CN210120493U

CN210120493U - Vehicle-mounted inverter

Info

Publication number: CN210120493U
Application number: CN201921199105.9U
Authority: CN
Inventors: 叶慧; 叶贤良
Original assignee: Zhejiang Feipeng Vehicle Fittings Co
Current assignee: Zhejiang Feipeng Vehicle Fittings Co
Priority date: 2019-07-26
Filing date: 2019-07-26
Publication date: 2020-02-28
Anticipated expiration: 2029-07-26

Abstract

The utility model relates to an on-vehicle dc-to-ac converter, including heat dissipation shell and inverter circuit board, integrated on the inverter circuit board has the electronic components who constitutes inverter circuit, electronic components includes MOS pipe and the dc-to-ac converter main part of paster shape, the heat dissipation shell includes drain pan and lid shell, the drain pan forms the holding chamber that holds components and parts on inverter circuit board and the inverter circuit board with the mutual lock of lid shell, the setting of lying down of dc-to-ac converter main part is on inverter circuit board, there is just the contact convex seat to the dc-to-ac converter main part towards the holding intracavity arch on the lid shell, be equipped with the recess on the contact convex seat, be equipped with dc-to-ac converter main part heat conduction silica gel pad in the recess, dc. The inverter main body and the heat dissipation shell are in contact type heat dissipation, and the heat dissipation effect is good.

Description

Vehicle-mounted inverter

Technical Field

The utility model relates to an on-vehicle dc-to-ac converter.

Background

The inverter converts direct current electric energy into alternating current, is commonly used in automobiles, can convert DC12V into AC220V alternating current with the same commercial power, is used for common electric appliances, and is a convenient power converter for vehicles. The power devices on the inverter include an inverter body, a MOS tube, a capacitor, a coil and the like. Because each power device height of inverter is not straight, and most power device top surfaces are usually unevenness, like the inverter main part, therefore current power device adopts non-contact heat dissipation mode usually, has the defect that the radiating effect is poor.

Disclosure of Invention

The utility model discloses the invention purpose: for overcoming the defect that prior art exists, the utility model provides a contact heat dissipation, vehicle-mounted inverter that the radiating effect is good.

In order to achieve the above purpose, the utility model provides a following technical scheme:

the utility model provides an on-vehicle inverter, includes heat dissipation shell and inverter circuit board, and the integration on the inverter circuit board has the electronic components who constitutes inverter circuit, and electronic components includes MOS pipe and the inverter main part of paster shape, and the heat dissipation shell includes drain pan and lid shell, and the mutual lock of drain pan and lid shell forms the holding chamber that holds components and parts on inverter circuit board and the inverter circuit board, its characterized in that: the inverter main body is horizontally arranged on the inverter circuit board, a contact convex seat facing the inverter main body is arranged on the cover shell in a protruding mode towards the containing cavity, a groove is formed in the contact convex seat, a heat-conducting silica gel pad of the inverter main body is arranged in the groove, and the top of the inverter main body is supported on the groove of the contact convex seat through the heat-conducting silica gel pad of the inverter main body.

Through adopting above-mentioned technical scheme, the dc-to-ac converter main part adopts the flat bed to place, make the main cooling surface of dc-to-ac converter main part towards the lid shell, the contact convex seat guarantees that lid shell and dc-to-ac converter main part can form good contact on the spatial distance, make the holding intracavity have good heat dissipation space simultaneously, and the flexible contact of dc-to-ac converter main part and contact convex seat realization can be realized to dc-to-ac converter main part heat conduction silica gel pad, guarantee that the heat conduction contact is reliable, the recess can adapt to the appearance of dc-to-ac converter main part, make dc-to-ac converter main part heat conduction silica gel pad and dc-to-ac converter main part form good heat conduction contact, in addition.

Preferably, the contact boss includes a middle protrusion and lateral protrusions located at both sides of the middle protrusion, the lateral protrusions are higher than the middle protrusion to form the groove, the lateral protrusions correspond to the silicon steel sheet frame portion of the inverter body, the middle protrusion corresponds to the coil portion of the inverter body, and a surface of the middle protrusion located in the groove is in a concave arc shape. Under this structural design, the contact convex block adopts the middle lug and the side direction lug design that correspond inverter main part silicon steel sheet frame part and coil part for heat conduction contact is good, and the better coil part location contact of adaptation inverter main part of concave arc shape face, middle lug and side direction lug are convenient for contact convex block machine-shaping.

Preferably, the electronic component further comprises a capacitor and a magnetic induction coil, a heat conduction contact boss which respectively corresponds to the capacitor and the magnetic induction coil is protruded towards the accommodating cavity on the cover shell, and the capacitor and the magnetic induction coil are in heat conduction fit with the corresponding heat conduction contact boss through a heat conduction silica gel pad. Under this structural design, realize the contact heat conduction of electric capacity and magnetic induction coil device, improve the heat conduction effect.

Preferably, the bottom shell is provided with a circuit board supporting lug protruding towards the accommodating cavity, the circuit board supporting lug comprises an edge supporting lug located at the edge of the inner cavity of the bottom shell and a central supporting lug located in the middle, the inverter circuit board is erected on the bottom shell through the circuit board supporting lug, a frame space is formed between the inverter circuit board and the inner bottom surface of the bottom shell, and an insulating plate is arranged in the frame space. Under this structural design, realize that the contravariant circuit board is built on stilts to be installed, improve the radiating effect of contravariant circuit board, the insulation board realizes insulation protection.

Preferably, the MOS pipe is that the mode of crouching is set up and on the inverter circuit board, set up the window of stepping down that corresponds with the main part position of MOS pipe on the inverter circuit board, the main part of MOS pipe stretches into in the window of stepping down, the radiating surface and the lid shell laminating up of the main part of MOS pipe, the radiating surface and the drain pan laminating down of the main part of MOS pipe. Under this structural design, two upper and lower radiating surfaces of the main part of MOS pipe all laminate with the heat dissipation shell, realize the contact heat dissipation, effectively utilize the heat dispersion of heat dissipation shell, have the advantage that the radiating effect is good.

Preferably, the heat conduction silica gel pads are respectively clamped between the upward radiating surface of the main body part of the MOS tube and the inner wall of the cover shell and between the downward radiating surface of the main body part of the MOS tube and the inner wall of the bottom shell. Under this structural design, realize forming good heat conduction contact between MOS pipe and the heat dissipation shell, guarantee heat dispersion.

Preferably, integrated into one piece is to the bellied MOS pipe laminating boss in holding chamber on the lid shell, and corresponding lid shell outside is sunken in the formation of MOS pipe laminating boss department of correspondence, is equipped with radiating fin in this is sunken, and the main part radiating surface and the laminating boss of MOS pipe are laminated to the major part of MOS pipe radiating surface up. Under this structural design, the lid shell corresponds MOS pipe position and adopts concave-convex structure design, and MOS pipe laminating boss can make the lid shell better press close to the MOS pipe and realize laminating heat conduction, sets up radiating fin in the sunken of corresponding formation, improves the radiating effect, and radiating fin locates in sunken, has compact structure's advantage.

Preferably, the bottom case is integrally formed with an MOS tube support boss protruding toward the accommodating cavity, the MOS tube support boss is adapted to the circuit board support boss in height, a concave portion is formed at a position corresponding to the MOS tube support boss on the outer side of the corresponding bottom case, a heat dissipation rib plate is arranged in the concave portion, and a downward heat dissipation surface of a main body of the MOS tube is attached to the MOS tube support boss. Under this structural design, the drain pan corresponds MOS pipe position and adopts concave-convex structure design, can make the drain pan better press close to the MOS pipe and realize laminating heat conduction, sets up heat dissipation gusset in the concave part of corresponding formation, improves the radiating effect, and in heat dissipation gusset locates the concave part, has compact structure's advantage.

Preferably, the outer side wall of the bottom shell and the outer side wall of the cover shell are provided with heat dissipation convex ribs. Under this structural design, improve the heat radiating area of heat dissipation shell, improve the radiating effect.

Preferably, the bottom shell and the cover shell are aluminum shells. With the structural design, the aluminum shell has excellent heat dissipation performance and machinability.

The present invention will be further described with reference to the accompanying drawings.

Drawings

Fig. 1 is a schematic structural diagram of a vehicle-mounted inverter according to an embodiment of the present invention;

fig. 2 is an exploded view of the inverter circuit board and the bottom cover according to the embodiment of the present invention (the output line and the input line on the inverter circuit board are omitted);

FIG. 3 is a schematic view of a top case structure according to an embodiment of the present invention;

FIG. 4 is a schematic structural view of a bottom view of the bottom shell according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a bottom case according to an embodiment of the present invention.

Detailed Description

Referring to the attached drawings 1-5, the utility model discloses a vehicle-mounted inverter, which comprises a heat dissipation casing 1 and an inverter circuit board 2, an electronic component 3 forming an inverter circuit is integrated on the inverter circuit board 2, the electronic component 3 comprises a patch-shaped MOS transistor 3-1, of course, the electronic component 3 further comprises an inverter main body 3-2, a capacitor 3-3, a magnetic induction coil 3-4, and the like, the inverter circuit on the inverter circuit board 2 is conventional in the art, so the type of the electronic component 3 on the inverter circuit board 2 is well known by those skilled in the art, and is not an innovation point created by the invention, and thus, the description is omitted, the heat dissipation casing 1 comprises a bottom casing 1-1 and a cover casing 1-2, the bottom casing 1-1 and the cover casing 1-2 are mutually buckled to form an accommodating cavity for accommodating the inverter circuit board 2 and the inverter circuit board 2, the inverter main body 3-2 is horizontally arranged on the inverter circuit board 2, the inverter main body 3-2 is arranged on the inverter circuit board 2 in an overhead mode, contact convex seats 1-24 which are opposite to the inverter main body 3-2 are arranged on the cover shell 1-2 in a protruding mode in the accommodating cavity, grooves 1-241 are formed in the contact convex seats 1-24, heat-conducting silica gel pads 5 of the inverter main body are arranged in the grooves 1-241, and the top of the inverter main body 3-2 is supported on the grooves 1-241 of the contact convex seats 1-24 through the heat-conducting silica gel pads 5 of the inverter main body. The inverter main body 3-2 is horizontally placed, so that the main radiating surface of the inverter main body 3-2 faces the cover shell 1-2, the contact convex seats 1-24 ensure that the cover shell 1-2 and the inverter main body 3-2 can form good contact in the spatial distance, and meanwhile, a good radiating space is formed in the accommodating cavity, the inverter main body heat-conducting silica gel pad 5 can realize the flexible contact between the inverter main body 3-2 and the contact convex seats 1-24, ensure the reliable heat-conducting contact, the grooves 1-241 can adapt to the shape of the inverter main body 3-2, so that the inverter main body heat-conducting silica gel pad 5 and the inverter main body 3-2 form good heat-conducting contact, in addition, the grooves 1-241 can position and fix the inverter main body 3-2, so that the inverter circuit board 2 of the inverter is impacted by external force and reduced.

The MOS tube 3-1 is horizontally arranged on the inverter circuit board 2, the inverter circuit board 2 is provided with a yielding window 21 corresponding to the main part 3-11 of the MOS tube 3-1, the main part 3-11 of the MOS tube 3-1 extends into the yielding window 21, the upward heat dissipation surface of the main part 3-11 of the MOS tube 3-1 is attached to the cover shell 1-2, and the downward heat dissipation surface of the main part 3-11 of the MOS tube 3-1 is attached to the bottom shell 1-1. The upper and lower radiating surfaces of the main body part 3-11 of the MOS tube 3-1 are attached to the radiating shell 1, so that contact radiating is realized, the radiating performance of the radiating shell 1 is effectively utilized, and the radiating device has the advantage of good radiating effect.

And heat-conducting silica gel pads 4 are respectively clamped between the upward radiating surface of the main part 3-11 of the MOS tube 3-1 and the inner wall of the cover shell 1-2 and between the downward radiating surface of the main part 3-11 of the MOS tube 3-1 and the inner wall of the bottom shell 1-1. Good heat conduction contact between the MOS tube 3-1 and the heat dissipation shell 1 is achieved, and heat dissipation performance is guaranteed.

The cover shell 1-2 is integrally formed with an MOS tube attaching boss 1-21 protruding towards the accommodating cavity, a recess 1-22 is formed at the corresponding position of the MOS tube attaching boss 1-21 on the outer side of the corresponding cover shell 1-2, a radiating fin 1-23 is arranged in the recess 1-22, and the upward radiating surface of the main body part 3-11 of the MOS tube 3-1 is attached to the MOS tube attaching boss 1-21. Under the structural design, the position of the cover shell 1-2 corresponding to the MOS tube 3-1 is designed to be a concave-convex structure, the MOS tube attaching boss 1-21 can enable the cover shell 1-2 to be better close to the MOS tube 3-1 to realize attaching heat conduction, the heat radiating fins 1-23 are arranged in the correspondingly formed recess 1-22, the heat radiating effect is improved, and the heat radiating fins 1-23 are arranged in the recess 1-22, so that the structure has the advantage of compact structure. And the MOS tube 3-1 is arranged at the edge position of the inverter circuit board 2. Accordingly, the recesses 1 to 22 are located at the side edges of the cover shells 1 to 2, and the window is a notch groove located at the side edge of the inverter circuit board 2, so that the inverter circuit board 2 has the advantage of being convenient to machine and form, such as the window on the inverter circuit board 2 and the concave-convex structure on the cover shells 1 to 2.

An MOS tube supporting boss 1-11 protruding towards the accommodating cavity is integrally formed on the bottom shell 1-1, a concave part 1-12 is formed at the corresponding position of the MOS tube supporting boss 1-11 at the outer side of the corresponding bottom shell 1-1, a heat dissipation rib plate 1-13 is arranged in the concave part 1-12, and a downward heat dissipation surface of a main body part 3-11 of the MOS tube 3-1 is attached to the MOS tube supporting boss 1-11. The concave-convex structural design is adopted at the position of the bottom shell 1-1 corresponding to the MOS tube 3-1, so that the bottom shell 1-1 can be better close to the MOS tube 3-1 to realize the attaching heat conduction, the heat dissipation rib plates 1-13 are arranged in the correspondingly formed concave parts 1-12, the heat dissipation effect is improved, and the heat dissipation rib plates 1-13 are arranged in the concave parts 1-12, so that the structure is compact.

Further, the contact boss 1-24 includes a middle protrusion 1-242 and lateral protrusions 1-243 located at both sides of the middle protrusion 1-242, the lateral protrusions are higher than the middle protrusion 1-242 to form the groove 1-241, the lateral protrusions 1-243 correspond to the silicon steel sheet frame portion 3-21 of the inverter main body 3-2, the middle protrusion 1-242 corresponds to the coil portion 3-22 of the inverter main body 3-2, and a surface 1-2411 of the middle protrusion 1-242 located in the groove 1-241 is a concave arc shape. The contact convex seats 1-24 are designed by adopting middle convex blocks 1-242 and lateral convex blocks 1-243 corresponding to the coil parts 3-22 and the coil frame parts 3-21 of the inverter main body 3-2, so that the heat conduction contact is good, the concave arc surfaces are better suitable for the positioning contact of the coil parts 3-22 of the inverter main body 3-2, and the middle convex blocks 1-242 and the lateral convex blocks 1-243 are convenient for processing and molding the contact convex seats 1-24.

For other power devices, heat conduction contact bosses 1-25 respectively corresponding to the capacitors 3-3 and the magnetic induction coils 3-4 are protruded on the cover shell 1-2 towards the accommodating cavity, and the capacitors 3-3 and the magnetic induction coils 3-4 are in heat conduction fit with the corresponding heat conduction contact bosses 1-25 through heat conduction silica gel pads 4. The contact heat conduction of the capacitor 3-3 and the magnetic induction coil 3-4 is realized, and the heat conduction effect is improved.

In order to improve the heat dissipation effect of the inverter circuit board 2, circuit board supporting bumps 1-14 are protruded from the bottom case 1-1 towards the accommodating cavity, the circuit board supporting bumps 1-14 comprise edge supporting bumps 1-141 positioned at the edge of the inner cavity of the bottom case 1-1 and central supporting bumps 1-142 positioned in the middle, the inverter circuit board 2 is erected on the bottom case 1-1 through the circuit board supporting bumps 1-14, a space frame space is formed between the inverter circuit board 2 and the inner bottom surface of the bottom case 1-1, and an insulating plate 7 is arranged in the space frame space. The inverter circuit board 2 is mounted overhead, the heat dissipation effect of the inverter circuit board 2 is improved, and the insulation board realizes insulation protection. Screw holes are arranged on the edge supporting convex blocks 1-141, and the inverter circuit board 2 is locked and fixed by screws. The height dimension of the MOS tube supporting boss 1-11 is matched with the height dimension of the circuit board supporting boss 1-14, and the matched dimension is that the MOS tube supporting boss 1-11 can be reliably attached to the bottom shell 1-1 after the inverter circuit board 2 is overhead.

In order to improve the heat dissipation effect, heat dissipation convex ribs 1-16 and 1-26 are arranged on the outer side wall of the bottom shell 1-1 and the outer side wall of the cover shell 1-2. The heat dissipation area of the heat dissipation shell 1 is increased, and the heat dissipation effect is improved. The bottom shell 1-1 and the cover shell 1-2 are aluminum shells. The aluminum case has excellent heat dissipation performance and workability.

In this embodiment, the edge of the bottom case 1-1 is provided with an annular buckling outer step groove 1-17, the edge of the cover case 1-2 is provided with a buckling inner step groove 1-27 adapted to the buckling outer step groove 1-17, and the buckling outer step groove 1-17 of the bottom case 1-1 is in buckling fit with the buckling inner step groove 1-27 of the cover case 1-2. The cover shell 1-2 and the bottom shell 1-1 are buckled and sealed reliably, and the dustproof sealing performance is good.

The mouth of the bottom shell 1-1 is provided with wire outlet notches 1-18, the upper mouths of the wire outlet notches 1-18 are sealed by cover shells 1-2, the middle parts of the wire outlet notches 1-18 are provided with positioning convex fingers 1-19, the wire outlet notches 1-18 are provided with wire outlet sealing rubber seats 6 in a positioning mode, the wire outlet sealing rubber seats 6 are provided with input wire through holes 61 and output wire through holes 62 for input wires and output wires on the inverter circuit board 2 to pass through, and positioning slots matched with the positioning convex fingers 1-19 are arranged between the input wire through holes and the output wire through holes of the wire outlet sealing rubber seats 6. The outgoing line sealing rubber seat 6 realizes the sealing and passing and protection of the input line and the output line on the inverter circuit board 2, the outgoing line notches 1-18 realize the positioning and fixing of the outgoing line sealing rubber seat 6, the outgoing line sealing rubber seat 6 is simultaneously used for the input line and the output line on the inverter circuit board 2 to pass through, the transverse length is long, and the outgoing line sealing rubber seat 6 is more firmly and reliably installed under the design of the positioning convex fingers 1-19.

Claims

1. The utility model provides an on-vehicle inverter, includes heat dissipation shell and inverter circuit board, and the integration on the inverter circuit board has the electronic components who constitutes inverter circuit, and electronic components includes MOS pipe and the inverter main part of paster shape, and the heat dissipation shell includes drain pan and lid shell, and the mutual lock of drain pan and lid shell forms the holding chamber that holds components and parts on inverter circuit board and the inverter circuit board, its characterized in that: the inverter main body is horizontally arranged on the inverter circuit board, a contact convex seat facing the inverter main body is arranged on the cover shell in a protruding mode towards the containing cavity, a groove is formed in the contact convex seat, a heat-conducting silica gel pad of the inverter main body is arranged in the groove, and the top of the inverter main body is supported on the groove of the contact convex seat through the heat-conducting silica gel pad of the inverter main body.

2. The vehicle-mounted inverter according to claim 1, characterized in that: the contact convex base comprises a middle convex block and lateral convex blocks positioned on two sides of the middle convex block, the convex blocks are higher than the middle convex block to form the groove, the lateral convex blocks correspond to the silicon steel sheet frame part of the inverter main body, the middle convex blocks correspond to the coil part of the inverter main body, and the surface of the middle convex block positioned in the groove is in a concave arc shape.

3. The vehicle-mounted inverter according to claim 1, characterized in that: the electronic component further comprises a capacitor and a magnetic induction coil, heat conduction contact bosses which respectively correspond to the capacitor and the magnetic induction coil are arranged on the cover shell in a protruding mode towards the accommodating cavity, and the capacitor and the magnetic induction coil are in heat conduction fit with the corresponding heat conduction contact bosses through heat conduction silica gel pads.

4. The vehicle-mounted inverter according to claim 1, characterized in that: the bottom shell is provided with a circuit board supporting lug protruding towards the accommodating cavity, the circuit board supporting lug comprises an edge supporting lug located at the edge of the inner cavity of the bottom shell and a central supporting lug located in the middle, the inverter circuit board is erected on the bottom shell through the circuit board supporting lug, a space between the inverter circuit board and the inner bottom surface of the bottom shell is formed, and an insulating plate is arranged in the space.

5. The vehicle-mounted inverter according to claim 1, characterized in that: the MOS pipe is that the mode of crouching sets up with on the inverter circuit board, set up the window of stepping down that corresponds with the main part position of MOS pipe on the inverter circuit board, in the main part of MOS pipe stretched into the window of stepping down, the major part's of MOS pipe radiating surface up and the laminating of lid shell, the radiating surface down and the drain pan laminating of the major part of MOS pipe.

6. The vehicle-mounted inverter according to claim 5, characterized in that: and heat-conducting silica gel pads are respectively clamped between the upward radiating surface of the main body part of the MOS tube and the inner wall of the cover shell and between the downward radiating surface of the main body part of the MOS tube and the inner wall of the bottom shell.

7. The vehicle-mounted inverter according to claim 5, characterized in that: the lid shell is gone up the bellied MOS pipe laminating boss in integrated into one piece to the holding chamber, and corresponding lid shell outside is sunken in the formation of MOS pipe laminating boss department of corresponding, is equipped with radiating fin in this is sunken, and the main part radiating surface and the laminating boss of MOS pipe are laminated to the major part of MOS pipe radiating surface up.

8. The vehicle-mounted inverter according to claim 5, characterized in that: the MOS tube supporting boss protruding towards the accommodating cavity is integrally formed on the bottom shell, a concave portion is formed at the position, corresponding to the MOS tube supporting boss, of the outer side of the corresponding bottom shell, a heat dissipation rib plate is arranged in the concave portion, and the downward heat dissipation surface of the main body part of the MOS tube is attached to the MOS tube supporting boss.

9. The vehicle-mounted inverter according to claim 1, characterized in that: and heat dissipation convex ribs are arranged on the outer side wall of the bottom shell and the outer side wall of the cover shell.

10. The vehicle-mounted inverter according to claim 1, characterized in that: the bottom shell and the cover shell are aluminum shells.