CN210042366U - Water-cooling heat dissipation structure of automobile circuit board - Google Patents
Water-cooling heat dissipation structure of automobile circuit board Download PDFInfo
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- CN210042366U CN210042366U CN201920388109.5U CN201920388109U CN210042366U CN 210042366 U CN210042366 U CN 210042366U CN 201920388109 U CN201920388109 U CN 201920388109U CN 210042366 U CN210042366 U CN 210042366U
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Abstract
A water-cooling heat dissipation structure of an automobile circuit board comprises the automobile circuit board, heat dissipation fins, spring nails, a heat conduction layer, a heat conduction pipe and a refrigerator; the automobile circuit board is connected with components, the radiating fin is fixedly arranged on the automobile circuit board through spring nails, the heat conducting layer is arranged between the radiating fin and the components, one end of the heat conducting pipe is connected with the refrigerator, and the other end of the heat conducting pipe is attached to the radiating fin and is connected with the refrigerator again around the automobile circuit board; the refrigerator comprises a box body, a water storage tank, a controller, a water pump and a refrigerating device, wherein the water storage tank, the controller, the water pump and the refrigerating device are arranged in the box body; one side of the box body is provided with two connecting holes, the connecting holes are communicated with the water storage tank, and the heat conduction pipe is connected with the water storage tank through the connecting holes; the water pump is connected with the water storage tank, and the refrigerating device is connected with the water storage tank; the refrigerating device and the water pump are both electrically connected with the controller. The problem of current high-power equipment car circuit board radiating effect not good, lead to the stability reduction of electronic equipment performance is solved. The practicability is strong, and the popularization significance is strong.
Description
Technical Field
The utility model relates to an automotive circuit board technical field especially relates to an automotive circuit board water-cooling heat radiation structure.
Background
The automobile circuit board takes an insulating plate as a base material to realize the electrical connection of electronic components. The heat that electronic equipment during operation produced makes the inside temperature of equipment rise rapidly, and especially high-power equipment if not in time give off this heat, equipment can continue to heat up, and the device can lose efficacy because of overheated, and electronic equipment's reliability descends, and consequently, it is very important to carry out heat dissipation treatment to the circuit board. The manufacturing substrate of the automobile circuit board enables a medium directly contacting with the component, and the heat dissipation capability of the medium directly influences the heat dissipation of the whole system.
At present, an automobile circuit board generally radiates electronic components by connecting an additional radiator, but the radiator can only radiate one side of the automobile circuit board, so that the radiating effect is poor, and the stability of the performance of electronic equipment is reduced.
SUMMERY OF THE UTILITY MODEL
Therefore, an object of the utility model is to provide an automobile circuit board water-cooling heat radiation structure to it is not good to solve present automobile circuit board radiating effect, has leaded to the problem of the stability reduction of electronic equipment performance.
In order to achieve the above purpose, the utility model mainly adopts the following technical scheme:
a water-cooling heat dissipation structure of an automobile circuit board comprises the automobile circuit board, heat dissipation fins, spring nails, a heat conduction layer, a heat conduction pipe and a refrigerator; the automobile circuit board is connected with components, the radiating fin is fixedly arranged on the automobile circuit board through spring nails, the heat conduction layer is arranged between the radiating fin and the components, one end of the heat conduction pipe is connected with the refrigerator, and the other end of the heat conduction pipe is attached to the radiating fin and surrounds the automobile circuit board for a circle to be connected with the refrigerator again; the refrigerator comprises a box body, and a water storage tank, a controller, a water pump and a refrigerating device which are arranged in the box body; two connecting holes are formed in one side of the box body and communicated with the water storage tank, and the heat conduction pipe is connected with the water storage tank through the connecting holes; the water suction pump is connected with the water storage tank, and the refrigerating device is connected with the water storage tank; the refrigerating device and the water suction pump are both electrically connected with the controller.
Furthermore, the automobile circuit board is provided with a plurality of heat conduction holes.
Further, the circumference of fin is equipped with a plurality of mounting panels, each all seted up the through-hole on the mounting panel, thereby the spring nail passes the through-hole is fixed the mounting panel on the car circuit board.
Further, the heat conduction pipe is made of copper.
Furthermore, a temperature adjusting switch and a drainage switch are arranged on the controller; the temperature adjusting switch and the drainage switch extend out of the box body.
To sum up, the utility model discloses a set up a car circuit board water-cooling heat radiation structure, the heat pipe is gone into to the water drainage after the cooling treatment in the refrigerator passes through the suction pump with the water storage tank, heat pipe one end with the refrigerator links to each other, the other end laminating fin 20 centers on car circuit board 10 round once more with the refrigerator links to each other, the cooling water flows through the heat pipe and carries out the heat dissipation for car circuit board and components and parts and handle, thereby gets back to the water storage tank of refrigerator at last again and discharge once more after the cooling device cools off and carry out the heat dissipation for car circuit board of circulation again. The automobile circuit board solves the problem that the stability of the performance of the electronic equipment is reduced due to poor heat dissipation effect of the existing automobile circuit board of the high-power equipment. The practicability is strong, and the popularization significance is strong.
Drawings
Fig. 1 is a schematic structural view of the water-cooling heat dissipation structure of the car circuit board of the present invention;
FIG. 2 is a schematic view of a reverse side of the water-cooling heat dissipation structure of the vehicle circuit board shown in FIG. 1;
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.
As shown in fig. 1 and fig. 2, the present invention provides a water-cooling heat dissipation structure for a car circuit board, which includes a car circuit board 10, a heat sink 20, a spring pin 30, a heat conduction layer 40, a heat conduction pipe 50 and a refrigerator 60. The automobile circuit board 10 is connected with a component 11, the heat sink 20 is fixedly arranged on the automobile circuit board 10 through a spring nail 30, and the heat conduction layer 40 is arranged between the heat sink 20 and the component 11 and is used for transferring heat generated by the component 11 to the heat sink 20 so as to dissipate heat at the top of the component 11; the heat conduction pipe 50 is made of copper; one end of the heat pipe 50 is connected to the refrigerator 60, and the other end of the heat pipe is attached to the heat sink 20 and is connected to the refrigerator 60 again around the vehicle circuit board 10. The automobile circuit board 10 is provided with a plurality of heat conduction holes 12, so that heat at the bottom of the component 11 can be conveniently transferred to the heat conduction pipe 50 through the heat conduction holes 12.
The heat sink 20 is circumferentially provided with a plurality of mounting plates (not shown), each of the mounting plates is provided with a through hole (not shown), and the spring pin 30 passes through the through hole and the heat conduction hole 12 to fix the mounting plate on the vehicle circuit board. The heat sink 20 can be effectively protected by the spring, and damage to the heat sink 20 caused by over-pressing the heat sink 20 can be avoided.
The refrigerator 60 includes a box 61, a water storage tank (not shown) disposed in the box 61, a controller (not shown), a water pump (not shown), and a refrigerating device (not shown). One side of the box body 61 is provided with two connection holes (not shown), and the connection holes are communicated with the water storage tank. The water storage tank is filled with water. The heat conductive pipe 50 is connected to the water storage tank through the connection hole. The water suction pump is connected with the water storage tank and used for discharging water in the water storage tank to enter the heat conduction pipe 50 and performing heat dissipation treatment on the automobile circuit board 10 and the component 11; and then returns to the water storage tank. The refrigerating device is connected with the water storage tank and used for cooling the water in the water storage tank. The refrigerating device and the water suction pump are both electrically connected with the controller. The controller is provided with a temperature adjusting switch 62 and a drainage switch 63. The temperature adjusting switch 62 and the drainage switch 63 both extend out of the box body 61, so that the adjustment and control of a user are facilitated. The temperature adjusting switch 62 is used for adjusting the temperature of the water in the water storage tank, and the drainage switch 63 is used for discharging the low-temperature water in the water storage tank into the heat conduction pipe 50 and performing heat dissipation treatment on the automobile circuit board 10 and the component 11. And after the treatment, the water returns to the water storage tank of the refrigerator again, is cooled by the cooling device and then is discharged again, so that the automobile circuit board 10 is circularly subjected to heat dissipation treatment.
To sum up, the utility model discloses a set up a car circuit board 10 water-cooling heat radiation structure, the refrigerator passes through the suction pump and pours into heat pipe 50 with the water after the cooling treatment in the water storage tank, heat pipe 50 one end with the refrigerator links to each other, the other end laminating fin 20 centers on car circuit board 10 round once more with the refrigerator links to each other, cooling water flows through heat pipe 50 and carries out the heat dissipation for car circuit board 10 and components and parts 11, thereby gets back to the water storage tank of refrigerator at last again and discharges the endless for car circuit board 10 after the cooling device cooling again and carry out the heat dissipation. The problem of current high-power equipment car circuit board 10 radiating effect not good, lead to the stability reduction of electronic equipment performance is solved. The practicability is strong, and the popularization significance is strong.
The above-mentioned embodiments only represent one embodiment of the present invention, and the description is more specific and detailed, but not understood as the limitation of the scope of the invention, it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention, therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. The utility model provides an automobile circuit board water-cooling heat radiation structure which characterized in that: the automobile heat dissipation device comprises an automobile circuit board, a heat dissipation sheet, spring nails, a heat conduction layer, a heat conduction pipe and a refrigerator; the automobile circuit board is connected with components, the radiating fin is fixedly arranged on the automobile circuit board through spring nails, the heat conduction layer is arranged between the radiating fin and the components, one end of the heat conduction pipe is connected with the refrigerator, and the other end of the heat conduction pipe is attached to the radiating fin and surrounds the automobile circuit board for a circle to be connected with the refrigerator again; the refrigerator comprises a box body, and a water storage tank, a controller, a water pump and a refrigerating device which are arranged in the box body; two connecting holes are formed in one side of the box body and communicated with the water storage tank, and the heat conduction pipe is connected with the water storage tank through the connecting holes; the water suction pump is connected with the water storage tank, and the refrigerating device is connected with the water storage tank; the refrigerating device and the water suction pump are both electrically connected with the controller.
2. The water-cooling heat dissipation structure for the circuit board of the automobile of claim 1, wherein: the automobile circuit board is provided with a plurality of heat conduction holes.
3. The water-cooling heat dissipation structure for the circuit board of the automobile of claim 1, wherein: the circumference of fin is equipped with a plurality of mounting panels, each all seted up the through-hole on the mounting panel, thereby the spring nail passes the through-hole is fixed the mounting panel on the car circuit board.
4. The water-cooling heat dissipation structure for the circuit board of the automobile of claim 1, wherein: the heat conduction pipe is made of copper.
5. The water-cooling heat dissipation structure for the circuit board of the automobile of claim 1, wherein: the controller is provided with a temperature adjusting switch and a drainage switch; the temperature adjusting switch and the drainage switch extend out of the box body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920388109.5U CN210042366U (en) | 2019-03-25 | 2019-03-25 | Water-cooling heat dissipation structure of automobile circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920388109.5U CN210042366U (en) | 2019-03-25 | 2019-03-25 | Water-cooling heat dissipation structure of automobile circuit board |
Publications (1)
Publication Number | Publication Date |
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CN210042366U true CN210042366U (en) | 2020-02-07 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201920388109.5U Active CN210042366U (en) | 2019-03-25 | 2019-03-25 | Water-cooling heat dissipation structure of automobile circuit board |
Country Status (1)
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CN (1) | CN210042366U (en) |
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2019
- 2019-03-25 CN CN201920388109.5U patent/CN210042366U/en active Active
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GR01 | Patent grant | ||
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CP01 | Change in the name or title of a patent holder |
Address after: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100 Patentee after: Jiangxi hongban Technology Co.,Ltd. Address before: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100 Patentee before: RED BOARD (JIANGXI) Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |