CN106658958B - Flexible circuit board and preparation method thereof - Google Patents
Flexible circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN106658958B CN106658958B CN201510712461.6A CN201510712461A CN106658958B CN 106658958 B CN106658958 B CN 106658958B CN 201510712461 A CN201510712461 A CN 201510712461A CN 106658958 B CN106658958 B CN 106658958B
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- Prior art keywords
- hole
- layer
- circuit board
- wall
- flexible circuit
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A kind of Double-layer flexible circuit board includes basal layer, the first line layer and the second line layer for being formed in the basal layer two sides.Multiple first conductive structures are formed on first line layer.First conductive structure is electrically connected first line layer and the second line layer.Flexible circuit board offers interconnected the first hole and the second hole.The diameter in the first hole is greater than the diameter in the second hole.The a part of first hole through first line layer and basal layer.The remaining part of basal layer is run through in second hole.First conductive structure includes first part and second part.First part is housed in the first hole, and second part is filled and is housed in second hole.Flexible circuit board is also formed with the first annular groove not exclusively around first part setting.The outer wall of first annular groove and the hole wall in first hole coincide.The inner wall of first annular groove is located between the hole wall in first hole and the hole wall in the second hole.
Description
Technical field
The present invention relates to circuit board technology field more particularly to a kind of flexible circuit boards.
Background technique
Currently, many flexible circuit boards have high complexity, and high-precision, the cabling requirement of high density.But in route
When production, the hole on flexible circuit board needs to increase orifice ring to enhance its connectivity capabilities, and this reduces flexible circuit board typesettings
Utilization rate, be unfavorable for high-density line production.
Summary of the invention
In view of this, the present invention, which provides one kind, avoids flexible circuit board existing for the ring structure of hole.
A kind of Double-layer flexible circuit board includes basal layer, the first line layer and the second route for being formed in the basal layer two sides
Layer.Multiple first conductive structures are formed on the first line layer.First conductive structure be electrically connected the first line layer and
Second line layer.The flexible circuit board offers interconnected the first hole and the second hole.The diameter in first hole be greater than this
The diameter in two holes.The a part of first hole through the first line layer and the basal layer.Second hole is surplus through the basal layer
Remaining part.First conductive structure includes first part and second part.The first part is housed in first hole, this
Two are partially filled with and are housed in second hole.The flexible circuit board be also formed with not exclusively around first part setting the
One annular groove.The outer wall of the first annular groove and the hole wall in first hole coincide.The inner wall position of the first annular groove
Between the hole wall in first hole and the hole wall in second hole.
A kind of multi-layer flexible circuit board includes the Double-layer flexible circuit board as described above, is arranged in the Double-layer flexible circuit
The tertiary circuit layer of plate two sides.The tertiary circuit layer includes multiple second conductive structures.Second conductive structure conducting electrical connection
The tertiary circuit layer and the first line layer or the tertiary circuit layer and second line layer.Second conductive structure includes
Part III and Part IV.The Part III section Opening length is greater than the section Opening length of the Part IV.The multilayer
Flexible circuit board is also formed with the second annular groove not exclusively around Part III setting.The outer wall of the second annular groove
It coincides with the side wall of the Part III.The inner wall of the annular groove is located at the side wall of the Part III and the side of the Part IV
Between wall.
A kind of production method of flexible circuit board comprising steps of provide substrate, the substrate include basal layer and be located at the base
The bottom layers of copper of the opposite two sides of bottom；Interconnected the first hole and the second hole are opened up on the substrate, and the diameter in first hole is big
Diameter in second hole, through the side copper foil of the substrate and a part of the basal layer, which runs through in first hole
The remaining part of the basal layer；First hole and the second hole are filled in plating, form first for filling and being contained in first hole
Part and the second part filled and be contained in second hole；Dry film is provided, which is covered on the surface of the substrate；It is right
The substrate after covering the dry film is exposed processing, forms the ring halfway around first hole in the first hole corresponding region
Shape pattern, the Section of Outer Ring Line of the circular pattern is corresponding with the first hole hole wall, and the inner loop-line of the circular pattern is located at first hole
Between hole wall and the second hole hole wall；Route is carried out to the substrate to make to form conductive circuit layer, is formed around the first part
There is imperfect circular first annular groove, the outer wall of the first annular groove and the hole wall in first hole coincide, this first
The inner wall of annular groove is located between the hole wall in first hole and the hole wall in second hole.
The flexible circuit board provided by the invention being somebody's turn to do forms ladder-like aperture wide outside and narrow inside, the structure: 1. by laser
It avoids and orifice ring is set around conductive hole, to increase the typesetting utilization rate of flexible circuit board, meet high-density line system
Make demand；2. being conducive to liquid medicine is filled into micropore, the high aspect ratio (depth and diameter ratio) in filling perforation due to hole can avoid
Caused by fail to fill in or empty bubble etc. is bad；3. allow to expose the deviation existed within the scope of the wide aperture in ladder-like aperture,
It reduces because bad caused by exposure deviation.Meanwhile it also contributing to improving filled with conductive structure in the ladder-like aperture
The integral heat sink efficiency of substrate.
Detailed description of the invention
Fig. 1 is the cross-sectional view for the substrate that first embodiment of the invention provides.
Fig. 2 is the cross-sectional view that the first hole and the second hole are opened on the substrate of Fig. 1.
Fig. 3 is that the cross-sectional view after filling perforation is electroplated on the substrate of Fig. 2.
Fig. 4 is the cross-sectional view that dry film is covered on the substrate of Fig. 3.
Fig. 5 is the cross-sectional view exposed on the substrate of Fig. 4.
Fig. 6 is the cross-sectional view that route is formed on substrate in Fig. 5.
Fig. 7 is the cross-sectional view for the single sided board for having copper foil layer and resin layer in the pressing of the Double-layer flexible circuit board two sides of Fig. 6.
Fig. 8 is the cross-sectional view after the Double-layer flexible circuit board two sides of Fig. 7 press the single sided board.
Fig. 9 is the cross-sectional view that third hole and the 4th hole are opened on the copper foil layer of Fig. 8.
Figure 10 is that the cross-sectional view after filling perforation is electroplated on the Double-layer flexible circuit board of Fig. 9.
Figure 11 is the cross-sectional view that route is formed on the copper foil layer in Figure 10.
Main element symbol description
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Fig. 1 to Fig. 6 is please referred to, first embodiment of the invention provides a kind of production method of Double-layer flexible circuit board, including
Following steps:
The first step, referring to Fig. 1, providing a substrate 100.
In the present embodiment, which is dual platen, which includes a basal layer 110, is formed in the base
The the first bottom layers of copper 111 and the second bottom layers of copper 112 of 110 opposite sides of bottom.
In the present embodiment, which is flexible resin layer, and such as polyimides (Polyimide, PI) gathers to benzene two
Formic acid glycol ester (Polyethylene Terephthalate, PET) or polyethylene naphthalate (Polyethylene
Naphthalate,PEN)。
Second step, referring to Fig. 2, opening up multiple first holes 102 and multiple second holes 104 on the substrate 100.
In the present embodiment, which is blind hole, passes through the first bottom layers of copper 111, the basal layer 110
Top half.The diameter in first hole 102 is greater than 50 microns.The height that first hole 102 passes through the basal layer 110 is less than or waits
In a half thickness of the basal layer 110.First hole 102 is obtained in the form of laser processing.The substrate 100 open up this first
When hole 102, first with laser breakdown the first bottom layers of copper 111, further according to 110 thickness of basal layer, with laser breakdown preset height
The basal layer 110.
In first hole, 102 bottom opens up second hole 104.Second hole 104 passes through the remainder of the basal layer 110
Point, terminate in the second bottom layers of copper 112.The diameter in second hole 104 is less than the diameter in first hole 102, in the present embodiment,
The diameter in second hole 104 is greater than or equal to 25 microns, and less than 50 microns.
First hole 102 and second hole 104 are interconnected, and the axis weight in first hole 102 and second hole 104
It closes.First hole 102 and the section in second hole 104 are stepped.
Third step, referring to Fig. 3, being electroplated the substrate 100 to form electroplated layer, which includes first conductive
Structure 106.First conductive structure 106 includes first part 107 and the second part 108 of mutual conduction connection.This second
108 are divided to fill and be housed in second hole 104.The first part 107 fills and is housed in first hole 102.
4th step, referring to Fig. 4, after carrying out shadow or organic conductive coating processing to substrate 100, on the substrate 100
Cover the first dry film 113, the second dry film 114.In the present embodiment, the first dry film 113 is covered on 111 side of the first bottom layers of copper
Electroplated layer on, the second dry film 114 is covered on the electroplated layer of 112 side of the second bottom layers of copper.
5th step, referring to Fig. 5, being exposed the substrate 100 to form line pattern on 100 surface of substrate.Its
In, the dry film pattern 109 around first conductive structure 106 is formed in first dry film 113.The dry film pattern 109 exists
Notch (not shown), halfway around the first conductive structure 106.The shape of the figure of the dry film pattern 109 and first hole 102
It is corresponding.When first hole 102 is round hole, which is with circular loop pattern jaggy；When first hole
102 be square hole when, the dry film pattern 109 be with side's circular pattern jaggy.The shape in corresponding first hole 102, this is dry
Film figure 109 is also designed as other shapes, is not limited with above two shape.In present embodiment, first hole
102 be round hole, which is with circular loop pattern jaggy.The Section of Outer Ring Line of the dry film pattern 109 and this first
The hole wall in hole 102 is corresponding.The inner loop-line of the dry film pattern 109 is located at the hole wall of the first hole 102 hole wall and second hole 104
Between.
Film process is developed, etched and gone to 6th step to the substrate 100 also referring to Fig. 5 and Fig. 6, by this first
Bottom layers of copper 111 is fabricated to first line layer 115, which is fabricated to the second line layer 116.It is double to obtain
Layer flexible circuit board 10.Wherein, the first annular groove of imperfect (there is interval) is formed in first conductive structure 106
119.The first annular groove 119 is corresponding with the dry film pattern 109.The outer wall of the first annular groove 119 and first hole
102 hole wall coincides.The inner wall of the first annular groove 119 is located at the hole wall in first hole 102 and the hole in second hole 104
Between wall.Due to its process be it is well-known to those skilled in the art, be not repeated herein.
Referring to Fig. 6, the Double-layer flexible circuit board 10 that present embodiment provides, including basal layer 110 and it is formed in the base
The first line layer 115 of 110 two sides of bottom and the second line layer 116；The Double-layer flexible circuit board 10 offers interconnected
First hole 102 and the second hole 104, the diameter in first hole 102 are greater than the diameter in second hole 104, which runs through should
The remaining part of basal layer 110 is run through in a part of first line layer 115 and the basal layer 110, second hole 104, this
One hole 102 is less than or equal to the thickness of 110 half of basal layer through the depth of the basal layer 110；The Double-layer flexible circuit board
10 further include the first conductive structure 106 that the first line layer 115 and second line layer 116 is connected, first conductive structure
106 include first part 107 and second part 108, which is housed in first hole 102, the second part
108 fill and are housed in second hole 104.The Double-layer flexible circuit board 10 is formed with first annular groove 119.First ring
Connected in star 119 is arranged around the first part 107.The outer wall of the first annular groove 119 is mutually be overlapped with the hole wall in first hole 102
It closes.The inner wall of the first annular groove 119 is located between the hole wall in first hole 102 and the hole wall in second hole 104.
Fig. 7 to Figure 11 is please referred to, second embodiment of the invention provides a kind of production method of multi-layer flexible circuit board, including
Following steps:
The first step, referring to Fig. 6, providing as first embodiment makes the Double-layer flexible circuit board 10 to be formed.
Second step, referring to Fig. 7, providing two single sided boards 120.The single sided board 120 includes the copper foil of mutual gluing connection
Layer 121 and resin layer 123.The single sided board 120 further includes a glue-line 125.The glue-line 125 is coated on the resin layer 123.The tree
Rouge layer 123 is located between the copper foil layer 121 and the resin layer 123.
Third step, referring to Fig. 8, two single sided boards 120 are pressed together on 10 two sides of Double-layer flexible circuit board.At this point,
The glue-line 125 fills the first line layer 115 and second line layer 116.
4th step, referring to Fig. 9, opening up multiple third holes 126 and multiple 4th holes 128 on the copper foil layer 121.
In the present embodiment, which is blind hole, passes through the upper half of the copper foil layer 121, the resin layer 123
Part.The diameter in the third hole 126 is greater than 50 microns.The height that the third hole 126 passes through the resin layer 123 is less than or equal to should
One half thickness of resin layer 123.The third hole 126 is obtained in the form of laser processing.The third hole is opened up in the copper foil layer 121
When 126, first with the laser breakdown copper foil layer 121, further according to the thickness of the resin layer 123, with laser breakdown preset height should
Resin layer 123.
The 4th hole 128 is opened up in the bottom in the third hole 126.4th hole 128 passes through the remainder of the resin layer 123
Point and the glue-line 125, terminate in the first line layer 115 and second line layer 116.The diameter in the 4th hole 128 be less than this
The diameter in three holes 126, in the present embodiment, the diameter in the 4th hole 128 are greater than or equal to 25 microns, and less than 50 microns.
The third hole 126 and the 4th hole 128 are interconnected, and the axis weight in the third hole 126 and the 4th hole 128
It closes.The third hole 126 and the section in the 4th hole 128 are stepped.
Wherein, there are the position and first hole 102 and second hole 104 in some third holes 126 and the 4th hole 128
Position is corresponding.4th hole 128 and first hole 102 are interconnected connection, the third hole 126, the 4th hole 128, this
The axis in one hole 102 and second hole 104 overlaps.
5th step, referring to Fig. 10, after copper foil layer 121 opens up third hole 126 and the 4th hole 128, it is soft to the bilayer
Property circuit board 10 be electroplated to form electroplated layer, the electroplated layer include the second conductive structure 130.Second conductive structure 130
Part III 132 and Part IV 134 including mutual conduction connection.The Part III 132 fills and is housed in the third hole
In 126.The Part IV 134 is filled and is housed in the 4th hole 128.
6th step, please refers to Figure 11, carries out pressing dry film, exposure, development, erosion to the Double-layer flexible circuit board 10 after plating
Film process is carved and gone, which is fabricated to tertiary circuit layer 117.To obtain multi-layer flexible circuit board 20.Its step
With pressed dry film in first embodiment, exposure, development, etch and film process is gone to form first line layer 115 and the second line layer
116 the step of, is roughly the same.Due to its process be it is well-known to those skilled in the art, be not repeated herein.Wherein, this second
The second annular groove 136 of imperfect (there is interval) is formed at conductive structure 130.The substantially ring of second annular groove 136
It is arranged around the Part III 132.The second annular groove 136 can be the toroidal cavity in the presence of interval, the side there are interval
Annular groove etc..In present embodiment, which can be the toroidal cavity in the presence of interval.Second ring
The outer wall of connected in star 136 and the hole wall in the third hole 126 coincide.The inner wall of the second annular groove 136 is located at the third hole
Between 126 hole wall and the hole wall in the 4th hole 128.
The flexible circuit board provided by the invention being somebody's turn to do forms ladder-like aperture wide outside and narrow inside, the structure: 1. by laser
It avoids and orifice ring is set around conductive hole, to increase the typesetting utilization rate of flexible circuit board, meet high-density line system
Make demand；2. being conducive to liquid medicine is filled into micropore, the high aspect ratio (depth and diameter ratio) in filling perforation due to hole can avoid
Caused by fail to fill in or empty bubble etc. is bad；3. allow to expose the deviation existed within the scope of the wide aperture in ladder-like aperture,
It reduces because bad caused by exposure deviation.Meanwhile it also contributing to improving filled with conductive structure in the ladder-like aperture
The integral heat sink efficiency of substrate.
It is understood that above embodiments are only used to illustrate the present invention, it is not used as limitation of the invention.For this
For the those of ordinary skill in field, the various other changes and modifications made in accordance with the technical idea of the present invention, all
It falls within the scope of protection of the claims of the present invention.
Claims (10)
1. a kind of Double-layer flexible circuit board, which includes basal layer, is formed in the first of the basal layer two sides
Line layer and the second line layer are formed with multiple first conductive structures on the first line layer, which electrically connects
Connect the first line layer and the second line layer, which is characterized in that the flexible circuit board offers interconnected the first hole and
Two holes, the diameter in first hole are greater than the diameter in second hole, which runs through the first line layer and the one of the basal layer
The remaining part of the basal layer is run through in part, second hole, which includes first part and second part, this
A part is housed in first hole, which fills and be housed in second hole, which is also formed with
Not exclusively around the first annular groove of first part setting, the hole wall phase of the outer wall of the first annular groove and first hole
It is overlapped, the inner wall of the first annular groove is located between the hole wall in first hole and the hole wall in second hole.
2. Double-layer flexible circuit board as described in claim 1, which is characterized in that the diameter in first hole is greater than 50 microns.
3. Double-layer flexible circuit board as described in claim 1, which is characterized in that the diameter in second hole is greater than/is equal to 25 micro-
Rice and less than 50 microns.
4. Double-layer flexible circuit board as described in claim 1, which is characterized in that first hole is small through the height of the basal layer
In or equal to the substrate half thickness.
5. a kind of multi-layer flexible circuit board, which includes this pair as described in claim 1-4 any one
Layer flexible circuit board, the tertiary circuit layer that the Double-layer flexible circuit board two sides are arranged in, which includes multiple second
Conductive structure, second conductive structure conducting are electrically connected the tertiary circuit layer and the first line layer or the tertiary circuit layer
With second line layer, which includes Part III and Part IV, and the Part III section Opening length is big
In the section Opening length of the Part IV, which is also formed with not exclusively around Part III setting
Second annular groove, the outer wall of the second annular groove coincide with the side wall of the Part III, the inner wall position of the annular groove
Between the side wall of the Part III and the side wall of the Part IV.
6. a kind of production method of flexible circuit board, comprising steps of
Substrate is provided, which includes basal layer and the bottom layers of copper positioned at the opposite two sides of the basal layer；
Interconnected the first hole and the second hole are opened up on the substrate, the diameter in first hole is greater than the diameter in second hole,
The remaining portion of the basal layer is run through through the side copper foil of the substrate and a part of the basal layer, second hole in first hole
Point；
First hole and the second hole are filled in plating, are formed and are filled and be contained in first part and filling in first hole and accommodate
Second part in second hole；
Dry film is provided, which is covered on the surface of the substrate；
Be exposed processing to the substrate after the dry film is covered, the first hole corresponding region formed halfway around this first
The circular pattern in hole, the Section of Outer Ring Line of the circular pattern is corresponding with the first hole hole wall, and the inner loop-line of the circular pattern is located at should
Between first hole hole wall and the second hole hole wall；
Route is carried out to the substrate to make to form conductive circuit layer, and imperfect the first circular ring is formed with around the first part
Connected in star, the outer wall of the first annular groove and the hole wall in first hole coincide, and the inner wall of the first annular groove is located at should
Between the hole wall in the first hole and the hole wall in second hole.
7. the production method of flexible circuit board as claimed in claim 6, which is characterized in that open up first hole in the substrate
When, laser breakdown bottom layers of copper is first used, further according to the base layer thickness, the basal layer of laser breakdown preset height.
8. the production method of flexible circuit board as claimed in claim 7, which is characterized in that after forming first hole, use laser
In first hole, second hole is formed on bottom, which is overlapped with the axis in second hole.
9. the production method of flexible circuit board as claimed in claim 6, which is characterized in that section in first hole and second hole
Face is stepped.
10. the production method of flexible circuit board as claimed in claim 6, which is characterized in that in the step for forming conductive circuit layer
It further include pressing single layer copper foil on the flexible circuit board and carrying out pressing dry film, exposure, development, etch and go film process after rapid
Route making step to realize circuit board increasing layer the step of.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510712461.6A CN106658958B (en) | 2015-10-28 | 2015-10-28 | Flexible circuit board and preparation method thereof |
| TW104141692A TWI608777B (en) | 2015-10-28 | 2015-12-11 | Flexible printed circuit board and method manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510712461.6A CN106658958B (en) | 2015-10-28 | 2015-10-28 | Flexible circuit board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106658958A CN106658958A (en) | 2017-05-10 |
| CN106658958B true CN106658958B (en) | 2019-03-08 |
Family
ID=58816158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510712461.6A Active CN106658958B (en) | 2015-10-28 | 2015-10-28 | Flexible circuit board and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106658958B (en) |
| TW (1) | TWI608777B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109661125B (en) * | 2017-10-12 | 2021-11-16 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
| CN109673101A (en) * | 2017-10-13 | 2019-04-23 | 鹏鼎控股(深圳)股份有限公司 | The production method and circuit substrate of circuit substrate |
| CN108161253B (en) * | 2017-11-13 | 2019-10-15 | 上海申和热磁电子有限公司 | A kind of method of aperture on double-sided copper-clad ceramic substrate single side copper foil |
| CN110545625B (en) * | 2018-05-29 | 2021-11-02 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and manufacturing method thereof |
| WO2021120196A1 (en) * | 2019-12-20 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Transmission line, electronic device, and method for manufacturing transmission line |
| CN114126225A (en) * | 2020-08-31 | 2022-03-01 | 庆鼎精密电子（淮安）有限公司 | Method for manufacturing circuit board, circuit board and method for manufacturing circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW552839B (en) * | 2002-06-18 | 2003-09-11 | Phoenix Prec Technology Corp | Multi-layer circuit board through hole forming method and structure for integrated circuit package |
| CN101370354A (en) * | 2007-08-17 | 2009-02-18 | 三星电机株式会社 | Capacitor-embedded printed circuit board and manufacturing method thereof |
| CN102480838A (en) * | 2010-11-24 | 2012-05-30 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board with composite through holes |
| CN103369867A (en) * | 2012-04-01 | 2013-10-23 | 北大方正集团有限公司 | Printed Circuit Board (PCB) and preparation method thereof |
| CN104754855A (en) * | 2013-12-31 | 2015-07-01 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5794502B2 (en) * | 2012-01-23 | 2015-10-14 | 京セラサーキットソリューションズ株式会社 | Method for manufacturing printed wiring board |
| TW201347629A (en) * | 2012-05-09 | 2013-11-16 | Hon Hai Prec Ind Co Ltd | Method for manufacturing printed circuit board |
-
2015
- 2015-10-28 CN CN201510712461.6A patent/CN106658958B/en active Active
- 2015-12-11 TW TW104141692A patent/TWI608777B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW552839B (en) * | 2002-06-18 | 2003-09-11 | Phoenix Prec Technology Corp | Multi-layer circuit board through hole forming method and structure for integrated circuit package |
| CN101370354A (en) * | 2007-08-17 | 2009-02-18 | 三星电机株式会社 | Capacitor-embedded printed circuit board and manufacturing method thereof |
| CN102480838A (en) * | 2010-11-24 | 2012-05-30 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board with composite through holes |
| CN103369867A (en) * | 2012-04-01 | 2013-10-23 | 北大方正集团有限公司 | Printed Circuit Board (PCB) and preparation method thereof |
| CN104754855A (en) * | 2013-12-31 | 2015-07-01 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106658958A (en) | 2017-05-10 |
| TWI608777B (en) | 2017-12-11 |
| TW201720259A (en) | 2017-06-01 |
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