WO2021120196A1

WO2021120196A1 - Transmission line, electronic device, and method for manufacturing transmission line

Info

Publication number: WO2021120196A1
Application number: PCT/CN2019/127114
Authority: WO
Inventors: 陈勇利; 王建安; 许心影; 梁悦
Original assignee: 瑞声声学科技(深圳)有限公司; 瑞声科技(新加坡)有限公司
Priority date: 2019-12-20
Filing date: 2019-12-20
Publication date: 2021-06-24

Abstract

Provided are a transmission line, an electronic device, and a method for manufacturing the transmission line. The transmission line comprises a first substrate layer, a first signal line arranged on one side of the first substrate layer, and a second signal line buried in the first substrate layer. The transmission line further comprises a first through hole that penetrates through the first substrate layer so as to electrically connect the first signal line to the second signal line. The position on the other side of the first substrate layer corresponding to the first through hole is recessed in a direction approaching the first signal line in order to form an isolation groove, so as to remove part of the first through hole. The transmission line further comprises a reinforcement plate that covers the isolation groove. The reinforcement plate comprises a second substrate layer stacked with the first substrate layer and a first grounding layer arranged on the side of the second substrate layer close to the first substrate layer. According to the transmission line provided in the present invention, a through hole is provided in a substrate layer, such that a smaller diameter can be achieved, and more space can be provided for impedance adjustment of the transmission line. In addition, the processing process is simpler and the yield is high, thereby greatly improving the excellence rate of the transmission line.

Description

Transmission line, electronic equipment and manufacturing method of transmission line

Technical field

The invention relates to the field of signal transmission, in particular to a transmission line, electronic equipment and a manufacturing method of the transmission line.

Background technique

In the development of RF transmission lines, vias have always been an important part. Nowadays, the current way of converting the inner layer wire to the outer layer wire is mostly in the form of blind holes, and in addition, grounding through holes need to be drilled around the blind holes to prevent electromagnetic leakage. However, when the prior art uses the form of blind holes to realize the transition from the inner layer line to the outer layer line, the size of the blind hole is greatly restricted by the processing capacity, and the diameter of the blind hole needs to be greater than the thickness of the stack, which will limit the impedance at the via hole. adjust.

technical problem

The purpose of the present invention is to provide a transmission line with a through hole instead of a blind hole.

Technical solutions

The technical solution of the present invention is as follows: a transmission line comprising a first substrate layer, a first signal line provided on one side of the first substrate layer, and a second signal line embedded in the first substrate layer A signal line, the transmission line further includes a first through hole penetrating the first substrate layer to electrically connect the first signal line and the second signal line, and the other side of the first substrate layer corresponds to The position of the first through hole is recessed toward the first signal line to form an isolation groove to remove a part of the first through hole; the transmission line further includes a reinforcing plate covering the isolation groove, The reinforcing plate includes a second base material layer laminated with the first base material and a first ground layer disposed on a side of the second base material layer close to the first base material layer.

Further, the bottom of the isolation groove is connected to the layer where the second signal line is located.

Further, the reinforcing plate further includes a second ground layer disposed on the side of the second base material layer away from the first base material layer, and a second ground layer connected to the first ground layer and the second ground layer. A plurality of second through holes, and the second through holes are arranged around the first through holes.

Further, the transmission line further includes a third ground layer provided on a side of the first base material layer away from the second base material layer, the third ground layer is provided with an escape groove, and the first signal line Set in the avoidance slot.

Further, the transmission line is further provided with a first orifice ring, the first orifice ring is arranged in the avoiding groove, and the first orifice ring is arranged around the periphery of the first through hole and is connected to the first hole. The through hole is electrically connected to the first signal line.

Further, the transmission line is further provided with a second eye ring, the second eye ring is provided on the layer where the second signal line is located, and the second eye ring is provided on the periphery of the first through hole and is connected with The first through hole is electrically connected to the second signal line.

The present invention also provides a method of manufacturing the above-mentioned transmission line, including

1) Provide a first base material layer, one side of which is provided with the first signal line, and the second signal line is buried in it;

2) providing a first through hole penetrating the first substrate layer to electrically connect the first signal line and the second signal line;

3) Milling a hole from the other side of the first substrate layer corresponding to the position of the first through hole in the direction close to the first signal line to form the isolation groove to remove the first through hole Part of

4) Covering the isolation groove with a reinforcing plate, the reinforcing plate comprising a second base material layer laminated with the first base material, and a second base material layer arranged on the second base material layer close to the first base material. The first ground layer on one side of the substrate layer.

Further, the isolation groove is milled to the level where the second signal line is located.

The present invention also provides an electronic device, which includes the transmission line described in any one of the above.

Beneficial effect

The beneficial effect of the present invention is that the through holes are provided in the base material layer, which is less limited by the processing capacity compared with the blind holes. The same base material layer can be provided with through holes to achieve a smaller diameter, which is the impedance adjustment of the transmission line. Provides more space, simpler processing, high yield, and greatly improves the good rate of transmission lines.

Description of the drawings

Figure 1 is an exploded perspective view of a transmission line according to an embodiment of the present invention;

Figure 2 is a three-dimensional assembly diagram of the transmission line of the embodiment of the present invention;

Figure 3 is a cross-sectional view along A-A of Figure 2;

Figure 4 is an enlarged view of B in Figure 3;

FIG. 5 is a schematic flowchart of a method for manufacturing a transmission line according to an embodiment of the present invention.

Embodiments of the present invention

In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, a person of ordinary skill in the art can understand that, in each embodiment of the present invention, many technical details are proposed for the reader to better understand the present invention. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solution claimed by the present invention can be realized.

The embodiment of the present invention provides a transmission line and an electronic device. When an antenna is arranged in the electronic device, the antenna and the signal processing unit of the electronic device need to be electrically connected through the transmission line. Electronic devices include, but are not limited to, smart phones, tablet computers, and portable wearable devices.

Please refer to Figures 1 to 4, a transmission line in which a first substrate layer 1, a first signal line 10 provided on one side of the first substrate layer 1, and a first signal line embedded in the first substrate The second signal line 20 of layer 1, the transmission line further includes a first through hole 4 penetrating through the first substrate layer 1 to electrically connect the first signal line 10 and the second signal line 20, the The other side of the first substrate layer 1 corresponds to the position of the first through hole 4 and is recessed to form an isolation groove 5 in a direction close to the first signal line 10 to remove a part of the first through hole 4; The transmission line also includes a reinforcing plate 6 covering the isolation groove 5, and the reinforcing plate 6 includes a second base material layer 61 stacked on the first base material layer 1 and a second base material layer 61 disposed on the second base material layer. The material layer 61 is close to the first ground layer 62 on the side of the first substrate layer 1.

In this embodiment, the surface of the first through hole 4 is plated with copper to conduct signal conduction. It can be understood that the first signal line 10 forms a microstrip line; the second signal line 20 is arranged in the first substrate layer 1 to form a strip line, and the strip line is electrically connected to the first through hole 4 and passes through the first The copper-plated layer of the through hole 4 is indirectly electrically connected to the microstrip line, which realizes a transmission line structure that converts from an inner line to an outer line, or from an outer line to an inner line. Specifically, a hole milling operation on the first base material layer 1 can be performed, and the redundant first through holes 4 are removed to obtain the isolation groove 5. However, due to the existence of the isolation groove 5, the transmission line is easily broken. Therefore, the reinforcing plate 6 is covered at the isolation groove 5, and the isolation groove 5 is connected to the first ground layer 62 to prevent the transmission line from breaking from the isolation groove 5 and reduce the transmission to The signal of the second signal line is leaking. Preferably, the bottom of the isolation groove 5 is connected to the layer where the second signal line 20 is located.

Preferably, the reinforcing plate 6 further includes a second ground layer 63 disposed on the side of the second base material layer 61 away from the first base material layer 1, and connects the first ground layer 62 and the A plurality of second through holes 7 of the second ground layer 63, and the second through holes 7 are arranged around the first through holes 4.

Specifically, the reinforcing plate 6 is used to strengthen the overall strength of the transmission line, and the reinforcing plate 6 is provided with a second through hole 7 that communicates with the second ground layer 63 and the first ground layer 62 to prevent The signal of the first through hole 4 leaks. In this embodiment, the reinforcing plate 6 includes four second through holes 7, and the four second through holes 7 are arranged around the first through holes 4. It can be understood that the four second through holes 7 are arranged at the relative positions of the reinforcing plate 6 around the first through hole 4. Specifically, the second through holes 7 are opposed to each other in a crisscross arrangement. The relative position of the first through hole 4 on the reinforcing plate 6 is arranged around the second through hole 7 to minimize signal leakage.

Preferably, the transmission line further includes a third ground layer 12 provided on the side of the first substrate layer 1 away from the second substrate layer, and the third ground layer 12 is provided with an escape groove 11, the The first signal line 10 is arranged in the escape groove 11.

Specifically, the avoidance groove 11 is obtained by hollowing out the third ground layer 12, and the avoidance groove 11 is used to prevent the first through hole 4 from being electrically connected to the third ground layer 12.

Compared with the blind hole connection, the processing capacity of the first through hole 4 is less limited, and the same environment can achieve a smaller diameter, which provides more space for impedance adjustment, and the processing process is simple and the yield rate is high.

Preferably, the transmission line is further provided with a first orifice ring 81 and a second orifice ring 82; the first orifice ring 81 is arranged in the avoiding groove 11, and the first orifice ring 81 is connected to the first orifice A ring 81 is arranged around the periphery of the first through hole 4 and is electrically connected to the first through hole 4 and the first signal line 10; the second ring 82 is arranged where the second signal line 20 is located At the level of, the second ring 82 is arranged around the periphery of the first through hole 4 and is electrically connected to the first through hole 4 and the second signal line 20.

Specifically, the soldering area of the first through hole 4 is increased by the eye ring, and the contact area with the first signal line 10 and the second signal line 20 is increased, so that the first through hole 4 is connected to the first signal line 10, The connection of the second signal line 20 is more stable.

Please refer to FIG. 5, the present invention also provides a method for manufacturing the above-mentioned transmission line:

Step S1: providing a first substrate layer, one side of which is provided with the first signal line, and the second signal line is embedded therein;

Step S2: setting a first through hole penetrating the first substrate layer to electrically connect the first signal line and the second signal line;

Step S3: milling a hole from the other side of the first substrate layer corresponding to the position of the first through hole in a direction close to the first signal line to form the isolation groove to remove the first through hole a part of;

Step S4: Cover the isolation groove with a reinforcing plate, the reinforcing plate including a second base material layer laminated with the first base material, and a second base material layer disposed on the second base material layer close to the first base material. A first ground layer on one side of the substrate layer.

Specifically, the isolation groove is milled to the level where the second signal line is located.

In the above-mentioned embodiment, the first through hole 4 is used instead of the blind hole, and the redundant first through hole 4 of the first base material layer 1 is removed through the hole milling process to form the isolation groove 5 to reduce the size of the via hole through which the signal flows. , There are certain benefits for the overall performance improvement. Providing the first ground layer 62 and the second ground layer 63 at the corresponding positions of the first through hole 4 can effectively prevent signal leakage, and at the same time, the isolation groove 5 can prevent the first through hole 4 from electrically contacting the first ground layer 62.

Those skilled in the art can clearly understand that, for the convenience and conciseness of the description, the specific working process of the above-described system, device, and unit can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.

The above are only the embodiments of the present invention. It should be pointed out here that for those of ordinary skill in the art, improvements can be made without departing from the inventive concept of the present invention, but these all belong to the present invention. The scope of protection.

Claims

A transmission line comprising a first substrate layer, a first signal line provided on one side of the first substrate layer, and a second signal line embedded in the first substrate layer, characterized in that The transmission line further includes a first through hole penetrating the first substrate layer to electrically connect the first signal line and the second signal line, and the other side of the first substrate layer corresponds to the The position of the first through hole is recessed toward the first signal line to form an isolation groove to remove a part of the first through hole; the transmission line further includes a reinforcing plate covering the isolation groove, and The reinforcing plate includes a second base material layer laminated with the first base material and a first grounding layer disposed on a side of the second base material layer close to the first base material layer.
The transmission line according to claim 1, wherein the bottom of the isolation groove is connected to the layer where the second signal line is located.
The transmission line according to claim 1, wherein the reinforcing plate further comprises a second ground layer provided on the side of the second substrate layer away from the first substrate layer and connected to the first substrate layer. A plurality of second through holes of the ground layer and the second ground layer, and the second through holes are arranged around the first through holes.
The transmission line according to claim 1, wherein the transmission line further comprises a third ground layer provided on a side of the first substrate layer away from the second substrate layer, and the third ground layer is provided There is an escape groove, and the first signal line is arranged in the escape groove.
The transmission line according to claim 1, wherein the transmission line is further provided with a first grommet ring, the first grommet ring is disposed in the avoiding groove, and the first grommet ring is disposed in the first grommet. A peripheral edge of a through hole is electrically connected to the first through hole and the first signal line.
The transmission line according to claim 1, wherein the transmission line is further provided with a second annular ring, the second annular ring is arranged on the layer where the second signal line is located, and the second annular ring is arranged At the periphery of the first through hole and electrically connected to the first through hole and the second signal line.
A method of manufacturing the transmission line as claimed in claims 1-6, characterized in that it comprises

1) Provide a first base material layer, one side of which is provided with the first signal line, and the second signal line is buried in it;

2) providing a first through hole penetrating the first substrate layer to electrically connect the first signal line and the second signal line;

3) Milling a hole from the other side of the first substrate layer corresponding to the position of the first through hole in the direction close to the first signal line to form the isolation groove to remove the first through hole Part of

4) Covering the isolation groove with a reinforcing plate, the reinforcing plate comprising a second base material layer laminated with the first base material, and a second base material layer arranged on the second base material layer close to the first base material. The first ground layer on one side of the substrate layer.
7. The transmission line according to claim 7, wherein the isolation slot is milled to the level where the second signal line is located.
An electronic device, characterized in that the electronic device comprises the transmission line according to any one of claims 1-6.