1-5, the utility model discloses a high heat dissipation performance vehicle-mounted high-power inverter, which comprises a heat dissipation shell 1 and an inverter circuit board 2, wherein an electronic component 3 forming an inverter circuit is integrated on the inverter circuit board 2, the electronic component 3 comprises a patch-shaped MOS tube 3-1, of course, the electronic component 3 further comprises an inverter main body 3-2, a capacitor 3-3, a magnetic induction coil 3-4 and the like, the inverter circuit on the inverter circuit board 2 is conventional in the field, therefore, the type of the electronic component 3 on the inverter circuit board 2 is well known by those skilled in the art, which is not an innovation point created by the invention, and is not repeated, the heat dissipation shell 1 comprises a bottom shell 1-1 and a cover shell 1-2, the bottom shell 1-1 and the cover shell 1-2 are mutually buckled to form an accommodating cavity for accommodating the inverter circuit board 2 and the inverter circuit board 2, the MOS tube 3-1 is horizontally arranged on the inverter circuit board 2, the inverter circuit board 2 is provided with a yielding window 21 corresponding to the main part 3-11 of the MOS tube 3-1, the main part 3-11 of the MOS tube 3-1 extends into the yielding window 21, the upward heat dissipation surface of the main part 3-11 of the MOS tube 3-1 is attached to the cover shell 1-2, and the downward heat dissipation surface of the main part 3-11 of the MOS tube 3-1 is attached to the bottom shell 1-1. The upper and lower radiating surfaces of the main body part 3-11 of the MOS tube 3-1 are attached to the radiating shell 1, so that contact radiating is realized, the radiating performance of the radiating shell 1 is effectively utilized, and the radiating device has the advantage of good radiating effect.
And heat-conducting silica gel pads 4 are respectively clamped between the upward radiating surface of the main part 3-11 of the MOS tube 3-1 and the inner wall of the cover shell 1-2 and between the downward radiating surface of the main part 3-11 of the MOS tube 3-1 and the inner wall of the bottom shell 1-1. Good heat conduction contact between the MOS tube 3-1 and the heat dissipation shell 1 is achieved, and heat dissipation performance is guaranteed.
The cover shell 1-2 is integrally formed with an MOS tube attaching boss 1-21 protruding towards the accommodating cavity, a recess 1-22 is formed at the corresponding position of the MOS tube attaching boss 1-21 on the outer side of the corresponding cover shell 1-2, a radiating fin 1-23 is arranged in the recess 1-22, and the upward radiating surface of the main body part 3-11 of the MOS tube 3-1 is attached to the MOS tube attaching boss 1-21. Under the structural design, the position of the cover shell 1-2 corresponding to the MOS tube 3-1 is designed to be a concave-convex structure, the MOS tube attaching boss 1-21 can enable the cover shell 1-2 to be better close to the MOS tube 3-1 to realize attaching heat conduction, the heat radiating fins 1-23 are arranged in the correspondingly formed recess 1-22, the heat radiating effect is improved, and the heat radiating fins 1-23 are arranged in the recess 1-22, so that the structure has the advantage of compact structure. And the MOS tube 3-1 is arranged at the edge position of the inverter circuit board 2. Accordingly, the recesses 1 to 22 are located at the side edges of the cover shells 1 to 2, and the window is a notch groove located at the side edge of the inverter circuit board 2, so that the inverter circuit board 2 has the advantage of being convenient to machine and form, such as the window on the inverter circuit board 2 and the concave-convex structure on the cover shells 1 to 2.
An MOS tube supporting boss 1-11 protruding towards the accommodating cavity is integrally formed on the bottom shell 1-1, a concave part 1-12 is formed at the corresponding position of the MOS tube supporting boss 1-11 at the outer side of the corresponding bottom shell 1-1, a heat dissipation rib plate 1-13 is arranged in the concave part 1-12, and a downward heat dissipation surface of a main body part 3-11 of the MOS tube 3-1 is attached to the MOS tube supporting boss 1-11. The concave-convex structural design is adopted at the position of the bottom shell 1-1 corresponding to the MOS tube 3-1, so that the bottom shell 1-1 can be better close to the MOS tube 3-1 to realize the attaching heat conduction, the heat dissipation rib plates 1-13 are arranged in the correspondingly formed concave parts 1-12, the heat dissipation effect is improved, and the heat dissipation rib plates 1-13 are arranged in the concave parts 1-12, so that the structure is compact.
The inverter main body 3-2 is horizontally arranged on the inverter circuit board 2, the inverter main body 3-2 is arranged on the inverter circuit board 2 in an overhead mode, contact convex seats 1-24 which are opposite to the inverter main body 3-2 are arranged on the cover shell 1-2 in a protruding mode in the accommodating cavity, grooves 1-241 are formed in the contact convex seats 1-24, heat-conducting silica gel pads 5 of the inverter main body are arranged in the grooves 1-241, and the top of the inverter main body 3-2 is supported on the grooves 1-241 of the contact convex seats 1-24 through the heat-conducting silica gel pads 5 of the inverter main body. The inverter main body 3-2 is horizontally placed, so that the main radiating surface of the inverter main body 3-2 faces the cover shell 1-2, the contact convex seats 1-24 ensure that the cover shell 1-2 and the inverter main body 3-2 can form good contact in the spatial distance, and meanwhile, a good radiating space is formed in the accommodating cavity, the inverter main body heat-conducting silica gel pad 5 can realize the flexible contact between the inverter main body 3-2 and the contact convex seats 1-24, ensure the reliable heat-conducting contact, the grooves 1-241 can adapt to the shape of the inverter main body 3-2, so that the inverter main body heat-conducting silica gel pad 5 and the inverter main body 3-2 form good heat-conducting contact, in addition, the grooves 1-241 can position and fix the inverter main body 3-2, so that the inverter circuit board 2 of the inverter is impacted by external force and reduced.
Further, the contact boss 1-24 includes a middle protrusion 1-242 and lateral protrusions 1-243 located at both sides of the middle protrusion 1-242, the lateral protrusions are higher than the middle protrusion 1-242 to form the groove 1-241, the lateral protrusions 1-243 correspond to the silicon steel sheet frame portion 3-21 of the inverter main body 3-2, the middle protrusion 1-242 corresponds to the coil portion 3-22 of the inverter main body 3-2, and a surface 1-2411 of the middle protrusion 1-242 located in the groove 1-241 is a concave arc shape. The contact convex seats 1-24 are designed by adopting middle convex blocks 1-242 and lateral convex blocks 1-243 corresponding to the coil parts 3-22 and the coil frame parts 3-21 of the inverter main body 3-2, so that the heat conduction contact is good, the concave arc surfaces are better suitable for the positioning contact of the coil parts 3-22 of the inverter main body 3-2, and the middle convex blocks 1-242 and the lateral convex blocks 1-243 are convenient for processing and molding the contact convex seats 1-24.
For other power devices, heat conduction contact bosses 1-25 respectively corresponding to the capacitors 3-3 and the magnetic induction coils 3-4 are protruded on the cover shell 1-2 towards the accommodating cavity, and the capacitors 3-3 and the magnetic induction coils 3-4 are in heat conduction fit with the corresponding heat conduction contact bosses 1-25 through heat conduction silica gel pads 4. The contact heat conduction of the capacitor 3-3 and the magnetic induction coil 3-4 is realized, and the heat conduction effect is improved.
In order to improve the heat dissipation effect of the inverter circuit board 2, circuit board supporting bumps 1-14 are protruded from the bottom case 1-1 towards the accommodating cavity, the circuit board supporting bumps 1-14 comprise edge supporting bumps 1-141 positioned at the edge of the inner cavity of the bottom case 1-1 and central supporting bumps 1-142 positioned in the middle, the inverter circuit board 2 is erected on the bottom case 1-1 through the circuit board supporting bumps 1-14, a space frame space is formed between the inverter circuit board 2 and the inner bottom surface of the bottom case 1-1, and an insulating plate 7 is arranged in the space frame space. The inverter circuit board 2 is mounted overhead, the heat dissipation effect of the inverter circuit board 2 is improved, and the insulation board realizes insulation protection. Screw holes are arranged on the edge supporting convex blocks 1-141, and the inverter circuit board 2 is locked and fixed by screws. The height dimension of the MOS tube supporting boss 1-11 is matched with the height dimension of the circuit board supporting boss 1-14, and the matched dimension is that the MOS tube supporting boss 1-11 can be reliably attached to the bottom shell 1-1 after the inverter circuit board 2 is overhead.
In order to improve the heat dissipation effect, heat dissipation convex ribs 1-16 and 1-26 are arranged on the outer side wall of the bottom shell 1-1 and the outer side wall of the cover shell 1-2. The heat dissipation area of the heat dissipation shell 1 is increased, and the heat dissipation effect is improved. The bottom shell 1-1 and the cover shell 1-2 are aluminum shells. The aluminum case has excellent heat dissipation performance and workability.
In this embodiment, the edge of the bottom case 1-1 is provided with an annular buckling outer step groove 1-17, the edge of the cover case 1-2 is provided with a buckling inner step groove 1-27 adapted to the buckling outer step groove 1-17, and the buckling outer step groove 1-17 of the bottom case 1-1 is in buckling fit with the buckling inner step groove 1-27 of the cover case 1-2. The cover shell 1-2 and the bottom shell 1-1 are buckled and sealed reliably, and the dustproof sealing performance is good.
The mouth of the bottom shell 1-1 is provided with wire outlet notches 1-18, the upper mouths of the wire outlet notches 1-18 are sealed by cover shells 1-2, the middle parts of the wire outlet notches 1-18 are provided with positioning convex fingers 1-19, the wire outlet notches 1-18 are provided with wire outlet sealing rubber seats 6 in a positioning mode, the wire outlet sealing rubber seats 6 are provided with input wire through holes 61 and output wire through holes 62 for input wires and output wires on the inverter circuit board 2 to pass through, and positioning slots matched with the positioning convex fingers 1-19 are arranged between the input wire through holes and the output wire through holes of the wire outlet sealing rubber seats 6. The outgoing line sealing rubber seat 6 realizes the sealing and passing and protection of the input line and the output line on the inverter circuit board 2, the outgoing line notches 1-18 realize the positioning and fixing of the outgoing line sealing rubber seat 6, the outgoing line sealing rubber seat 6 is simultaneously used for the input line and the output line on the inverter circuit board 2 to pass through, the transverse length is long, and the outgoing line sealing rubber seat 6 is more firmly and reliably installed under the design of the positioning convex fingers 1-19.
Claims (10)
1. The utility model provides a high heat dispersion vehicle-mounted high-power inverter, includes heat dissipation shell and inverter circuit board, and the integration on the inverter circuit board has the electronic components who constitutes inverter circuit, and electronic components includes the MOS pipe of paster shape, and the heat dissipation shell includes drain pan and lid shell, and the mutual lock of drain pan and lid shell forms the holding chamber that holds components and parts on inverter circuit board and the inverter circuit board, its characterized in that: the MOS pipe be the horizontal mode set up with on the inverter circuit board, set up the window of stepping down that corresponds with the main part position of MOS pipe on the inverter circuit board, the main part of MOS pipe stretches into in the window of stepping down, the major part's of MOS pipe radiating surface up and the laminating of lid shell, the main part's of MOS pipe radiating surface down and drain pan laminating.
2. The vehicle-mounted high-power inverter with high heat dissipation performance according to claim 1, characterized in that: and heat-conducting silica gel pads are respectively clamped between the upward radiating surface of the main body part of the MOS tube and the inner wall of the cover shell and between the downward radiating surface of the main body part of the MOS tube and the inner wall of the bottom shell.
3. The vehicle-mounted high-power inverter with high heat dissipation performance according to claim 1 or 2, characterized in that: the lid shell is gone up the bellied MOS pipe laminating boss in integrated into one piece to the holding chamber, and corresponding lid shell outside is sunken in the formation of MOS pipe laminating boss department of corresponding, is equipped with radiating fin in this is sunken, and the main part radiating surface and the laminating boss of MOS pipe are laminated to the major part of MOS pipe radiating surface up.
4. The vehicle-mounted high-power inverter with high heat dissipation performance according to claim 1 or 2, characterized in that: the MOS tube supporting boss protruding towards the accommodating cavity is integrally formed on the bottom shell, a concave portion is formed at the position, corresponding to the MOS tube supporting boss, of the outer side of the corresponding bottom shell, a heat dissipation rib plate is arranged in the concave portion, and the downward heat dissipation surface of the main body part of the MOS tube is attached to the MOS tube supporting boss.
5. The vehicle-mounted high-power inverter with high heat dissipation performance according to claim 3, characterized in that: the MOS tube supporting boss protruding towards the accommodating cavity is integrally formed on the bottom shell, a concave portion is formed at the position, corresponding to the MOS tube supporting boss, of the outer side of the corresponding bottom shell, a heat dissipation rib plate is arranged in the concave portion, and the downward heat dissipation surface of the main body part of the MOS tube is attached to the MOS tube supporting boss.
6. The vehicle-mounted high-power inverter with high heat dissipation performance according to claim 1, characterized in that: the MOS tube is arranged at the edge position of the inverter circuit board.
7. The vehicle-mounted high-power inverter with high heat dissipation performance according to claim 1, characterized in that: and heat dissipation convex ribs are arranged on the outer side wall of the bottom shell and the outer side wall of the cover shell.
8. The vehicle-mounted high-power inverter with high heat dissipation performance according to claim 1, characterized in that: the edge of the bottom shell is provided with an annular buckling outer step groove, the edge of the cover shell is provided with a buckling inner step groove matched with the buckling outer step groove, and the buckling outer step groove of the bottom shell is in buckling fit with the buckling inner step groove of the cover shell.
9. The vehicle-mounted high-power inverter with high heat dissipation performance according to claim 1, characterized in that: the improved inverted circuit board is characterized in that a wire outlet notch is formed in the opening of the bottom shell, the upper opening of the wire outlet notch is sealed through the cover shell, a positioning convex finger is arranged in the middle of the wire outlet notch, a wire outlet sealing rubber seat is installed in the wire outlet notch in a positioning mode, an input wire passing hole and an output wire passing hole through which an input wire and an output wire on the inverted circuit board pass are formed in the wire outlet sealing rubber seat, and a positioning slot matched with the positioning convex finger is formed in the wire outlet sealing rubber seat between the input.
10. The vehicle-mounted high-power inverter with high heat dissipation performance according to claim 1, characterized in that: the bottom shell and the cover shell are aluminum shells.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921199497.9U CN210120494U (en) | 2019-07-26 | 2019-07-26 | High-heat-dissipation-performance vehicle-mounted high-power inverter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921199497.9U CN210120494U (en) | 2019-07-26 | 2019-07-26 | High-heat-dissipation-performance vehicle-mounted high-power inverter |
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| Publication Number | Publication Date |
|---|---|
| CN210120494U true CN210120494U (en) | 2020-02-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921199497.9U Active CN210120494U (en) | 2019-07-26 | 2019-07-26 | High-heat-dissipation-performance vehicle-mounted high-power inverter |
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| CN (1) | CN210120494U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747752A (en) * | 2021-08-06 | 2021-12-03 | 诚远电子(苏州)有限公司 | Automobile fan controller with good heat dissipation |
| CN113784552A (en) * | 2021-08-06 | 2021-12-10 | 诚远电子(苏州)有限公司 | Automobile fan controller |
-
2019
- 2019-07-26 CN CN201921199497.9U patent/CN210120494U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747752A (en) * | 2021-08-06 | 2021-12-03 | 诚远电子(苏州)有限公司 | Automobile fan controller with good heat dissipation |
| CN113784552A (en) * | 2021-08-06 | 2021-12-10 | 诚远电子(苏州)有限公司 | Automobile fan controller |
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