CN114523210A - Rotary cutting device and cutting method for wafer protective film - Google Patents
Rotary cutting device and cutting method for wafer protective film Download PDFInfo
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- CN114523210A CN114523210A CN202011217124.7A CN202011217124A CN114523210A CN 114523210 A CN114523210 A CN 114523210A CN 202011217124 A CN202011217124 A CN 202011217124A CN 114523210 A CN114523210 A CN 114523210A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 251
- 230000001681 protective effect Effects 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims description 13
- 238000002271 resection Methods 0.000 claims abstract description 6
- 238000012545 processing Methods 0.000 claims description 14
- 238000007664 blowing Methods 0.000 claims description 8
- 238000003754 machining Methods 0.000 claims description 8
- 210000001503 joint Anatomy 0.000 claims description 2
- 230000003068 static effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 110
- 238000013461 design Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000002679 ablation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/25—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member
- B26D1/26—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut
- B26D1/28—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut and rotating continuously in one direction during cutting
- B26D1/285—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut and rotating continuously in one direction during cutting for thin material, e.g. for sheets, strips or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
- B26D7/2628—Means for adjusting the position of the cutting member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
- B26D2007/2657—Auxiliary carriages for moving the tool holders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
- B26D2007/2664—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member for radial adjustment
Abstract
The invention belongs to the technical field of wafer manufacturing, and particularly relates to a rotary cutting device for a wafer protective film. The rotary cutting device for the wafer protective film comprises a main body box, an object stage, a rotating assembly, a cutting assembly and a moving mechanism; the moving mechanism comprises a vertical moving assembly for driving the cutting assembly to move along the vertical direction and a transverse moving assembly for driving the cutting assembly to move along the horizontal direction; the rotating assembly comprises a first rotating member arranged between the main body box and the moving mechanism or/and a second rotating member arranged between the main body box and the object stage; the resection assembly includes a cutting head; the rotating assembly is used for driving the object stage and the cutting assembly to rotate relatively, so that the cutting head can cut off the protective film on the wafer placed on the object stage. According to the invention, the wafer protective film rotary cutting device can be used for cutting redundant protective films around the wafer, so that the production efficiency and the quality of the wafer are improved.
Description
Technical Field
The invention belongs to the technical field of wafer manufacturing, and particularly relates to a rotary cutting device and a cutting method for a wafer protective film.
Background
With the continuous development of electronic technology, the demand for chips is higher and higher; the wafer is used as the basic material of the chip, and various required complex circuits can be etched on the wafer by using a laser etching technology, so that the chip is manufactured. In the process of manufacturing the wafer, a layer of protective film needs to be covered on the edge of part of the wafer, after the wafer is manufactured, redundant protective films can extend out of the edge of the wafer, and influence is generated on the subsequent processing process of the wafer by the redundant protective films, so that the protective films extending out of the edge of the wafer need to be removed after the wafer is manufactured. However, in the prior art, the protective films at the wafer edge are all removed by manual work, and the method of manually removing the protective films at the wafer edge has the problems of low processing efficiency, poor processing quality and the like.
Disclosure of Invention
The invention solves the technical problems of low processing efficiency, poor processing quality and the like in the prior art of manually removing the wafer edge protective film, and provides a rotary cutting device and a cutting method for the wafer protective film.
In view of the above problems, an embodiment of the present invention provides a device for rotationally cutting off a wafer protection film, including a main body box, a stage, a rotation assembly, a cutting assembly, and a moving mechanism mounted on the main body box;
the moving mechanism comprises a vertical moving assembly and a transverse moving assembly, wherein the vertical moving assembly is used for driving the cutting assembly to move along the vertical direction, and the transverse moving assembly is used for driving the cutting assembly to move along the horizontal direction; the rotating assembly comprises a first rotating member arranged between the main body box and the moving mechanism or/and a second rotating member arranged between the main body box and the object stage;
the resection assembly includes a cutting head; the rotating assembly is used for driving the object stage and the cutting assembly to rotate relatively, so that the cutting head cuts off the protective film on the wafer placed on the object stage.
Optionally, the cutting head is a cutter;
the cutting assembly further comprises a mounting seat, a connecting rod and a force measuring piece for detecting the pressure of the cutting head; one end of the connecting rod is connected with the mounting seat, and the other end of the connecting rod is connected with the cutting head; the mounting seat is mounted on the transverse moving assembly;
when the force measuring piece detects that the cutting force between the cutting head and the wafer is smaller than or equal to a preset cutting force, the rotating assembly drives the cutting head to cut off the protective film of the wafer;
and when the force measuring piece detects that the cutting force between the cutting head and the wafer is greater than the preset cutting force, controlling the rotating assembly to be static.
Optionally, the cutting assembly further comprises a blowing member mounted on the mounting base and used for blowing off the waste chips on the object stage.
Optionally, the wafer protective film rotary cutting device further comprises a line butt joint assembly bundle for connecting the circuit and the air path; and the mounting seat is provided with a mounting space for mounting the line butt-joint assembling bundle.
Optionally, the resection assembly further comprises a collision avoidance sensor; the anti-collision sensor is used for detecting the distance between a preset position on the cutting assembly and a to-be-cut piece on the objective table; the rotary cutting device for the wafer protective film further comprises an alarm device which is arranged on the main body box and connected with the anti-collision sensor;
and when the anti-collision sensor detects that the distance between the preset position and the to-be-cut piece is smaller than a preset safety distance, the alarm device gives out a danger alarm.
Optionally, the main body box comprises a vertical arm and a first cross arm and a second cross arm connected to two opposite ends of the vertical arm; the vertical moving assembly is mounted on the first cross arm, and the object stage is mounted on the second cross arm; a C-shaped operation space is defined by the vertical arm, the first cross arm and the second cross arm.
Optionally, the cutting head is a laser head.
Optionally, the wafer protection film rotary cutting device further comprises a start-stop button which is installed on the main body box and used for triggering emergency braking.
Optionally, the stage is a circular stage; and a positioning part for positioning and installing the piece to be cut is arranged on the central positioning point of the circular objective table.
Another embodiment of the present invention further provides a cutting method of the above-mentioned wafer protection film rotation cutting device, including:
acquiring a preset processing size of a wafer, and driving a cutting-off component to move along the horizontal direction through a transverse moving component according to the preset processing size until a cutting head is aligned with a cutting loop line of the wafer mounted on the objective table; the cutting loop line is an annular cutting line which is to be cut on the wafer through a cutting head and has the size consistent with the preset machining size; the central point of the cutting loop line of the wafer is superposed with the central positioning point of the objective table for mounting the wafer;
driving the cutting assembly to move along the vertical direction through a vertical moving assembly until the distance between the cutting head and the cutting loop line is equal to a preset cutting distance;
the cutting assembly and the objective table are driven to rotate relatively through a rotating assembly until the cutting head is aligned with a preset cutting starting point on the cutting loop line;
and controlling the rotating assembly to drive the cutting head to carry out rotary cutting so as to cut the wafer placed on the objective table into a circle matched with the preset machining size through the cutting head.
In the invention, the moving mechanism comprises a vertical moving assembly for driving the cutting assembly to move along the vertical direction and a transverse moving assembly for driving the cutting assembly to move along the horizontal direction; the rotating assembly comprises a first rotating member arranged between the main body box and the horizontal moving mechanism or/and a second rotating member arranged between the main body box and the object stage; the rotating assembly is used for driving the object stage and the cutting assembly to rotate relatively, so that the cutting head can cut the to-be-cut piece placed on the object stage into a circular shape. The rotary cutting device for the wafer protective film can be used for cutting redundant protective films around the wafer, so that the production efficiency and quality of the wafer are improved, and the normal operation of the subsequent processing of the wafer is ensured. In addition, due to the design of the transverse moving assembly, the parts to be cut with different sizes can be cut, and therefore the universality of the rotary cutting device for the wafer protective film is improved.
Drawings
The invention is further illustrated with reference to the following figures and examples.
Fig. 1 is a schematic structural diagram of a wafer protection film spin-cutting apparatus according to an embodiment of the present invention;
fig. 2 is a schematic partial structural view of a wafer protection film spin-cutting apparatus according to another embodiment of the present invention;
fig. 3 is a schematic structural diagram of a cutting assembly of the apparatus for rotationally cutting off a wafer protection film according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another view angle of a cutting assembly of the apparatus for rotationally cutting off a wafer protection film according to an embodiment of the present invention;
FIG. 5 is a front view of a work piece to be cut according to another embodiment of the present invention;
fig. 6 is a sectional view taken along line a-a in fig. 5.
The reference numerals in the specification are as follows:
1. a main body case; 11. a vertical arm; 12. a first cross arm; 13. a second cross arm; 2. an object stage; 3. a rotating assembly; 4. a resection component; 41. a cutting head; 42. a mounting seat; 421. an installation space; 43. a connecting rod; 44. a force measuring member; 45. an anti-collision sensor; 46. an air blowing member; 5. a moving mechanism; 51. a vertical movement assembly; 52. a lateral movement assembly; 6. an alarm device; 7. the lines are butted and assembled; 8. a start-stop button; 100. a wafer; 101. and (6) protecting the film.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
It is to be understood that the terms "upper", "lower", "left", "right", "front", "rear", "middle", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
As shown in fig. 1 and fig. 2, a wafer protecting film spin-cutting apparatus according to an embodiment of the present invention includes a main body case 1, a stage 2, a rotation module 3, a cutting module 4, and a moving mechanism 5 mounted on the main body case 1; it is understood that the main body case 1 can be used for carrying the object stage 2, the rotating assembly 3, the cutting assembly 4, the moving mechanism 5, etc., and can be conveniently used for taking the wafer protecting film rotating cutting device.
The moving mechanism 5 comprises a vertical moving assembly 51 for driving the cutting assembly 4 to move in the vertical direction, and a transverse moving assembly 52 for driving the cutting assembly 4 to move in the horizontal direction; the rotating assembly 3 comprises a first rotating member installed between the main body case 1 and the moving mechanism 5 or/and a second rotating member installed between the main body case 1 and the object stage 2; it is understood that the lateral moving assembly 52 and the vertical moving assembly 51 can be linear moving members such as linear motors, pneumatic cylinders, hydraulic cylinders, etc.; the rotating component 3 may be a driving member such as a rotating motor. Further, the transverse moving assembly 52 is installed between the vertical moving assembly 51 and the cutting assembly 4, and at this time, after the vertical moving assembly 51 drives the transverse moving assembly 52 to move together with the cutting assembly 4 in the vertical direction, the transverse moving assembly 52 drives the cutting assembly 4 to move in the horizontal direction.
In another embodiment, the vertical moving assembly 51 may be installed between the lateral moving assembly 52 and the cutting assembly 4, and in this case, after the lateral moving assembly 52 drives the vertical moving assembly 51 and the cutting assembly 4 to move together along the horizontal direction, the vertical moving assembly 51 drives the cutting assembly 4 to move along the vertical direction.
The resection assembly 4 comprises a cutting head 41; the rotating assembly 3 is used for driving the object stage 2 and the cutting assembly 4 to rotate relatively, so that the cutting head 41 cuts off the protective film 101 on the wafer 100 placed on the object stage 2. It is understood that the rotating assembly 3 only needs to drive the rotating table and the cutting assembly 4 to rotate relatively, and the cutting head 41 can rotate around the wafer 100 and cut off the protective film 101 protruding from the wafer 100 (i.e. cut off the wafer 100 into a circular shape).
Specifically, the wafer protective film rotary cutting device may only comprise a first rotating member installed between the main body box 1 and the horizontal moving mechanism 5, and the first rotating member drives the cutting assembly 4 to rotate; or only a second rotating member arranged between the body box and the object stage 2 can be included, and the second rotating member drives the object stage 2 to rotate; the first rotating member and the second rotating member may be included, and the cutting assembly 4 or the stage 2 may be rotated according to actual requirements.
The workpiece to be cut by the wafer protective film rotary cutting device is not limited to the wafer 100 and the like, and can be used for cutting other structural members.
Specifically, the working steps of the wafer protective film rotary cutting device are as follows: first, the wafer 100 is fixed and positioned on the stage 2; moving the cutting assembly 4 by the transverse moving assembly 52 to determine the size of the piece to be cut of the wafer 100; adjusting the cutting head 41 to the cutting start point of the wafer 100 by the rotating assembly 3; the cutting head 41 is moved to the cutting height of the wafer 100 by the vertical moving assembly 51, the rotating assembly 3 is started, and the protective film 101 protruding out of the periphery of the wafer 100 is cut off by the relative rotation of the cutting head 41 and the wafer 100.
In the invention, the moving mechanism 5 comprises a vertical moving assembly 51 for driving the cutting assembly 4 to move along the vertical direction, and a transverse moving assembly 52 for driving the cutting assembly 4 to move along the horizontal direction; the rotating assembly 3 comprises a first rotating member installed between the main body case 1 and the horizontal moving mechanism 5 or/and a second rotating member installed between the main body case 1 and the object stage 2; the rotating assembly 3 is used for driving the object stage 2 and the cutting assembly 4 to rotate relatively, so that the cutting head 41 cuts off the protective film 101 on the wafer 100 placed on the object stage 2. The wafer protective film rotary cutting device can be used for cutting the redundant protective film 101 around the wafer 100, so that the production efficiency and quality of the wafer 100 are improved, and the normal operation of the subsequent processing of the wafer 100 is ensured. In addition, the transverse moving component 52 is designed to cut wafers 100 with different sizes, so that the universality of the wafer protective film rotary cutting device is improved.
In one embodiment, as shown in fig. 3 and 4, the cutting head 41 is a cutter;
the cutting assembly 4 further comprises a mounting seat 42, a connecting rod 43 and a load cell 44 for detecting the pressure of the cutting head 41; one end of the connecting rod 43 is connected with the mounting seat 42, and the other end of the connecting rod 43 is connected with the cutting head 41; the mounting block 42 is mounted on the traverse assembly 52; it will be appreciated that the load cell 44 may be mounted on the cutting head 41, or between the connecting rod 43 and the mounting base 42, for detecting the force between the cutting head 41 and the member to be cut.
When the force measuring piece 44 detects that the cutting force between the cutting head 41 and the wafer 100 is smaller than or equal to a preset cutting force, the rotating assembly 3 drives the cutting head 41 to cut off the protective film 101 of the wafer 100; it is understood that the cutting depth of the cutting head 41 can be controlled by the cutting force between the cutting head 41 and the wafer 100, and the preset cutting force can be set according to actual requirements.
When the force measuring unit 44 detects that the cutting force between the cutting head 41 and the wafer 100 is greater than the preset cutting force, the rotating assembly 3 is controlled to be stationary. It is understood that when the cutting force is less than the preset cutting force, the cutting head 41 is controlled not to cut by controlling the rest of the rotating assembly 3; in the invention. The force measuring device 44 is designed to ensure that the wafer 100 is not damaged during the cutting process of the wafer 100 by the cutting head 41. In addition, the rotary cutting device for the wafer protective film is simple in structure and low in manufacturing cost.
In one embodiment, as shown in fig. 3 and 4, the cutting assembly 4 further comprises a blowing member 46 mounted on the mounting base 42 and used for blowing off the shavings on the stage 2. It can be understood that, during the cutting process of the protective film 101 on the wafer 100 by the cutting head 41, the gas blowing member 46 can continuously blow gas onto the stage 2, so as to prevent the waste generated by cutting the protective film 101 from damaging the wafer 100, thereby further improving the cutting quality of the wafer 100.
In one embodiment, as shown in fig. 1 and 4, the wafer protective film rotary cutting device further comprises a line butt-joint assembly bundle 7 for connecting an electric circuit and an air circuit; the mounting seat 42 is provided with a mounting space 421 for mounting the line butt-joint assembling bundle 7. Understandably, the design of the line butt-joint assembly bundle 7 can realize the centralized butt-joint of the circuit and the air circuit in the wafer protective film rotary cutting device, and realize the design of modularization and plug-and-play, so that the maintenance of the wafer protective film rotary cutting device is more convenient.
In one embodiment, as shown in FIG. 3, the ablation assembly 4 further includes a crash sensor 45; the collision avoidance sensor 45 is used for detecting the distance between a preset position on the cutting assembly 4 and a workpiece to be cut on the object stage 2; the rotary cutting device for the wafer protective film further comprises an alarm device 6 which is arranged on the main body box 1 and connected with the anti-collision sensor 45; as can be appreciated, the predetermined position is the lowest point of the mounting seat 42; it is understood that the collision avoidance sensor 45 is mounted at the lowest position of the mounting base 42, and can be used to detect the distance between the mounting base 42 and the wafer 100.
When the anti-collision sensor 45 detects that the distance between the preset position and the to-be-cut piece is smaller than a preset safety distance, the alarm device 6 sends out a danger alarm. Specifically, when the anti-collision sensor 45 detects that the distance between the cutting assembly 4 and the wafer 100 is not within a safe distance range (i.e., the distance is too small), the alarm device 6 displays a danger alarm (e.g., displays a red light, broadcasts a dangerous voice, etc.); further, when the collision avoidance sensor detects that the distance between the cutting assembly 4 and the wafer 100 is within the installation distance range, the alarm device 6 displays a safety alarm (e.g., displays a green light, broadcasts a safety voice, etc.). The design of the alarm device 6 ensures that the wafer 100 is not damaged by the cutting head 61, and the quality of the wafer 100 is improved.
In one embodiment, as shown in fig. 1, the main body case 1 includes a vertical arm 11, and a first crossbar 12 and a second crossbar 13 connected to opposite ends of the vertical arm 11; the vertical moving assembly 51 is mounted on the first cross arm 12, and the object table 2 is mounted on the second cross arm 13; the vertical arm 11, the first cross arm 12 and the second cross arm 13 enclose a C-shaped operation space. It will be appreciated that the first cross arm 12 is mounted above the vertical arm 11 and the second cross arm 13 is mounted below the vertical arm 11; and the stage 2, the ablation assembly 4, etc. are mounted in the "C-shaped" operating space. In the invention, the main body box 1 is designed to facilitate the transportation and installation of the rotary cutting device according to the wafer protective film.
In one embodiment, the cutting head 41 is a laser head. By means of laser cutting, the processing efficiency of the wafer 100 is improved, and the cutting quality of the wafer 100 is improved.
In one embodiment, as shown in fig. 1, the wafer protective film rotary cutting device further includes a start-stop button 8 mounted on the main body case 1 and used for triggering emergency braking. The emergency stop button can guarantee that the wafer protective film rotary cutting device has an emergency braking effect when the wafer protective film rotary cutting device breaks down, so that the normal operation of the wafer protective film rotary cutting device is guaranteed.
In one embodiment, as shown in fig. 1, the stage 2 is a circular stage 2; a positioning part (not shown) for positioning and installing the piece to be cut is arranged on a central positioning point of the circular object stage 2. It is understood that the center of the circular stage 2 is collinear with the axis of rotation of the rotating assembly 3; the design of location portion makes things convenient for the customer location installation wait to weld the piece.
Another embodiment of the present invention further provides a cutting method of the above-mentioned wafer protective film rotation cutting device, including:
s1, obtaining a preset machining size of the wafer 100, and driving the cutting assembly 4 to move along the horizontal direction through the transverse moving assembly 52 according to the preset machining size until the cutting head 41 is aligned with the cutting loop line of the wafer 100 mounted on the stage 2; the cutting loop line is an annular cutting line which is to be cut on the wafer 100 by the cutting head 41 and has a size consistent with the preset machining size; the central point of the cutting loop line of the wafer 100 is superposed with the central positioning point of the object stage 2 for installing the wafer 100; it is understood that the transverse moving assembly 52 moves the cutting assembly 4, so that the cutting head 41 can be used to cut wafers 100 of different sizes; illustratively, during the cutting process of the cutting head 41, the cutting process is equivalent to rotating around the center line of the object stage 2.
S2, driving the cutting assembly 4 to move along the vertical direction through the vertical moving assembly 51 until the distance between the cutting head 41 and the cutting loop line is equal to a preset cutting distance; it will be understood that, when the cutting head 41 is a cutting knife, the preset cutting distance is equal to zero; when the cutting head 41 is a laser head, the preset cutting distance can be set according to actual requirements.
S3, the cutting assembly 4 and the object stage 2 are driven to rotate relatively by the rotating assembly 3 until the cutting head 41 is aligned with a preset cutting starting point on the cutting loop line; as can be appreciated. In order to ensure the cutting quality of the wafer 100, the cutting start point of the cutting head 41 needs to be ensured before cutting.
And S4, controlling the rotating assembly 3 to drive the cutting head 41 to perform rotary cutting, so that the wafer 100 placed on the object stage 2 is cut into a circular shape matched with the preset machining size through the cutting head 41. That is, the protective film 101 outside the circular cutting line is cut off and waits for a complete circular wafer 100.
Further, when the rotating assembly 3 is installed between the transverse moving assembly 52 and the vertical moving assembly 51, the rotating assembly 3 can drive the cutting head 41 to cut after the rotating shaft of the rotating assembly 3 is aligned with the center of the object stage 2; and the cutting head 41 is moved to a distance between the rotation axis and the cutting head 41 to be equal to the radius of the wafer 100 in the processing size of the wafer 100.
In the invention. The rotary cutting device for the wafer protective film can be used for cutting redundant protective film 101 around the wafer 100, so that the production efficiency and quality of a piece to be cut are improved, and the normal operation of the subsequent processing of the wafer 100 is ensured. In addition, the transverse moving assembly 52 is designed to cut pieces to be cut in different sizes, so that the universality of the rotary cutting device for the wafer protective film is improved. Understandably, the cutting method of the wafer protective film rotary cutting device of the invention is a method when the wafer protective film rotary cutting device is used for cutting off the wafer protective film; the method corresponds to the above-mentioned wafer protection film rotary cutting device one by one, and is not described herein again.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A wafer protection film rotary cutting device is characterized by comprising a main body box, an object stage, a rotary assembly, a cutting assembly and a moving mechanism arranged on the main body box;
the moving mechanism comprises a vertical moving assembly and a transverse moving assembly, wherein the vertical moving assembly is used for driving the cutting assembly to move along the vertical direction, and the transverse moving assembly is used for driving the cutting assembly to move along the horizontal direction; the rotating assembly comprises a first rotating member arranged between the main body box and the moving mechanism or/and a second rotating member arranged between the main body box and the object stage;
the resection assembly includes a cutting head; the rotating assembly is used for driving the object stage and the cutting assembly to rotate relatively, so that the cutting head cuts off the protective film on the wafer placed on the object stage.
2. The wafer protective film rotary cutting device as claimed in claim 1, wherein the cutting head is a cutter;
the cutting assembly further comprises a mounting seat, a connecting rod and a force measuring piece for detecting the pressure of the cutting head; one end of the connecting rod is connected with the mounting seat, and the other end of the connecting rod is connected with the cutting head; the mounting seat is mounted on the transverse moving assembly;
when the force measuring piece detects that the cutting force between the cutting head and the wafer is smaller than or equal to a preset cutting force, the rotating assembly drives the cutting head to cut off the protective film of the wafer;
and when the force measuring piece detects that the cutting force between the cutting head and the wafer is greater than the preset cutting force, controlling the rotating assembly to be static.
3. The wafer protective film rotary cutting device according to claim 2, wherein the cutting assembly further comprises a blowing member mounted on the mounting base and used for blowing off the scraps on the stage.
4. The wafer protective film rotary cutting device according to claim 2, further comprising a line butt joint assembly bundle for connecting a circuit and a gas path; and the mounting seat is provided with a mounting space for mounting the line butt-joint assembling bundle.
5. The wafer protective film rotary cutting device as claimed in claim 1, wherein the cutting assembly further comprises a collision avoidance sensor; the anti-collision sensor is used for detecting the distance between a preset position on the cutting assembly and a to-be-cut piece on the objective table; the rotary cutting device for the wafer protective film further comprises an alarm device which is arranged on the main body box and connected with the anti-collision sensor;
and when the anti-collision sensor detects that the distance between the preset position and the to-be-cut piece is smaller than a preset safety distance, the alarm device gives out a danger alarm.
6. The wafer protective film spin-cutting apparatus as claimed in claim 1, wherein the main body case includes a vertical arm and first and second traverse arms connected to opposite ends of the vertical arm; the vertical moving assembly is mounted on the first cross arm, and the object stage is mounted on the second cross arm; a C-shaped operation space is defined by the vertical arm, the first cross arm and the second cross arm.
7. The wafer protective film rotary cutting device as claimed in claim 1, wherein the cutting head is a laser head.
8. The wafer protective film rotary cutting device according to claim 1, further comprising a start-stop button mounted on the main body box and used for triggering emergency braking.
9. The wafer protective film rotary cutting device according to claim 1, wherein the stage is a circular stage; and a positioning part for positioning and installing the piece to be cut is arranged on the central positioning point of the circular objective table.
10. A method for cutting a wafer protective film rotation cutting device according to any one of claims 1 to 9, comprising:
acquiring a preset processing size of a wafer, and driving a cutting-off component to move along the horizontal direction through a transverse moving component according to the preset processing size until a cutting head is aligned with a cutting loop line of the wafer mounted on the objective table; the cutting loop line is an annular cutting line which is to be cut on the wafer through a cutting head and has the size consistent with the preset machining size; the central point of the cutting loop line of the wafer is superposed with the central positioning point of the objective table for mounting the wafer;
driving the cutting assembly to move along the vertical direction through a vertical moving assembly until the distance between the cutting head and the cutting loop line is equal to a preset cutting distance;
the cutting assembly and the objective table are driven to rotate relatively through a rotating assembly until the cutting head is aligned with a preset cutting starting point on the cutting loop line;
and controlling the rotating assembly to drive the cutting head to carry out rotary cutting so as to cut the wafer placed on the objective table into a circle matched with the preset machining size through the cutting head.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011217124.7A CN114523210A (en) | 2020-11-04 | 2020-11-04 | Rotary cutting device and cutting method for wafer protective film |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011217124.7A CN114523210A (en) | 2020-11-04 | 2020-11-04 | Rotary cutting device and cutting method for wafer protective film |
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| CN114523210A true CN114523210A (en) | 2022-05-24 |
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| CN202011217124.7A Pending CN114523210A (en) | 2020-11-04 | 2020-11-04 | Rotary cutting device and cutting method for wafer protective film |
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