CN219627573U

CN219627573U - Miniature photovoltaic inverter

Info

Publication number: CN219627573U
Application number: CN202320045979.9U
Authority: CN
Inventors: 季德海; 陈龙; 夏金锁
Original assignee: NINGBO DEYE FREQUENCY CONVERSION TECHNOLOGY CO LTD
Current assignee: NINGBO DEYE FREQUENCY CONVERSION TECHNOLOGY CO LTD
Priority date: 2023-01-05
Filing date: 2023-01-05
Publication date: 2023-09-01
Anticipated expiration: 2033-01-05

Abstract

The miniature photovoltaic inverter comprises a shell, a cover plate of the shell and a circuit board fixedly arranged in the shell, wherein radiating ribs are arranged on the outer wall of the shell; the circuit board comprises a PCB substrate and heating elements arranged on the front side and the back side of the PCB substrate, a plurality of corresponding bosses are respectively arranged on the bottom wall in the shell, and each boss has a shape and a height corresponding to the corresponding heating element; when in assembly, each heating element arranged on the back surface of the circuit board is directly attached to each corresponding boss; the PCB substrate is provided with a hollowed-out notch at the position where the heating element is arranged on the front surface, and each heating element arranged on the front surface of the circuit board is attached to each corresponding boss penetrating through the PCB substrate through the hollowed-out notch; the miniature photovoltaic inverter has good heat radiation performance, compact and reasonable structural layout, convenient assembly and manufacture, convenient operation and use, and reasonable solutions for the problems of hanging, moisture and dust prevention, installation and fixation of a circuit board and the like of the miniature photovoltaic inverter are provided.

Description

Miniature photovoltaic inverter

Technical Field

The utility model belongs to the technical field of solar photovoltaic power generation, and relates to a miniature photovoltaic inverter, in particular to a miniature photovoltaic inverter with power of 1KW to 2KW and a radiating structure thereof.

Background

Along with the gradual shortage of energy and the gradual aggravation of environmental pollution, clean energy and renewable energy become the fields of important development of various countries in the world at present, wherein the photovoltaic power generation technology is more and more valued and welcome by people because of the advantages of green, environmental protection, renewable and the like. In the photovoltaic power generation technology, an inverter for converting direct-current electric energy generated by a photovoltaic module into alternating-current electric energy is a key component of the whole photovoltaic power generation technology.

The numerous heating devices in the photovoltaic inverter circuit are a difficult problem for the design of the photovoltaic inverter in terms of how to reduce the heating of the photovoltaic inverter and improve the heat dissipation efficiency. Current photovoltaic inverter products pursue higher energy densities while requiring smaller size and lighter weight inverters. Under such conditions, there are higher demands placed on the design of the heat sink. The back of the photovoltaic inverter with common size is specially provided with a radiator which is equivalent to the body volume of the photovoltaic inverter, the micro photovoltaic inverter is usually smaller in size and lighter in weight and is required to have the power of below 2000W, the photovoltaic inverter is not suitable for specially arranging the radiator, and the micro photovoltaic inverter circuit has the same device with heating temperature which is not allowed to exceed the rated value although the heating device is relatively less and the heating value is relatively less, so that the heat dissipation problem is also required to be solved.

In order to achieve more efficient heat dissipation, the existing micro photovoltaic inverter generally adopts an increased heat dissipation area, or adopts a space in the micro photovoltaic inverter to be increased so as to accelerate heat dissipation, and adopts a fan with higher performance to solve the heat dissipation problem. However, the above method causes problems such as increased size and cost of the product, troublesome installation, etc.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, the technical problem to be solved by the present utility model is to provide a miniature photovoltaic inverter with compact and reasonable structure, good heat dissipation and convenient assembly and use.

The technical scheme adopted by the miniature photovoltaic inverter is as follows:

the miniature photovoltaic inverter comprises a shell, a cover plate thereof and a circuit board fixedly arranged in the shell, wherein the shell is made of metal with good heat conduction performance, the circuit board comprises a PCB substrate and devices arranged on the PCB substrate, the devices comprise heating parts which can generate heat when being electrified and work, the heating parts arranged on the front surface of the circuit board and the heating parts arranged on the back surface of the circuit board, and the miniature photovoltaic inverter is characterized in that a plurality of corresponding bosses are respectively arranged on the bottom wall in the shell, each boss has a shape and a height corresponding to the corresponding heating parts, and radiating ribs are arranged on the outer wall of the shell; when in assembly, each heating element arranged on the back surface of the circuit board is respectively and directly attached to each corresponding boss on the inner bottom wall of the shell; the PCB substrate is provided with a hollowed-out notch at the position where the heating parts are arranged on the front surface, and each heating part arranged on the front surface of the circuit board is attached to each corresponding boss penetrating through the PCB substrate through the hollowed-out notch.

The further scheme is as follows:

the heating elements are ordered according to the heating value of a single element or the surface temperature during working, the heating elements sequentially comprise a first heating element, a second heating element, a third heating element and a fourth heating element, and correspondingly, the boss on the bottom wall in the shell comprises a first boss, a second boss, a third boss and a fourth boss, the number of the first heating element, the second heating element, the third heating element, the fourth heating element and the first boss, the second boss, the third boss and the fourth boss is at least 1, and during assembly, the first heating element, the second heating element, the third heating element, the fourth heating element and the corresponding first boss, the second boss, the third boss and the fourth boss are sequentially attached.

The heating element arranged on the front surface of the circuit board is a high-frequency transformer serving as a third heating element, the heating element arranged on the back surface of the circuit board is a silicon carbide diode serving as a first heating element, a MOS (metal oxide semiconductor) tube serving as a second heating element, and a silicon controlled switch tube and an IGBT (insulated gate bipolar transistor) tube serving as a fourth heating element.

And a heat conduction silica gel gasket is arranged between the heating piece of the circuit board and the boss on the bottom wall in the shell during assembly.

During assembly, heat conduction silicone grease is filled between the heating element of the circuit board and the boss on the bottom wall in the shell.

The shell is provided with frames around, each side frame is provided with at least 1 threaded hole, and the corresponding positions of the cover plate close to the edges are provided with connecting holes and are connected by configuration screws.

The shell is provided with a reinforcing block below the frame where the threaded holes are located, and the threaded holes are formed downwards along the reinforcing block.

The shell frame is provided with a groove along the inner circumference of the shell frame, and a sealing strip is embedded in the groove.

An extension plate is additionally arranged on one side frame of the shell, and the extension plate is provided with hanging holes for hanging or fixing the micro photovoltaic inverter on a photovoltaic plate or other objects.

The circuit board is characterized in that at least 1 reinforcing column is arranged at the side close to each side of the inner bottom surface of the shell, each reinforcing column is provided with a threaded hole, connecting holes are formed in corresponding positions of the periphery of the circuit board, the connecting holes are connected by the screws, and the screws penetrate through the connecting holes of the circuit board and are screwed into the threaded holes, so that the circuit board is fixedly installed in the shell.

After the circuit board is installed and fixed, the organic silicon heat conduction sealing glue is poured downwards from the upper direction of the circuit board, so that the whole machine cavity is filled with the organic silicon heat conduction sealing glue, and the cover plate is additionally installed after solidification.

The device on the circuit board comprises cylindrical capacitors which are respectively arranged at four corners of the PCB substrate, rectangular notches are respectively formed at the four corners of the PCB substrate, leads of the capacitors are led out from the front surface of the circuit board, and the capacitors are respectively positioned at the rectangular notches and are electrically connected with the PCB substrate and are in positioning connection with the capacitors by virtue of the leads of the capacitors; such that each capacitor is mostly above the PCB substrate and a small part below the PCB substrate.

The miniature photovoltaic inverter shell is formed by die casting metal aluminum, and because the metal aluminum has good heat conduction performance, the aluminum die casting shell is utilized to have good heat dissipation performance, and the boss is arranged on the bottom wall in the shell, so that the heating piece of the circuit board is attached to the boss on the bottom wall in the shell during assembly, and the heat of the heating piece of the circuit board is dissipated through the outer surface of the shell. The PCB substrate of the miniature photovoltaic inverter circuit board is provided with the hollowed-out notch at the position where the heating element is arranged on the front surface, and each heating element arranged on the front surface of the circuit board is attached to each corresponding boss penetrating through the PCB substrate through the hollowed-out notch so as to enhance the heat conducting performance of the PCB substrate. The miniature photovoltaic inverter has good heat radiation performance.

The miniature photovoltaic inverter has compact and reasonable structural layout, is convenient to assemble and manufacture, and is convenient for users to operate and use. In addition, the miniature photovoltaic inverter also provides a reasonable solution for the problems of hanging, moisture and dust prevention, circuit board installation and fixation and the like of the photovoltaic inverter. The radiator solution of the photovoltaic inverter of the utility model is particularly suitable for micro photovoltaic inverters with a power of 1300 to 2000W.

Drawings

Fig. 1 is a schematic perspective view of the whole cover plate of the micro photovoltaic inverter.

Fig. 2 is a schematic perspective view showing a hidden cover plate of the micro photovoltaic inverter.

Fig. 3 is a schematic rear perspective view of the micro photovoltaic inverter of the present utility model.

Fig. 4 is a schematic front perspective view of a circuit board.

Fig. 5 is a schematic perspective view of the back side of the circuit board.

Fig. 6 is a schematic front view of a PCB substrate of a circuit board.

Fig. 7 is a schematic view of the back side of a PCB substrate of a circuit board.

Fig. 8 is a schematic rear perspective view of the housing.

Fig. 9 is a schematic front perspective view of the housing.

Fig. 10 is a schematic front perspective view of the cover plate.

Reference numerals in the drawings: 1. a housing; 2. a cover plate; 3. a circuit board; 4. a PCB substrate; 6. radiating ribs; 7. emptying the notch; 8. a first boss; 9. a second boss; 10. a third boss; 11. a fourth boss; 12. a high frequency transformer; 13. a silicon carbide diode; a MOS tube; 15. a thyristor switching tube; an IGBT switching tube; 17. a frame; 18. a threaded hole; 19. a connection hole; 20. a screw; 21. a reinforcing block; 22. a groove; 23. an extension plate; 24. a hanging hole; 25. a reinforcing column; 26. a capacitor; 27. a rectangular notch; 28. and (5) a lead wire.

Detailed Description

Specific embodiments of the present utility model will be described below with reference to fig. 1 to 10.

The micro photovoltaic inverter has a power of 300 to 2000W, and the applicant sets 300 to 500W to a micro microcomputer type, 600 to 1000W to a medium microcomputer type, and 1300 to 2000W to a large microcomputer type. The heating parts of the built-in circuit board sequentially comprise a first heating part silicon carbide diode 13, a second heating part MOS tube 14, a third heating part high-frequency transformer 12, a fourth heating part silicon controlled switching tube 15 and an IGBT switching tube 16 according to the single heating value or the surface temperature sequence during working. The thicknesses of the first heating element silicon carbide diode 13, the second heating element MOS tube 14, the fourth heating element silicon controlled switch tube 15 and the IGBT switch tube 16 are thin, the sizes are small, and the first heating element MOS tube, the second heating element MOS tube and the IGBT switch tube can be arranged on the back of a circuit board so as to be attached to a boss on the inner bottom wall of the shell 1, so that heat of the heating element is emitted through the outer wall radiating ribs 6 of the shell 1. The third heat generating element, high frequency transformer 12, is thicker in thickness and larger in size and can only be arranged on the front surface of the circuit board. The small microcomputer with the power of 300W to 500W is provided with 2 high-frequency transformers 12, the middle microcomputer with the power of 600W to 1000W is provided with 4 high-frequency transformers 12, and the whole machine heating meets the standard requirement after test. And 1300W to 2000W are set as large microcomputer type 8 high-frequency transformers 12, and the whole machine heating exceeds the standard requirement after test. For this reason, it is necessary to try to solve this problem. The applicant has thus proposed the solution of the present utility model. The present utility model is mainly directed to a large microcomputer type of 1300W to 2000W as shown in fig. 1 to 10.

As shown in fig. 1, 2 and 3, the micro photovoltaic inverter of the present utility model includes a housing 1, a cover plate 2 thereof, and a circuit board 3 fixedly installed in the housing 1, wherein the housing 1 is made of metal having good heat conductivity.

As shown in fig. 4 and 5, the circuit board 3 includes a PCB substrate 4 and devices arranged on the PCB substrate 4, the devices including heat generating elements that generate heat when energized, including heat generating elements arranged on the front surface of the circuit board 3 and heat generating elements arranged on the back surface of the circuit board 3.

As shown in fig. 9, a plurality of corresponding bosses are respectively arranged on the inner bottom wall of the shell 1, each boss has a shape and a height corresponding to those of the corresponding heating element, and radiating ribs 6 are arranged on the outer wall of the shell 1. When in assembly, each heating element arranged on the back of the circuit board 3 is respectively and directly attached to each corresponding boss on the inner bottom wall of the shell 1. As shown in fig. 5, the PCB substrate 4 is provided with a hollowed-out notch 7 at the position where the heating element is arranged on the front surface, and each heating element arranged on the front surface of the circuit board 3 is attached to each corresponding boss penetrating through the PCB substrate 4 through the hollowed-out notch 7. To enhance its thermal conductivity. The housing 1 may be die cast from metallic aluminum. Because metal aluminum has good heat conduction performance, the aluminum die-casting shell body has good heat dissipation performance, through the boss arranged on the inner bottom wall of the shell body, the heating piece of the circuit board is attached to the boss on the inner bottom wall of the shell body during assembly, and the heat of the heating piece of the circuit board is dissipated through the outer wall heat dissipation rib 6 of the shell body 1. The miniature photovoltaic inverter has good heat radiation performance.

The heating elements are ordered according to the heating value of a single element or the surface temperature during working, and sequentially comprise a first heating element, a second heating element, a third heating element and a fourth heating element, correspondingly, the boss on the inner bottom wall of the shell 1 comprises a first boss 8, a second boss 9, a third boss 10 and a fourth boss 11, the first heating element, the second heating element, the third heating element and the fourth heating element are at least 1, and the first heating element, the second heating element, the third heating element and the fourth heating element are sequentially attached to the corresponding first boss 8, the second boss 9, the third boss 10 and the fourth boss 11 during assembly.

As shown in fig. 4, the heat generating component arranged on the front surface of the wiring board 3 is a high-frequency transformer 12 as a third heat generating component. As shown in fig. 5, the heat generating elements arranged on the back surface of the wiring board 3 are a silicon carbide diode 13 as a first heat generating element, a MOS transistor 14 as a second heat generating element, and a thyristor switching transistor 15 and an IGBT switching transistor 16 as a fourth heat generating element.

During assembly, a heat conduction silica gel gasket is arranged between the heating part of the circuit board 3 and the boss on the inner bottom wall of the shell 1.

During assembly, heat conduction silicone grease is also filled between the heating element of the circuit board 3 and the boss on the inner bottom wall of the shell 1.

As shown in fig. 9, a frame 17 is arranged around the shell 1, and each side frame 17 is provided with at least 1 threaded hole 18; as shown in fig. 10, the corresponding position of the cover plate 2 close to the edge is provided with a connecting hole 19, and is connected by a screw 20. As shown in fig. 8, the housing 1 is provided with a reinforcing block 21 below the frame 17 where the screw holes 18 are located, and the screw holes 18 are opened downward along the reinforcing block 21. As shown in fig. 9, the frame 17 of the housing 1 is provided with a groove 22 along the inner circumference thereof, and is embedded with a sealing strip. An extension plate 23 is additionally arranged on one side frame 17 of the shell 1, and the extension plate 23 is provided with a hanging hole 24 for hanging or fixing the micro photovoltaic inverter on a photovoltaic panel or other objects.

As shown in fig. 9, at least 1 reinforcing column 25 is disposed at the side of each side of the inner bottom surface of the casing 1, each reinforcing column 25 is provided with a threaded hole 18, the corresponding position of the periphery of the circuit board 3 is provided with a connecting hole 19, and is connected by a screw 20, the screw 20 passes through the connecting hole 19 of the circuit board 3 and is screwed into the threaded hole 18, so that the circuit board 3 is fixedly mounted in the casing 1.

After the circuit board 3 is installed and fixed, the organic silicon heat conduction sealing glue is poured downwards from the upper side of the circuit board 3, so that the whole machine cavity is filled with the organic silicon heat conduction sealing glue, and the cover plate 2 is additionally installed after solidification.

As shown in fig. 4 and 5, the device on the wiring board 3 includes columnar capacitors 26 arranged at four corners of the PCB substrate 4, respectively. As shown in fig. 6 and 7, rectangular notches 27 are formed at four corners of the PCB substrate 4. As shown in fig. 4 and 5, the leads 28 of the capacitor 26 are led out from the front surface of the circuit board 3, and the capacitor 26 is respectively positioned at the rectangular notch 27 and is electrically connected with the PCB substrate 4 and is in positioning connection with the capacitor 26 by virtue of the leads 28; such that each capacitor 26 is mostly above the PCB substrate 4 and a small part below the PCB substrate 4.

Claims

1. The utility model provides a miniature photovoltaic inverter, includes casing (1) and apron (2) and circuit board (3) of fixed mounting in casing (1), casing (1) are made by the metal that heat conductivility is good, and circuit board (3) include PCB base plate (4) and arrange the device on PCB base plate (4), the device include the work that can generate heat when circular telegram, including arrange in the positive of circuit board (3) generate heat piece with arrange in the back of circuit board (3) generate heat piece, characterized in that, be provided with corresponding polylith boss on the diapire respectively in casing (1), each boss has shape and height corresponding with corresponding piece that generates heat, the outer wall of casing (1) is provided with cooling fin (6); when in assembly, each heating element arranged on the back of the circuit board (3) is respectively and directly attached to each corresponding boss on the inner bottom wall of the shell (1); the PCB substrate (4) is provided with a hollowed-out notch (7) at the position where the heating parts are arranged on the front surface, and each heating part arranged on the front surface of the circuit board (3) is attached to each corresponding boss penetrating through the hollowed-out notch (7) on the PCB substrate (4).

2. The micro photovoltaic inverter according to claim 1, wherein the heating elements are ordered according to the heat productivity of the single element or the surface temperature during operation, and sequentially comprise a first heating element, a second heating element, a third heating element and a fourth heating element, and correspondingly, the boss on the inner bottom wall of the shell (1) comprises a first boss (8), a second boss (9), a third boss (10) and a fourth boss (11), the first heating element, the second heating element, the third heating element, the fourth heating element and the first boss (8), the second boss (9), the third boss (10) and the fourth boss (11) are all at least 1, and the first heating element, the second heating element, the third heating element, the fourth heating element and the corresponding first boss (8), the second boss (9), the third boss (10) and the fourth boss (11) are sequentially attached during assembly.

3. The micro photovoltaic inverter according to claim 1, wherein a heat conducting silica gel pad is arranged between the heat generating element of the circuit board (3) and the boss on the inner bottom wall of the housing (1) during assembly.

4. The micro photovoltaic inverter according to claim 1, wherein, during assembly, heat conduction silicone grease is filled between the heat generating element of the circuit board (3) and the boss on the inner bottom wall of the housing (1).

5. The miniature photovoltaic inverter according to claim 1, characterized in that the housing (1) is provided with a frame (17) around, each side frame (17) is provided with at least 1 threaded hole (18), and the corresponding position of the side of the cover plate (2) is provided with a connecting hole (19) and is connected by a configuration screw (20).

6. The micro photovoltaic inverter according to claim 1, wherein the devices on the circuit board (3) comprise cylindrical capacitors (26) respectively arranged at four corners of the PCB substrate (4), rectangular notches (27) are respectively formed at the four corners of the PCB substrate (4), leads (28) of the capacitors (26) are led out from the front surface of the circuit board (3), and the capacitors (26) are respectively positioned at the rectangular notches (27) and are electrically connected with the PCB substrate (4) and are in positioning connection with themselves by means of the leads (28); so that a major portion of each capacitor (26) is above the PCB substrate (4) and a minor portion is below the PCB substrate (4).

7. The micro photovoltaic inverter according to claim 2, wherein the heat generating element arranged on the front surface of the wiring board (3) is a high frequency transformer (12) as a third heat generating element, the heat generating element arranged on the back surface of the wiring board (3) is a silicon carbide diode (13) as a first heat generating element, a MOS transistor (14) as a second heat generating element, and a thyristor switching transistor (15) and an IGBT switching transistor (16) as a fourth heat generating element.

8. A micro photovoltaic inverter according to claim 3, characterized in that the frame (17) of the housing (1) is provided with a groove (22) along its inner circumference, embedded in the sealing strip.

9. A micro photovoltaic inverter according to claim 3, wherein at least 1 reinforcing column (25) is arranged at the side of each side of the inner bottom surface of the casing (1), each reinforcing column (25) is provided with a threaded hole (18), the corresponding position of the periphery of the circuit board (3) is provided with a connecting hole (19) and is connected by a screw (20), the screw (20) penetrates through the connecting hole (19) of the circuit board (3) to be screwed into the threaded hole (18), and the circuit board (3) is fixedly arranged in the casing (1).

10. The micro photovoltaic inverter according to claim 5, wherein the housing (1) is provided with a reinforcement block (21) under the frame (17) where the threaded hole (18) is located, and the threaded hole (18) is opened downwards along the reinforcement block (21).

11. The micro photovoltaic inverter according to claim 5, wherein an extension plate (23) is additionally arranged on one side frame (17) of the housing (1), and the extension plate (23) is provided with a hanging hole (24) for hanging or fixing the micro photovoltaic inverter on a photovoltaic panel or other objects.