CN210025469U

CN210025469U - Film cutting device

Info

Publication number: CN210025469U
Application number: CN201920342976.5U
Authority: CN
Inventors: 谢军
Original assignee: 广东思沃精密机械有限公司
Current assignee: Guangdong Siwo Advanced Equipment Co ltd
Priority date: 2019-03-18
Filing date: 2019-03-18
Publication date: 2020-02-07
Anticipated expiration: 2029-03-18

Abstract

The utility model discloses a film cutting device, which comprises a cutting table, a cutting assembly and a moving driving assembly for driving the cutting assembly to move; the middle part of the cutting table is provided with a vacuum chuck, and the cutting table is provided with at least one round cutting abdicating groove; the cutting assembly comprises a cutting fixing platform, a cutter assembly and a cutting driving assembly, wherein the cutting fixing platform is connected with the output end of the movable driving assembly, and the cutting driving assembly is arranged on the cutting fixing platform and used for driving the cutter assembly to complete cutting action. When the wafer attached to the strip-shaped dry film moves along with the dry film belt and reaches the position right above the cutting table, the vacuum chuck on the cutting table sucks and positions the wafer, the moving driving assembly drives the cutting assembly to the position right above the wafer, and the cutting driving assembly drives the cutter assembly to cut the dry film along the boundary of the wafer, so that the wafer is integrally separated from the dry film belt, and then the finished product wafer attached with the dry film is obtained.

Description

Film cutting device

Technical Field

The utility model relates to a cutting equipment field especially relates to a cut membrane device.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed on a silicon wafer to form an integrated circuit product with specific electrical functions.

In the production process of products such as wafers and the like, finished products need to be subjected to film pasting treatment, the wafers are firstly bonded and attached with the strip-shaped dry film, and in order to obtain the finished product wafers, the dry film needs to be cut along the edges of the wafers, so that the wafers are separated from the dry film strip.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a cut membrane device aims at solving prior art, and product pad pasting in-process such as wafer needs take the problem of separation with wafer and dry film.

To achieve the purpose, the utility model adopts the following technical proposal:

the film cutting device comprises a cutting table, a cutting assembly and a movement driving assembly for driving the cutting assembly to move; the middle part of the cutting table is provided with a vacuum chuck, and the cutting table is provided with at least one round cutting abdicating groove; the cutting assembly comprises a cutting fixing table, a cutter assembly and a cutting driving assembly, wherein the cutting fixing table is connected with the output end of the moving driving assembly, the cutter assembly is arranged on the cutting fixing table, and the cutting driving assembly is used for driving the cutter assembly to complete cutting action.

Furthermore, the mobile driving assembly comprises a supporting table, a horizontal driving module arranged on the supporting table, and a vertical driving module connected with the output end of the horizontal driving module; the cutting fixing table is connected with the output end of the vertical driving module.

Furthermore, the horizontal driving module comprises a horizontal motor arranged on the supporting table, a horizontal lead screw shaft connected with an output shaft of the horizontal motor, a horizontal lead screw nut sleeved outside the horizontal lead screw shaft, and a horizontal moving plate connected with the horizontal lead screw nut; the vertical driving module comprises a vertical motor arranged on the horizontal moving plate, a vertical screw shaft connected with an output shaft of the vertical motor, a vertical screw nut sleeved outside the vertical screw shaft, and a vertical moving plate connected with the vertical screw nut, and the cutting fixed table is connected with the vertical moving plate.

Furthermore, the cutting assembly also comprises a mounting plate arranged between the cutting driving assembly and the cutter assembly, and the cutter assembly is rotatably connected with the mounting plate; the cutting assembly further comprises a film breaking driving assembly used for driving the cutter assembly to rotate relative to the mounting plate so that the cutter assembly is abutted to the boundary of a product to be cut.

Furthermore, the cutter assembly comprises a cutter holder which is rotatably connected with the mounting plate and a cutter which is fixedly arranged on the cutter holder; the film breaking driving assembly comprises a rotating block which is rotatably connected with the tool apron and a driving cylinder of which the movable end is connected with the rotating block; the stiff end of drive actuating cylinder with the mounting panel rotates to be connected.

Furthermore, a first rotating seat is arranged on the cutter seat; the rotating block is rotationally connected with the first rotating seat; the mounting plate is provided with a second rotating seat; the fixed end of the driving cylinder is rotatably connected with the second rotating seat.

Further, the side wall of the cutting abdicating groove is provided with a lower cutter abdicating notch.

Furthermore, a connecting plate is arranged between the cutting driving assembly and the mounting plate, the connecting plate is provided with a connecting through hole, and the mounting plate is provided with a plurality of threaded holes in the length direction; and a connecting screw is arranged between the connecting plate and the mounting plate, penetrates through the connecting through hole and is in threaded connection with the threaded hole.

Furthermore, the number of the cutting abdicating grooves is multiple, and the circle centers of the cutting abdicating grooves are the same.

Furthermore, the connecting plate is provided with a sliding groove, and the mounting plate is provided with a sliding protrusion positioned in the sliding groove.

The utility model has the advantages that: when the wafer attached to the strip-shaped dry film moves along with the dry film belt and reaches the position right above the cutting table, the vacuum chuck on the cutting table sucks and positions the wafer, the moving driving assembly drives the cutting assembly to the position right above the wafer, and the cutting driving assembly drives the cutter assembly to cut the dry film along the boundary of the wafer, so that the wafer is integrally separated from the dry film belt, and then the finished product wafer attached with the dry film is obtained.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is a schematic structural diagram of a film cutting device in an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a cutting assembly according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a cutting table according to an embodiment of the present invention;

in the figure:

1. cutting table; 11. cutting the abdication groove; 12. the lower cutter avoids the gap; 2. a cutting assembly; 21. cutting the fixed table; 22. a cutter assembly; 221. a tool apron; 2211. a first rotating base; 222. a cutter; 23. a cutting drive assembly; 24. mounting a plate; 241. a second rotating base; 25. a rupture drive assembly; 251. rotating the block; 252. a driving cylinder; 26. a connecting plate; 3. a movement drive assembly; 31. a support table; 32. a horizontal driving module; 321. a horizontal motor; 33. a vertical driving module; 331. a vertical motor.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

The following describes the implementation of the present invention in detail with reference to specific embodiments.

As shown in fig. 1-3, an embodiment of the present invention provides a film cutting device, which includes a cutting table 1, a cutting assembly 2, and a movement driving assembly 3 for driving the cutting assembly 2 to move; the middle part of the cutting table 1 is provided with a vacuum chuck, and the cutting table 1 is provided with at least one round cutting abdicating groove 11; the cutting assembly 2 includes a cutting fixing table 21 connected to the output end of the moving driving assembly 3, a cutter assembly 22, and a cutting driving assembly 23 (which may be a motor or other driving mechanism that drives the cutter assembly 22 to complete a circular cutting operation) disposed on the cutting fixing table 21 and used for driving the cutter assembly 22 to complete the cutting operation.

The utility model discloses an in the embodiment, when the wafer that is attached to banded dry film along with the removal in dry film area and arrive cutting bed 1 directly over, the vacuum chuck on cutting bed 1 holds the wafer location, removes drive assembly 3 and drives cutting assembly 2 to the wafer directly over, and cutting drive assembly 23 drives cutter unit spare 22 and cuts the dry film along the boundary of wafer for wafer and dry film area wholeness separation, and then obtain the finished product wafer that the subsides cover has the dry film. The vacuum chuck can stably adsorb and fix the wafer, the surface of the wafer cannot be damaged when the wafer is fixed, the cutting abdicating groove 11 is used for the cutter assembly 22 to pass through when the cutting action is completed, and the damage of the cutter 222 to the cutting table 1 or the cutter 222 from the cutting table 1 is avoided.

Further, referring to fig. 1, as another embodiment of the film cutting device provided by the present invention, the movable driving assembly 3 includes a supporting platform 31, a horizontal driving module 32 disposed on the supporting platform 31, and a vertical driving module 33 connected to an output end of the horizontal driving module 32; the cutting fixture 21 is connected to the output of the vertical drive module 33. Vertical drive module 33 is used for driving the up-and-down motion of cutting fixed station 21 along vertical direction, horizontal drive module 32 is used for driving vertical drive module 33 and is the seesaw in the horizontal plane, consequently will prop up supporting bench 31 and be fixed in the position with the center collineation of cutting bed 1, can drive cutting drive assembly 23 and the middle part position of cutter unit spare 22 motion to cutting bed 1 of setting on cutting fixed station 21 through vertical drive module 33 and horizontal drive module 32's cooperation, in order to realize cutting the marginal dry film of wafer.

Further, referring to fig. 1, as another embodiment of the film cutting device provided by the present invention, the horizontal driving module 32 includes a horizontal motor 321 disposed on the supporting table 31, a horizontal screw shaft connected to an output shaft of the horizontal motor 321, a horizontal screw nut sleeved outside the horizontal screw shaft, and a horizontal moving plate connected to the horizontal screw nut; the vertical driving module 33 includes a vertical motor 331 disposed on the horizontal moving plate, a vertical screw shaft connected to an output shaft of the vertical motor 331, a vertical screw nut sleeved on an outer portion of the vertical screw shaft, and a vertical moving plate connected to the vertical screw nut, and the cutting fixing table 21 is connected to the vertical moving plate. The horizontal driving module 32 is a screw pair consisting of a horizontal screw shaft and a horizontal screw nut driven by a horizontal motor 321 to drive a horizontal moving plate to move, and the horizontal driving module 32 also comprises components such as bearings and the like which are necessary for the operation of the screw pair in the prior art; the vertical driving module 33 is a screw pair composed of a vertical screw shaft and a vertical screw nut driven by a vertical motor 331 to drive a vertical moving plate to move, and the vertical driving module 33 further comprises components such as bearings necessary for the operation of the screw pair in the prior art.

Further, please refer to fig. 2, as another embodiment of the film cutting device provided by the present invention, the cutting assembly 2 further includes a mounting plate 24 disposed between the cutting driving assembly 23 and the cutter assembly 22, and the cutter assembly 22 is rotatably connected to the mounting plate 24; the cutting assembly 2 further includes a rupture drive assembly 25 for driving the cutter assembly 22 to rotate relative to the mounting plate 24 to bring the cutter assembly 22 into abutment with the boundary of the product to be cut. In the initial state of the cutting assembly 2, the cutter assembly 22 is inclined towards the direction far away from the product to be cut (for cutting the dry film on the product to be cut), and the cutter assembly 22 is positioned above the dry film with a small gap; the film breaking driving assembly 25 drives the cutter assembly 22 to rotate towards the direction close to the product to be cut, the rotating process of the cutter assembly 22 has two partial motions in the horizontal direction and the vertical direction, the vertical partial motion enables the cutter assembly 22 to break a dry film and enables the end part of the cutter assembly 22 to be lower than the product to be cut, and the horizontal partial motion enables the cutter assembly 22 to move towards the direction close to the product to be cut until the horizontal partial motion is abutted to the boundary of a wafer; therefore, the cutter assembly 22 can be abutted against the boundary of the product to be cut after being lower than the product to be cut, and the product to be cut cannot be damaged. The mode that directly moves down from vertical direction for cutter unit 22 will dry film cut and with the border butt of the product that will cut can avoid cutter unit 22 directly to damage the product that will cut when moving down from vertical direction. The mounting plate 24 may be connected to the output of the cutting drive assembly 23 by a connecting plate 26.

Further, referring to fig. 2, as another embodiment of the film cutting device provided by the present invention, the cutter assembly 22 includes a cutter seat 221 rotatably connected to the mounting plate 24, and a cutter 222 fixedly mounted on the cutter seat 221; the film breaking driving assembly 25 comprises a rotating block 251 rotationally connected with the tool apron 221 and a driving cylinder 252 with a movable end connected with the rotating block 251; the fixed end of the drive cylinder 252 is rotatably connected to the mounting plate 24. The tool holder 221 rotates relative to the mounting plate 24 to rotate the tool 222. The cutter assembly 22 may also be a cutter blade that is rotatably coupled directly to the mounting plate 24. The cutter 222 is provided with an inclined cutting edge, and the cutter 222 is provided with a plurality of mounting positions connected with the cutter holder 221 so as to realize the adjustment of the length of the cutter 222 extending out of the cutter holder 221. The process that the membrane rupturing driving assembly 25 drives the cutter assembly 22 to rotate is as follows: the telescopic process of the movable end of the driving cylinder 252 drives the rotating block 251 to move, and the rotating block 251 drives the cutter assembly 22 to rotate during the moving process.

Further, referring to fig. 2, as another embodiment of the film cutting device provided by the present invention, a first rotating seat 2211 is disposed on the knife holder 221; the rotating block 251 is rotatably connected with the first rotating seat 2211; the mounting plate 24 is provided with a second rotating seat 241; the fixed end of the driving cylinder 252 is rotatably connected to the second rotating base 241. The first rotating base 2211 can be two guide plates which are opposite and spaced, and a rotating shaft can be arranged between the rotating block 251 and the guide plates of the first rotating base 2211 to realize rotating connection. The second rotating base 241 may be two opposite guide plates disposed at an interval, and a rotating shaft may be disposed between the fixed end of the driving cylinder 252 and the guide plates of the second rotating base 241 to achieve a rotating connection.

Further, please refer to fig. 3, as another embodiment of the film cutting device of the present invention, a lower knife avoiding notch 12 is disposed on a side wall of the cutting abdicating groove 11. The film breaking driving assembly 25 drives the cutter assembly 22 to rotate towards the direction close to the wafer and enables the cutter 222 to be lower than the upper surface of the wafer, and the cutter 222 enters the cutting abdicating groove 11 through the lower cutter abdicating notch 12.

Further, please refer to fig. 2, as another embodiment of the film cutting device provided by the present invention, a connecting plate 26 is disposed between the cutting driving assembly 23 and the mounting plate 24, the connecting plate 26 is provided with a connecting through hole, and the mounting plate 24 is provided with a plurality of threaded holes in the length direction; and a connecting screw is arranged between the connecting plate 26 and the mounting plate 24, penetrates through the connecting through hole and is in threaded connection with the threaded hole. The connecting plate 26 is provided with a connecting through hole, and the mounting plate 24 is provided with a plurality of threaded holes in the length direction; the connecting screw is arranged between the connecting plate 26 and the mounting plate 24, the length of the mounting plate 24 extending out of the connecting plate 26 can be adjusted, and further when the cutter assembly 22 arranged on the mounting plate 24 is adjusted to do circular cutting motion along with the mounting plate 24, the radius of the circumference can be adjusted to adapt to products with different sizes.

Further, please refer to fig. 3, as another embodiment of the film cutting device provided by the present invention, the number of the cutting abdicating slots 11 is plural, and the circle centers of the cutting abdicating slots 11 are the same, so that products with different sizes can be placed on the cutting table 1, and only the length of the mounting plate 24 extending out of the connecting plate 26 needs to be adjusted, and the position of the cutter assembly 22 is not required to be moved.

Further, referring to fig. 2, as another embodiment of the film cutting device provided by the present invention, the connecting plate 26 is provided with a sliding groove, and the mounting plate 24 is provided with a sliding protrusion located in the sliding groove. When the length of the mounting plate 24 extending out of the connecting plate 26 is adjusted, the mounting plate 24 can be operated to slide along the connecting plate 26 to a preset length and then locked by a connecting screw, and operation is convenient and fast.

It is to be noted that the solution in another embodiment may be a further modified embodiment on the basis of other examples.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. The film cutting device is characterized by comprising a cutting table, a cutting assembly and a moving driving assembly for driving the cutting assembly to move; the middle part of the cutting table is provided with a vacuum chuck, and the cutting table is provided with at least one round cutting abdicating groove; the cutting assembly comprises a cutting fixing table, a cutter assembly and a cutting driving assembly, wherein the cutting fixing table is connected with the output end of the moving driving assembly, the cutter assembly is arranged on the cutting fixing table, and the cutting driving assembly is used for driving the cutter assembly to complete cutting action.

2. The film cutting device according to claim 1, wherein the moving driving assembly comprises a supporting table, a horizontal driving module arranged on the supporting table, and a vertical driving module connected with an output end of the horizontal driving module; the cutting fixing table is connected with the output end of the vertical driving module.

3. The film cutting device according to claim 2, wherein the horizontal driving module comprises a horizontal motor arranged on the supporting table, a horizontal screw shaft connected with an output shaft of the horizontal motor, a horizontal screw nut sleeved outside the horizontal screw shaft, and a horizontal moving plate connected with the horizontal screw nut; the vertical driving module comprises a vertical motor arranged on the horizontal moving plate, a vertical screw shaft connected with an output shaft of the vertical motor, a vertical screw nut sleeved outside the vertical screw shaft, and a vertical moving plate connected with the vertical screw nut, and the cutting fixed table is connected with the vertical moving plate.

4. The film cutting device according to claim 1, wherein the cutting assembly further comprises a mounting plate arranged between the cutting driving assembly and the cutter assembly, and the cutter assembly is rotatably connected with the mounting plate; the cutting assembly further comprises a membrane breaking driving assembly used for driving the cutter assembly to rotate relative to the mounting plate.

5. The film cutting device according to claim 4, wherein the cutter assembly comprises a cutter holder rotatably connected with the mounting plate, and a cutter fixedly mounted on the cutter holder; the film breaking driving assembly comprises a rotating block which is rotatably connected with the tool apron and a driving cylinder of which the movable end is connected with the rotating block; the stiff end of drive actuating cylinder with the mounting panel rotates to be connected.

6. The film cutting device according to claim 5, wherein the tool holder is provided with a first rotating seat; the rotating block is rotationally connected with the first rotating seat; a second rotating seat is arranged on the mounting plate; the fixed end of the driving cylinder is rotatably connected with the second rotating seat.

7. The film cutting device according to claim 4, wherein the side wall of the cutting abdicating groove is provided with a lower cutter abdicating notch.

8. The film cutting device according to claim 4, wherein a connecting plate is arranged between the cutting driving assembly and the mounting plate, the connecting plate is provided with a connecting through hole, and the mounting plate is provided with a plurality of threaded holes in the length direction; and a connecting screw is arranged between the connecting plate and the mounting plate, penetrates through the connecting through hole and is in threaded connection with the threaded hole.

9. The film cutting device according to claim 8, wherein the number of the cutting and avoiding grooves is multiple, and the centers of the cutting and avoiding grooves are the same.

10. The film cutting device according to claim 8, wherein the connecting plate is provided with a sliding groove, and the mounting plate is provided with a sliding protrusion positioned in the sliding groove.