CN210112370U - Process edge of DPC ceramic substrate - Google Patents

Abstract

The utility model discloses a DPC ceramic substrate process edge, which comprises a process edge body, wherein the surface of the process edge body is provided with four through testing positioning holes, the process edge body is of a U-shaped structure, and the inner side surface of the process edge body is provided with two chutes which are distributed oppositely; the utility model has the advantages that: the technical edge body with the U-shaped structure is designed, and the two sliding grooves which are distributed oppositely are formed in the inner side surface of the technical edge body, so that the substrate body to be processed can be conveniently inserted into the sliding grooves; the surface of the supporting plate is provided with a notch, so that the substrate body can be conveniently taken down after being processed.

Description

Process edge of DPC ceramic substrate

Technical Field

The utility model belongs to the technical field of DPC ceramic substrate, concretely relates to DPC ceramic substrate's technology limit.

Background

The DPC is also called as a direct copper-plated substrate, firstly, according to the product requirement and design requirement, the ceramic substrate is drilled, scribed and the like by laser, cleaned and plated with copper on the ceramic substrate by a vacuum coating mode, then the circuit manufacturing is finished by a yellow lithography or laser development mode, then the thickness of the circuit is increased by an electroplating/chemical plating deposition mode, and finally the metallized circuit manufacturing is finished.

The technical edge is used for pasting the machine of a pasting plant, namely, the technical edge is formed by respectively adding 5mm to two sides of a DPC ceramic substrate, and the two sides cannot be provided with any pasting elements.

However, the process side of the existing DPC ceramic substrate still has some unreasonable factors when in use, and the process side of the existing DPC ceramic substrate has the following disadvantages when in use:

the process has low recycling rate.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a technology limit of DPC ceramic substrate to solve the problem that the technology limit cyclic utilization who provides among the above-mentioned background art is low.

In order to achieve the above object, the utility model provides a following technical scheme: the process edge of the DPC ceramic substrate comprises a process edge body, wherein four through test positioning holes are formed in the surface of the process edge body, the process edge body is of a U-shaped structure, and two sliding chutes which are distributed oppositely are formed in the inner side surface of the process edge body.

The inner side surfaces of the two sliding grooves are movably provided with a substrate body, and the side surfaces of the substrate body are fastened with fixing edges along the length direction of the substrate body.

Preferably, the width of the fixing edge is 1 mm.

Preferably, a support plate is fixed on the inner side surface of the technical edge body.

Preferably, the vertical distance between the supporting plate and the groove bottom of the sliding groove is 3 mm.

Preferably, the surface of the supporting plate is provided with a notch.

Preferably, the technical edge body is further provided with a plurality of datum points distributed at intervals.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the technical edge body with the U-shaped structure is designed, and the two sliding grooves which are distributed oppositely are formed in the inner side surface of the technical edge body, so that the substrate body to be processed can be conveniently inserted into the sliding grooves;

(2) the surface of the supporting plate is provided with a notch, so that the substrate body can be conveniently taken down after being processed.

Drawings

FIG. 1 is a schematic view of the top view of the process edge of the present invention;

FIG. 2 is a schematic top view of the DPC ceramic substrate of the present invention;

FIG. 3 is a schematic view of the DPC ceramic substrate and the process edge connection structure of the present invention;

in the figure: 1. a technical edge body; 2. testing the positioning hole; 3. a reference point; 4. a support plate; 5. a recess; 6. fixing the edge; 7. a substrate body; 8. a chute.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, fig. 2 and fig. 3, the present invention provides a technical solution: the process edge of the DPC ceramic substrate comprises a process edge body 1, wherein four through test positioning holes 2 are formed in the surface of the process edge body 1 and used for fixing when a connectivity test is conducted on a board factory, the process edge body 1 is of a U-shaped structure, and two sliding grooves 8 which are distributed oppositely are formed in the inner side surface of the process edge body 1, so that the process edge body 1 can be recycled.

In this embodiment, preferably, the inner side surfaces of the two sliding grooves 8 are movably provided with a substrate body 7, and the side surfaces of the substrate body 7 are fastened with fixing edges 6 along the length direction of the substrate body 7, so that the substrate body 7 is integrally exposed through the fixing edges 6 to process the substrate body 7.

In this embodiment, the width of the fixing edge 6 is preferably 1 mm.

In this embodiment, preferably, the inner side surface of the technical edge body 1 is fixed with the supporting plate 4, so that the protection of the substrate body 7 to be processed is increased through the supporting plate 4.

In this embodiment, it is preferable that the vertical distance between the supporting plate 4 and the groove bottom of the sliding groove 8 is 3mm, which contributes to further protecting the substrate body 7.

In this embodiment, preferably, the surface of the supporting plate 4 is provided with a notch 5, so that the substrate body 7 can be more conveniently taken down after being processed.

In this embodiment, preferably, the technical edge body 1 is further provided with a plurality of reference points 3 distributed at intervals, so as to achieve the effect of positioning the circuit pattern in the assembling process.

The utility model discloses a theory of operation and use flow: the technical edge body 1 is fixed on equipment, when the substrate body 7 is processed, the substrate body 7 to be processed is inserted along a sliding groove 8 formed in the technical edge body 1, the vertical distance between a supporting plate 4 and the bottom of the sliding groove 8 is 3mm, and the substrate body 7 is prevented from directly contacting the supporting plate 4; the fixing edge 6 is arranged, so that the substrate body 7 is conveniently exposed integrally through the fixing edge 6 to process the substrate body 7, and the processed substrate body 7 is more conveniently pulled out through the notch 5 formed in the surface of the supporting plate 4; the above steps are repeated to process the substrate body 7 to be processed next.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The process edge of the DPC ceramic substrate comprises a process edge body (1), wherein four through test positioning holes (2) are formed in the surface of the process edge body (1), and the process edge is characterized in that: the technical edge body (1) is of a U-shaped structure, and two sliding chutes (8) which are distributed oppositely are formed in the inner side surface of the technical edge body (1).
2. 2. The process edge of a DPC ceramic substrate of claim 1, wherein: the inner side surfaces of the two sliding grooves (8) are movably provided with a substrate body (7), and the side surfaces of the substrate body (7) are fastened with fixing edges (6) along the length direction of the substrate body (7).
3. 3. The process edge of the DPC ceramic substrate of claim 2, wherein: the width of the fixed edge (6) is 1 mm.
4. 4. The process edge of a DPC ceramic substrate of claim 1, wherein: and a support plate (4) is fixed on the inner side surface of the technical edge body (1).
5. 5. The process edge of the DPC ceramic substrate of claim 4, wherein: the vertical distance between the supporting plate (4) and the groove bottom of the sliding groove (8) is 3 mm.
6. 6. The process edge of the DPC ceramic substrate of claim 5, wherein: the surface of the supporting plate (4) is provided with a notch (5).
7. 7. The process edge of a DPC ceramic substrate of claim 1, wherein: the technical edge body (1) is also provided with a plurality of datum points (3) which are distributed at intervals.

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