CN109673101A - The production method and circuit substrate of circuit substrate - Google Patents

The production method and circuit substrate of circuit substrate Download PDF

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Publication number
CN109673101A
CN109673101A CN201710955055.1A CN201710955055A CN109673101A CN 109673101 A CN109673101 A CN 109673101A CN 201710955055 A CN201710955055 A CN 201710955055A CN 109673101 A CN109673101 A CN 109673101A
Authority
CN
China
Prior art keywords
hole
substrate
conductive
base
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710955055.1A
Other languages
Chinese (zh)
Inventor
郭志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Avary Holding Shenzhen Co Ltd
Original Assignee
Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Avary Holding Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongqisheng Precision Electronics Qinhuangdao Co Ltd, Avary Holding Shenzhen Co Ltd filed Critical Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Priority to CN201710955055.1A priority Critical patent/CN109673101A/en
Priority to TW107124543A priority patent/TWI677268B/en
Publication of CN109673101A publication Critical patent/CN109673101A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

A kind of production method of circuit substrate comprising: copper-clad plate is provided, which includes substrate, which includes opposite first surface and second surface, which further includes respectively in connection in the Liang Ge base copper foil of first surface and second surface；Through-hole is opened up in copper-clad plate, the through-hole includes the first hole and the second hole, the base's copper foil for being incorporated into first surface is run through in first hole, enter substrate across first surface, the base's copper foil for being incorporated into second surface is run through in second hole, enter substrate across second surface, and communicated with the first hole, the aperture in first hole is greater than the aperture in second hole；Electro-coppering forms conductive through hole in through-hole, forms copper electroplating layer on the surface of the separate substrate of each base's copper foil, which includes the first conductive hole being formed in the first hole and the second conductive hole being formed in the second hole.In addition, the present invention also provides circuit substrates made from a kind of application production method.

Description

The production method and circuit substrate of circuit substrate
Technical field
The present invention relates to a kind of production method of circuit substrate and circuit substrates obtained by this method.
Background technique
Filling perforation electroplating technology is because the high density designs of circuit board may be implemented in it, and it is high smooth to have circuit board obtained Property, the characteristics such as high heat dissipation and excellent electric conductivity, and apply more and more extensive.
Existing filling perforation processing hole type design is usually conductive blind hole (BVH) and X-type conductive through hole (PTH).Conductive blind hole Manufacture craft be generally the plating of radium-shine formation blind hole-hole wall cleaning-hole metallization-filling perforation, which lacks there are following It falls into: firstly, it is higher to the hole wall cleaning process requirements of blind hole, generally requiring and plasma-based processing is carried out to hole wall；Secondly, conductive blind The attachment of three face of hole, for conductive through hole, the bottom of conductive blind hole has the risk of layering；Again, conductive blind hole is formed The phenomenon that being easy to appear packet (sky packet or air packet) in the process.The manufacture craft of conductive through hole is generally the radium-shine shape in upper surface At the first blind hole-lower surface radium-shine formation the second blind hole (the first blind hole is communicated with the second blind hole, and the two cooperatively forms through-hole)-hole Wall cleaning-hole metallization-filling perforation plating, which has the following deficiencies: firstly, its production process is longer, need by Radium-shine processing procedure twice；Secondly, the technique can not process slim material, circuit board thinning tendency has been violated；Again, two-sided radium-shine blind Hole needs aligning accuracy high, increases the complexity of technique.
Summary of the invention
In view of this, it is necessary to provide a kind of production methods of new circuit substrate, to solve the above problems.
In addition, there is a need to provide circuit substrate made from a kind of production method using the circuit substrate.
A kind of production method of circuit substrate comprising following steps:
Step S1 provides a copper-clad plate, which includes substrate, the substrate include first surface and with the first surface Opposite second surface, the copper-clad plate further include respectively in connection in the Liang Ge base copper foil of the first surface and second surface；
Step S2 opens up through-hole in the copper-clad plate, which has a hole wall, which includes the first hole and second The base's copper foil for being incorporated into the first surface is run through in hole, first hole, passes through the first surface and enters the substrate, should Second hole, which is run through, is incorporated into base's copper foil of the second surface, passes through the second surface and enters the substrate, and with it is described First hole communicates, and the aperture in first hole is greater than the aperture in second hole；
Step S3, change plating, on the hole wall and the surface of separate the substrate of base's copper foil formation one seed layer；
Step S4, electro-coppering, to form conductive through hole in through-hole, in the surface shape of the separate substrate of each base's copper foil At a copper electroplating layer, which includes the first conductive hole being formed in the first hole and what is be formed in the second hole second lead Electric hole.
A kind of circuit substrate comprising substrate, the substrate include first surface and second table opposite with the first surface Face, the circuit substrate further include respectively in connection in two layers of copper on the first surface and second surface, which includes In conjunction with the copper electroplating layer on the surface of base's copper foil with substrate and the separate substrate for being incorporated into base's copper foil, the circuit substrate is also Including an at least conductive through hole, the conductive through hole is conductive including the first conductive hole and with first conductive hole integrally formed second Hole, the aperture of first conductive hole are greater than the aperture of second conductive hole, which, which runs through, is incorporated into the first of substrate Base's copper foil on surface, into the substrate, which runs through the base's copper foil for being incorporated into the second surface of substrate, enters The substrate, and be connected with first conductive hole.
The production method of circuit substrate of the invention, by one-step pore-creating, directly opening up in copper-clad plate has into ladder Shape and through-hole including the first hole and the second hole are not necessarily to secondary pore-forming, shorten production process, reduce cost of manufacture.In addition, the electricity The applicable filling perforation processing procedure of the production method of base board, makes full use of the advantage of hole filling technology, conducive to the slimming of circuit substrate, system It is not high to hole wall cleaning process requirements to make process, and the bond strength of conductive through hole obtained and copper electroplating layer and substrate is high, has The reliability for improving circuit substrate and circuit board of effect.
Detailed description of the invention
Fig. 1 is the schematic cross-section of copper-clad plate.
Fig. 2 is the schematic diagram that through-hole is arranged in copper-clad plate shown in Fig. 1.
Fig. 3 is that on the hole wall of the through-hole of the copper-clad plate shown in Fig. 2 and surface of the separate substrate of base's copper foil forms crystalline substance The schematic diagram of kind layer.
Fig. 4 is the schematic diagram that early period is electroplated when copper-clad plate shown in Fig. 3 is electroplated.
Fig. 5 is the schematic diagram that the prometaphase is electroplated when copper-clad plate shown in Fig. 3 is electroplated.
Fig. 6 is the schematic diagram that mid-term is electroplated when copper-clad plate shown in Fig. 3 is electroplated.
Fig. 7 is the schematic diagram that the later period is electroplated when copper-clad plate shown in Fig. 3 is electroplated.
Fig. 8 is the schematic diagram of the circuit substrate of better embodiment of the present invention.
Main element symbol description
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear Chu is fully described by, it is clear that described embodiment is only some embodiments of the invention, rather than whole realities Apply mode.
Based on the embodiment in the present invention, those of ordinary skill in the art institute without making creative work The every other embodiment obtained, shall fall within the protection scope of the present invention.
All technical and scientific terms used herein with to belong to those skilled in the art of the invention usual The meaning of understanding is identical.Term as used herein in the specification of the present invention is intended merely to description specific embodiment Purpose, it is not intended that in limitation the present invention.
Fig. 1~8 are please referred to, better embodiment of the present invention provides a kind of production method of circuit substrate comprising Following steps:
Step S1: referring to Fig. 1, providing a copper-clad plate 101.The copper-clad plate 101 is including substrate 10 and is incorporated into the substrate 10 Liang Ge base copper foil 21.
The substrate 10 includes first surface 11 and the second surface 12 opposite with the first surface 11.Described two base's copper Foil 21 is respectively in connection on the first surface 11 and second surface 12.
The substrate 10 can be polyimide base material.
Step S2: further referring to Fig. 2, through-hole 102 is opened up in the copper-clad plate 101.
Into a ladder, the through-hole 102 is substantially at Y type for the through-hole 102.The through-hole has a hole wall 1020.
The through-hole 102 includes the first hole 1021 and the second hole 1022.First hole 1021, which is run through, is incorporated into substrate 10 First surface 11 on base's copper foil 21, pass through the first surface 11 and enter the substrate 10, and end in distance the At two surfaces, 12 predetermined distance d.The base's copper foil 21 being incorporated on the second surface 12 of substrate 10 is run through in second hole 1022, Enter the substrate 10 across the second surface 12, and is communicated with the first hole 1021.
It is the first hole at the predetermined distance d between the first surface 11 and second surface 12 of the substrate 10 1021 and second hole 1022 junction.
Preferably, the value of the d is greater than 2 μm.
It should be understood that the value of the d is also less than equal to 2 μm or even value is 0.
The aperture in first hole 1021 be greater than second hole 1022 aperture, thus substrate 10 the first hole 1021, Second hole, 1022 intersection forms protrusion 13.Length of the protrusion 13 in the first surface 11 and the extending direction of second surface 12 Degree is D0, the aperture in first hole 1021 is D1, the aperture at the first hole 1021 in second hole 1022 is D2, then In an at least embodiment, D2=D1-2×D0, wherein D1> D020 μm of >.
The shape design of the through-hole 102 can guarantee that high/low currents area distribution is unaffected when subsequent plating filling perforation, Reach good filling perforation effect.
In an at least embodiment, first hole 1021 is generally cylindrical, and is rectangle along axial section；It is described Direction of the hole in the second hole 1022 without leave close to the direction in the first hole 1021 away from the first hole 1021 is gradually reduced.
The method for opening up through-hole 102 is the laser pore-forming conventionally used for circuit board making.
Step S3 changes plating further referring to Fig. 3, on the hole wall 1020 of through-hole 102 and base's copper foil 21 it is separate The surface of substrate 10 forms a seed layer 103.
Step S4, further referring to Fig. 4~8, electro-coppering, in the copper coating of the seed layer 103, in through-hole Filling electro-coppering is in 102 to form conductive through hole 30, while forming one on the surface of the separate substrate 10 of each base's copper foil 21 Copper electroplating layer 22.Layers of copper 20 is collectively formed in base's copper foil 21 and the copper electroplating layer 22 for being incorporated in its surface.The conductive through hole 30 Including the first conductive hole 31 being formed in the first hole 1021 and the second conductive hole 32 being formed in the second hole 1022.The conduction Through-hole 30 and described two copper electroplating layers 22 are integrally formed, in this way, can effectively enhance conductive through hole 30 and copper electroplating layer 22 With the bond strength of substrate 10.The conductive through hole 30 is substantially at Y type.The aperture of first conductive hole 31 is greater than second conductive hole 32 aperture.
Specifically, the step S4 includes:
Step S41, referring to Fig. 4, Fig. 4 be electroplated early period schematic diagram, at this point, on the hole wall 1020 of through-hole 102 and The surface of the separate substrate 10 of base's copper foil 21 forms electro-coppering.
Step S42 is the schematic diagram that the prometaphase is electroplated further referring to Fig. 5, Fig. 5, at this point, because of the hole in the second hole 1022 Diameter is smaller, and copper filling is plated in second hole 1022 completely, forms the second conductive hole 32, and the first hole 1021 is not plated copper also Filling is full.Simultaneously, the thickness of the electro-coppering on the surface of the separate substrate 10 of base's copper foil 21 continues growing.
Step S43 is the schematic diagram that mid-term is electroplated further referring to Fig. 6, Fig. 6, at this point, electro-coppering continues to fill up first Hole 1021.Simultaneously, the thickness of the electro-coppering on the surface of the separate substrate 10 of base's copper foil 21 continues growing.
Step S44 is the schematic diagram that the later period is electroplated further referring to Fig. 7, Fig. 7, at this point, electro-coppering continues to fill up first Hole 1021.Simultaneously, the thickness of the electro-coppering on the surface of the separate substrate 10 of base's copper foil 21 continues growing.
Step S45 is the schematic diagram after the completion of plating further referring to Fig. 8, Fig. 8, at this point, electro-coppering is by the first hole 1021 fillings are full, form the first conductive hole 31.Simultaneously, electro-coppering is formed on the surface of the separate substrate 10 of base's copper foil 21 Layer 22.
Further referring to Fig. 8, a kind of circuit substrate 100 is used to make circuit board (not shown).The circuit substrate 100 include substrate 10.The substrate 10 includes first surface 11 and the second surface 12 opposite with the first surface 11.The circuit base Plate 100 further includes respectively in connection in two layers of copper 20 on the first surface 11 and second surface 12.Each layers of copper 20 includes In conjunction with the copper electroplating layer 22 on the surface of base's copper foil 21 with substrate 10 and the separate substrate 10 for being incorporated into base's copper foil 21.Institute Stating circuit substrate 100 further includes an at least conductive through hole 30, and the conductive through hole 30 is through substrate 10 and is incorporated into substrate 10 opposite to each other The Liang Ge base copper foil 21 on two surfaces.
The conductive through hole 30 include the first conductive hole 31 and with integrally formed second conductive hole of the first conductive hole 31 32.The aperture of first conductive hole 31 is greater than the aperture of second conductive hole 32.First conductive hole 31, which runs through, is incorporated into substrate Base's copper foil 21 of 10 first surface 11 into the substrate 10, and ends at 12 predetermined distance d of second surface, should Second conductive hole 32 run through be incorporated into substrate 10 second surface 12 base's copper foil 21, into the substrate 10, and with this first Conductive hole 31 is connected.
In an at least embodiment, the value of the d is greater than 2 μm.
The substrate 10 has a protrusion 13 in the first conductive hole 31,32 intersection of the second conductive hole.The protrusion 13 is in institute The size for stating the extending direction of first surface 11 and second surface 12 is D0, the diameter of first conductive hole 31 is D1, described The diameter of neighbouring first conductive hole 31 of two conductive holes 32 is D2, then in an at least embodiment, D2=D1-2×D0, wherein D1 > D020 μm of >.
The conductive through hole 30 is substantially at Y type.
In an at least embodiment, it is rectangle along axial section that first conductive hole 31, which is cylindric,；Described Direction of the hole of two conductive holes 32 without leave close to the first conductive hole 31 away from the first conductive hole 31 is gradually reduced.
The production method of circuit substrate of the invention, by one-step pore-creating, directly opening up in copper-clad plate 101 has into rank Scalariform and through-hole 102 including the first hole 1021 and the second hole 1022 are not necessarily to secondary pore-forming, shorten production process, reduce production Cost.In addition, the applicable filling perforation processing procedure of the production method of the circuit substrate, makes full use of the advantage of hole filling technology, it is conducive to circuit The slimming of substrate, and manufacturing process is not high to hole wall cleaning process requirements, and conductive through hole obtained 30 and copper electroplating layer 22 It is high with the bond strength of substrate 10, effectively raise the reliability of circuit substrate 100.
In addition, it is described above, it is only better embodiment of the invention, not to limit in any form of the invention System, although the present invention is disclosed above by better embodiment, is not intended to limit the invention, any skill for being familiar with this profession Art personnel, without departing from the scope of the present invention, be modified when the technology contents using the disclosure above or The equivalent implementations of equivalent variations are modified to, but without departing from the technical solutions of the present invention, technology according to the present invention Any simple modification, equivalent change and modification that essence does embodiment of above, still fall within technical solution of the present invention In range.

Claims (10)

1. a kind of production method of circuit substrate comprising following steps:
Step S1 provides a copper-clad plate, which includes substrate, which includes first surface and opposite with the first surface Second surface, which further includes respectively in connection in the Liang Ge base copper foil of the first surface and second surface；
Step S2 opens up through-hole in the copper-clad plate, which has a hole wall, which includes the first hole and the second hole, First hole, which is run through, is incorporated into base's copper foil of the first surface, passes through the first surface and enters the substrate, this Two holes, which are run through, is incorporated into base's copper foil of the second surface, passes through the second surface and enters the substrate, and with described the One Kong Xiangtong, the aperture in first hole are greater than the aperture in second hole；
Step S3, change plating, on the hole wall and the surface of separate the substrate of base's copper foil formation one seed layer；
Step S4, electro-coppering form one on the surface of the separate substrate of each base's copper foil to form conductive through hole in through-hole Copper electroplating layer, the conductive through hole include that the first conductive hole being formed in the first hole and second be formed in the second hole are conductive Hole.
2. the production method of circuit substrate as described in claim 1, it is characterised in that: the substrate is in the first hole and the second hole Intersection has a protrusion.
3. the production method of circuit substrate as claimed in claim 2, it is characterised in that: the protrusion in the first surface and The length of the extending direction of second surface is D0, the aperture in first hole is D1, the hole at the first hole in second hole Diameter is D2, D2=D1-2×D0。
4. the production method of circuit substrate as claimed in claim 3, it is characterised in that: D1> D020 μm of >.
5. the production method of circuit substrate as described in claim 1, it is characterised in that: first hole be it is cylindric, it is described Direction of the hole in the second hole without leave close to the direction in the first hole away from the first hole is gradually reduced.
6. the production method of circuit substrate as described in claim 1, it is characterised in that: the method for opening up through-hole is radium-shine Pore-forming.
7. a kind of circuit substrate comprising substrate, the substrate include first surface and the second surface opposite with the first surface, The circuit substrate further include respectively in connection in two layers of copper on the first surface and second surface, each layers of copper include combine with Base's copper foil of substrate and be incorporated into base's copper foil separate substrate surface copper electroplating layer, the circuit substrate further include to A few conductive through hole, it is characterised in that: the conductive through hole include the first conductive hole and with first conductive hole integrally formed the Two conductive holes, the aperture of first conductive hole are greater than the aperture of second conductive hole, which, which runs through, is incorporated into substrate First surface base's copper foil, into the substrate, second conductive hole run through be incorporated into substrate second surface base's copper Foil is connected into the substrate, and with first conductive hole.
8. circuit substrate as claimed in claim 7, it is characterised in that: the substrate is in the first conductive hole, the second conductive hole phase There is a protrusion, which is D in the size of the first surface and the extending direction of second surface at friendship0, described first leads The diameter in electric hole is D1, the diameter of neighbouring first conductive hole of second conductive hole is D2, D2=D1-2×D0。
9. circuit substrate as claimed in claim 8, it is characterised in that: D1> D020 μm of >.
10. circuit substrate as claimed in claim 7, it is characterised in that: first conductive hole be it is cylindric, described second leads Direction of the hole in electric hole without leave close to the direction of the first conductive hole away from the first conductive hole is gradually reduced.
CN201710955055.1A 2017-10-13 2017-10-13 The production method and circuit substrate of circuit substrate Pending CN109673101A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201710955055.1A CN109673101A (en) 2017-10-13 2017-10-13 The production method and circuit substrate of circuit substrate
TW107124543A TWI677268B (en) 2017-10-13 2018-07-16 Circuit board manufacturing method and circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710955055.1A CN109673101A (en) 2017-10-13 2017-10-13 The production method and circuit substrate of circuit substrate

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CN109673101A true CN109673101A (en) 2019-04-23

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TW (1) TWI677268B (en)

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CN110167286A (en) * 2019-06-27 2019-08-23 浪潮商用机器有限公司 A kind of pcb board hole wall method for processing plating layer
CN112203440A (en) * 2019-07-08 2021-01-08 相互股份有限公司 Via hole structure in circuit board and manufacturing method thereof
CN113966067A (en) * 2020-07-20 2022-01-21 宏恒胜电子科技（淮安）有限公司 Circuit board and manufacturing method thereof

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Publication number Priority date Publication date Assignee Title
CN110167286A (en) * 2019-06-27 2019-08-23 浪潮商用机器有限公司 A kind of pcb board hole wall method for processing plating layer
CN112203440A (en) * 2019-07-08 2021-01-08 相互股份有限公司 Via hole structure in circuit board and manufacturing method thereof
CN113966067A (en) * 2020-07-20 2022-01-21 宏恒胜电子科技（淮安）有限公司 Circuit board and manufacturing method thereof

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TW201918133A (en) 2019-05-01
TWI677268B (en) 2019-11-11

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